Presenter EUROPEAN NANOELECTRONICS FORUM 2009 17 – 18 November Noordwijk, The Netherlands ENIAC project IMPROVE Implementing Manufacturing science solutions.

Presenter

EUROPEAN NANOELECTRONICS FORUM 2009

17 – 18 November

Noordwijk, The Netherlands

ENIAC project IMPROVEImplementing Manufacturing science solutions to

increase equiPment pROductiVity and fab pErformance

F.Finck

2Presenter

Implementing Manufacturing science solutions to increase equiPment

pROductiVity and fab pErformance

The IMPROVE Eniac Project

Context

3Presenter

• Scaling down CMOS (Moore Law)• Managing High mix and heterogeneity (More than Moore)

Two Technical Challenges for the Future

4Presenter

LG = 10nmLG = 10nm

20nm Length (Development)

25 nm

15nm

15nm Length15nm Length(Research)(Research)

65nm Node2006

45nm Node2007

90nm Node2003

32nm Node2009 22nm Node

2011

10nm Length10nm Length(Research)(Research)

50nm Length(Production)

30nm Length(Production)

30nm

Scaling Down CMOS

What kind of Process Control Systems do we need to develop to be able to manufacture these devices in high

volumes at reduced cost per die?

Source: Intel Ireland Public Relations

Courtesy of Intel

5Presenter

SPC Chart

4750

4800

4850

4900

4950

5000

5050

5100

5150

5200

5250

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31

Lot number

Tre

nch

Dep

th

Metrology Data

UCL

LCL

Etch STI Planer

Hours/days delay

for metrology

SPC

LRC Etch

Wafer

Voltage, power, OES

etc

Metrology

y

Y

Y = f(X)

Y

X=[X1,X2,………. Xn ]

Virtual Metrology Data

Courtesy of Intel

Virtual Metrology

6Presenter

High Mix and Heterogeneity (typ. fab)

• 10 technologies types• 4 to 6 generations of each technology type• > 50 products running concurrently through the

manufacturing fab. • 5000 wafers per Week• 100 reticle changes per week

7Presenter

High Mix and Heterogeneity

• Challenges in Equipment Effectiveness– Increase in non productive time (gating metrology, recipe

qualifications, wait and down time)– Stagnating equipment reliability, availability and utilization– Increasing variations by increased number of equipment

per process step (and vice-versa)– Increasing interaction between process steps– Increasing internal tool complexity

8Presenter

Manufacturing Science Answers

Manage FDC strategy, collect data, perform analysis at equipment level

• Solutions to Process Control Issues– Virtual metrology, dynamic control plan, data mining, data reduction, data /

time synchronization

• Improving Equipment Effectiveness– Predictive Maintenance, remote diagnostics, lots scheduling and resources

planning

9Presenter

Implementing Manufacturing science solutions to increase equiPment

pROductiVity and fab pErformance

The IMPROVE Eniac Project

Project Presentation

10Presenter

ENIAC Annual Work Plan Sub Programme 8

Target Activity 1: Advanced Line Operation (Manufacturing Science)

• SP8-1 Objective:To allow European device makers to increase the productivity and sustainability of the most advanced CMOS and derivative technologies semiconductor fabs

11Presenter

IMPROVE Master Objectives

• To improve processes reproducibility and quality• To improve the effectiveness of production

equipement• To shorten cycles time

=> To IMPROVE Fab Competiveness

12Presenter

Expected Project Results

• Virtual Metrology Implementation– Allow measurement of every wafer in real time– Improve process control from "run to run" to "wafer to

wafer"• Increase device quality and yield

– Reduce standard metrology steps• Cycle time improvement

• Operating costs reduction

13Presenter

Expected Project Results

• Passing from reactive to predictive factory operations in European fabs.– Reduce unscheduled equipment downtime– Increase equipment reliability– Reduce number of scrapped wafers.

• Dynamically optimizing the Control Plan with respect to the real time risk analysis– Reduce unecessary control steps– Reinforce the control on critical steps

14Presenter

How to address these challenges (1)

• Need for an extensive vertical collaboration– SC Manufacturers

• To define problem, provide data, specify and assess solutions

– Academics• To work on physical and statistical

models– Solution Providers

• To prototype harware and software tools for development assessment

Data Acquisition

Modeling

Prototypes

Assessment

15Presenter

How to address these challenges (2)

• Need for an extensive horizontal collaboration – SC Manufacturers

• To be able to address in parallel different processing equipment and silicon structures

• To ensure developped solutions will be adapted to various production environments

– Academics• To provide a cluster of complementary expertise on the

modeling activity

– Solution Providers• To address the different software packages and sensors

needed by the project

16Presenter

Diffusion

How to address these challenges (2)

– SC Manufacturers

– Academics

– Solution Providers

More Moore

PhysicalModeling

200/300mmLines

More thanMoore

Etch Implant Photo-Litho

APC Framework

Data Analysis

Simulation Software

Sensors

Non linear Stats.

NeuralNetworks

BayesianNetworks

RiskAnalysis

•Need for an extensive horizontal collaboration

17Presenter

Consortium

• 6 major European SC manufacturers– ATMEL– INTEL– INFINEON– Austriamicrosystems– Numonyx– ST

• 2 Institutes– Fraunhofer G.– LETI

18Presenter

Consortium

• 10 Solutions Providers– France:PDF Solutions, Probayes– Germany: Camline, ISYST, InReCon– Ireland: Straatum, Lexas Research– Italy: Techno Fittings, AP-Technologies, LAM – Portugal:Critical SoftWare

19Presenter

Consortium

• 12 Academic Labs– France:EMSE-CMPGC, GSCOP, LTM CNRS– Germany: LMU (München), FAPS (Erlangen)– Ireland: DCU (Dublin)– Italy: UNIPV, UNIMI, UNIPD, CNR E, CNR IMM – Austria:FH-WN (Wiener Neustadt)

20Presenter

Key figures

3600 Men Months over 3 years100 full-time researchers

35 Partners over 6 countriesSC ManufacturersSW ProvidersAcademics

21Presenter

IMPROVE WORK PACKAGES

• 3 R&D themes in 3 main Work Packages:– Virtual Metrology (Leader INTEL)– Predictive Equipment Behaviour / Predictive

Maintenance (Leader INFINEON)– Dynamic Risk Assessment & Control Plan

(Leader STMicroelctronics)

22Presenter

IMPROVE WORK PACKAGES

• 3 "ancillary" Work Packages– Survey & Specification (Leader Fraunhofer)– Integration in Manufacturing Decision Systems (leader

Numonyx)– Equipment Forum (Leader Fraunhofer)

23Presenter

Work Packages Structure

24Presenter

Project Progress after 6 months

• Building the cooperation structure– Consolidate work distribution among partners– Define technical and geographical clusters– Implement communication channels (Web site, net

meetings)

Novel approach using combination of technologies to

estimate wafer’s physical dimensions and electrical

performance

25Presenter

First Results in Virtual Metrology

Etch rate estimation from Optical Spectra using statistical approach.

26Presenter

First Results in Predictive Equipment Behaviour

Example of Equipment Behaviour analysis from Ion Implantation

Change of beam line graphite

Equipment Predictive Behaviour System Concept and Interaces

27Presenter

Benefits of the Cooperation for Europe

• The IMPROVE project will be a key enabler for 2 main competitive advantages

1. To directly contribute to the competitiveness of the semiconductor fabrication in Europe with the developped solutions• Better process and equipment control at lower cost

• Better productivity of equipment

• Better cycle time

28Presenter

Benefits of the Cooperation for Europe

2. To contribute to the creation and reinforcement of a European ecosystem in the semiconductor manufacturing area• Leadership in Manufacturing Science for SC

manufacturers, labs and academics– The Virtuous Cycle

• Advanced hardware and software tools in solution providers portofolio– Opportunity to gain new customers and increase

marketshare

• Building of a continuous collaboration network in Manufacturing Science among European actors

29Presenter

Benefits of the Cooperation for EuropeThe Virtuous Cycle

SCManufacturers

Labs &Academics

SolutionProvidersLong term reinforced

competitiveness for all actors

New Technologies Introduction

New Problems

Expertise Development & Recognition

New Concepts to Implement

Enriched Portofolio,New Markets

More Effective Production Lines

New Tools

30Presenter

Thank you for your attention

More information available on IMPROVE public web

site:to be completed