Product / Process Change Notification N° 2013-078-A 2014-01-07 Page 1 of 4 Dear Customer, Please find attached our INFINEON Technologies PCN: Implementation of Copper wire bonding and Halogen-free 1) mold compound for products assembled in lead-free package PG-SOT223 & SOT89 Important information for your attention: Please respond to this PCN by indicating your decision on the approval form, sign it and return to your sales partner before 07.02.2014. Infineon aligns with the widely-recognized JEDEC STANDARD “JESD46-C“, which stipulates: “Lack of acknowledgement of the PCN within 30 days constitutes acceptance of the change.“ Your prompt reply will help Infineon Technologies to assure a smooth and well executed transition. If Infineon does not hear from your side by the due date, we will assume your full acceptance to this proposed change and its implementation. This PCN includes a Product Discontinuation. Kindly refer to attachment 1_cip13078_a. Your attention and response to this matter is highly appreciated. Disclaimer: If we do not receive any response by the date in the PCN above we consider this as the acceptance of the PCN. After the last order date as stated herein, purchase orders related to the unchanged product(s) cannot be accepted.
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Implementation of Copper wire bonding and Halogen-free1) mold compoundfor products assembled in lead-free package PG-SOT223 & SOT89
Important information for your attention:
Please respond to this PCN by indicating your decision on the approval form,sign it and return to your sales partner before 07.02.2014.
Infineon aligns with the widely-recognized JEDEC STANDARD “JESD46-C“,which stipulates: “Lack of acknowledgement of the PCN within 30 daysconstitutes acceptance of the change.“
Your prompt reply will help Infineon Technologies to assure a smooth andwell executed transition. If Infineon does not hear from your side by the due date, we will assume your fullacceptance to this proposed change and its implementation.
This PCN includes a Product Discontinuation. Kindly refer to attachment 1_cip13078_a.
Your attention and response to this matter is highly appreciated.
Disclaimer:If we do not receive any response by the date in the PCN above we consider this as the acceptance of the PCN.After the last order date as stated herein, purchase orders related to the unchanged product(s) cannot beaccepted.
Product / ProcessChange Notification
N° 2013-078-A
2014-01-07 Page 2 of 4
SUBJECT OF CHANGE: Implementation of Copper wire bonding
Implementation of halogen-free1)
mold compound
PRODUCTS AFFECTED: Products assembled in lead free package PG-SOT223 & SOT89, as
listed per attachment 1_cip13078_a.
REASON OF CHANGE: Implementation of Copper wire bonding process improves the quality
and reliability of Infineon products and ensures market competiveness.
Halogen-free1)
mold compound material does cope with the increasing
requirements from customers for environment-friendly products
according the WEEE directive.
1)Note:
Halogen-free according to International Electrotechnical Commission
(IEC) Standard IEC 61249-2-21:
- 900 ppm maximum Chlorine
- 900 ppm maximum Bromine
- 1500 ppm maximum total Halogens
Product / ProcessChange Notification
N° 2013-078-A
2014-01-07 Page 3 of 4
DESCRIPTION OF CHANGE: OLD NEW
Mold compound Halogen containing moldcompound
Halogen-free1)
mold compound
Wire bonding material Au wire Cu wire
Marking on deviceDevice Marking for SOT223:
____________________________
Device Marking for SOT89:
Device Marking for SOT223:- “H” in front of Date Code
___________________________
Device Marking for SOT89:- No Change
Product barcode label Pb free logo Pb free and halogen-free logo
PRODUCT IDENTIFICATION: External traceability
A) Sales code
“E” in sales code will be substituted by “H” (see 1_cip13078_a)
B) SP numbers (ordering code)
Introduction of new SP numbers (see 1_cip13078_a)
Internal traceability
Ensured via Bau number, lot number and date code marking.
TIME SCHEDULE:
Final qualification report: See attachment 2_cip13078_a
First samples available: Lead types available.All other types on request with a lead time of 6 weeks from customersample order till PCN sample delivery
Start of delivery: From April 2014 onwards
Earlier customer deliveries on special customer agreement possible.
Last order date of unchanged product: 30-06-2014
Last delivery date of unchangedproduct:
30-12-2014
Product / ProcessChange Notification
N° 2013-078-A
2014-01-07 Page 4 of 4
ASSESSMENT: Product data sheet values and package dimensions remain
unchanged
Product reliability meets the high quality standards, verified by full
product qualification on defined test vehicles
Advantages of Cu wire against Au wire concerning quality and
reliability see 3_cip30178_a
DOCUMENTATION: 1_cip13078_a Affected product list including
a. Details in changes
b. Product discontinuation & new ordering codes
2_cip13078_a Final Qualification Report
3_cip13078_a Customer information package:
Additional information on Cu wiring
Type Sales Name SP number Package Sales Name SP number Package
22µm Cu 43µm Cu 43µm Cu 43µm Cu17,5 µm AUno change
43µm Cu 43µm Cu 22µm Cu 43µm Cu
Test description Abbr. Condition Readout Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot
Note: AEC Q101 asks for 3x77 pcs (in total 231pcs for each reliability test) at least from 3 different lots. Infineon’s testboards have a size of 60pcs / per board. Based on this boundary condition we decided to test ≥ 4 lots (for each package) à 60pcs (in total 240pcs) which is compliant to the Q101 requirements.
SOT2230 / 30
SOT2230 / 30
SOT890 / 30
SOT2230 / 30
SOT2230 / 30
SOT2230 / 30
SOT2230 / 30
SOT890 / 30
SOT890 / 30
SOT890 / 30
SOT890 / 30
SOT890 / 30
1 / 1
Customer Information Package
3_cip13078_a
PCN 2013-078-A
Implementation of Copper wire bonding and Halogen-free moldcompound for products assembled in lead-free package PG-SOT223& SOT89
Market trend clearly points to introduction of Copper wiring and Halogen freemold compound
Positive qualification results with Copper wiring were generated for the alreadyissued PCN’s- PCN 2008-187-A SC79 / SCD80 - All- PCN 2009-122-A SOT3x3 - All- PCN 2012-133-A SOT223 - Small Signal MOSFET- PCN 2012-134-A SOT89 - Small Signal MOSFET- PCN 2010-181-A SOT23 - Small Signal MOSFET
Infineon has already successfully implemented both Copper wiring and Halogenfree mold compound at Wuxi since 2010 and proved robust and reliableproduction capability on SCD80, SC79 & SOT3x3 packages.
As part of the proliferation strategy, the aim is to implement Copper wiring andHalogen free mold compound for further leaded packages at Wuxi.