PDR IR-E3 EvolutionBGA Rework System
PDRs Focused IR SMT/BGA Rework Systemfor Ultimate Performance in BGA Rework
PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
Advanced features available
FocusedIRcomponentheating PDRspatentedtool-freeIRtechnology
QuartzIRPCBpreheater Largearea2000wIRheating Optional750w,1600wor2400w
AdvancedPrecisioncomponent pickandplacement Liftfromcomponentnestpluslowforcelanding androtation
Componentnest/fluxapplicationfacility Usingfluxdiptrayorcomponentprintframe
PrecisionX/YPCBtable Macro-Micromovementandmicrometer adjustment
Auto-profileprocesscontrolpackage WithPDRsThermoActiveV4+softwaresuite
BGA/BGAalignment Highmagnification,CCTV/prismbasedsystem
AuxiliaryProcessCamera(Optional) Highmagnification,CCTV/prismbasedsystem
Non-contactcomponent temperaturesensing Realtimemeasurementofcomponent temperatures
PrecisionPCBtemperaturesensing Contactornon-contacttemperaturesensors
AutoLiftPick-Up(Optional) Automaticremovalofcomponent
PCBCooling(Optional) ForfastcoolingofLED-Freeassemblies
BGAreworkwithoutthecomplications
ThePDRIR-E3SMT/BGAreworksystem,usingPDRspatentedFocusedIRtechnology,hasbeenspecificallydesignedtocopewiththechallengesofrepairingtodaysPCBassemblies.
Thesystemistoolfree,gasfree,instantly/preciselycontrollable,clean,modular,upgradeableandproduces100%yieldBGAreworkwithoutanycomplications.Itprovidestheextremelyhighlevelsofprofilingandprocesscontrolnecessaryfortheeffectivereworkofeventhemostadvancedpackages,includingSMDs,BGAs,CSPs,QFNs,Flipchipsandisreadyfor0201andlead-freeapplications.
TheIR-E3canbeeasilyconfiguredtoyourrequirements,withagoodrangeofadvancedfeaturestochoosefrom,allowingtheoperatortoquicklyandsafelyreworkalltypesofcomponentswithoutoverheatingthecomponent,adjacentsorthePCB.ItusesalltheprovenattributesofPDRsFocusedIRtechnology,firstintroducedin1987andnowusedworldwidebyover4000customers.
SimpleBGAreworkprocedure
BGAreworkposestheproblemofaccessinghiddeninterconnectsinahighdensityenvironment.Consequently,itrequiresasystemthatisabletoaccessthehiddenjointswithoutaffectingneighbouringcomponents.Asystemthatissafe,gentle,adaptableand,aboveall,simpletooperate.TheIR-E3issuchasystem.ItissoeasytooperatethattechniciansareabletoinstantlyachieveexcellentprocesscontrolforBGA/SMTreworkwithoutthecomplexitiesandfrustrationsnormallyassociatedwithhigh-endreworksystems.
Paste-Place-Reflow
Withtheaidofexcellentmechanics,opticsandcontrol,operatorscansimplypickupthefluxedBGAfromthenest,alignit,placeitontothePCBspadsandthenreflowwiththesystemsaccuratePCbased,closedloopcomponentandPCBtemperaturecontrol.
PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
AdvancedFocusedIRcomponentheating 150W,lensbasedFocusedIRheatingwithadjustableimagesystem PDRlensattachmentswithIRimagefrom4to70mmdiameter ReworksallSMDs/BGAsincluding0201s+leadfreeapplications
QuartzIRPCBpreheating Highpower,mediumwavequartzIR Standard2000W,2x1000Wzones(240mmx240mmarea) Optional750W,singlezone(120mmx120mmarea) Optional1600W,2x800Wzones(240mmx240mmarea) Optional2400W,2zones,800w+1600W(240mmx360mmarea)
PDRlensattachments F150(4-18mmspotsize)optional F200(10-28mmspotsize)optional F400(12-35mmspotsize)optional F700(25-70mmspotsize)standard
AdvancedProfessionalvacuumplacementsystem Withprecisepickandplaceaction,Y/Zaxismovementand rotationsoftcomponentlandingandZ-axisstopforplacement inpaste Interchangeablepick-upheadsfordifferentapplications
Componentnestforprecisioncomponentpick upandFluxapplication Withcomponentprintframe,diptray,orministencilpaste-head facilityforfluxandsolderpasteapplication
Precisionmacro-microX/YPCBtable Precisionmicrometer(micro)X/Yandmicrorotationcontrol +/-10microns(.0004)movementinX/Ydirections MacrooverridefacilityinX/Ydirections Upto12X18(300mmX450mm)capacitywith lockableX/Yaxis
Componenttemperaturesensing Non-contact,IRsensor Manuallyadjustable,K-typenon-contactIRsensor Realtimemonitoringofcomponenttemperature throughoutprocess
PCBtemperaturesensing Contactoroptionalnon-contactsensors Manuallyattached,K-typethermocouplecontactprobe,or manuallyadjustable,K-typenon-contactIRsensor RealtimemonitoringofPCBtemperaturethroughoutprocess
Detailsandspecificationsofadvancedfeaturesavailable
Autoprofileprocesscontrolwith PDRThermoActivesoftwaresuite Type5,digitalcontrollerwithmultifunctionalfeatures Advanced,WindowsXP/Vista/NTThermoActiveV4+softwaresuite Twochannel,realtime,closedloopcomponentandPCB temperaturecontrol Auto-profiletemperatureprofilinganddatalogging MultiK-typethermocouple(x4)capacityfortemp/timetesting
CCTV/prismbasedBGA/uBGAalignmentsystem Splitbeamprismsystemforsimultaneous PCB/componentviewing BGA,CSPandleadlesscomponentalignment IntegralLEDlightingsystemwithilluminationlevelcontrol Fullcolour1/2CCTVcameraand17TFT/LCDFlatscreen colourmonitor HighqualityzoomlenswithuptoX50magnification PreciseX/Yaxismountingsystem
Auxiliaryprocessobservationcamera(optional) IntegralLEDlightingsystemwithilluminationlevelcontrol Fullcolour1/2CCTVcameraand17TFT/LCDFlatscreen colourmonitor HighqualityzoomlenswithuptoX40magnification
BenchTopRequirementsTopheatpower 150WIR
Backheaterpower 750W,1600W,2000Wor2400WIR
Voltage/frequency 220-240volts50/60Hz,upto2.6KW
Typicalcomponents CSPs,BGAs,uBGAs,QFNs,QFPs,PLCCs,SOICs,smallSMDs
Bencharea 1400mm(w)x600mm(d)
Weight 65Kg
Theabovefeaturesaremostlyoptionalandalso,PDRreservestherighttoimproveorchangespecificationswithoutgivingnotice.
PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
PDRPioneersofFocusedIRtechnology
In1986,PDRpioneeredtheuseofFocusedInfra-
Redtechnologyforreworkapplications.Today,
over4000systemshavebeeninstalledaroundthe
worldatOEMsandEMSprovidersactiveinthe
defence,aerospace,automotive,avionics,telecoms
andcomputerindustries.Companiessuchas
NASA,Boeing,Nokia,Alcatel,Sony,Motorola,
Philips,Dell,IBMandEADS,tonamebutafew,
relyeverydayonPDRsFocusedIRtechnology
todeliversimple,safeandrepeatablerework.
Withtheevolutionofincreasinglycomplex
boards,theongoingminiaturisationof
componentsandlead-freesolders,PDRsFocused
IRtechnologyisrapidlysupersedinghotgas
astheplatformofchoiceforOEMsandEMS
providers.Highlevelsofprofilingandprocess
controlmakeFocusedIRtheperfectchoiceto
handlethenarrowerprocesswindowoflead-
freeanddeliverthe100%yieldmanufacturers
demand.
PDRsFocusedIRdelivers100%yieldBGArework
PDRsFocusedIRreworksystemsprovide
highqualityresultsonbothstandardand
fine-pitchcomponents,arraypackagesand
alllead-freedevices.FocusedIRisable
topinpointthesmallestcomponentina
high-densityenvironmentandprovidethe
operatorwithaclearviewofboththe
PCBandthecomponentthroughoutthe
process,makingthisthebestchoiceforall
reworkapplications.
PDRsprocessinvolvespre-heatingthePCBfrombelowwithaback
heaterandthenheatingthecomponentfromabove.Thisreducesthe
timeandenergyrequiredfortopsideheating,therebyminimisingthe
potentialfordamagetothecomponent,thePCBoradjacentdevices.
PDRsclosedlooptemperaturemonitoringsystem,withanon-contact
IRsensor,makestheprocesshighlycontrollableandrepeatable,
producinghighqualitysolderjointseverytime.
PDRsystems-flexible,modularandupgradeable
PDRsversatilesystemsrangefromaFocused
IRhandtoolrightthroughtosemi-automated,
advancedreworkstations.Theyalsoinclude
systemsdesignedspecificallyforsmalltolarge
applications.EachFocusedIRsystemoffers
anexcellentlevelofstandardfeatures,plus
optionstosuiteverybudget.PDRssystems
aremodularandeasilyupgraded,allowingyou
toaddtheextrafunctionalityyouneedasyour
requirementschange.
PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
TheadvantagesofFocusedIR
FocusedIRcomponentheatingPrecisecomponentheatingeliminatestheriskofdamagetothePCB/adjacents
Nonozzles,focushoodsorshieldsAsimpleturnofthelensallowsforeasyreworkofanysize/shapecomponent
LowcostofownershipCompetitivesystempricingandnearlyzerofollow-oncosts
ModularandupgradeablesystemsEasilyconfiguredtomeetanyrequirementsasyourdemandsexpand
ExcellentcontrolsoftwareNon-contact,componenttemperaturesensingandautomaticthermalprofiling
Easytoset-upanduseClean,simpleandsafe.Easeofusedelivers100%yield
ThebestBGAreworksystemsintheworld
Forovertwentyyearswehavecontinuallypushedtheboundariesofrefinedreworksystems.Ourcleanandintuitiveheatingtechnologycombineswithitsunmatchedcontrolandsolderingability,tobecomeoneofthemosteffectiveinnovationsinourindustry.
AnotherdevelopmentfromPDRisourhighresolutionCCTV/splitbeamprism-basedBGAalignmentoption,whichallowstheoperatortoviewthePCBandcomponentsimultaneouslywithacolourvideomonitorandzoomlens.
AddtothisPDRssuperbprecisionmechanics,whichprovideoperatorswithvacuum-operatedpickup,macro-microZaxis,360componentrotationandmicrometercontrolforsoftcomponentlanding,andyouhaveunbeatablereworksystemsthatprovide100%yieldonallSMT/BGAreworkapplications.
Leading-edgecontrolsoftware
AmajoradvantageinchoosingPDRsFocusedIRreworksystemsistheThermoActiveV4+autoprofilingsoftwaresuite.Ithasbeendesignedtobeasuser-friendlyaspossible,withexcellentgraphicsandsimple,logicalcontrols.
TheoperatorsetsthetemperaturetargetandtheThermoActiveV4+softwaremanagestheheatingprocess,ensuringthattheheatappliedtothePCBandcomponentisprecise.Particularlybeneficialforthedemandsoflead-free,thermalprofilesfordifferentassembliescanbeautomaticallycreatedwithinminutesandstoredforfutureuse.
PDR
PDR-DesignandManufacturingUnit3StanleyCentre,KelvinWayCrawley,WestSussex,RH109SE,England
T:+44(0)1293614000F:+44(0)1293613600E:[email protected]
PDR America - Sales/Support Center
3869DividendDrive,ShingleSprings,CA95682,USAT:(530)6766262F:(530)6766265E:[email protected]
PDRsproductsareavailableworldwideviaourinternationaldistributors,allofferingprofessionalsalesandsupport.Forcontact,productandcompanydetailspleasevisitwww.pdr-rework.com
www.pdr-rework.com