Product / Process Change Notification N° 2012-134-B !! UPDATE !! Updated Information in BLUE TYPE Original PCN N° 2012-134-A dated 15. November 2012 2013-01-30 Page 1 of 5 Dear Customer, Attached please find an updated PCN 2012-134-A for your attention. Updates covered by B version(PCN N°2012-134-B): 1. Products affected: Product BSP123 L6327 removed. see page 2 and 1_cip12134_b. 2. Description of change : additional information for Die attach for BSP613P (page 3) 3. Time Schedule:: Start of delivery: date postpone (page 4) 4. Products Discontinuation list: Product BSP123 L6327 removed see 1_cip12134_b. Transfer of Assembly to Infineon Technologies (Wuxi), China, implementation of Halogen-free 1) mold compound and Copper wire bonding for products assembled in lead-free package PG-SOT223 This PCN includes a Product Discontinuation Notice refer to attachment 1_cip12134_b If you have any questions, please do not hesitate to contact your local Sales office. Disclaimer: If we do not receive any response we consider this as the acceptance of the PCN. After the last order date as stated herein, purchase orders related to the unchanged product(s) cannot be accepted. In case the customer rejects this PCN this PCN shall be considered a product discontinuation notice (PD).
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Product / ProcessChange Notification
N° 2012-134-B !! UPDATE !!
Updated Information in BLUE TYPE
Original PCN N° 2012-134-A dated 15. November 2012
2013-01-30 Page 1 of 5
Dear Customer,
Attached please find an updated PCN 2012-134-A for your attention.
Updates covered by B version(PCN N°2012-134-B):
1. Products affected:
Product BSP123 L6327 removed. see page 2 and 1_cip12134_b.
2. Description of change :
additional information for Die attach for BSP613P (page 3)
3. Time Schedule::
Start of delivery: date postpone (page 4)
4. Products Discontinuation list:
Product BSP123 L6327 removed see 1_cip12134_b.
Transfer of Assembly to Infineon Technologies (Wuxi), China,implementation of Halogen-free1) mold compound and Copper wire bondingfor products assembled in lead-free package PG-SOT223
This PCN includes a Product Discontinuation Notice refer to attachment 1_cip12134_b
If you have any questions, please do not hesitate to contact your local Sales office.
Disclaimer:If we do not receive any response we consider this as the acceptance of the PCN. After the lastorder date as stated herein, purchase orders related to the unchanged product(s) cannot be accepted.In case the customer rejects this PCN this PCN shall be considered a product discontinuation notice (PD).
Product / ProcessChange Notification
N° 2012-134-B !! UPDATE !!
Updated Information in BLUE TYPE
Original PCN N° 2012-134-A dated 15. November 2012
2013-01-30 Page 2 of 5
SUBJECT OF CHANGE: 1. Transfer of assembly location
2. Implementation of halogen-free1)
mold compound
3. Implementation of Copper wire bonding
PRODUCTS AFFECTED: Products assembled in lead free package PG-SOT223, as listed per
sales code in attachment 1_cip12134_b.
Product BSP123 L6327 removed from affected product list.
REASON OF CHANGE: Infineon expands the production capacity for standard Small Signal
Surface Mount Devices at Infineon Technologies (Wuxi) Co., Ltd.,
China, as previously announced in Information Note 069/09.
This is in line with the Infineon production strategy:
Infineon Wuxi to be a volume manufacturing centre for the Discretes &
Chip Card products.
Halogen-free1)
mold compound material copes with the increasing
requirements from customers for environment-friendly products
according to the WEEE directive.
1)Note:
Halogen-free according to International Electrotechnical Commission
(IEC) Standard IEC 61249-2-21:
- 900 ppm maximum Chlorine
- 900 ppm maximum Bromine
- 1500 ppm maximum total Halogens
Product / ProcessChange Notification
N° 2012-134-B !! UPDATE !!
Updated Information in BLUE TYPE
Original PCN N° 2012-134-A dated 15. November 2012
2013-01-30 Page 3 of 5
DESCRIPTION OF CHANGE: OLD NEW
Assembly Location
Note:
Reflected in Country of Assembly printed onBarcode product label. Illustration see page 4
Transfer of Assembly to Infineon Technologies (Wuxi), China, implementation of Halogen-free1) mold compound and Copper wire bonding for products assembled in lead-free package PG-SOT223
Please list product(s) affected in your application(s):
Please check the appropriate box below: We agree with this proposed change and its schedule.
We have objections:
We need more information:
We need samples:
Sender Company: Name: Address/Location :
E-Mail:
Telefon: Fax:
Signature Date:
Please return to : your Sales partner Company: Infineon Name:
BSP613P: biggest chip from KSP wafertechnology, 1st lot with glue die-attach
BSP613P: biggest chip from KSP wafertechnology, 2nd lot with eutectic die-attach
BSP171P: medium chip from KSP wafertechnology
Assessment of Qualification Test Results: The products assembled in PG-SOT223-4 at Infineon Technologies (Wuxi), China, pass the qualification acc. AEC Q101.
This is based on positive results from all reliability stress tests performed
Moisture Sensitivity Level + 3x solder reflow at 260 °C + 100xTC before HTRB, HTGS, TC, AC, H3TRB, IOL
PCN 2012-134-AQualification of PG-SOT223Transfer of Assembly to Infineon Technologies (Wuxi), China, implementation of Halogen-free mold compound and Copper wire bonding for products assembled in lead-free package PG-SOT223
Final Qualification Report
Reason for choosing the following test vehicles, all assembled in PG-SOT223-4 at Infineon Technologies (Wuxi), China
after Initial, AC & TCpositive on 5 samples positive on 5 samples
refer to BSP295/BSP613P
refer to BSP295/BSP613P
positive on 5 samples positive on 5 samplesrefer to
BSP295/BSP613P
Wire Bond Strength
MIL-STD-750 Method 2037WBS
random sample devices after Initial & TC
positive on 5 samples positive on 5 samples positive on 5 samples positive on 5 samples positive on 5 samples positive on 5 samples positive on 5 samples
Bond ShearAEC-Q101-003
BSrandom sample devices
after Initial & TCpositive on 5 samples positive on 5 samples positive on 5 samples positive on 5 samples positive on 5 samples positive on 5 samples positive on 5 samples
The intermetallic phase growth between Copper wire and Aluminium metallization issignificantly slower than with Gold wire. This ensures an extended long term stabilityof bond connections.
Copper wire bonding enables an upgrade of the maximum storage and operatingtemperature from 150°C to 175°C for new applications.
Above cross-section examples were bonded with Au / Cu on a chip with 3.2um Al metal in SOT23 package andsubjected to precon MSL1 + solder reflow at 260deg.C + 100x TC + 1000 hours HTGS test.
Au-Al intermetallic phase
Customer Information Package4_cip12134_a
General information for PCN 2012-134-ATransfer of Assembly and Final Testing to Infineon Technologies Wuxi(China), the high volume production center for leaded Discretes packages(China), the high volume production center for leaded Discretes packages
Introduction
Infineon’s discretes package operations are centered at Wuxi (China) toensure competiveness also in the future
Supported by the Wuxi government, Infineon is investing into a Wuxicompetence center for leaded packages
Expansion of Wuxi leaded package production by capacity transferfrom Malacca
Malacca transformation to higher end products(Leadless, Wafer Level, System-in-Package, Sensors)