PRODUCT / PROCESS CHANGE NOTIFICATION 1. PCN basic data 1.1 Company STMicroelectronics International N.V 1.2 PCN No. MDG/20/11944 1.3 Title of PCN STM32MP15x product improvement - listed products 1.4 Product Category STM32MP151x, STM32MP153x STM32MP157x 1.5 Issue date 2020-02-07 2. PCN Team 2.1 Contact supplier 2.1.1 Name ROBERTSON HEATHER 2.1.2 Phone +1 8475853058 2.1.3 Email [email protected]2.2 Change responsibility 2.2.1 Product Manager Ricardo Antonio DE SA EARP 2.1.2 Marketing Manager Veronique BARLATIER 2.1.3 Quality Manager Pascal NARCHE 3. Change 3.1 Category 3.2 Type of change 3.3 Manufacturing Location General Product & Design Die redesign : Mask or mask set change with new die design like metallization (specifically chip frontside) or bug fix Crolles 4. Description of change Old New 4.1 Description Revision B (cut 2.0) Limitations as described in Errata Sheet ES0438 Revision 3 - November 2019 “STM32MP151x STM32MP153x STM32MP157x ” Summary of Device errata New Revision Z (cut 2.1): New Errata sheet ES0438 Revision 4 - January 2020 “STM32MP151x STM32MP153x STM32MP157x ” Summary of Device errata 4.2 Anticipated Impact on form,fit, function, quality, reliability or processability? Function will change only 5. Reason / motivation for change 5.1 Motivation Correct some product functionality limitations 5.2 Customer Benefit QUALITY IMPROVEMENT 6. Marking of parts / traceability of change 6.1 Description Traceability of the change is ensured by ST internal tools. 7. Timing / schedule 7.1 Date of qualification results 2020-01-30 7.2 Intended start of delivery 2020-03-09 7.3 Qualification sample available? Upon Request 8. Qualification / Validation 8.1 Description 11944 MDG-MCD-RER1902 V2.0 - STM32MP15x - Die 500XXXZ - Reliability evaluation report.pdf 8.2 Qualification report and qualification results Available (see attachment) Issue Date 2020-02-07
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PRODUCT / PROCESS CHANGE NOTIFICATION 1. PCN basic data · 2020. 2. 10. · PRODUCT / PROCESS CHANGE NOTIFICATION 1. PCN basic data 1.1 Company STMicroelectronics International N.V
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PRODUCT / PROCESS CHANGE NOTIFICATION
1. PCN basic data
1.1 Company STMicroelectronics International N.V
1.2 PCN No. MDG/20/11944
1.3 Title of PCN STM32MP15x product improvement - listed products
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
General Product & Design Die redesign : Mask or mask set change withnew die design like metallization (specificallychip frontside) or bug fix
Crolles
4. Description of change
Old New
4.1 Description Revision B (cut 2.0)Limitations as described in Errata SheetES0438 Revision 3 - November 2019“STM32MP151x STM32MP153x STM32MP157x” Summary of Device errata
New Revision Z (cut 2.1):New Errata sheet ES0438 Revision 4 - January2020“STM32MP151x STM32MP153x STM32MP157x” Summary of Device errata
4.2 Anticipated Impact on form,fit,function, quality, reliability orprocessability?
Function will change only
5. Reason / motivation for change
5.1 Motivation Correct some product functionality limitations
5.2 Customer Benefit QUALITY IMPROVEMENT
6. Marking of parts / traceability of change
6.1 Description Traceability of the change is ensured by ST internal tools.
11944 Public product.pdf11944 MDG-MCD-RER1902 V2.0 - STM32MP15x - Die 500XXXZ - Reliability evaluation report.pdf
10. Affected parts
10. 1 Current 10.2 New (if applicable)
10.1.1 Customer Part No 10.1.2 Supplier Part No 10.1.2 Supplier Part No
STM32MP151AAB3
STM32MP151AAC3
STM32MP151AAD3
STM32MP151CAB3
STM32MP151CAC3
STM32MP151CAD3
STM32MP153AAB3
STM32MP153AAC3
STM32MP153AAD3
STM32MP153CAB3
STM32MP153CAC3
STM32MP153CAD3
STM32MP157AAB3
STM32MP157AAC3
STM32MP157AAD3
STM32MP157CAB3
STM32MP157CAC3
STM32MP157CAD3
IMPORTANT NOTICE – PLEASE READ CAREFULLY
Subject to any contractual arrangement in force with you or to any industry standard implemented by us, STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
Publict Products are off the shelf products. They are not dedicated to specific customers, they are available through ST Sales team,
or Distributors, and visible on ST.com
PCN Title : STM32MP15x product improvement - listed products
PCN Reference : MDG/20/11944
Subject : Public Products List
Dear Customer,
Please find below the Standard Public Products List impacted by the change.
STM32MP153CAC3T STM32MP157AAB3 STM32MP151CAD3
STM32MP153CAD3 STM32MP153AAC3 STM32MP153CAB3T
STM32MP157CAC3T STM32MP157CAB3 STM32MP153CAB3
STM32MP157CAD3T STM32MP151AAB3T STM32MP157AAD3
STM32MP157AAD3T STM32MP151CAB3 STM32MP151AAD3T
STM32MP151CAB3T STM32MP157CAC3 STM32MP157AAC3
STM32MP157CAB3T STM32MP153AAD3T STM32MP157CAD3
STM32MP151CAC3 STM32MP153AAB3 STM32MP153AAB3T
STM32MP151AAB3 STM32MP153CAD3T STM32MP151CAD3T
STM32MP153CAC3 STM32MP151AAC3T STM32MP153AAC3T
STM32MP153AAD3 STM32MP157AAC3T STM32MP151CAC3T
STM32MP151AAD3 STM32MP151AAC3 STM32MP157AAB3T
Public Products List
IMPORTANT NOTICE – PLEASE READ CAREFULLY
Subject to any contractual arrangement in force with you or to any industry standard implemented by us, STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
LOT INFORMATION ...................................................................................................................................... 8
TEST PLAN AND RESULTS SUMMARY ............................................................................................................. 10
4 APPLICABLE AND REFERENCE DOCUMENTS ................................................................................................ 15
6 REVISION HISTORY ......................................................................................................................................... 16
STM32MP15x product is based on ARM Cortex®-A7 core and ARM Cortex®-M4 core in C40nm
technology. It provides a standard peripheral set compatible with STM32H7x (M40nm) with the
addition of a 3D GPU, DRAM memory controller and supports high level operating system like Linux,
Android or Windows. It is using external flash, larger and faster external memory, with embedded
two port USB High-Speed PHY, GPU for 3D capabilities, security with Trust Zone which is system
security by ARM.
For additional information concerning the product behavior, refer to STM32MP15x datasheets.
Traceability
2.2.1 Wafer fab information
Table 1
Wafer fab information
FAB1
Wafer fab name / location ST C12” CROLLES 300 / FRANCE
Wafer diameter (inches) 12
Wafer thickness (µm) 775 +/- 25
Silicon process technology CMOS040
Number of masks 39
Die finishing front side (passivation)
materials/thicknesses (µm) PSG + NITRIDE, 1.1
Die area (Stepping die size) (µm) 5200, 5043
Die pad size (X,Y) (µm) 41.4, 90
Sawing street width (X,Y) (µm) 72, 72
Metal levels/Materials/Thicknesses (µm) Metal 1 Cu 0.130 / Metal 2 Cu 0.140 / Metal 3 Cu 0.140 Metal 4 Cu 0.140 / Metal 5 Cu 0.140 / Metal 6 Cu 0.900 Metal 7 Cu 0.900 / Metal 8 Ta/TaN/AlCu 2.880
Die over coating (material/thickness) No
FIT level (Ea=0.7eV, C.L: 60%, 55°C) 2 FITs
Soft Error Rate - Alpha SER [FIT/Mb]
- Neutron SER [FIT/Mb]
- Conditions
Alpha SER: 357 FIT/Mb Neutron SER: 288 FIT/Mb Neutron SER is an estimation at sea level of NYC (13n/h/cm²). Alpha result is estimated using a nominal flux of 0.001α/h/cm²