Proposal Proposal : : 2.5 Gbps 2.5 Gbps Radiation Tolerant Radiation Tolerant Serializer Design for the Serializer Design for the CBM–DAQ in 180 nm CMOS CBM–DAQ in 180 nm CMOS process process Pradeep Banerjee, Pradeep Banerjee, Dr. T. K. Bhattacharyya, E & ECE Dept., Dr. T. K. Bhattacharyya, E & ECE Dept., Indian Institute of Technology, Indian Institute of Technology, Kharagpur Kharagpur 15 15 th th CBM Collaboration Meeting, GSI CBM Collaboration Meeting, GSI 12 12 th th - 16 - 16 th th April 2010 April 2010
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Proposal: 2.5 Gbps Radiation Tolerant Serializer Design for the CBM–DAQ in 180 nm CMOS process Pradeep Banerjee, Dr. T. K. Bhattacharyya, E & ECE Dept.,
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ProposalProposal:: 2.5 Gbps Radiation 2.5 Gbps Radiation Tolerant Serializer Design for Tolerant Serializer Design for the CBM–DAQ in 180 nm the CBM–DAQ in 180 nm CMOS processCMOS process
Pradeep Banerjee,Pradeep Banerjee,
Dr. T. K. Bhattacharyya, E & ECE Dept.,Dr. T. K. Bhattacharyya, E & ECE Dept.,
Indian Institute of Technology, KharagpurIndian Institute of Technology, Kharagpur
1212thth – 16 – 16thth April, 2010 April, 2010 1515thth CBM Collaboration Meeting CBM Collaboration Meeting
OutlineOutline
New Proposal for a separate Data Aggregation chip
Architecture and Circuit Options for the High speed Serializer
Some aspects of Radiation Tolerant design in deep submicron CMOS
Activities at the RF IC group at AVLSI Lab, IIT KGP
1212thth – 16 – 16thth April, 2010 April, 2010 1515thth CBM Collaboration Meeting CBM Collaboration Meeting3
The CBM Generic Read-out The CBM Generic Read-out ChainChainDetectorFront-End
BoardRead-OutController
Active BufferBoard
FEB ROC ABB
Data CombinerBoard
DCB
First LevelEvent Selector
FLES
TNet
Data
Control
Data &Control
Sync
Data
DigitizationCustom ASIC
FEE DAQInterfaceLocal Pre-Processing
BufferingSystem
Synchronization
DAQFLESInterface
FPGA Coprocessor
Event SelectionCPU Farm
DAQ chainDetector Sub-System FLES
Slide Info: Slide Info: Walter F.J. Müller, GSI
DCS
1212thth – 16 – 16thth April, 2010 April, 2010 1515thth CBM Collaboration Meeting CBM Collaboration Meeting4
STS Data Rates – Aggregation STS Data Rates – Aggregation
Hit rate [MHz]
Sta0
Sta 1
Sta 2
Sta 3
Sta 4
Sta 5
Sta 6
Sta 7
Total
32-64 21 14 9 1 0 0 0 0 45
16-32 67 72 157 116 73 60 1 1 547
8-16 208 357 477 555 325 430 157 189 2698
4-8 494 521 250 440 964 785 1048
753 5255
2-4 441 376 51 24 219 294 693 1079
3177
1-2 104 51 0 0 3 5 21 90 274
0.5-1 1 1 0 0 0 4 0 0 6
Total 1336 1392 944 1136 1584 1578
1920
2112
12002
Very few chip in inner region have hit rate > 32 MHz > 90% of chips have hit rates in 2...16 MHz range AMPLE SCOPE FOR DATA AGGREGATION AMPLE SCOPE FOR DATA AGGREGATION
Hit rate per chip StatisticsHit rate per chip StatisticsAu+Au @ 25 AGevAu+Au @ 25 AGev
101077 evt/sec evt/sec
Slide Data from: Slide Data from: Walter F.J. Müller, GSI
31.25 MHz hit rate 31.25 MHz hit rate 2.5 2.5 Gbps Gbps
1212thth – 16 – 16thth April, 2010 April, 2010 1515thth CBM Collaboration Meeting CBM Collaboration Meeting
STS FEB Type and Link DistributionSTS FEB Type and Link Distribution
38 chips exceed 2.0 Gbps: 29 with 2.0 … 2.4; 9 with 2.4 … 3.2; # of FEBs and type distributions varies for stations
Slide Data from: Slide Data from: Walter F.J. Müller, GSI
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Data Aggregation on separate chip - Data Aggregation on separate chip - Communication hubCommunication hub Motivation:
Data Aggregation: In most cases 2,4, or 8 CBM-XYTER chips (FEBa2, FEBa4, FEBa8, resp.) can be aggregated to fill a 2.5 Gbps link
Increase the bandwidth available per link Reduce the number of Optical Links
Schemes: Embedded (aggregation integrated in CBM-XYTER)
Data aggregation and Traffic Management with a separate Communication Controller Asic
Communication ‘hub’
Clock Distribution Slow control traffic Data Readout traffic
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1212thth – 16 – 16thth April, 2010 April, 2010 1515thth CBM Collaboration Meeting CBM Collaboration Meeting
A peep into some feasible ‘Hub’ ASIC A peep into some feasible ‘Hub’ ASIC RequirementsRequirements Capacity for data aggregation from several Readout-ASICs into a single output link
1 ‘hub’ ASIC may contain 6 high speed Serializers : 6 Tx for data 15 Gbps serviceable data bandwidth
1 Rx – 1 Tx channel for clock, sync, control 250 MHz sys clock as Transmit clk 500 Mbps (DDR LVDS) input interface 5-8 LVDS o/p links (each 500 Mbps) per chip
FEBa8 case : 1 LVDS link per chip: combine data of 6 FEBs (48 LVDS links) per Hub FEBa1 case : All 6 LVDS links (single chip) per Serializer
Not shown: FIFOs, Arbitration logic (token ring), 8B/10B Encoders
TXN
1212thth – 16 – 16thth April, 2010 April, 2010 1515thth CBM Collaboration Meeting CBM Collaboration Meeting
Multiple Serializer Core: Design Multiple Serializer Core: Design ChallengesChallenges Jitter-free Clock signal Minimize noise contribution of VCO (Total serial
o/p jitter < 120 ps for BER ~ 10-12)
Switching noise generated by digital logic in ASIC
Constant phase relationship b/w VCO and Sys clock (400 ps bit time)
Multiple Serializer cores per chip: Power efficiency, ASIC footprint Sharing a single frequency multiplier among several Serializer cores in the same ASIC :
Distributing multi-gigahertz clocks over an extended distance consumes lot of power Signal integrity issues percentage of area saved as a function of the number of cores for a PLL that is half the size of a Serializer core saturates beyond 4 Careful planning on circuit layout buffering high speed clock in cascade actually worsens jitter performance
De-Serializer: CDR complexity
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Total Ionizing Dose (TIID) Effects Issues : threshold-voltage shifts, mobility degradation, and isolation related
leakage Remedy : “Radiation tolerant Layout techniques” – Systematic use of
Annular Symmetric Enclosed Layout Transistors (ELT) and p+ guard rings between the n+ diffusions
Single Event Effects (SEE) Variants:
Non-Destructive : Single Event Upset (SEU), Single Event Transient (DSET) Destructive : Single Event Latch-Up (SEL)
Issues: SEU : Depending on the LET, if parasitic charge > node critical charge, a
logical switch may occur (bit flip) DSET : Error rate depends linearly on Clock frequency (glitch) SEL : Parasitic thyristor structure leading to latch-up
Detection and Correction (EDAC); Add Capacitance to sensitive nodes to increase ‘critical charge’
SEL : Radiation tolerant Layout techniques and usage of p+ guard rings
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Observations/Experience in CBM Radiation Environment:
TID : MUCH plane 1 (at 130 cm) : deposited energy (rad/CBM-yr) at perimeter: ~30krad/yr, in center: ~500krad/yr Not necessary to have all transistors with ELT layout
SEL : Not seen as an issue in tests so far in deep submicron CMOS
1212thth – 16 – 16thth April, 2010 April, 2010 1515thth CBM Collaboration Meeting CBM Collaboration Meeting
Approach: Work Plan Freeze System level/Interface Specs
Design an appropriate architecture for the High speed Serializer core
Design and Implementation of the Peripheral cores in UMC 180μm process: PLL Clock generator 50 ohm output Impedance driver
Characterization of UMC 0.18μm CMOS process concerning the vulnerability against SEU / SETs
Testing : Functionality/Performance : Design of different Testing/Digital blocks:
Pseudo Random Sequence generator (PRSG) 8B/10B encoder, FIFOs FPGA devices to program the Serializer Test Configuration generation of Test data patterns monitor PLL’s locking state, etc.
Radiation Tolerance
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Resources Available at AVLSI Lab, IIT KGPName of Equipment Status
Cadence Spectre Simulation software Functional
Cadence Virtuoso Layout Editor Functional
Agilent Advanced Design System Functional
Agilent Golden Gate, Momentum, EMDS Functional
Full Synopsys software suite for Digital design Functional
Agilent Network Analyzer Functional
Rhode and Schwartz Signal generator (up to 3 GHz) Functional
Agilent Spectrum Analyzer (up to 26.5 GHz) Functional