Pulse Transformer Module LAN-SERIES - 45-LAN.pdf · 3. Notebook pc LAN Pulse Transformer Module 4. Hub switch, Ap router Multi-port Pulse Transformer. Pulse Transformer Module LAN-SERIES

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1. Features

2. Applications

3. Dimensions

1.10/100 Base-T, Single Port, Low profile Modules w/Surge Protection

(LAN-128740M162P7A8(16 Pin)、LAN-128740M162P7B8 (16 Pin)、LAN-128740M165P7A8 (16 Pin)、LAN-5008M(24 Pin)

2.1000 Base-T, Single Port, Low profile Modules w/Surge Protection

(LAN-131850G241P1A8(24 Pin)、LAN-131850G242P1A8 (24 Pin)、LAN-161040G241P1A8 (24 Pin)、

LAN-161040G241P1B8 (24 Pin)、LAN-161040G242P1A8 (24 Pin)、LAN-171445G241P7B8 (24 Pin)、

LAN-281450G481P1A8 (48 Pin)、LAN-321050G502P1A8 (50 Pin) )

3. Notebook pc LAN Pulse Transformer Module

4. Hub switch, Ap router Multi-port Pulse Transformer.

Pulse Transformer Module LAN-SERIES

1. Low profile, small footprint saves board space and height 2. Compliant with IEEE 802.3ab standard for 10/100、1000BASE-T 3. Pin to Pin compatibility with LAN transformer 4. Operating temperature range: 0°C to +70°C (10/100), 0°C to +85°C(1G) 5. Storage temperature range: 0°C to +85°C 6. 100% Lead (Pb)-Free and RoHS compliant.

Pb-free

PbHalogen-free

Halogen

LAN-128740M162P7A8A(mm) A’(mm) B(mm) B’(mm) C(mm) C’(mm) D(mm) E(mm) F(mm)

12.7±0.25 8.89±0.25 8.67±0.25 7.2±0.25 4.0±0.25 0.8±0.05 0.6±0.1 1.27±0.25 1.00±0.25

Tolerance: XX.X0 +/-0.25(mm)

0.XX +/-0.05(mm)

Units: mm(inch)Tolerance: XX.X0 +/-0.25(0.010)

0.XX +/-0.05(0.002)

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0.XX +/-0.05(mm)

LAN128740M162P7B8

A(mm) A’(mm) B(mm) B’(mm) C(mm) C’(mm) D(mm) E(mm) F(mm)

12.7±0.25 8.89±0.25 8.67±0.25 7.2±0.25 4.0±0.25 0.8±0.05 0.6±0.1 1.27±0.25 1.00±0.25

LAN-128740M165P7A8A(mm) A’(mm) B(mm) B’(mm) C(mm) C’(mm) D(mm) E(mm) F(mm)

12.7±0.25 8.89±0.25 8.67±0.25 7.2±0.25 4.0±0.25 0.8±0.05 0.6±0.1 1.27±0.25 1.00±0.25


0.XX +/-0.05(mm)


0.XX +/-0.05(0.002)


0.XX +/-0.05(0.002)

LAN-5008M

A(mm) A’(mm) B(mm) B’(mm) C(mm) C’(mm) D(mm) E(mm) F(mm) G(mm) H(mm)

15.1 14.6 9.4 8.9 4.1 0.8 6.1 4.1 3.1 0.8 1.0

I(mm) J(mm) K(mm) L(mm) M(mm) N(mm) O(mm) P(mm)

2.1 0.7 0.3 1.1 0.8 0.7 0.3 4.7


0.XX +/-0.05(0.002)


0.XX +/-0.05(mm)

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LAN-131850G242P1A8


13.60 13.1 18.15 17.35 5.0 max 1.2 5.315 3.335 2.345 0.6 0.99

J(mm) K(mm) L(mm)

0.8 0.3 1.2

LAN-131850G241P1A8


13.60 13.1 18.15 17.35 5.0 max 1.2 5.315 3.335 2.345 0.6 0.99

J(mm) K(mm) L(mm)

0.8 0.3 1.2


0.XX +/-0.05(mm)


0.XX +/-0.05(mm)


0.XX +/-0.05(mm)


0.XX +/-0.05(mm)

LAN-161040G241P1A8


16.5 16.0 10.3 9.65 4.1 0.8 6.75 4.75 3.75 0.4 1.0

I(mm) J(mm) K(mm) L(mm)

2.75 0.65 0.2 1.0


0.XX +/-0.05(0.002)


0.XX +/-0.05(0.002)

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0.XX +/-0.05(mm)

LAN-161040G241P1B8


16.5 16.0 10.3 9.65 4.1 0.8 6.75 4.75 3.75 0.4 1.0


2.75 0.65 0.2 1.0


0.XX +/-0.05(mm)

LAN-161040G242P1A8


16.5 16.0 10.3 9.65 4.1 0.8 6.75 4.75 3.75 0.4 1.0


2.75 0.65 0.2 1.0


0.XX +/-0.05(0.002)


0.XX +/-0.05(0.002)

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0.XX +/-0.05(mm)

LAN-171445G241P7B8


17.53 17.03 14.6 13.92 4.5 max 1.0 6.86 4.32 3.05 0.8 1.27


1.78 0.67 0.3 1.1


0.XX +/-0.05(mm)

LAN-281450G481P1A8


28.58 28.08 14.6 13.99 5.0 max 1.2 6.64 4.6 3.58 0.5 1.02


2.56 0.62 0.25 1.0


0.XX +/-0.05(0.002)


0.XX +/-0.05(0.002)

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4. Part Numbering

5. Specification

LAN-321050G502P1A8


32.4 32.2 10.3 10.1 5.0 max 1.2 6.16 4.13 3.11 0.4 1.016


2.1 0.6 0.2 1.0


0.XX +/-0.05(mm)


0.XX +/-0.05(0.002)

Part Number Insertion Loss

(dB Max) Return Loss (dB min) Cross talk (db min) DCMR(dB Min)

1~100Mhz 1~30Mhz 40Mhz 50Mhz 60~80Mhz 1~100Mhz 1~60Mhz 60~100MhzLAN-128740M162P7A8 -1.2 -18 -15.5 -13.5 -10 -38 -33 -26

LAN-128740M162P7B8 -1.2 -18 -15.5 -13.5 -10 -38 -33 -26

LAN-128740M165P7A8 -1.2 -18 -15.5 -13.5 -10 -38 -33 -26

Note: All test data referenced to 25℃ ambient

Part Number Insertion Loss

(dB Max) Return Loss (dB min)

Cross talk (db min)

DCMR(dB Min)

1~100Mhz 1~30Mhz 40Mhz 50Mhz 60~80Mhz 100Mhz 1~100Mhz 1~60Mhz 60~100MhzLAN-5008M -1.1 -18 -14.4 -13.1 -12 -10 -35 -35 -30

LAN-131850G241P1A8 -1.1 -18 -14.4 -13.1 -12 -10 -35 -35 -30

LAN-131850G242P1A8 -1.1 -18 -14.4 -13.1 -12 -10 -35 -35 -30

LAN-161040G241P1A8 -1.1 -18 -14.4 -13.1 -12 -10 -35 -35 -30

LAN-161040G241P1B8 -1.1 -18 -14.4 -13.1 -12 -10 -35 -35 -30

LAN-161040G242P1A8 -1.1 -18 -14.4 -13.1 -12 -10 -35 -35 -30

LAN-171445G241P7B8 -1.1 -18 -14.4 -13.1 -12 -10 -35 -35 -30

LAN-281450G481P1A8 -1.1 -18 -14.4 -13.1 -12 -10 -35 -35 -30

LAN-321050G502P1A8 -1.1 -18 -14.4 -13.1 -12 -10 -35 -35 -30

Note: All test data referenced to 25℃ ambient

LAN - 128740 M 16 5 P7 A8 A B C D E F G

A: Series C: Application E: Center tab G: Special B: Dimensions D: Pin F: Pitch

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6. Pin Define

LAN-128740M162P7A8

LAN-128740M162P7B8

LAN-128740M165P7A8

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LAN-5008M

LAN-131850G241P1A8

LAN-131850G242P1A8

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LAN-161040G241P1A8

LAN-161040G241P1B8

LAN-161040G242P1A8

LAN-171445G241P7B8

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LAN-281450G481P1A8

LAN-321050G502P1A8

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7. Reliability and Test Condition

Item Performance Test Condition

Insertion Loss

Refer to standard electrical characteristics list. Agilent E5071C Retuen Loss

Cross talk

DCMR

Operating Temperature 0°C to +70°C (10/100) 0℃~+85℃ (1G) (Including self - temperature rise)

Storage Temperature 0℃~+85℃(Product without taping)

Life Test

Appearance：No damage. Insertion Loss：within spec. Return Loss：within spec.

Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles

Temperature： 85±2℃

Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs

Humidity Resistance Test


Humidity：85±2﹪R.H,

Temperature：85℃±2℃

Duration：1000hrs Min. Measured at room temperature after placing for 24±2 hrs

Thermal shock Test

Appearance：No damage. Insertion Loss：within spec. Return Loss：within spec.


Step1：-40±2℃ 30±5min

Step2：25±2℃ ≦0.5min

Step3：105±2℃ 30±5min

Number of cycles： 500 Measured at room fempraturc after placing for 24±2 hrs

Vibration Test

Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。

Solderability Test

More than 95% of bottom terminal electrode should be covered with solder.

Preheat: 150℃,60sec.。

Solder:Sn96.5% Ag3% Cu0.5% Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec。

Depth: completely cover the termination

Resistance To Solder Heat Test

Appearance：No damage.

Depth: completely cover bottom the termination

Temperature(°C)

Time (s)

Temperature ramp/immersion and emersion rate

Number of heat cycles

260 ±5 (solder temp)

10 ±1 25mm/s ±6 mm/s 1

Terminal Strength Test

Series No. 2(Kg)

LAN 1.0(min.)

With the component mounted on a PCB with the device to be tested, apply a force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested.

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8. Soldering and Mounting 8-1. Soldering

8-1.1 Solder re-flow:

8-1.3 Soldering Iron(Figure 2):

Recommended temperature profiles for re-flow soldering in Figure 1.

Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧Use a 20 watt soldering iron with tip diameter of 1.0mm

‧355℃ tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 4~5 sec.

Fig.2

SOLDERINGCOOLINGNATURALPRE-HEATING

TE

MP

ER

AT

UR

E(°

C)

within 4~5s

Gradual cooling

350

150

TIME(sec.)

Iron Soldering

Over 60s

Iron Soldering times: 1 times max. Reflow times: 3 times max.

Fig.1

TE

MP

ER

AT

UR

E(°

C)

60~180s

60~150s217

150

TIME( sec.)

200

25

480s max.

tp(245°C / 20~40s.)

PRE-HEATING

Reflow Soldering

SOLDERING NATURALCOOLING

TP(260℃ / 10s max.)

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9. Packaging Information

(1) Reel Dimension

Type A(mm) B(mm) C(mm) D(mm) E(mm)

LAN-128740M162P7A8 24.4±2.0 2.1±0.15 φ100 φ330±2 2.5

LAN128740M162P7B8 24.4±2.0 2.1±0.15 φ100 φ330±2 2.5

LAN-128740M165P7A8 24.4±2.0 2.1±0.15 φ100 φ330±2 2.5

LAN-5008M 24.4±2.0 2.1±0.15 φ100 φ330±2 2.5

LAN-131850G241P1A8 24.4±2.0 2.1±0.15 φ100 φ330±2 2.5

LAN-131850G242P1A8 24.4±2.0 2.1±0.15 φ100 φ330±2 2.5

LAN-161040G241P1A8 33.5±2.0 2.0±0.15 φ100 φ330±2 2.5

LAN-161040G241P1B8 33.5±2.0 2.0±0.15 φ100 φ330±2 2.5

LAN-161040G242P1A8 33.5±2.0 2.0±0.15 φ100 φ330±2 2.5

LAN-171445G241P7B8 33.5±2.0 2.0±0.15 φ100 φ330±2 2.5

LAN-281450G481P1A8 45.5±2.0 2.0±0.15 φ100 φ330±2 2.5

LAN-321050G502P1A8 45.5±2.0 2.0±0.15 φ100 φ330±2 2.5

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(2) Tape Dimension

(3) Packaging Quantity

LAN-128740M162P7A8 LAN128740M162P7B8 LAN-128740M165P7A8 LAN-5008M

Chip / Reel 900 900 900 800

LAN-131850G241P1A8 LAN-131850G242P1A8 LAN-161040G241P1A8 LAN-161040G241P1B8

Chip / Reel 400 400 800 800

LAN-161040G242P1A8 LAN-171445G241P7B8 LAN-281450G481P1A8 LAN-321050G502P1A8

Chip / Reel 800 500 500 600

Series Bo(mm) Ao(mm) Ko(mm) P(mm) Po(mm) P2(mm) W(mm) F(mm) D(mm)

LAN-128740M162P7A8 13.0±0.1 9.0±0.1 4.4±0.1 16.00±0.1 4.0±0.1 2.0±0.1 24±0.3 11.5±0.1 1.5±0.1

LAN128740M162P7B8 13.0±0.1 9.0±0.1 4.4±0.1 16.00±0.1 4.0±0.1 2.0±0.1 24±0.3 11.5±0.1 1.5±0.1

LAN-128740M165P7A8 13.0±0.1 9.0±0.1 4.4±0.1 16.00±0.1 4.0±0.1 2.0±0.1 24±0.3 11.5±0.1 1.5±0.1

LAN-5008M 15.50±0.1 9.65±0.1 4.80±0.1 16.00±0.1 4.0±0.1 2.0±0.1 24±0.3 11.5±0.1 1.5±0.1

LAN-131850G241P1A8 13.90±0.1 18.45±0.1 5.6±0.1 24.00±0.1 4.0±0.1 2.0±0.1 24±0.3 11.5±0.1 1.5±0.1

LAN-131850G242P1A8 13.90±0.1 18.45±0.1 5.6±0.1 24.00±0.1 4.0±0.1 2.0±0.1 24±0.3 11.5±0.1 1.5±0.1

LAN-161040G241P1A8 16.80±0.1 10.6±0.1 4.90±0.1 16.00±0.1 4.0±0.1 2.0±0.1 32±0.3 14.2±0.1 1.5±0.1

LAN-161040G241P1B8 16.80±0.1 10.6±0.1 4.90±0.1 16.00±0.1 4.0±0.1 2.0±0.1 32±0.3 14.2±0.1 1.5±0.1

LAN-161040G242P1A8 16.80±0.1 10.6±0.1 4.90±0.1 16.00±0.1 4.0±0.1 2.0±0.1 32±0.3 14.2±0.1 1.5±0.1

LAN-171445G241P7B8 17.93±0.1 15.3±0.1 4.80±0.1 23.45±0.1 4.0±0.1 2.0±0.1 26±0.3 12.75±0.1 1.5±0.1

LAN-281450G481P1A8 28.90±0.1 14.9±0.1 5.80±0.1 20.00±0.1 4.0±0.1 2.0±0.15 44.0±0.3 20.2±0.15 1.5±0.1

LAN-321050G502P1A8 32.70±0.1 10.60±0.1 5.80±0.1 16.00±0.1 4.0±0.1 2.0±0.15 44.0±0.3 20.2±0.15 1.5±0.1

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Application Notice

‧Storage Conditions(component level) To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air.

‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration

and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components.3. Bulk handling should ensure that abrasion and mechanical shock are minimized.

Pulse Transformer Module LAN-SERIES - 45-LAN.pdf · 3. Notebook pc LAN Pulse Transformer Module 4. Hub switch, Ap router Multi-port Pulse Transformer. Pulse Transformer Module LAN-SERIES

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