PRODUCT/PROCESS CHANGE NOTIFICATION...PRODUCT/PROCESS CHANGE NOTIFICATION SUBJECT SO-20 Products (Gold wire): Migration to SO20 IDF (Inter Digit Frame) line with new BOM and matte

PRODUCT/PROCESS CHANGE NOTIFICATION

SUBJECT SO-20 Products (Gold wire): Migration to SO20 IDF (Inter Digit Frame) line with new BOM and matte Tin plating process

IMPACTED PRODUCTS

ST Commercial Products:

L9333MD L9380-TR-LF TDA7418 MAR9125013TR-E MAR9108TR-E TDA7418TR L9339 MAR9144TR L93PI L9339-TR L9380-LF E-L9338MD/TR L9333MD-TR MAR9134013TR E-L9338MD

IMPACTED MANUFACTURING

STEPS

Assembly

INVOLVED PLANTS

ST Muar (Malaysia)

CHANGE REASON

Company Road Map

CHANGE DESCRIPTION

Migration to Inter Digit Frame line. Below summary of changes:

• From Pre-Plated Frame (PPF) to Matte Tin Plating Process • Copper frame (SpAg/RgAg/SelAg) with ME2 treatment for rough surface • Resin Sumitomo EME-G633CA • Glue Loctite Ablestik ABP8302

No Changes Bonding Wire Material and Diameter

Details included below TRACEABILITY Dedicated Finished Good Code:

REPORTS 11215 Validation SO20IDF.pdf

SO20 IDF Project in Muar

November, 2018

• Migration to IDF line and new BOM introduction

• From Pre-Plated Frame (PPF) to Matte Tin Plating Process

Change description

Migration from SO20 Matrix to High Density Line IDF (Inter Digit Frame)

New Bill of Material (BOM)

• Copper frame (SpAg/RgAg/SelAg) with ME2 treatment for rough surface

• Resin Sumitomo EME-G633CA

• Glue Loctite Ablestik ABP8302

ME2 treatment has been introduced in order to improve the die attach material adhesion to the lead frame die pad.

Matte Tin plating process introduction

No Changes Bonding Wire Material and Diameter

SO20 Matrix SO20 Inter Digit Frame (IDF)

Matrix Leadframe 3row x 8columns 24units

IDF Leadframe4row x 12columns 48units

57m

m

mm75

215.7mm 215.7mm

SO20 IDF Line

Adv.Micro PPF IDF + Cu pad (with ME2)

SEM images

On die pad Lead tip On die pad Lead tip

[ Note: SEM Mag 1000X]

Existing frame vs ME2

Leadframe drawing comparison ST Line: U750, U538

New leadframe die pad140x165mils

Current leadframedie pad 157x160mils

Leadframe drawing comparison ST Line: UF34

New leadframe die pad 140x165mils

Current leadframe die pad 150x200mils

leadframe drawing comparison Product Line: U569, U717


New leadframedie pad 140x165mils

leadframe drawing comparison Product Line: UH03



leadframe drawing comparison Product Line: A108, A205, A139

Current leadframedie pad 195x230mils


Leadframe Comparison

ME2: Micro Etching Version 2

ITEM EXISTING NEW

Frame size (215.7 x 57 mm) (215.7 x 57 mm)

Units/Strip 24 48

Inner Lead Plating PPF (NiPdAuAg or TNPd) Selective Ag or Ring Ag

Frame base material C194 C194

Frame process Etched Stamped

Plating PPF (NiPdAuAg or TNPd) Sn

Leadframe Supplier DCI ASM

Surface treatment No ME2

Public Products List

Publict Products are off the shelf products. They are not dedicated to specific customers, they are available through ST Sales team,

or Distributors, and visible on ST.com

PCN Title : SO-20 Products (Gold wire): Migration to SO20 IDF (Inter Digit Frame) line with new BOM and matte Tin plating

process

PCN Reference : ADG/18/11215

Subject : Public Products List

Dear Customer,

Please find below the Standard Public Products List impacted by the change.

L9333MD L93PI L9333MD-TR

L9380-TR-LF TDA7418TR L9339-TR

TDA7418 L9339 L9380-LF

E-L9338MD E-L9338MD/TR

Public Products List

IMPORTANT NOTICE – PLEASE READ CAREFULLY

Subject to any contractual arrangement in force with you or to any industry standard implemented by us, STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2018 STMicroelectronics – All rights reserved

VALIDATION REPORT

SO-20 Products Migration to SO20 IDF (Inter Digit Frame) line with new BOM and matte Tin plating process

ADG ‐ Quality November 2018

Page 2 o 8

Reliability evaluations overview

Objective

This is the summary of reliability trials performed in order to validate the SO-20 Products Migration to SO20 IDF (Inter Digit Frame) line with new BOM and matte Tin plating process.

Results

Based on the overall positive results on below mentioned TVs we consider the change qualified

Product Line W023 A108 UB63 U447

FE Technology Bipolar HF3CMOS BCD2 BCD3

FE Diffusion Fab AMK6 (Singapore)

AMK6 (Singapore)

AMK6 (Singapore)

AMK6 (Singapore)

Die size (un) 2160x1960 4420x2980 3500x3100 4120x2510

Passivation SiN/POLYIMIDE P‐VAPOX(SiO2) / NITRIDE (SiN) P‐VAPOX (Si glass) USG‐PSG‐SiON‐PIX

Die finishing back CHROMIUM/NICKEL Raw Silicon Raw Silicon Raw Silicon

L/F description SO 20 IDF SO 20 IDF SO 20 IDF SO 20 IDF

Wire diameter (mils) Au 1.3 Au 1.3 Au 1.3 Cu 2.0

Molding compound EME‐G633CA EME‐G633CA EME‐G633CA EME‐G633CA

Die attach LOCTITE ABLESTIK ABP8302

LOCTITE ABLESTIK ABP8302



Validation was done according to AEC_Q100 Rev.H using above mentioned Test Vehicles

In the below table the applied stress test as well as a comparison between the AEC‐Q100 and ZVEI Requirement is reported:

Test Group A Test Group B Test Group C Test Group D Test Group E

THB AC TC PTC HTSL HTOL ELFR WBS WBP SD PD EM TDDB HCI NBTI SM HBM CDM LU ED GL EMC SC AEC‐Q100

x

x

x

x

x

x

x x x x x

ZVEI x x x x x x x x x x X ST x x x x x x x x x x x

Page: 3 of 8

Traceability

Wafer fab information

W023 A108 UB63 U447

Wafer fab manufacturing location AMK6 (Singapore)

AMK6 (Singapore)

AMK6 (Singapore)

AMK6 (Singapore)

Wafer diameter(inches) 6 6 6 6

Silicon process technology Bipolar HF3CMOS BCD2 BCD3

Die finishing back side CHROMIUM/NICKEL Raw Silicon Raw Silicon Raw Silicon

Die size (un) 2160x1960 4420x2980 3500x3100 4120x2510

Metal levels /materials 2 / AlSiCu 2 / Ti AlSiCu TiN 2 / AlSiCu 2 / AlSiCu

Passivation (front side) SiN/POLYIMIDE P‐VAPOX(SiO2) / NITRIDE (SiN) P‐VAPOX (Si glass) USG‐PSG‐SiON‐PIX

Assembly Information

I6Z7*W023FB6 I6Z7*A108BD6 I6Z7*UB63BB6 I9Z7*U447CA6

Assembly plant location ST Muar ST Muar ST Muar ST Muar

Package description SO 20 IDF SO 20 IDF SO 20 IDF SO 20 IDF

Molding compound EME‐G633CA EME‐G633CA EME‐G633CA EME‐G633CA

Wires bonding material/diameter Au 1.3 Au 1.3 Au 1.3 Cu 2.0

Die attach material LOCTITE ABLESTIK ABP8302 LOCTITE ABLESTIK ABP8302 LOCTITE ABLESTIK ABP8302 LOCTITE ABLESTIK ABP8302

Assembly Lots #

997150KS01 9964318802 996221T101 996451F5RP

997150KS02 996221T1RQ 996451F5RQ

9973914201 996221T1RR 996451F5RR

Page: 4 of 8

Reliability qualification plan and results

Test group A: Accelerated Environment Stress

AEC #

Test Name STM Test Conditions Sample Size/ Lots

Results Fails/SS/Lots

Comments

A1

PC Pre Cond

Preconditioning according to JedecJESD22-A113F including 5 Temperature Cycling Ta=-40ºC/+60ºC Reflow according to leve 3 Jedec JSTD020D-1 100 Temperature Cycling Ta=-50ºC/+150ºC

Before THB, AC,TC,HTOL

A2

THB Temp Humidity Bias

Ta=85ºCR, H=85%V, cc=24Vfor 1000hours

77/3

0/77/3

A108 excluded

A3

AC Autoclave

ENV. SEQ. Enviromental Sequence TC (Ta=-65ºC+/ 150ºCfor 100 cycles) + AC (Ta=121ºC, Pa=2atm for 96 hours)

77/3

0/77/3

Each Test

vehicle

A4

TC Temp. Cycling

Ta=-65ºC+/ 150ºC for 500 cycles

77/3

0/77/3

Each Test vehicle

A5

PTC Power Temp. Cycling

Ta=-40ºC+/ 125ºC for 1000 cycles

N/A

N/A

A6

HTSL High Temp. Storage Life

Ta=150ºC for 1000 hours

77/3 0/77/3

Each Test

vehicle

Page: 5 of 8

Test group B: Accelerated Lifetime Simulation

AEC #



Comments

B1 HTOL High Temp. Op Life

Bias Dynamic stress (JESD22- A108) Ta=125ºC, Vcc=28V for 1000 hours

77/3 0/77/3

A108 excluded

B2 ELFR Early Life Failure Rate

Part submitted to HTOL per JESD22-A108 requirements; GRADE1: 24hours at 150ºC

1000/3 0/1000/3

U447 only

B3

EDR Endurance Data Retention

Only for memory devices N/A N/A

Test group C: Package Assembly Integrity

AEC #



Comments

C1

WBS Wire Bond Shear

Per AEC-Q100-001

30/3

0/30/3

Each Test

vehicle

C2

WBP Wire Bond Pull

Per MIL-STD883, M2011 Condition C o D

30/3

0/30/3

Each Test

vehicle

C3

SD Solderability

Wetting balance 10/3

0/10/3

Each Test

vehicle

C4

PD Physical Dimensions

10/3 0/10/3

Each Test

vehicle

C5 SBS Solder Ball Shear

Only for BGA package N/A N/A

C6 LI Lead Integrity

Not required for Surface Mount Devices

Page: 6 of 8

Test group D: Die Fabrication Reliability

AEC #



Comments

D1 EM Electromigration

N/A N/A

D2

TDDB Time Dependent Dielectric Breakdown

N/A

N/A

D3 HCI Hot Carrier Injection

N/A N/A

D4

NBTI Negative Bias Temperature Instability

N/A

N/A

D5 SM Stress Migration

N/A N/A

Page: 7 of 8

Test group E: Electrical Verification

AEC #



Comments

E2

ESD HBM

HBM=[R=1.5kΩC, =150pF]

N/A

N/A

E3

ESD CDM

N/A N/A

E4

LU Latch-Up

Injection current ±:100mA Over voltage 1.5 x Vop max N/A N/A

E5 ED Electrical Distributions 30/3 0/30/3

U447 only

E7 CHAR Characterization

N/A N/A

E8 GL Gate Leakage

N/A N/A

E9 EMC Electromagnetic Compatibility

N/A N/A

E10

SC Short Circuit Characterization

Accordingto AEC-Q100-012

N/A

N/A

Test group F: Defects Screening Tests

AEC #



Comments

F1 PAT Process Average Testing

Not performed. Implemented in production

F2

SBA Statistical Bin/Yield Analysis

Page: 8 of 8

Test group G: Cavity Package Integrity Tests

AEC #



Comments

G1 MS Mechanical Shock

Not Applicable: Not for plastic package devices

G2

VFV Variable Frequency Vibration

G3 CA Constant Acceleration

G4 GFL Gross/Fine Leak

G5 DROP Package Drop

G6 LT Lid Torque

G7 DS Die Shear

G8

IWV Internal Water Vapor

PRODUCT/PROCESS CHANGE NOTIFICATION...PRODUCT/PROCESS CHANGE NOTIFICATION SUBJECT SO-20 Products (Gold wire): Migration to SO20 IDF (Inter Digit Frame) line with new BOM and matte

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