General Application Discretes H Philips Discrete Semiconductors Hamburg Sheet 1/12 Philips Discrete Semiconductors Whisker Test Results Update Philips fail criteria: Whiskerlength > 50μm • Room temperature storage: 2 years. Please refer to the pictures attached. Test is continued. • Storage at 55°C uncontrolled humidity: 2 years. Please refer to the pictures attached. Test is stopped as storage at 55°C is not an acceleration test for whiskers. • Storage at 55°C and 85% humidity: 2000h. Please refer to the pictures attached. No significant whiskers have been found
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General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 1/12
Philips Discrete Semiconductors Whisker Test Results Update
Philips fail criteria: Whiskerlength > 50µm
• Room temperature storage: 2 years. Please refer to the pictures attached. Test is continued.
• Storage at 55°C uncontrolled humidity: 2 years.
Please refer to the pictures attached. Test is stopped as storage at 55°C is not an acceleration test for whiskers.
• Storage at 55°C and 85% humidity: 2000h. Please refer to the pictures attached.
à No significant whiskers have been found
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 2/12
Qualification Results for CPCN 200205014F Lead-free Plating
Type: PDTC144EK in SC59 package Batches: 3 assembly lots pure tin plated leads + 1 reference lot plated Sn/Pb 80/20 # Test Conditions c/n 1 Electrical
characterisation according to type specification 0/320
2 Preconditioning JESD22-A113-C but with 260°C reflow profile and Sn/Ag/Cu paste, MSL 1
0/960
3 HTRB Ta=150°C, Vce=48V, Veb=2V tt = 1000hrs 0/320 4 RBT Ta=85°C, Hrel=85%, Vce=48V, Veb=2V tt = 4000hrs 0/320 5 Autoclave Ta = 121°C, Hrel=100% tt = 288hrs 0/320 6 TCT -65°C ... 150°C, tt = 4000 cycles 0/320 7 Solder heat 260°C, 10sec 0/120 8 Solderability after aging Sn/Ag/Cu solderpaste and lead-free reflow profile 0/120 9 Solderability after aging Sn/Pb 63/37 solderpaste and standard reflow profile 0/120 10 Wetting Balance Test Sn/Ag/Cu testingpellets at 245°C 0/80 11 Wetting Balance Test Sn/Pb 60/40 testingpellets at 235°C 0/80 12 Whiskergrowth Storage at 55°C dry heat 2 years 0/30 13 Whiskergrowth Storage at 55°C 85% Hrel 2000h 0/30 14 Whiskergrowth Ongoing storage at roomcondition 2 years 0/30 15 Physical analysis Cross sections 0/30 Type: PDTC144EEF in SC89 package Batches: 3 assembly lots pure tin plated leads + 1 reference lot plated Sn/Pb 80/20 # Test Conditions c/n 1 Electrical
Characterisation according to type specification 0/320
2 Preconditioning JESD22-A113-C but with 260°C reflow profile and Sn/Ag/Cu paste, MSL 1
0/960
3 HTRB Ta=150°C, Vce=48V, Veb=2V tt = 1000hrs 0/320 4 RBT Ta=85°C, Hrel=85%, Vce=48V, Veb=2V tt = 4000hrs 0/320 5 Autoclave Ta = 121°C, Hrel=100% tt = 288hrs 0/320 6 TCT -65°C ... 150°C, tt = 4000 cycles 0/320 7 Solder heat 260°C, 10sec 0/120 8 Solderability after aging Sn/Ag/Cu solderpaste and lead-free reflow profile 0/120 9 Solderability after aging Sn/Pb 63/37 solderpaste and standard reflow profile 0/120 10 Wetting Balance Test (1) Sn/Ag/Cu testingpellets at 245°C na 11 Wetting Balance Test (1) Sn/Pb 60/40 testingpellets at 235°C na 12 Whiskergrowth Storage at 55°C dry heat 2 years 0/30 13 Whiskergrowth Storage at 55°C 85% Hrel 2000h 0/30 14 Whiskergrowth Ongoing storage at roomcondition 2 years 0/30 15 Physical analysis Cross sections 0/30 Note 1: Not applicable for SC89 due to too short leads. Updated: Thomas Unger, 04. Dec. 2003
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 3/12
PDTC144EK in SC59: Investigation whiskers. All 3 batches show no whiskergrowth even after 1 year storage @ room condition Batch 1 Batch 1
Batch 2 Batch 2
Batch 3 Batch 3
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 4/12
PDTC144EK in SC59: Investigation whiskers. All 3 batches show no significant whiskergrowth even after 2 years storage @ room condition Batch 1 Batch 1
Batch 2 Batch 2
Batch 3 Batch 3
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 5/12
PDTC144EEF in SC89: Investigation whiskers. All 3 batches show no whiskergrowth even after 1 year storage @ room condition Batch 1 Batch 1
Batch 2 Batch 2
Batch 3 Batch 3
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 6/12
PDTC144EEF in SC89: Investigation whiskers. All 3 batches show no whiskergrowth even after 2 years storage @ room condition Batch 1 Batch 1
Batch 2 Batch 2
Batch 3 Batch 3
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 7/12
PDTC144EK in SC59: Investigation whiskers. All 3 batches show no whiskergrowth even after 1 year storage @ 55°C dry heat Batch 1 Batch 1
Batch 2 Batch 2
Batch 3 Batch 3
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 8/12
PDTC144EK in SC59: Investigation whiskers. All 3 batches show no whiskergrowth even after 2 years storage @ 55°C dry heat Batch 1 Batch 1
Batch 2 Batch 2
Batch 3 Batch 3
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 9/12
PDTC144EEF in SC89: Investigation whiskers. All 3 batches show no whiskergrowth even after 1 year storage @ 55°C dry heat Batch 1 Batch 1
Batch 2 Batch 2
Batch 3 Batch 3
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 10/12
PDTC144EEF in SC89: Investigation whiskers. All 3 batches show no whiskergrowth even after 2 years storage @ 55°C dry heat Batch 1 Batch 1
Batch 2 Batch 2
Batch 3 Batch 3
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 11/12
PDTC144EK in SC59: Investigation whiskers. All 3 batches show no whiskergrowth even after 2000h storage @ 55°C and 85% Hrel Batch 1 Batch 1
Batch 2 Batch 2
Batch 3 Batch 3
General Application Discretes H Philips Discrete Semiconductors Hamburg
Sheet 12/12
PDTC144EEF in SC89: Investigation whiskers. All 3 batches show no whiskergrowth even after 2000h storage @ 55°C and 85% Hrel Batch 1 Batch 1