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1 PRINTED CIRCUIT BOARD MANUFACTURER Website: www.visionpcb.com
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PRINTED CIRCUIT BOARD MANUFACTURER - Vision · PDF filePRINTED CIRCUIT BOARD MANUFACTURER . ... Capabilities 3. PCB Material 4. Business Sector 5. Product Specialization ... (drill

Feb 07, 2018

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Page 1: PRINTED CIRCUIT BOARD MANUFACTURER - Vision · PDF filePRINTED CIRCUIT BOARD MANUFACTURER . ... Capabilities 3. PCB Material 4. Business Sector 5. Product Specialization ... (drill

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PRINTED CIRCUIT BOARD MANUFACTURER

Website: www.visionpcb.com

Page 2: PRINTED CIRCUIT BOARD MANUFACTURER - Vision · PDF filePRINTED CIRCUIT BOARD MANUFACTURER . ... Capabilities 3. PCB Material 4. Business Sector 5. Product Specialization ... (drill

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1. Background 2. Capabilities 3. PCB Material 4. Business Sector 5. Product Specialization – RF 6. Customers

Table of Contents VS

Page 3: PRINTED CIRCUIT BOARD MANUFACTURER - Vision · PDF filePRINTED CIRCUIT BOARD MANUFACTURER . ... Capabilities 3. PCB Material 4. Business Sector 5. Product Specialization ... (drill

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• Established in 1989 • Manufacturing plant located in Penang,

Malaysia • Manufacturer of 2-16 layers Printed Circuit

Board • Capacity - 72,000 sq ft/month • No of Employees - 100

Background VS

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Organization Chart VS

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• IPC Standards are applied unless specified otherwise

• ISO 9001:2008 certified • UL E148204 certified • ISO 14001 – certified

Standards and Certifications VS

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Capabilities

• Fabricate Multilayer :- – Maximum 16 layers

• Fabricate High Mix Low Volume • High Density • Blind and Buried Vias • Plug Vias • Plate over Plug Vias

VS

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Capabilities

• Finished Hole Size – Minimum 0.2mm for Board thickness of up to 1.6mm – Minimum 0.3mm for Board thickness of up to 2.4mm – Minimum 0.4mm for Board thickness of up to 3.2mm

• Hole Size Tolerance – PTH Hole +/- 0.1 mm – NPTH Hole +/- 0.05 mm – Punched Hole +/- 0.1 mm

• Hole Location Tolerance (drill hole) – 0.08mm

VS

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Capabilities

Width & Gap • Minimum Line / Gap : 0.102 mm (4 mils)/0.102 mm (4 mils) • Min Gap size between circuit and V-Cut’s Line : 0.500 mm (19.6 mils) • Min Gap size between circuit and Board’s edge : 0.250 mm ( 9.8 mils)

SMD Pitch • Minimum : 0.304 mm (12 mils)

Annular Ring • Min Pad’s size of Component holes : 8 mils of annular ring • Min Pad’s size of Via holes : 6 mils of annular ring • Min Solder Mask Opening for both : 3 mils of annular ring component & via holes

VS

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Capabilities

• Types of Finishing:- – Lead Free Hot Air Leveling – Immersion Silver – Organic Solderability Preservatives (OSP) – Electro Nickel / Flash Gold Plating – Electroless Nickel and Immersion Gold (ENIG) – Hot Air Leveling with Gold Fingers – OSP with Gold Fingers/Gold Touch Pads – Electro Nickel / Flash Gold with Gold Fingers/Gold Touch Pads – Electro Nickel / Flash Gold with Soft Bondable Gold Plating

VS

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Corporate Strategies VS

4 “Highs” • High Frequency • High Power • High Temperature • High Mix Low Volume

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Equipments – Dry Film Photo Imaging & Development VS

CBT Optical Alignment Collimated Light Exposure Machine Auto Cut Sheet Lamination

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Equipments – AOI & Black Oxide VS

AOI Black Oxide

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Equipments – Multilayer Lamination VS Pluritec X Ray Target Drill

Rivomat

OEM Lamination Press

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Equipments – CNC Drilling VS

Multi station Machine Pluritec X Ray Target Drill

Takeuchi Machine Hitachi Machine

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Equipments – Plasma Etch Desmear & Hole Wall conditioning VS Plasma Etch Desmear Machine

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Equipments – PTH & Copper Plating VS

PTH Copper Plating

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Equipments – Etching VS Outer Layer Inner Layer

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Equipments – S/M Coating Imaging VS CBT Optical Alignment

Exposure Machine C Sun Exposure Conveyor Oven

DP10 Double Side Photo Imageable Solder Mask coater

DP1000 Photo Imageable Solder Mask coater

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Equipments – V-Cut & Forming VS Punching Machine V-Cut Machine High Pressure Rinse Machine

Hitachi Routing Machine ATI Routing Machine

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Equipments – Surface Treatment VS Hard Gold & Soft Gold Plating

HAL

OSP

Nickel Plating

Immersion Silver

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Equipments – Electrical Testing VS Mania ATG

Tester

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Equipments – Lab Analysis Instrument VS POLAR

Controlled Impedance Test System

FISHERSCOPE Multi-measuring

System

OPTEK 3D Measurement

Machine

CARY UV-Visible

Spectrophotometer

SPECTRAA Atomic Absorption

Spectrometer

Ionic

Contamination Analyses

Gel Time Tester & Peeling Strength Tester Nikon- CMM

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PCB Materials

• High TG FR4 – Isola FR406 – Isola FR408 – Isola IS410 – Isola 370HR – Nelco N4000-6 – Nelco N4000-11 – Nelco N4000-13

• HALOGEN FREE FR4

VS

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VS PCB Materials

1. Rogers – RT/Duroid 5880, RT/Duroid 5870 – RT/Duroid 6002, RT/Duroid 6006,

RT/Duroid 6010LM – RO3003, RO3006, RO3010 – RO4003C, RO4350B, RO4500,

RO4003 Lo Pro – TMM10, TMM10i

2. Arlon

– CuClad 250GT,250GX,233LX,217LX

– CLTE, CLTE-LC, AD 255/350/450/600/1000

– DiClad 517, 522, 527, 870, 880 – 25N

3. Taconic – TLY-5A, TLY-5, TLY-3 – TLE-95 – RF-34, RF-35, RF-35A – TLC-27, TLC-30, TLC-32

4. Nelco

– N4380-13 RF – NY9233

5. ISOLA

– FR408HR – IS620 – IS680

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VS Business Sector

Microwave Applications 66%

Commercial Electronics 23%

Automotive 10%

Others 1%

Microwave Applications Commercial Electronics Automotive Others

BUSINESS SEGMENT

Domestic 45%

Philipines 18%

Thailand 18%

Vietnam 6%

Europe 5%

Singapore 4%

Australia 2%

China 1% US

1%

GEOGRAPHICAL AREA

Domestic Philipines Thailand Vietnam Europe Singapore Australia China US

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High Frequency Applications: • Antenna • Wireless Technologies • High Speed Digital Transmitter and Receiver • Military

VS Product Specialization - Microwave

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Microwave Customers

VS

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Microwave’s Products VS DRAGONWAVE BRIDGEWAVE

SKYWAVE CODAN

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Microwave’s Products VS REMEC

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Microwave’s Products VS

RFS

AGILENT

RF Conditioning

Products Spectrum Meter

AMPLUS

Transceiver

Modem

Converters

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Customers - Others

VS

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Thank You