FEATURES AND BENEFITS Molex adds Intel*-approved LGA 1155 socket assemblies to its extended series of high-performance Land Grid Array (LGA) CPU sockets Known as Socket H2, the LGA 1155 CPU socket is used with Intel’s “2nd Generation Core* i7/i5/i3 series” of desktop microprocessors codenamed Sandy Bridge. This 1155-circuit socket is a replacement of its predecessor – the LGA 1156 Socket (or Socket H1) – which mates with the Nehalem processor. Sandy Bridge is a hallmark of Intel’s 32nm microarchitecture technology with highly acclaimed features of “breakthrough performance and capabilities”. The LGA 1156 and LGA 1155 sockets have similar features such as the same pitch size of 0.9144mm (.036"); I/O, power and ground contacts for the proces- sors they mate to; and a grid array of 40 by 40 with 24 by 16 grid depopulation in the center of the array. Both sockets have contacts arranged in two opposing L-shaped patterns within the grid array for maintenance of electrical contact under processor-load conditions. These sockets use high strength copper alloy as base contact material to ensure reliable physical contact with their respective LGA land packages, and are designed to withstand typical reflow conditions. These LGA sockets have lead-free solder balls on the underside for surface mounting on the motherboard. An Independent Loading Mechanism (ILM) - usable with each of the two sockets and secured to the PCB by means of a base plate - provides the force needed to seat the processor onto the socket and distributes the resulting compressive load evenly through the socket solder joints. Both LGA1155 and LGA1156-based processors are not compatible between sockets due to electrical, mechanical, and keying differences. Besides their different Alignment Post Void configurations, the distance from the center of the alignment post to the socket center has shifted from 9.0mm (.354") for Socket H1, to 11.5mm (.453") for Socket H2. Their similar 3- piece design (comprising socket, Integrated Loading Mechanism (ILM) and back plate), however, provides easy transfer of useful socket features and advantages from one generation of socket to the next. Molex’s newly released LGA 1155 socket assemblies (47596-0232 and 47596-0233) and new LGA 1156 product extensions (47596-0532 and 47596-0533), come in (respectively) 15 and 30 micron gold-plating contact versions. All these have a common alignment-key height of 2.10mm (.083") to accommodate an additional (and optional) ILM pick-and-place cover. Other new socket components added to the series 47596 family are: LGA 1155 and LGA1156 Pan and Shoulder Screws for 1U Servers. These feature 5.60mm (.220") and 4.22mm (.166") Thread sizes respectively, and are both lead-free. For additional information visit our website at: www.molex.com/link/lga1155and1156.html. • Satisfies all requirements in Intel’s “Desktop Sandy Bridge Processor and LGA1155 Socket, Thermal Mechanical Specifications and Design Guidelines” (Revision 1.5, October 2010). The LGA 1155 socket supports the Intel ® Core™ i7/ i5/i3 processors with thermal design power of 95W or less, including: Sandy Bridge Desktop processor with 4 cores and integrated graphics; Sandy Bridge Desktop processor with 4 cores and no inte- grated graphics, and Sandy Bridge Desktop processor with 2 cores and integrated graphics LGA 1155/1156 Desktop PC CPU Sockets 47596 LGA 1155 / 1156 Desktop PC CPU Sockets Series 47596 LGA 1155 / 1156 Processor Sockets with Pick-and-Place Cap complete with Independent Loading Mechanism (ILM) Assembly • Similar 3-piece (socket, ILM and back plate) design as in LGA 1156 facilitates easy assembly of new processor to LGA 1155 socket with no re-learning processes needed • Visible pin-1-identification triangle on housing corner ensures correct CPU loading with indication mark closest to socket pin marked “A1” (Refer Sales Drawing) • Differentiated key-alignment posts on socket ensures mating compatibility with correct CPU; prevents mis-mating with Intel’s 1156-pin Nehalem processor • High-temperature thermoplastic housing with UL 94 V-0 flame rating withstands lead-free processing temperatures typical with reflow profile • Strong pick-and-place cover-to- socket retention helps prevent socket contacts from damage during board shipping and handling; and ensures sufficient support for socket weight during lifting, translation, and placement on, or assembly of PCB *Intel, Nehalem, Sandy Bridge, LGA 1155 (Socket H2), LGA 1156 (Socket H1), ILM, Core™ i-series (Core i3/i5/i7) and relevant names are either trademarks or registered trademarks of Intel Corporation
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FEATURES AND BENEFITS
Molex adds Intel*-approved LGA 1155 socket assemblies to its extended series of high-performance Land Grid Array (LGA) CPU sockets
Known as Socket H2, the LGA 1155 CPU socket is used with Intel’s “2nd Generation Core* i7/i5/i3 series” of desktop microprocessors codenamed Sandy Bridge. This 1155-circuit socket is a replacement of its predecessor – the LGA 1156 Socket (or Socket H1) – which mates with the Nehalem processor. Sandy Bridge is a hallmark of Intel’s 32nm microarchitecture technology with highly acclaimed features of “breakthrough performance and capabilities”.
The LGA 1156 and LGA 1155 sockets have similar features such as the same pitch size of 0.9144mm (.036"); I/O, power and ground contacts for the proces-sors they mate to; and a grid array of 40 by 40 with 24 by 16 grid depopulation in the center of the array. Both sockets have contacts arranged in two opposing L-shaped patterns within the grid array for maintenance of electrical contact under processor-load conditions. These sockets use high strength copper alloy as base contact material to ensure reliable physical contact with their respective LGA land packages, and are designed to withstand typical reflow conditions. These LGA sockets have lead-free solder balls on the underside for surface mounting on the motherboard. An Independent Loading Mechanism (ILM) - usable with each of the two sockets and secured to the PCB by means of a base plate - provides the force needed to seat the processor onto the socket and distributes the resulting compressive load evenly through the socket solder joints.
Both LGA1155 and LGA1156-based processors are not compatible between sockets due to electrical, mechanical, and keying differences. Besides their different Alignment Post Void configurations, the distance from the center of the alignment post to the socket center has shifted from 9.0mm (.354") for Socket H1, to 11.5mm (.453") for Socket H2. Their similar 3- piece design (comprising socket, Integrated Loading Mechanism (ILM) and back plate), however, provides easy transfer of useful socket features and advantages from one generation of socket to the next. Molex’s newly released LGA 1155 socket assemblies (47596-0232 and 47596-0233) and new LGA 1156 product extensions (47596-0532 and 47596-0533), come in (respectively) 15 and 30 micron gold-plating contact versions. All these have a common alignment-key height of 2.10mm (.083") to accommodate an additional (and optional) ILM pick-and-place cover.
Other new socket components added to the series 47596 family are: LGA 1155 and LGA1156 Pan and Shoulder Screws for 1U Servers. These feature 5.60mm (.220") and 4.22mm (.166") Thread sizes respectively, and are both lead-free.
For additional information visit our website at: www.molex.com/link/lga1155and1156.html.
• Satisfies all requirements in Intel’s “Desktop Sandy Bridge
Processor and LGA1155 Socket, Thermal Mechanical Specifications and Design Guidelines” (Revision 1.5, October 2010). The LGA 1155 socket supports the Intel® Core™ i7/i5/i3 processors with thermal design power of 95W or less, including: Sandy Bridge Desktop processor with 4 cores and integrated
graphics; Sandy Bridge Desktop processor with 4 cores and no inte-
grated graphics, and Sandy Bridge Desktop processor with 2 cores and integrated graphics
LGA 1155/1156 Desktop PC CPU Sockets
47596 LGA 1155 / 1156 Desktop PC CPU Sockets
Series 47596 LGA 1155 / 1156 Processor Sockets with
Pick-and-Place Cap complete with Independent Loading Mechanism
(ILM) Assembly
• Similar 3-piece (socket, ILM and back plate) design as in LGA 1156 facilitates easy assembly of new processor to LGA 1155 socket with no re-learning processes needed
• Visible pin-1-identification triangle on housing corner ensures correct CPU loading with indication mark closest to socket pin marked “A1” (Refer Sales Drawing)
• Differentiated key-alignment posts on socket ensures mating
compatibility with correct CPU; prevents mis-mating with Intel’s 1156-pin Nehalem processor
• High-temperature thermoplastic housing with UL 94 V-0 flame rating withstands lead-free processing
temperatures typical with reflow profile
• Strong pick-and-place cover-to-socket retention helps prevent socket contacts from damage during board shipping and handling; and ensures sufficient support for socket weight during lifting, translation, and
placement on, or assembly of PCB
* Intel, Nehalem, Sandy Bridge, LGA 1155 (Socket H2), LGA 1156 (Socket H1), ILM, Core™ i-series (Core i3/i5/i7) and relevant names are either trademarks or registered trademarks of Intel Corporation
APPLICATIONS
SPECIFICATIONS
LGA 1155/1156 Desktop PC CPU Sockets
Reference Information
Packaging (Sockets): JEDEC Hard Tray (Screws): Bag