1 Pacific MicroCHIP Corp. 2008 Dalius Baranauskas Denis Zelenin Evaluation Report – White Paper
1Pacific MicroCHIP Corp. 2008
Dalius Baranauskas
Denis Zelenin
Evaluation Report – White Paper
2Pacific MicroCHIP Corp. 2008
OUTLINE
1. Test Objective. DUT Description
2. On-wafer Probing Setup For Static Frequency Divider
3. On-wafer Probing Equipment
4. Measurement Equipment Readings. DUT Input And Output
5. Measured Divider Input Power Level vs. Input Refered Working Frequency
6. Measured Divider Output Power Level vs. Input Refered Working Frequency
7. Measured Self-Oscillation Frequency over Power Supply Voltage
8. Measured Current Consumption over Power Supply Voltage
9. Measured Output Power over Power Supply Voltage in Self-Oscillation Mode
10.Conclusion
3Pacific MicroCHIP Corp. 2008
Objective: test and characterize 60GHz Frequency
divider By2. Device under test (DUT) was fabricated
on MPW runs at Jazz Semiconductor. DUT is a
3x1.3mm die on a 5x5mm MPW tile (Figure 1).
Figure 1. MPW tile and 60GHz divider location on the tile.
Test Objective. DUT Description
4Pacific MicroCHIP Corp. 2008
50
Spectrum
Analyser
G
G
SPitch 123um
Pitch 123um
GG S
50 - 75GHz
Up to 40GHz
G
SPitch 123um
+3.3V
Power
G GS
OPTIONAL
50
+
m
Pad Opening
Dimensions
m
m
Spectrum
Analyser
mm
mm
Signal
Generator
Up to 40GHz
On-wafer Probing Setup For Static Frequency Divider
1 2 3 4 5
1 2 3 4 5
MPW A0816
MPW A0686
10 DUT Tiles from 2 MPW runs
are glued on a blank wafer.
5Pacific MicroCHIP Corp. 2008
Equipment used:
1. Cascade Corp RF probe station and supporting equipment.
2. Agilent 83557A Source Module
3. Agilent 8565EC 50 GHz spectrum analyzer
4. HP 83650B Synthesizer
On-wafer Probing Equipment
6Pacific MicroCHIP Corp. 2008
70GHz Input signal.
NOTE: in order to calculated power level seen by
the IC, subtract 8dB from the source reading.
Divided Output signal.
NOTE: in order to calculated power level at the
IC output, add 5dB from the spectrum analyzer
reading.
Measurement Equipment Readings.
DUT Input And Output
7Pacific MicroCHIP Corp. 2008
Measured Divider Input Power Level vs. Input
Refered Working Frequency
Divider input power level vs. Input refered working frequency
-20
-15
-10
-5
0
5
50 55 60 65 70
Input Reffered working frequency, GHz
Input Power, dBm
DUT #1 MPW A0806
8Pacific MicroCHIP Corp. 2008
Output Power, dBm
-6
-5
-4
-3
-2
-1
0
1
2
50 52 54 56 58 60 62 64 66 68 70
Frequency, GHz
Power, dBm
Output Pow er, dBm
Measured Divider Output Power Level vs. Input
Refered Working Frequency
9Pacific MicroCHIP Corp. 2008
Measured Self-Oscillation Frequency
over Power Supply Voltage
Self Oscillation frequency
64
65
66
67
68
69
70
71
72
73
2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4
Power Supply Voltage, V
Frequency, GHz
Self Oscillation frequency
10Pacific MicroCHIP Corp. 2008
Measured Current Consumption
over Power Supply Voltage
IC current consumption over power supply voltage
0
50
100
150
200
250
300
350
2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4
Power supply voltage, V
Chip Current Consumption, mA
IC Current Consumption
11Pacific MicroCHIP Corp. 2008
Measured Output Power over Power Supply Voltage
in Self-Oscillation Mode
Output power at Self-Oscillation Frequency vs Power Supply Volatage
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4
Power supply voltage, V
Output power, dBm
Output power
12Pacific MicroCHIP Corp. 2008
Conclusion
Divider DUTs are measured and found
operating at expected 60GHz frequency
with sufficient margin up to about 70GHz.