Pryor-Hale Business Plan Competition April 18, 2001 Michael McCorquodale, Chief Executive Officer Keith Kraver, Chief Technical Officer Mobius Integrated Systems Corporation 1001 E. Jefferson Ave. Suite 105 Detroit, MI 48207 [email protected]313.205.3489
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Pryor-Hale Business Plan Competition April 18, 2001
Michael McCorquodale, Chief Executive Officer Keith Kraver, Chief Technical Officer Mobius Integrated Systems Corporation 1001 E. Jefferson Ave. Suite 105 Detroit, MI 48207 [email protected] 313.205.3489. Pryor-Hale Business Plan Competition April 18, 2001. Presentation Agenda. - PowerPoint PPT Presentation
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Pryor-Hale Business Plan Competition
April 18, 2001
Michael McCorquodale, Chief Executive OfficerKeith Kraver, Chief Technical OfficerMobius Integrated Systems Corporation1001 E. Jefferson Ave.Suite 105Detroit, MI [email protected]
Presentation Agenda
• The Mission of Mobius Integrated Systems• Problems with Embedded Systems• The Mobius’ Solution• Management Team• Market• Competition• Funding and Financials• Why Invest in Mobius?
Agenda Mission Problems Solution Team Market Comp. Funding Why?
The Mission of MobiusMobius Integrated Systems Utilizes Microsystems Technology to Deliver True System-On-A-Chip (TSoC) Solutions to the Embedded Systems Market
The Engine Control Module (ECM) is an example of an embedded system:
Inside the engine a sensor detects the fuel-to-air ratio and transmits the signal to the ECM so the fuel injection can be adjusted accordingly
What is an embedded system?
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Problems with Implementation
What’s the problem? Packaging costs high Power too high Size too large Engineering
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Board Level Implementation
Antenna
Microprocessor WirelessInterface
Frequency Reference
Sensor/Actuator Interface
Sensor
Actuator
DataConversion
BasebandModem
The Mobius Solution
True System-on-a-Chip Implementation
(TSoC)
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Board Level Implementation
Antenna
Microprocessor WirelessInterface
Frequency Reference
Sensor/Actuator Interface
Sensor
Actuator
DataConversion
BasebandModem
The Mobius’ Solution
TSoC Implementation
Packaging costs reduced: Fewer Circuits Power reduced: Less Input/Output Size Reduced: Fewer Circuits, Fewer Pins Fewer Engineering Resources: Simpler System Increased Reliability: Longer Operating Life Possibilities for increased functionality Possibilities for new applications
The MS-8 prototype developed at The University of Michigan
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Realizing The Mobius’ SolutionHow is it Done? Utilizing emerging technology: MEMS Integrating existing technology: RF + Analog + Digital New application in existing technology: Si Wireless Support Emerging Standards: Bluetooth
Vision TSoC solutions require competency in all technologies Who will integrate these technologies? Si RF, SOI, MEMS, etc. No Intel of Microsystems Exists
Recognizing MEMS as an enabling technology: Prototype MEMS resonators developed at The University of Michigan
Agenda Mission Problems Solution Team Market Comp. Funding Why?
The Mobius Team: Founders
Michael McCorquodale–Chief Executive Officer
–Ph.D. Candidate: Wireless Integrated Circuit and MEMS Research
–Embedded Circuit Development with Hughes Space and Communications
Keith Kraver–Chief Technical Officer
–Ph.D. Candidate: Low-Power, Low-Voltage, Mixed-Signal IC Research
–Embedded Analog Circuit Development with National Semiconductor
Matt Guthaus–Chief Operations Officer
–Ph.D. Candidate: Low-Power Microarchitecture Research
–Automotive Microcontroller Development with National Semiconductor
Agenda Mission Problems Solution Team Market Comp. Funding Why?
The Mobius Team: Advisory Board
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Dr. Richard Brown–Chairman of Advisory Board
–Founder, Sensicore Corporation: A Chemical Sensor Company
–Associate Chair Electrical Engineering Division, University of Michigan
Joe Giachino–Member, Automotive Microsystems Specialist
–Over 30 Years Experience in Automotive Microsystems, Ford/Visteon
Dr. Dennis Grimmard–Member, Semiconductor Manufacturing Specialist
–Manager, Solid-State Electronics Laboratory, University of Michigan
Market OverviewSystem-on-a-Chip (SoC) Market:
– Total Available Market: Currently $5 Billion– Projected to be $17 Billion by 2002 (Cahner’s InStat)– Currently SoC 30% of Integrated Circuit (IC) Market– Projected to be 70% of IC Market by 2003 (Semico Research)
Additional Markets– Scaling in Additional Markets: biomedical, environmental
monitoring, industrial, manufacturing, communications, etc.
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Automotive ECM Market: – Total Accessible Market: 15 Million Units per Year– Target Market: 100k ECMs in First Automobile Line– Automotive Market is Driving Microsystems and MEMS Industry: 60 Million
Units Deployed (ForbesASAP, April 2001)
Mobius vs. Competition
Shading indicates level of integration
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Company
MEMS: Sensing & Actuating Devices
Sensor & Actuator
InterfacesData Conversion Microcontroller
Frequency Reference
Baseband Modem
Bluetooth Interface
Analog Devices, Inc.
Motorola
Texas Instruments National Semiconductor
Broadcom
Sensicore*
Silicon Wave*
ISSYS* Cambridge Silicon Radio*
Mobius* ** **
Embedded System Components
*Denotes Start-Up Business
**Denotes In-Process Development, scheduled for integration Q2, 2002
Funding Sought
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Capital Sought– $3MM First Round to Initial Product Delivery
Expenditures– Development, Management, and Sales Teams– Office Space, Computer Hardware, CAD Tools– Design, Manufacturing, and Testing of Initial Product
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Why Invest in Mobius?
Reasons to Invest in Mobius Strong, Scalable, Needed Technology with
Significant Added Value Motivated, Experienced, Talented Team Tremendously Expanding Market Applications in Broad Spectrum of Markets Opportunity to Capitalize on Emerging Applications
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Agenda Mission Problems Solution Team Market Comp. Funding Why?
Current Strategy Full Business Plan just Completed Prototypes Developed, Manufactured, and Tested Seeking Start-Up Capital From Angel Investors and
Venture Capitalists Looking to Fill Gaps: Management and Partnerships Developing Specification for Initial Product Offerings R&D underway for Bluetooth Enabled ECM