P12555 Systems Design Review

P12555 Systems Design Review

Michael Imhof (EE) Michael Cheney (ME)Michael Hvorecny (ME) Jared Dodge(ME) Brandon LaQuay (ME)

VAR Billet Measuring System Project OverviewThe VAR ( Vacuum Arc Re-Melting) process is a continuous

melting vacuum process designed to remove defects and impurities.

The amount of electrical current required to melt a metal billet varies according to the cross-sectional area of the billet being melted.

This area can vary greatly from beginning to end of each billet.The goal of this project is to design a measurement system to

accurately find the billet diameter along the length of the billet.

The information can then be used to more accurately calculate the necessary current required for the re-melting phase.

Billet ProcessingBegins as a cast proprietary alloy, 160 inches in length

and 17-22 inches in diameter.Weighing 2-8 tonsBillet is removed from the cast and transported to a

grinder to remove scale and other surface impurities. Ground billet is transferred to the VAR process area. Measurements must be taken prior to VAR process but

after the grinding process.

Project GoalsNon-contact measurement system that can be

integrated into the existing process.Accuracy of .1 inch for diameter and linear

position.Minimum of 1 measurement every 3 inches.Must be useable for different size billets

ranging in length and diameter.

Project ConstraintsUse of commercially available materials is

allowed.Remaining within ultimate budget, and

minimizing costs wherever possibleMust be robust enough to handle harsh

factory conditions

Position Title Position Description

Lead Engineer (ME)

The Lead Engineer is a mechanical or industrial engineer responsible for maintaining project schedule, coordinating project tasks, and systems integration. The lead engineer should have strong leadership ability and communications skills. The lead engineer will be responsible for establishing realistic compromise device architecture and engineering parameters to meet desired performance objectives using commercially available components such as sensors and power supplies. Basic familiarity with mechanical engineering concepts is required. The lead engineer should have taken the DPM course.

Computer Engineer/ Electrical Engineer (EE)

This engineer will be responsible for interfacing the sensor device to a computer system. Depending on the system architecture chosen, this could require detailed manipulation of USB data streams at the hardware level or relatively straightforward interfacing of a well-documented commercial sensor to a USB port via high level protocols. For the Kinect solution, an engineer with significant background in USB data protocols will be needed, More commercial solutions could probably be accomplished with engineers of other backgrounds such as an electrical engineer with a digital background. The selected architecture will likely depend on the students available to support this function.

Electrical Engineer (EE) The electrical engineer will be responsible for implementation of the power supplies required to operate the selected sensor technology. Knowledge of electrical engineering (analog) is required.

Data Engineer (ME)The Data engineer will be responsible for setting up computer code required to convert the raw data from the sensor into an billet diameter map. The actual discipline of the student is not critical, but knowledge of a high level computer language (MATLAB, Labview, Visual Basic, etc) will be required.

Test Engineer (ME)

The test engineer will be an mechanical or industrial engineer responsible for design and implementation of a testing plan to demonstrate the performance of the prototype diameter measurement device. Demonstration of the device will require presentation of a previously characterized sample under different measurement conditions (lighting, distance, angle) and verification of proper results. Knowledge of basic metrology techniques and optical measurements will be required.

Mechanical Engineer (ME)

This engineer will be in charge of designing the casing as well as the structure necessary for the sensors to be mounted into the existing VAR process. The casing of the sensors as well as the shielding of any wires and computer devices must be able to handle factory extremes. Knowledge of statics and dynamics, as well as heat transfer will be required.

Team Member Roles

Functional Decomposition&Concept Generation

Map D vs. L

Measure Diameter

Measure L

Measure Total L

Report All Sensor Data Every ΔL

Mount Sensors Move Sensors or Billet?

Build Motorized Track for Sensors

Mount Stationary Sensors

Output Sensor Data

Map D vs. L

Mount Sensors

Measure Total L

Measure Diameter


Move Sensors or Billet?

Output Sensor Data

Map D vs. L



Measure Diameter

Purpose: To obtain diameter measurements to calculate A How: Variety of sensor solutions:

Keyence® Beam Sensor Kinect® Sensor Ultrasound Sensor Laser Scanner National Instruments® Machine Vision* Infrared Sensor

Specifications: Resolution: 0.1 inch Positioning: Remote/Non-contact (≈ 6 feet) Sensor Speed: 5 seconds

Comparison:

Solution: Ultrasound Sensor

Resolution Standoff Distance Impact Resistance Cost Ease of Use Sensor Speed Mounting Complexity Environment Immunity SumKeyence Beam Sensor ++ + - -- ++ + -- - 0Kinect Sensor 0 ++ -- - + + - -- -2Ultrasound Sensor + ++ - - ++ ++ - - +3Laser Scanner Method + + - - + + -- - -1Machine Vision ++ ++ -- --- + ++ -- 0 0Infrared Sensor + + - - ++ + - -- 0π-Tape 0 0 0 0 0 0 0 0 0

Map D vs. L

Measure Diameter

Measure L

Measure Total L





Output Sensor Data

Map D vs. L

Mount Sensors

Measure Total L



Output Sensor Data

Map D vs. L



Measure L

Measure Total L

Purpose: To obtain length measurements summing up to a total length How: Variety of solutions

Velocity solutions: V vs. T – Assumes constant velocity Radar sensor

Position solutions: Laser range finder Ultrasound sensor Cable-drive linear position transducer

Specifications: Resolution: 0.1 inch Positioning: Remote/Non-contact (≈ 6 feet)

Comparison:

Solution: TBD

Resolution Standoff Distance Impact Resistance Cost Ease of Use Sensor Speed Mounting Complexity Environment Immunity Sum Resolution Standoff Distance Impact Resistance Cost Ease of Use Sensor Speed Mounting Complexity Environment Immunity SumV vs. T - ++ 0 0 + + 0 0 +3Radar Sensor + ++ -- - + + -- - -1Laser Range Finder ++ ++ -- -- ++ ++ - - +2Cable-driven Sensor ++ 0 - - ++ ++ -- 0 +2Ultrasound Sensor + + -- - ++ ++ - 0 +2Measuring Tape 0 0 0 0 0 0 0 0 0

Map D vs. L

Measure Diameter

Measure L

Measure Total L





Output Sensor Data

Map D vs. L

Mount Sensors



Output Sensor Data

Map D vs. L



Measure L


Purpose: To report length and diameter measurements every ΔL in order to output useful data

How: Software conditioning using length sensor solution Specification:

ΔL = 3-4 inches Sensor sampling period ≤ 5 seconds

Solution: Sensor sampling periods « 5 seconds (generally)

Map D vs. L

Measure Diameter

Measure L

Measure Total L





Output Sensor Data

Map D vs. L

Mount Sensors

Measure Total L


Output Sensor Data

Map D vs. L




Decision: To gather diameter measurements down the length of the billet, either the billet needs to move or the sensors need to move

Comparison:

Solution: Mount stationary sensors in the grinder

Cost Postional Accuracy Ease of Use Design Complexity SumMotorized Track - 0 + -- -2Mounted to Grinder 0 0 0 0 0

Sensor Guards

Purpose: To protect the sensors from possible damage How:

Steel box/enclosure Metal cage Plexi guards

Comparison:

Solution: Steel box/enclosure

Strength Cost Ease of Use Protectivity SumSteel box/enclosure + + + + +4metal cage 0 0 + - 0plexi guards - - 0 - -3

Map D vs. L

Measure Diameter

Measure L

Measure Total L





Output Sensor Data

Map D vs. L

Mount Sensors

Measure Total L


Output Sensor Data

Map D vs. L




Purpose: Move the sensors down the length of the billet How: A few motorized track solutions:

Stepper Motor + Leadscrew Stepper Motor + Rack & Pinion Stepper Motor + Sprocket & Chain

Specifications: Track length ≥ 160 inches Positional accuracy ≤ 0.1 inches

Comparison:

Solution: Stepper Motor + Rack & Pinion

Cost Postional Accuracy Ease of Use Speed SumStepper & Leadscrew - + + - 0Stepper & Rack & Pinion - + + 0 +1Stepper & Sprkt & Chain 0 - 0 + 0

Map D vs. L

Measure Diameter

Measure L

Measure Total L





Output Sensor Data

Map D vs. L

Mount Sensors

Measure Total L


Output Sensor Data

Map D vs. L



Mounting Solutions

Purpose: Mount the sensors to measure the billet along its length How:

8020 Angle steel Bar/tube steel Brackets for the grinder head (sheet metal)

Comparison:

Solution: Brackets for the grinder head

Cost Strength Potential Deflection Machinability Sum8020 - + + + +2angle steel + 0 + + +3bar/tube steel 0 + - + +1brkts for grinder head ++ 0 + + +4

Map D vs. L

Measure Diameter

Measure L

Measure Total L





Output Sensor Data

Map D vs. L

Mount Sensors

Measure Total L


Output Sensor Data

Map D vs. L



Output Sensor Data

Purpose: To interface with the sensors and produce a useable output data file

How: Sensor interface – MCU via low-level software

Low-level software: Specific to each MCU (ex. Arduino® C)

High-level software: OO language to create a simple GUI (ex. Python or Java)

Output data format: CSV XML JSON

Operator

Computer

Sensor Interface/Control Unit

Diameter Measuring Sensor

Length Tracking Sensor

System Architecture

Feasibility Analysis - Programmingvoid setup(){

Serial.begin(9600);float last_distance = 0, last_length = 0, start_length = 0; float last_report = 0, delta_L = 3;

}void loop(){

float distance, length, total_length;

distance = ultrasound_measurement();length = length_measurement();

if (distance < max_distance) && (distance > min_distance){

if (last_distance > max_distance) || (last_distance < min_distance){

start_length = length;last_report = start_length;Serial.write(distance);Serial.write(length-start_length);

}else if (length-last_report >= delta_L – (.01*delta_L)){

Serial.write(distance);Serial.write(length – last_report);last_report = length;

}}else if (last_distance < max_distance) && (last_distance > min_distance){

total_length = last_length - start_length;Finish_measurement_report();

}

last_distance = distance;last_length = length;

}

Preliminary BudgetSensor Budget

Ultrasound Sensor - $30 - $1,000

Length Sensor - TBDMCU - $40Host Computer - $400-

$600Misc. Cabling - $20-$50Total = $490 - $1,690+TBD

Mounting BudgetTBD

Schedule Breakdown# Action Item Due Date POC

1 Site visit ASAP Team

2 Decide diameter sensor solution and pricing 3-Feb M. Imhof

3 Decide linear sensor solution and pricing 3-Feb M. Imhof

4 Decide on host computer and pricing 3-Feb B. LaQuay

5 Determine mounting solution and pricing 10-Feb M. Hvorecny

6 Develop a coding algorithm 17-Feb M. Imhof

7 Develop a CAD package 17-Feb M. Cheney

8 Develop a testing procedure 23-Feb J. Dodge

ID Risk Item Effect Cause Like

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Action to Minimize Risk Owner

1

Electrical Engineer leaves the team.

The team is without an electrical/computer specialist. All computer coding and electrical components are left without a team member who is trained to complete them.

Electrical engineer takes a leave of absence for personal reasons or for a job offer.

1 3 3 Ensure electrical engineer is aware of the consequences of leaving the team. If it is a personal reasons then they must come first, but any job offer should be consulted with the team.

Electrical Engineer

2

Any team member promises to complete a task but does not.

Important items will not get completed on time.

Team members get occupied with school and personal items 3 2 6

Have defined tasks for each team member to complete upon the conclusion of each meeting. Have bi-weekly check ins to ensure that the work is being done.

Every team member is responsible for all the others.

3 Design fails late in the design cycle.

All design work must be rethought and process must stop and be rethought

Overlooked failure modes in the design cycle. 2 3 6

Check and recheck the design and anticipate each and every failure mode that could occur

All team members

4 Purchased Parts do not come in on time

Design must be re-done to adjust for missing components

Team was late in ordering important components 2 3 6

Make sure that important components are ordered in a timely manner. Team Leader

5 Team breaks an important component in testing

Design must be re-done to adjust for broken components

Team was misusing component. 1 2 2

Use extreme caution when handling any device components

All team members

6

Specialty Metals increases security and the team is no longer allowed to visit site and handle propriety information

Design must be more broad and open ended

Heightened security on site 1 1 1

Maintain communication with Ben Hailer and all other contacts at specialty metals Team Leader

7

8

9

Risk Assessment

P12555 Systems Design Review

Documents

billet diameter

billet processingbegins

metal billet

ground billet

var process area

electrical current

system architecture

project schedule