TSZ22111・04・002 PRODUCTS Photo Link Module TYPE RPM973-H16 PAGE 1/13 < Specifications (Precautions and Prohibitions) > ● Precaution for circuit design 1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 2) The products are designed for use in a standard environment and not in any special environments. Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl 2 , H 2 S, NH 3 , SO 2 , and NO 2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] Use of the products in places subject to dew condensation [i ] Use or solder under irradiaton of excess infrared rays (IR reflow etc.) 3) The products are not radiation resistant. 4) The Company is not responsible for any problems resulting from use of the products under conditions not recommended herein. 5) The Company should be notified of any product safety issues. Moreover, product safety issues should be periodically monitored by the customer. 6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 7) Confirm that operation temperature is within the specified range described in product specification. 8) Failure induced under deviant condition from what defined in the product specification can not be guaranteed. 9) When product safety related problems arises, please immediately inform to ROHM, and consider technical counter measure. 10) The molding resin of the products is non fire-proof. DATE: 2009/2/13 SPECIFICATION No.: TSZ13201-RPM973-H16-0E DESIGN CHECK APPROVAL REV. 001
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TSZ22111・04・002
PRODUCTS
Photo Link Module
TYPE
RPM973-H16
PAGE
1/13
< Specifications (Precautions and Prohibitions) > ● Precaution for circuit design
1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following:
[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure
2) The products are designed for use in a standard environment and not in any special environments.
Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions:
[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including
Cl2, H2S, NH3, SO2, and NO2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after
soldering [h] Use of the products in places subject to dew condensation [i ] Use or solder under irradiaton of excess infrared rays (IR reflow etc.)
3) The products are not radiation resistant. 4) The Company is not responsible for any problems resulting from use of the products under conditions not
recommended herein. 5) The Company should be notified of any product safety issues. Moreover, product safety issues should be
periodically monitored by the customer. 6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta).
When used in sealed area, confirm the actual ambient temperature. 7) Confirm that operation temperature is within the specified range described in product
specification. 8) Failure induced under deviant condition from what defined in the product specification can not be
guaranteed. 9) When product safety related problems arises, please immediately inform to ROHM, and consider
technical counter measure.
10) The molding resin of the products is non fire-proof.
< Specifications (Precautions and Prohibitions) > ● Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability.
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please
consult with the Company in advance. Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification. ● Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics.
2) The application examples, their constants, and other types of information contained herein are applicable
only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made.
● Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
● Precaution for Stroge / Transportation 1) Product performance and soldered connections may deteriorate if the products are stored in the following
places: [a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2,
and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company [c] Storage in direct sunshine or condensation [d] Storage in high Electrostatic
2) Even under ROHM recommended storage condition, solderability of delivery over 1 year old
may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is exceeding recommended storage time period .
However, it gives priority to individual SPEC (technological standard) about recommended keeping condition of each product.
3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise
bent leads may occur due to excessive stress applied when dropping of a carton. 4) Please use parts of mounting on the side (SMD type) to which the MSL level is provided in the specified
time after opening a dry bag. When exceeded the specified time please bake products of individual SPEC the below condition before using.
REV.:001 SPECIFICATION No.:TSZ13201-RPM973-H16-0E
TSZ22111・05・002
PRODUCTS
Photo Link Module
TYPE
RPM973-H16
PAGE
3/13
< Specifications (Precautions and Prohibitions) > ● Precaution for product label
QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a internal part number that is inconsistent with an product part number.
● Precaution for disposition
When disposing products please dispose them properly with a industry waste company. ●Precaution for Foreign exchange control regulation
1) ROHM has not determined whether or not the products are considered “a controlled product or labor ” as specified in the Foreign Exchange and Foreign Trade Control Law. Accordingly, if exportation of the products, either separately or integrated in another company’s products, is intended, or giving the products to persons who are not residents is planed, additional steps are required, based upon the appropriate regulations.
● Prohibitions Regarding Industrial Property
1) These Specifications contain information related to the ROHM industrial property. Any use of them other than pertaining to theusage of appropriate products is not permitted. Duplication of these Specifications and its disclosure to a third party without the Company’s permission is prohibited.
2) Information and data on products, including application examples, contained in these specifications are
simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:
[a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein.
3) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights,
industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products.
● Precautions on Use of Products
1) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.
2) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is
applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability.
● Other Matters
1) Please sign these Specifications and return one copy to the Company. If a copy is not returned within three months after the issued date specified on the front page of these Specifications, the Company will consider the Specifications accepted.
2) If any matter related to these Specifications needs to be clarified, discussions shall be held promptly
between the two parties concerned to determine the issue.
1. Infrared LED, PIN photo diode, LED driver & Receiver frequency formation circuit built in. Improvement of EMI noise protection by Shield Case
2. Applied to SIR(9.6 k to 115.2 kbps) , MIR(0.576M,1.152 Mbps) and FIR(4Mbps) 3. Surface mount type. 4. Power down function built in. 5. Adjustable communication distance by LED load resistance value. 6.Infrared remote control transmission driver built-in.
Application Cellular Phone, PDA, DVC, Digital Still Camera, Printer, Handy Terminal etc.
Absolute maximum ratings (Ta=25 ℃)
*1) This applies to all pins basis ground pin(8pin).
Recommend Operating Conditions Parameter Symbol Min. Typ. Max. Unit
Vcc 2.4 3.0 3.6 V VLEDA 2.7 3.0 5.5 V
Supply Voltage VIO 1.7 3.0 VCC V
Parameter Symbol Limits Unit Supply Voltage Vcc/VLEDA/VIO 6.5 *1 V Input Voltage Vin(3,4,5pin) -0.3~VIO+0.3 V Operation Temperature Topr -25~85 ℃ Storage Temperature Tstg -30~100 ℃
REV. 001 SPECIFICATION No.:TSZ13201-RPM973-H16-0E
TSZ22111・05・002
PRODUCTS
Photo Link Module
TYPE
RPM973-H16
PAGE
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Electrical characteristics (VCC=3 V, VLEDVCC=3 V, VIO=3 V, Ta=25 ℃) Parameter Symbol Min. Typ. Max. Unit Conditions
Consumption Current 1 (SMIR Mode) Icc1 400 800 1600 μA PWDOWN=0 V At no input light
Consumption Current 2 (FIR Mode) Icc2 400 1000 1600 μA PWDOWN=0 V At no input light
Consumption Current 3(at PWDOWN) Icc3 - 0.01 0.2 μA PWDOWN=VIO At no input light
Transmission Rate (SMIR Mode) 9.6 - 1152 kbps ※
Transmission Rate (FIR Mode) - - 4 Mbps ※
PWDOWN Input High Voltage VPDH 2/3*VIO - VIO V
PWDOWN Input Low Voltage VPDL 0 - 1/3*VIO V VIO=1.7~3.6V (VIO≦VCC)
PWDOWN Input High Current IPDH -1.0 0 1.0 μA PWDOWN=VIO
PWDOWN Input Low Current IPDL -1.0 0 1.0 μA PWDOWN=0V
Transmitter
TXD Input High Voltage VTXH 2/3*VIO - VIO V
TXD Input Low Voltage VTXL 0 - 1/3*VIO V VIO=1.7~3.6V (VIO≦VCC)
TXD Input High Current ITXH 2.5 5 10 μA TXD=VIO
TXD Input Low Current ITXL -1.0 0 1.0 μA TXD=0V
LED Anode Current ILED 180 250 300 mA
Receiver
RXD Output High Voltage VRXH VIO-0.4 - VIO V IRXH= -200μA
Maximum Irradiance in Angular Eemax 500 - - mW/c ㎡ -15deg≦θL≦15deg
Input Half-Angular θD/2 ±15 - - deg
Maximum Emitting Time TLEDmax 16 65 120 μs TXD=VIO
1.This product is not designed for protection against radioactive rays. 2.This product dose not include laser transmitter. 3.This product includes one PIN photo diode. 4.This product dose not include optical load.
REV. 001 SPECIFICATION No.:TSZ13201-RPM973-H16-0E
TSZ22111・05・002
PRODUCTS
Photo Link Module
TYPE
RPM973-H16
PAGE
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Operating timing 1.Mode Setting (SIR/MIR/FIR) With RPM973-H16 there is a need for mode switch according to communication rate.
For the mode setting , there are “PWDOWN/Mode” and “TXD”. Please see below diagram for the set up of mode.
(a) FIR Mode (b) SMIR Mode
Figure-1
2.Remote control transmitting When remote control signal is input to the TXD terminal, remote control is transmitted.
3.Interface operating timing(use example)
(a) Emitting
LED will be emitting signal is input to TXD.
If TXD input pulse width is wider than 60μs , output LED emitting pulse will be turn
(b)Detecting If optical signal has been received , RXD signal will output.
①SIR Mode:It is outputted in the pulse width fixed at the time of SIR mode (9.6k to 115.2kbps).
Light input
less than 2.3 μs more than 2.3μs
more than 1.41μs
RXD
approximately 2.3μs approximately 2.3μs 300KΩ pull up
PWDOWN
②MIR Mode: It is outputted in the pulse width is the same as the input signal at the time of MIR
mode (0.576M,1.152Mbps).
Light input
434ns 217ns
RXD
434ns 217ns 300KΩ pull up
PWDOWN
③FIR Dode: It is outputted in the pulse width is the same as the input signal at the time of FIR
mode (4Mbps).
Light input
125ns 250ns
RXD
125ns 250ns 300KΩ pull up
PWDOWN
REV. 001 SPECIFICATION No.:TSZ13201-RPM973-H16-0E
TSZ22111・05・002
PRODUCTS
Photo Link Module
TYPE
RPM973-H16
PAGE
9/13
Dimensions Diagram
Figure-2
REV. 001 SPECIFICATION No.:TSZ13201-RPM973-H16-0E
TSZ22111・05・002
PRODUCTS
Photo Link Module
TYPE
RPM973-H16
PAGE
10/13
Block Diagram and Application Circuit
Figure-3
Recommended values Part symbol Recommended value Notice
C1
6.8 μF,Ceramic or tantalum
Bigger capacitance is recommended with much noise from
power supply.
C2 0.1 μF,Ceramic or tantalum Bigger capacitance is recommended with much noise from
power supply.
C3 0.1 μF,Ceramic or tantalum Bigger capacitance is recommended with much noise from
power supply.
REV. 001 SPECIFICATION No.:TSZ13201-RPM973-H16-0E
TSZ22111・05・002
LEDA
7 6
5 4
3 2
1
AM
P A
MP
AM
P
C1
LEDVCC
POWER DOWN /Mode
IrDA/RCcontroller
VCC
GND
VIO
TXD
RXD
PWDOWN/Mode
VCC
VIO
GND C2
Transmitter signal
Receiver signal
C3
PRODUCTS
Photo Link Module
TYPE
RPM973-H16
PAGE
11/13
Terminal Description
PIN No. Terminal Circuit Function 1 LEDA LED Anode Terminal
Other power source can be used difference between LEDVCC and VCC. LED current depends on LED load resistance value. Include internal current limiter (max. 400 mA).
2 TXD
Transmitting Data Input Terminal H:LED radiant(PWDOWN='L') CMOS Logic Level Input. Holding TXD='H'status,LED will be turn off approximately 60μs.
3 RXD
Receiving Data Output Terminal When PWDOWN(4pin)='H',the RXD output will be pulled up to VIO atapproximately 300kΩ.
4 PWDOWN /Mode
Power-down Control and Mode Setting Terminal H: POWERDOWN L: OPERATION CMOS Logic Level Input. When input is 'H',it will stop the receiving circuit, Pin-PD current and transmitting LED operation.
5 VCC
VCC Supply voltage for Transceiver circuits. For preventing from infection, connect a capacitor between GND(7pin).
6 VIO VIO Supply voltage for I/O pins (PWDOWN,RXD,TXD).
7 GND GROUND - Shield Case Connect to Ground.
REV. 001 SPECIFICATION No.:TSZ13201-RPM973-H16-0E
TSZ22111・05・002
VIO
VIOPWDOWN
300k
VIO
VIO
600k
LED
PRODUCTS
Photo Link Module
TYPE
RPM973-H16
PAGE
12/13
Recommended Window Size Design
X X Y Y
Z
1.34mm 1.59mm
X:0.268xZ+3.20 [mm] to 0.577xZ+3.20 [mm] Y:0.268x(Z-0.25)+0.68 [mm] to 0.577x(Z-0.25)+0.68 [mm]
※ Window material should have following characteristics. Lower reduction(less than 10%)for 850nm to 950nm. Higher reduction for under 850nm(this might cause of trouble).
REV. 001 SPECIFICATION No.:TSZ13201-RPM973-H16-0E
TSZ22111・05・002
Window
PRODUCTS
Photo Link Module
TYPE
RPM973-H16
PAGE
13/13
Notes
1)VLEDA(1PIN) ,VCC(5PIN) and VIO(6pin) ・Other power source can be used difference between VLEDA and VCC and VIO. (VIO < VCC+0.3V)
2)About the Optical Over Shoot Please pnt a condenser between LEDVCC-GND when a optical over shoot cccurs. And, put a condenser on as close a position as possible to the LEDA terminal.
3)Caution in designing board layout
To get maximum potential from RPM973-H16, please keep in mind following instruction. ・The line of RXD (3pin) should be connected at backside via through hole close to RPM973-H16 pin lead.Better not to be close to photo diode side(7pin side). ⇒This is to minimize feedback supplied to photo diode from RXD. ・As for C1 between 5-7 pin should be placed close to RPM973-H16. ・Better to be placed more than 1.0 cm in radius from photo diode(7pin side)and also away from the parts which generates noise,such as DC/DC converter.
4)Notes ・Please be sure to set up the TXD(2pin) input to be 'L' (under 0.6 V )except transmitting data (for<90 μsec.ON Duty <25 %). ・Powerdown current might increase if exposed by strong light (ex.direct sunlight) at powerdown mode. ・If you use this product as IrDA module , Please use by the signal format which is specified by IrDA Ver1.4(Low Power). There might be on error if used by different signal format.
<Signaling Rate and Pulse Duration Specification>
・Dusts or scratch on the lens may effect the characteristics of product , Please handle it with care.
5)Eye Safe ・Eye Safe is based on IEC60825-1(EN60825-1) Class 1 .