1 Physical Measurement Laboratory Semiconductor and Dimensional Metrology Division Nanoscale Metrology Group MEMS Measurement Science and Standards Project MEMS 5-in-1 RM Slide Set #1 Reference Materials 8096 and 8097 The MEMS 5-in-1 Test Chips – Overview of the MEMS 5-in-1 RMs Photo taken by Curt Suplee, NIST
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Physical Measurement Laboratory Semiconductor and Dimensional Metrology Division
MEMS 5-in-1 RM Slide Set #1. Reference Materials 8096 and 8097 The MEMS 5-in-1 Test Chips – Overview of the MEMS 5-in-1 RMs. Physical Measurement Laboratory Semiconductor and Dimensional Metrology Division Nanoscale Metrology Group MEMS Measurement Science and Standards Project. - PowerPoint PPT Presentation
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Physical Measurement Laboratory Semiconductor and Dimensional Metrology DivisionNanoscale Metrology GroupMEMS Measurement Science and Standards Project
MEMS 5-in-1 RM Slide Set #1
Reference Materials 8096 and 8097The MEMS 5-in-1 Test Chips
– Overview of the MEMS 5-in-1 RMs
Photo taken by Curt Suplee, NIST
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List of MEMS 5-in-1 RM Slide SetsSlide Set # Title of Slide Set
1 OVERVIEW OF THE MEMS 5-IN-1 RMs2 PRELIMINARY DETAILS
THE MEASUREMENTS:3 Young’s modulus measurements4 Residual strain measurements
8 Residual stress and stress gradient calculations
9 Thickness measurements (for RM 8096)
10 Thickness measurements (for RM 8097)
11 REMAINING DETAILS
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Outline for theOverview of the MEMS 5-in-1 RMs
1 Background
2 The MEMS 5-in-1 RM a. What is it? b. The 5 Standard Test Methods c. Uses of the MEMS 5-in-1 RM
3 Some Specifics a. The 2 Types of Chips b. The Packaging c. The Chip Designs d. 8 Properties Reported e. Example NIST Reference Values
4 Material Available
5 Instrumentation
6 Summary7 References
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Why is MEMS Important?• A $10.2B industry (in 2011)
– Yole forecasts $21.1B industry (in 2017) – doubled from 2011– Growth rate (13 %/year) is healthy
• MEMS being pulled into the market (esp. via the consumer market)• Spread out over many (say 100) smaller companies
– MEMS acquisitions have soared in 2011 (>300 % increase)
• MEMS is an enabling technology– Improved medical device performance
• In-vitro diagnostics• Micro dispensers for drug delivery• Accelerometers in pacemakers• Wireless implants
– Puts the “Smart” in Smart Phones• Accelerometers, gyros, pressure sensors, microphones,…• The future will see combination sensors
– Etc.
• As the field continues to grow, NIST can facilitate the introduction of product data sheets to allow inter-comparisons of consumer products.
“MEMS Technology has the potential to change our daily lives as much as the
computer has.”
(Are we there yet?)
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MEMS = microelectromechanical systems
5-in-1 = test structures for five standard test methods on one physical test chip
1. Young’s modulus (SEMI MS4)2. Residual strain (ASTM E 2245)3. Strain gradient (ASTM E 2246)4. Step height (SEMI MS2)5. In-plane length (ASTM E 2244)
RM = Reference Material: a material or substance one or more of whose property values are sufficiently homogeneous, stable, and well established to be used for the calibration of an apparatus, the assessment of a measurement method, or for assigning values to materials.
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The MEMS 5-in-1 RM(What is it ?)
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The 5 Standard Test Methods
Calculations performed on the MEMS Calculator website (Standard Reference Database 166)
These standards include precision and bias data (so considered validated standards)
– Who may want to buy in bulk to sell with their instruments
•IC and MEMS foundries and services
Uses of the MEMS 5-in-1• To validate use of the documentary standards
(so companies can compare their in-house measurements taken on the RM with NIST measurements)• To characterize or validate a process• To take local measurements • To compare measurements meaningfully (e.g., between suppliers and customers)• To trouble-shoot a process (to improve yield and track failure sources to speed development)• To calibrate an instrument
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Photo taken by Curt Suplee, NIST
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The 2 Types of Chips• RM 8097
– Fabricated using a polysilicon multi-user surface-micromachining MEMS process with a backside etch
– Material properties of the first or second polysilicon layer are reported
– Chip dimensions: 1 cm x 1 cm
• RM 8096– Fabricated on a multi-user
1.5 µm CMOS process followed by a bulk-micromachining etch
– Material properties of the composite oxide layer are reported
The Chip DesignsEach RM has 6 sections1.Young’s modulus (uses SEMI standard MS4)2.Residual strain (uses ASTM standard E 2245)3.Strain gradient (uses ASTM standard E 2246)4.Step height (uses SEMI standard MS2)5.In-plane length (uses ASTM standard E 2244)6.Certification Plus
RM 8097RM 8096
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8 Properties Reported[using 5 Test Methods (TMs)]
1. Young’s modulus (uses SEMI standard MS4)2. Residual strain (uses ASTM standard E 2245)3. Strain gradient (uses ASTM standard E 2246)4. Step height (uses SEMI standard MS2)5. In-plane length (uses ASTM standard E 2244)6. Residual stress (calculations in Young’s modulus TM SEMI MS4)7. Stress gradient (calculations in Young’s modulus TM SEMI MS4)8. Beam thickness
a. For RM 8096 [uses step height TM (SEMI MS2) with electro-physical technique]b. For RM 8097 [uses step height TM (SEMI MS2) with opto-mechanical technique]
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MeasurementNIST Reference Value
± Expanded Uncertainty(for k=2 for ≈95 % confidence)
1. Effective Young’s modulus, E 56.6 GPa ± 17.8 GPa
2. Effective residual strain, r –2.83×10–3 ± 0.71×10–3
7. Effective stress gradient, g 62.3 TPa/m ± 18.9 TPa/m
8. Thickness, toxide 2.65 µm ± 0.20 µm
Example NIST Reference Values for RM 8096
NOTE: Effective values are reported if there are non-idealities associated with the geometry and/or composition of the test structures.
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Material Available • NIST SP 260-177: A User’s Guide (2013 Edition)• The 5 standard test methods• Data analysis sheets
– On the MEMS Calculator website (Standard Reference Database 166)– Accessible via the NIST Data Gateway (http://srdata.nist.gov/gateway/)
with the keyword “MEMS Calculator”– Performs the calculations and verifies the data
• Report of Investigation (ROI)– Includes NIST Reference Values:
• A best estimate of the true value provided on a NIST Certificate/Certificate of Analysis/Report of Investigation where all known or suspected sources of bias have not been fully investigated by NIST
• RM 8096: When applicable platforms are not reflective• RM 8097: For measurement of A (for a lower uncertainty value), if used
C
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References• Overview articles1. J. Cassard, J. Geist, and J. Kramar, “Reference Materials 8096 and 8096 – The Microelectromechanical Systems 5-in-1 Reference
Materials: Homogeneous and Stable,” More-Than-Moore Issue of ECS Transactions, Vol. 61, May 2014.2. J. Cassard, J. Geist, C. McGray, R. A. Allen, M. Afridi, B. Nablo, M. Gaitan, and D. G. Seiler, “The MEMS 5-in-1 Test Chips
(Reference Materials 8096 and 8097),” Frontiers of Characterization and Metrology for Nanoelectronics: 2013, NIST, Gaithersburg, MD, March 25-28, 2013, pp. 179-182.
3. J. Cassard, J. Geist, M. Gaitan, and D. G. Seiler, “The MEMS 5-in-1 Reference Materials (RM 8096 and 8097),” Proceedings of the 2012 International Conference on Microelectronic Test Structures, ICMTS 2012, San Diego, CA, pp. 211-216, March 21, 2012.
• User’s guide4. J.M. Cassard, J. Geist, T.V. Vorburger, D.T. Read, M. Gaitan, and D.G. Seiler, “Standards Reference Materials: User’s Guide for
RM 8096 and 8097: The MEMS 5-in-1, 2013 Edition,” NIST SP 260-177, February 2013 (http://dx.doi.org/10.6028/NIST.SP.260-177).
• Standards5. SEMI MS4-0212, “Test Method for Young’s Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in
Resonance,” February 2012. (Visit http://www.semi.org for ordering information.)6. SEMI MS2-0212, “Test Method for Step Height Measurements of Thin Films,” February 2012. (Visit http://www.semi.org for ordering
information.)7. ASTM E 2245-11, “Standard Test Method for Residual Strain Measurements of Thin, Reflecting Films Using an Optical
Interferometer,” December 2011. (Visit http://www.astm.org for ordering information.)8. ASTM E 2246-11, “Standard Test Method for Strain Gradient Measurements of Thin, Reflecting Films Using an Optical
Interferometer,” January 2012. (Visit http://www.astm.org for ordering information.)9. ASTM E 2244-11, “Standard Test Method for In-Plane Length Measurements of Thin, Reflecting Films Using an Optical
Interferometer,” December 2011. (Visit http://www.astm.org for ordering information.)
• Thickness articles10. J.C. Marshall and P.T. Vernier, “Electro-physical technique for post-fabrication measurements of CMOS process layer
thicknesses,” NIST J. Res., Vol. 112, No. 5, pp. 223-256, 2007.11. J.C. Marshall, “New Optomechanical Technique for Measuring Layer Thickness in MEMS Processes,” J. of Microelectromechanical
Systems, Vol. 10, No. 1, pp. 153-157, March 2001.
• Fabrication12. The RM 8096 chips were fabricated through MOSIS on the 1.5 µm On Semiconductor (formerly AMIS) CMOS process. The URL
for the MOSIS website is http://www.mosis.com. The bulk-micromachining was performed at NIST.13. The RM 8097 chips were fabricated at MEMSCAP using MUMPs-Plus! (PolyMUMPs with a backside etch). The URL for the