Prototyping Pilot Line Workshop | ANDRE Bernard | 28/06/2019 OVERVIEW OF ADVANCED MATERIAL DEPOSITION CAPABILITIES
Prototyping Pilot Line Workshop | ANDRE Bernard | 28/06/2019
OVERVIEW OF ADVANCED MATERIAL DEPOSITION CAPABILITIES
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300mm & 200mm Si components Platforms ~270@200mm equipments ~105@300mm equipments
5600 square meters Cleanroom - ISO3-5
24/7 operations
200mm MEMS Platform ~130@200 mm equipments 2200 square meters - ISO 4-5
24/7 operations
Substrates <200 mm, III-V and II-VI Platform ~230 @ various diameter equipments
1000+1000 square meters - ISO 4-5 1shift/day
Nano-CHARACTERIZATION Platform ~ 40 huge equipments
2200 square meters
8 centers of competences Concentration of Means to Address Large Photonics
Challenges Closely with the Silicon Platform
NEW PHOTONICS PLATFORM IN 2017
ABOUT THE MICRO, NANO-ELECTRONICS & PHOTONICS
PLATFORMS
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Mature Processes& Technologies
Wafer service thruLETI 3S (SiliconSpecialitiesSolutions)
IP licensing
TechnologyTransfer
New products & applications
Collaboration thruLETI’s SiliconProduct Divisions (DCOS, DOPT, DTBS)
New Materials & Process
Development
Collaborative bilateral researchon specific project
Common laboratories
Affiliation program
New Equipement Engineering
Specific Joint DevelopmentProgram
A full range of business models to meet our partner’s needs
OUR COLLABORATION OFFER
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• Our Motto :
Developing Advanced Materials Solutions for Industrial
Applications
Advanced PCRAM Multilayer Optical filters for imagers Interco : Pillars 10µm pitch3 MoS2 monolayers on 12’’
substrate
ADVANCED MATERIAL DEPARTMENT
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- 100 permanent positions
- 10 PhD students
- 7X24 hrs Shift timePVD,CVD, ECD
- 40 Tools
- > 100 process chambers
- 200 and 300 mmField of applications
- Microelectronics
- Photonics
- Sensors
IDENTITY CARD of the Advanced Material Deposition
department : Some Figures
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Engineering
Developments
Process tuning on known
basis
« Longer » developments
(typically < week)
Directly related to the
programs needs
Chalenged in term of delay
Daily Operations Longer term R&D
New Material Developments
New Deposition Technique
New Material Functionalities
In collaboration with
Academics and Tool
Suppliers
Known Process
Recurent Batches
Higher Level of Maturity
Chalenged in terme of
delay (typically<1shift)
Optical Filters
3 ACTIVITY TYPOLOGIES
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Magnetronsputtering
Wet deposit.
ECD
Muli-Cathode co-sputtering
E-beamevaporation
Ion Beam deposition
CVD/ALD
Ionfab 200mm
Centura 200mm
Volta lineri-Sprint SSW
Sigma 200mmEndura 300mmEndura 200mmClusterline 200mmLLS EVO
EVA 760
Versalis 300mm
Polygon 300mm
W
Alta 300mm &
in-situ metroRaider
300mm
Producer 300mm
Planar 300mm
CAPABILITIES OVERVIEW
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• Our Motto :
« From Material to Device » : fast Proof Of Concept demonstration
mainly for Photonic Applications.
• Our Skills :
Crystal growth & Thin Film epitaxy
Technology & processes on
Non « CMOS standard » substrates & materials
II-VI Crystal Growth & epitaxy
GaN epitaxy for Native
Coloured LED (RGB) Lasers, 3-5 Photonic Display 3-5, GaN
PHOTONIC MATERIAL & TECHNOLOGY DEPARTMENT
Array Detector III-VIGaN epitaxy Power Devices
HgTe HgCdTe
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Substrates & Surface prep
Thin Film Epitaxy
1µm contactlesslithography
Plasma & Ionbeam Etching
PVD / CVD / ALD
Physical Characterization
CAPABILITIES OVERVIEW <200mm platform
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• From Surface Preparation to Contact Plug and Integration
Quasi in-situ XPS
AFM
InP surfaces
Impact of preclean on surface properties Study of solid-state reaction
Contact Plug Development Integration of contacts
Ni / GeSn system
W Liner and W Filling
14.5
µm
III-V / Si Lasers
EXAMPLE 1/6
Advanced Contact Technologies for Electronics and Photonics
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Cosputtering capability for
composition fine-tuning
Memory cell on
300mm MAD300 test
vehicle
Ti/TiN
Top electrode
Surface
preparation
Top electrode
PCM1
1
2
2
3
3
Industrial
pDC GST
chamber
Multicathode
chamber
Si
PCM full stack deposition:
EXAMPLE 2/6
Phase Change Memories
Quasi in-situ metrology
connectivity via Single wafer
vacuum carrier (XPS,
Raman,Ellipso w/o air break)
Si
Multi-layer deposition and
ultra thin film control
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Applications
• RGB filter on top of photosites matrix
• Colored picture (Bayer Matrix)
• IRCUT / IRPB filters defined under RGB filter
• IRCUT : suppress RGB filter rejection in IR
• IRPB : optimization of transmittance in IR
AMAT PRODUCER GT1
In Operando metrology
EXAMPLE 3/6
Filters for CMOS Image Sensors
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TSV
Barrier and seed deposition Versalis (MOCVD TiN, iPVD Cu)
eGseed (Direct on Barrier / seed repair) Raider ECD4- aveni chemistry
TSV filling Raider ECD4- Dow IL9200
Anneal Oven Cu1-2
DAMASCENE
Barrier & seed layer Endura 300B (iPVD TaN, Cu)
ECD filling Raider ECD4- NP52000
Anneal Raider ECD1
RDL, µbumps, µpillars
Ti, Cu undelayer Versalis
ECD metal deposition Raider ECD3 (Cu, Ni, SnAg, Au)
Cobalt ECD Raider ECD3 (aveni Kari chemistry)
advanced “zip filing” process developed with
iPVD
Ti/TiNiPVD
Cu
MOCVD
TiN
SPTS Versalis
AMAT Raider ECD3
AMAT Raider ECD4
Cu Cu
Cu Cu
Cu
Example 4/6
Interconnects for 3D integrations
1x10 µm (AR 10:1)
HD TSV
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PZT (Pb(Zr,Ti)O3) AlN
Sol gel deposition Sputtering deposition
MEMS actuators
High K, High piezo coef
NEMS sensors,
Acoustic Wave Devices
EXAMPLE 5/6
Piezoelectric materials
expertise in piezo material
LiNbO3 AlN:Sc (K,Na)NbO3
Pulsed Laser DepositionStarting 2020
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12’’
EXAMPLE 6/6
2D materials
To Léti 12’’ demos
Patent process
S. Cadot & al
300mm
- 3 MoS2 monolayers on 12’’ substrates- ~50nm domains size
From proof of concepts And Joint Developments with
Industrial Equipment Suppliers
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PEOPLE
- 100
- 24 hours shift organisation
CAPABILITIES
~ 100 [PVD CVD ALD ECD]
tool chambers
Industrial config or Dev Tools
OUR GOAL
speed up yourinnovations in
material sciences
and bringing them to industry
Takeaways
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Leti, technology research institute
Commissariat à l’énergie atomique et aux énergies alternatives
Minatec Campus | 17 rue des Martyrs | 38054 Grenoble Cedex | France
www.leti-cea.com
THANK YOU FOR YOUR ATTENTION
Contact : ANDRE Bernard
Head of Advanced Material Deposition Department
Next related talks :
- Advanced Metal Contact : Philippe Rodriguez
- 2D materials : Cécile Moulin
- Piezo materials : Guillaume Rodriguez
- AVENI solutions for 3D : Céline Doussot
- GaN Material : Bérangère Hyot
- Materials for Topologic Isolation : Philippe Ballet