IEEC Database for Electronic Packaging Materials Wayne E. Jones Jr .a, Peter Borgesen b , Junghyun Cho c Sam Mahin-Shirazi b , Linyue Tong a a) Department of Chemistry and Materials Science Program, Binghamton University, Binghamton, NY 13902 b) Department of Systems Science and Industrial Engineering, Binghamton University, Binghamton, NY 13902 c) Department of Mechanical Engineering, Binghamton University, Binghamton, NY 13902 The database of properties of industrial electronic packaging materials (EPMs) has been maintained and expanded in order to provide a wide range of information for various electronic packaging materials by utilizing chemical, mechanical, physical and thermal testing methods. The obtained information from the tests can provide a basis for decision making on new products as well as a foundation on which new materials can be evaluated. Introduction Test Descriptions for Tools By reviewing the description, the members will be able to have a general idea about the capabilities of the tools and their general application. The purpose of the tools description is to address the following: • What are the tool and its application • One/two picture(s) of the tool • An example of the result that can be obtained from the tool • A link to the tool for more details if there is any online information for further information, staff members that are responsible for that specific tool and some other technical specifications. Contact Information If you want to add new materials to the database please contact: Sam Mahin-Shirazi at [email protected] To discuss materials and data feel free to email: Sam Mahin-Shirazi at [email protected] Linyue Tong at [email protected] Dr. Peter Borgesen at [email protected] 1) IEEC Materials Submission Form The online form is now available for members with both secured access to the website and through a link which has been sent to all the members. Comparison of the measured and predicted plots for the creep compliance of Hysol QMI519. Continues lines are the predicted and dashed lines are the real data Where = () 0 is the creep compliance function which is a material property that characterizes creep behavior () is the time-varying strain at a constant load 0 is the mean retardation time. The smaller this value the more rapid is the creep Some of the tests have been reorganized and some of them are recently added to the list . Available Tests Chemical Structure and Composition Analysis Mechanical Testing • Universal Testing Machine • Nanoindentation Testing • Transmission electron microscopy (TEM) • Scanning Electron Microscopy (SEM) • X-ray Diffraction (XRD) • Optical Microscopy (OM) • Atomic Force Microscopy (AFM) • Small-angle X-ray scattering (SAXS) • IR Microscope • Sample Preparation tools Argon Ion Cross Section Polisher Multiprep Tools • Spectroscopic Ellipsometry • Moisture analysis in Polymer Weight Gain Moisture Swelling Coefficient Hygroscopic Swelling (CHS) Microstructure Analysis and Characterization • Flash Diffusivity • Thermal Conductivity • Differential Scanning Calorimetry (DSC) • TGA-MS • Thermo-Mechanical Analyzer (TMA) • Dynamic Mechanical Analyzer (DMA) • Rheological Characterization Thermal Analysis Electrical Properties • Electrical Conductivity • Electrical Resistivity • X-Ray Imaging • Scanning Acoustic Microscopy (C-SAM) Non-destructive Structural Characterization • Fourier Transform Infrared Spectroscopy • Energy/Wavelength-Dispersive X-ray Spectroscopy • X-Ray Photoelectron spectroscopy(XPS) IEEC Website Please enter the following information If Other Chooseclass o Encapsulants o Adhesives o ThermalInterfaceMaterials o Polymer UnderfillMaterials o Polymer Compositesw/ CNT's o Solders o Barrier Layers • Other Name Company Name Please enter your email id Name of Material Submit Property/Data Available Value TDS Value MSDS TDS T g (CTE Data) Coefficient of Thermal Expansion (CTE) Storage Modulus Stress Relaxation / TTS Data Elastic Region Stress-Strain Curve Moisture Uptake Outgassing Coefficient of Hygroscopic Swelling (CHS) 0.0021 %ε/%C 1.03% @ 100 0C 90 0 C 63.63 ppm/ 0 C (<Tg), 177.26 ppm/ 0 C (>Tg) 3.3 wt.%, @ 85°C/85°RH 90 0 C 54 ppm/ 0 C (<Tg), 206 ppm/ 0 C (>Tg) 516,912 psi EPO-TEK 353 ND Optical Adhesives 2) New Standard Template We designed Template to include TDS values for easy access to further information on the materials. - Included values where necessary for different types of preparation of the materials - Included links to PDF copies of both the TDS/MSDS Differential scanning calorimetry (DSC) DSC is the most popular thermal analysis technique, which measures the sample compared to a reference material, usually air, to determine heat flow as a function of temperature through exo or endothermic reactions. It can be used to characterize polymers, pharmaceuticals, food; biologicals, organic chemicals and inorganics, and yield thermal stability data or heat capacity depending on how the experiment is set up. The information of glass transition, melting, crystallization, curing and cure kinetics, onset of oxidation and heat capacity can be analyzed from the DSC result. DSC Q200 from TA Instruments As shown in the Figure 1 A) and B) we see no glass transition (Tg) since these epoxies start in a psudo liquid state, however the first exothermic process would indicate the melt point (Tm) which relates the thermal cure point. Figure 1 C) and D) are calibrated to measure heat Cp for the underfill materials. • For detailed tool information from the ADL click here Figure 1. DSC (a) and MDSC (b) of underfill epoxy Hysol QMSI519. DSC under different curing conditions (c and d). D) A) C) B) A New Section for Online Modeling tools We are creating a new section of the packaging materials database that we post modeling tools that are available online. One example is the creep model. We can predict the creep behavior of epoxy adhesives such as die attach adhesive, Hysol QM1519 in a wide range of stresses by using the provided equations. Sumitomo G700E (Mold Compounds) Sumitomo G700Y (Mold Compounds) Sumitomo G600 (Mold Compounds) Sumitomo G700l-Y (Mold Compounds) Hysol CE3103 (Optical Adhesive) Hysol CE3920 (Optical Adhesive) Ablecoat 8006NS (Die Attach Adhesive) New Materials IEEC Integrated Electronics Engineering Center