Packaging - Milwaukee School of EngineeringPackaging •Die Bond Pad Lead Frame. Packaging •Die Bond Pad. Packaging •Micro-Electro-Mechanical Device. T. Packaging = = = ...

Packaging

Last updated 6/17/19

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• Chip Resistor

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• Chip Capacitor

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System Design

• Chip Inductor

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• Die Bond PadLead Frame

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• Die Bond Pad

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• Die Bond Pad

video

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• TO – Transistor Outline

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• PDIP – Plastic Dual Inline Package

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• SOT – Standard Outline Transistor

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• SSOP – Shrink Small Outline

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• TSOP – Thin Small Outline

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• TQFP – Thin Quad Flat

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• PLCC – Plastic Leaded Chip Carrier

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• Ball Grid Array (BGA)

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• Ball Grid Array (BGA)

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• Flip Chip BGA/CSP (Chip Scale Package)

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• Stacked CSP

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• Flip Chip Stacked

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• Package on Package (PoP)

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• Wafer level CSP

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• Stacked Package

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• SiP – System in Package

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• SiP – System in Package

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• Silicon Through Vias

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• Micro-Electro-Mechanical Device

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• SMT Carriers

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• Power Dissipation

• Power dissipated in a part that is not provided to some load is converted into heat

• Electrical Analogy• Temp (ΔT) <-> Voltage

• Heat Flow (Q) <-> Current

• Thermal Resistance (θ) <-> Electrical Resistance

• Where Q corresponds to power dissipated

TA – Ambient Temperature

TPart – Part Temperature

θQ

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Packaging

• Power Dissipation

θTA – Ambient Temperature

TPart – Part Temperature

PD

A regulator has a θ = 50°C/W

If it dissipates 1W in an area where the ambient temperature is 27°C

Its temperature will be: Tpart = (Pd x θ) + TA =

(1W x 50°C/W) + 27°C = 77°C

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Packaging

• Power Dissipation

• Semiconductor devices are typically characterized by two thermal resistances

• θJC – thermal resistance from the junction to the case

• θCA – thermal resistance from the case to the ambient

• Since most users do not care about the intermediate temperature• Often combined to be θJA

• e.g. θJC = 60°C/W, θCA = 180°C/W → θJA 240°C/W

θJA

TA – Ambient Temperature

TJ – Junction Temperature

PD

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Packaging

• Power Dissipation

A regulator has a θJA = 240°C/W and a TJMax = 150°C

If it dissipates 1W in an area where the ambient temperature is 27°C

Its junction temperature will be: TJ = (PD x θJA) + TA =

(1W x 240°C/W )+ 27°C = 267°C

θJA

TA – Ambient Temperature

TJ – Junction Temperature

PD

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Packaging

• Power Dissipation

• We can’t impact the θJC but we can impact θCA

• Attach a heat sink

• Heat Sink• By increasing the air–heat interface area heat sinks allow more heat

to be dissipated faster

• Reduce the effective thermal resistance

θCA = 15 °C/W

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Packaging

• Power Dissipation

θJC

TA – Ambient Temperature

TJ – Junction Temperature

PD

A regulator has: θJC = 60°C/W, θCA = 180°C/W and TJMax = 150°C

A heat sink is attached with θCA = 15°C/W

If it dissipates 1W in an area where the ambient temperature is 27°C

Its junction temperature will be: TJ = (PD x (θJC + θCA)) + TA =

(1W x (60°C/W + 15°C/W) + 27°C = 102°C

θCA

TC – Case Temperature