© PragmatIC Printing Ltd - flexlogic.systemsflexlogic.systems/files/flexlogic-presentation-170626.pdf · PragmatIC: beyond silicon… Flexible integrated circuits enable trillions

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Introductory presentationwww.flexlogic.systems

FlexLogIC™Manufacturing innovation by PragmatIC

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This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 726029

PragmatIC: beyond silicon…

Flexible integrated circuits enable trillions of smart objects² Thinner than a human hair² Flexible and conformable² Sub-cent electronic solutions

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The evolution of electronics

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~300 million p.a. ~50 billion p.a. >1 trillion p.a.

VOLU

ME

~$100 per IC ~$1-10 per IC <1-10¢ per IC

COST

Electronics for a flexible world

² RF Identification (RFID) ² Near Field Comms (NFC)² Internet of Things (IoT)

Improve form factor & cost for existing applications

² Brand promotion labels² Functional packaging² Interactive card games² Novel security features etc.

Enable completely new product concepts

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+

Electronics for a flexible world

² Progressively smaller features² Increased performance² Increased density² Compact IC footprint² Overall low cost per transistor² But only if you need lots of transistors!

The benefits of Moore’s Law² Flexible low cost substrate² Flexible low cost active materials² Simpler fabrication equipment² Simpler fabrication processes² Overall low cost per unit area² Simple, low cost integration into a wide

variety of form factors

… but for everyday objects!

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² 21 patent families comprising over 80 individual patents² Low cost replication of micro- and nano-scale electronic features² Novel device architectures and processes to ensure feature alignment

PragmatIC’s core intellectual property

Scaling for growth

² Leveraging ~£60Mn capital investment at National Centre for Printable Electronics

² Cleanroom environment² Off-the-shelf equipment² Manual batch production² Capacity ~10Mn flexICs p.a.

Current: pilot production

² Self-contained “fab-in-box”² Fully integrated modular equipment² Fully automated production² Capex 100–1000x less than Si fab² Bn+ flexICs p.a. per modular line² Less than 1¢ per flexIC

Future: FlexLogIC™

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CPI’sNationalCentreforPrintableElectronics(Sedgefield)

FlexLogIC fab-in-a-box

Fully integrated flexIC production line² Automated materials handling and process control² Self-contained clean environment

Enables rapid expansion of flexIC manufacturing² Capacity for billions of flexICs per annum² Modular scalability

Compelling financial case² Capex 100–1000x less than Si fab² Payback period 1-2 years

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FlexLogIC production costs vs Silicon

1%

10%

100%

1000%

10000%

1 10 100 1,000 10,000 100,000 1,000,000 10,000,000

Fully

load

ed p

rodu

ctio

n co

st (r

elat

ive)

IC complexity (number of logic gates)

Silicon (old gen)

Silicon (new gen)

FlexLogIC

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>95%costadvantage

Lowercostforupto100kgates

NB: analysis assumes footprint is limited by complexity not I/O pads (more pads would increase inflection & crossover point)

FlexLogIC on track for 2018 production

Design & specification finalised and all orders placed² 60% higher capacity within original capex target² 30% lower marginal production cost per FlexIC

Lease secured at UK’s National Printable Electronics Centre² Collocated with existing PragmatIC pilot production

Installation and commissioning through end 2017² Initial equipment deliveries already on site in Q2

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2017 2018

Procurement Commissioning Operation & ongoing optimisation

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