Piezoelectric Material From Bulk to Thin Film...Piezo Material Integration Physical Analysis and Process Cost Analysis Comparison Related Reports About System Plus Piezoelectric Material
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Piezoelectric Devices: From Bulk to Thin-Film 2019 – Market andTechnology Report by Yole Développement
How strongly will piezoelectric’s good vibrations resonate in thedevice market?
KEY FEATURES OF THE REPORT• Introduction to piezoelectric devices• From bulk piezoelectric materials to thin-film materials• 2018 – 2024 market forecasts for piezo devices• Market trends, by device type and product availability• Detailed analysis of the manufacturing process and challenges ahead, including technology roadmaps• Piezoelectric device supply chain
• Bundle offer possible with the Piezoelectric Material From Bulk to Thin Film – Comparison 2019report by System Plus Consulting, contact us for more information.
This review study has been conducted toprovide insights and technology data for alarge range of functions based onpiezoelectric material characteristics.
Piezoelectric materials allow interactionsbetween electronic components and themechanical world, so that actuator andsensor functions can be integrateddirectly with electronic die. That’s whypiezoelectric materials are used in moreand more modules. Traditional productsinclude printheads, ultrasonictransducers, and radiofrequency (RF)filters. New MEMS products includemicrophones and speakers. The reportproposes a study of 16 piezoelectrictechnologies from 16 manufacturersincluding Qualcomm, Broadcom, Qorvo,Panasonic, Silicon Sensing, XAAR-Ricoh,Epson, Fujifilm, Vesper, Usound, Kyocera,Toshiba, OCE, and Paratek.
System Plus consulting has beenperforming reverse engineering andcosting of a large variety of componentsbased on the piezoelectric effect for morethan 10 years. However, only the latestgenerations are presented in this report.This review has been conducted toprovide insights into the structures,technical and design choices of thecomponents at the center of the mostinnovative functions.
We analyzed and compared twoultrasonic sensors, six printheads, fiveMEMS dies and three RF components.
This report contains a physical analysisand a cost estimation of the integration ofpiezoelectric material in a system orwafer. We base our analysis on fullteardowns of the piezoelectric materialand electrodes to unveil the technologicalchoices made by the differentmanufacturers. Finally, it features anexhaustive comparison between thestudied samples, highlighting thesimilarities and differences and theirimpact on cost.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Piezoelectric actuator cross-sections
• Materials analysis
• Manufacturing process flow
• Manufacturing cost analysis
• Physical comparisons
• Cost comparisons
Unique technical and cost review of 16 piezoelectric modules from marketpioneers, including transducers, inkjet dies, MEMS gyroscopes, RF filters, MEMSmicrophones and micro-speakers.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Piezoelectric Material Comparison 2019
Pages: 271
Date: September 2019
Format: PDF & Excel file
Price: EUR 6,490
Piezoelectric Material From Bulk to Thin Film –Comparison 2019
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
o MEMS: Vesper, Panasonic, Silicon Sensing, Usound, Qualcomm 3D
• RF & BAW filter: Qorvo, Broadcom, Paratek
Review
• Printhead Review
• Piezoelectric Component Review
• Piezoelectric Component Wafer Cost Review
*Detailed Table of Contents available on the webpage.
PIEZOELECTRIC MATERIAL FROM BULK TO THIN FILM - COMPARISON 2019
RELATED REPORTS
AUTHORS
Qualcomm 3D Sonic Sensor FingerprintJuly 2019 - EUR 3,990*
Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr SeriesFebruary 2019 - EUR 3,990*
Epson PrecisionCorePrinthead with MicroTFPInkjet DiesSeptember 2018 - EUR 3,990*
Sylvain Hallereau is in chargeof costing analyses for IC,power and MEMS. He has morethan 10 years of experience inpower device manufacturingcost analysis and has studied awide range of technologies.
Véronique Le Troadec has joinedSystem Plus Consulting as alaboratory engineer.She holds a Master degree inMicro-electronics from theUniversity of Nantes.
Guillaume Chevalier has joinedSystem Plus Consulting in early2018 to perform physicalanalyses. He holds a two-yearuniversity degree in technologyof physical measurements andinstru-mentation technics.
LINKED REPORT
Piezoelectric Devices: From Bulk to Thin-Film 2019 – Market and
Technology Report by Yole Développement
Bundle offer possible with the Piezoelectric Material From Bulk to
Thin Film – Comparison 2019, contact us for more information at
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
ParametricCosting Tools
WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
Our analysis is performed with our costing tool MEMS CoSim+.
System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from
single chip to complex structures.
MEMS CoSim+
Cost simulation tool to evaluate the cost of any MEMS process or device.
ORDER FORMPlease process my order for Piezoelectric Material From Bulk to Thin Film – Comparison 2019, Reverse Costing® – Structure, Process & Cost Report Ref: SP19472
Full Structure, Process & Cost Report : EUR 6,490* Annual Subscription offers possible from 3 reports, including this
report as the first of the year. Contact us for more information.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTPIEZOELECTRIC MATERIAL FROM BULK TO THIN FILM - COMPARISON 2019
Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.i-micronews.com. The present document is valid 6 months after its publishing date: September 2019
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Name (Mr/Ms/Dr/Pr): .............................................................
ORDER FORMPlease process my order for Piezoelectric Material From Bulk to Thin Film – Comparison 2019, Reverse Costing® – Structure, Process & Cost Report Ref: SP19472
Full Structure, Process & Cost Report : EUR 6,490* Annual Subscription offers possible from 3 reports, including this
report as the first of the year. Contact us for more information.
SHIP TO
Name (Mr/Ms/Dr/Pr): .............................................................
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTPIEZOELECTRIC MATERIAL FROM BULK TO THIN FILM - COMPARISON 2019
Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: September 2019
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