Presented By Lorenzo Andrioli Thermal Analysis in Support to Thermal Protection System Seals and Interface Design of IXV Lorenzo Andrioli, Massimo Antonacci Thales Alenia Space – Turin, Italy Alessandro Mannarelli SSE Sofiter System Engineering – Turin, Italy Thermal & Fluids Analysis Workshop TFAWS 2011 August 15-19, 2011 NASA Langley Research Center Newport News, VA TFAWS Paper Session
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Presented By Lorenzo Andrioli Thermal Analysis in Support to Thermal Protection System Seals and Interface Design of IXV Lorenzo Andrioli, Massimo Antonacci.
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Presented By
Lorenzo Andrioli
Thermal Analysis in Support to Thermal Protection System Seals
and Interface Design of IXVLorenzo Andrioli, Massimo Antonacci
Thales Alenia Space – Turin, Italy
Alessandro Mannarelli SSE Sofiter System Engineering – Turin, Italy
Thermal & Fluids Analysis WorkshopTFAWS 2011August 15-19, 2011NASA Langley Research CenterNewport News, VA
• between TPSs and other subsystems:– floatation system ejectable panels insulation– venting hole– protection insulation over antennas– bridle channels insulation– protection insulation on umbilical mechanisms
TFAWS 2011 – August 15-19, 2011 6
Analysis Approach
Modeling criterion• ESATAN Thermal
Lumped Parameter (TLP) solver
• Technique resembles System Thermal Mathematical Model (TMM) one improving temperature mapping capabilities
• highly customizable 2D mesh models and one 3D axisymmetric model
• depending on the I/F type, a fluid leak (sneak flow) through sealing materials is simulated
together to establish a geometrical hierarchy → propagation of changes by acting upon relevant parameters (e.g. modification of items sizing, material properties, etc.)
• Node blocks wrapped into arithmetical nodes→ spreading effect of surface heat exchanges implicitly solved (reliable evaluation of I/F temperatures)
TFAWS 2011 – August 15-19, 2011 8
I/F TMMs general description
Environment simulation• Internal environment: radiative and convective
equivalent conductors (representative nodes defined on the basis of System TMM)
• External environment: radiative conductors and heat fluxes (ATDB, max heat load trajectory) or input from dedicated thermo-ablative software
• Sneak flow: modelled by means of a heat contribution calculated as:
)( / SCAIRIMPINGINGAIRpFLOWSNEAK TTcmQ
TFAWS 2011 – August 15-19, 2011 9
I/F TMMs general description
Air mass flow: calculated with Darcy law 1D formulation
mGap
Seal thickness
phigh plow
th
pkAm
k permeability of the seal
air kinematic viscosity
air density
Sneak flow into non-passing through slots: air filling the gap is considered as stagnating (really thin and deep slots, highly conservative boundary layer temperature)
th spatial term describing the flow path (seal thickness)
p pressure
A flow area (gap × slot width)
TFAWS 2011 – August 15-19, 2011 10
• Air flow through venting hole: equivalent thermal conductor (h × A) linking duct with a inflow boundary node
I/F TMMs general description
bush
air
r
kNuh
2
kair air conductivity
rbush duct internal radius
Nu Nusselt number
1Pr8
7.121
Pr1000Re
83
2f
fNu
264.1Reln79.0
1
f
From Petukhov-Gnielinski semi-empiric correlation:
TFAWS 2011 – August 15-19, 2011 11
I/F TMMs general description
Analysis work logic
TFAWS 2011 – August 15-19, 2011 12
I/F TMMs general description
Model example: typical TPS-to-TPS junction I/F
TFAWS 2011 – August 15-19, 2011 13
Analysis results and their application
Local vs System TMMs T are applied to overall vehicle temperature maps all along the I/Fs envelope at C/S and TPS level.
Temperature maps are used as an input for System Thermo-elastic analyses → overall steps and gaps requirements verification
TFAWS 2011 – August 15-19, 2011 14
New approach for TPS thermal analysis
Current approach modeling (ESATAN) flaws:• ESATAN-TMS GUI is in early development phase
→ code is usually written down by hand• Manual debugging and subroutine generation is the rule
→ coding is more error-prone than a robust front-end approach
• CAD interfacing tools are under development→ geometry is user discretized and modeled, usually in scripting form with graphic visualization
• Data exchange is manually managed by means of properly written routines→ a coding endeavor is required
TFAWS 2011 – August 15-19, 2011 15
New approach for TPS thermal analysis
Solution: switching to an hybrid approach tool.
• Bi-directional from/to CAD geometry interfacing, with direct user intervention for simplification purposes
• Finite element based model mesh generation
• Possibility to chose between a Finite Element Method (FEM) or a TLP solution
• Possibility to chose between FEM or TLP like postprocessing (temperatures interpolated over the node vs isothermal nodes)
TFAWS 2011 – August 15-19, 2011 16
New approach for TPS thermal analysis
FEM-TLP hybrid workflow in NX environmentAn example of hybrid approach workflow applied to a preliminary TPS-to-TPS I/F analysis.
TFAWS 2011 – August 15-19, 2011 17
Summary & Conclusions
The presented modelling approach has been developed in the frame of IXV programme resulting into a key feature of the I/F design assessment at System level.
The adopted work logic resulted in an effective approach to:• Achieve the required detail level for I/Fs design justification• Reduce development times and iterations between the different
disciplines involved• Minimize and enhance data exchange cycles among several
analysis tools
TFAWS 2011 – August 15-19, 2011 18
Improvements based on hybrid FEM/TLP analysis are being implemented to:
• Boost up detail level for I/Fs design refinement
• Further reduce development and coding endeavor (minimizing modeling mistakes)
• Enhance data exchange among several CAD/analysis suites