Optimizing SiP Test Cost with a Platform Approachselected based on different company testing strategy. No Industrial Standard 1. Complexity of functions leads to complexity of test

ni.com

Optimizing SiP Test Cost with a Platform Approach

SiP Conferences China 2018

Pearl He

APAC Semi BDM Manager – National Instruments

ni.com

NI equips engineers and scientists with systems that

accelerate productivity, innovation, and discovery.

Mission Statement

7,500+

EMPLOYEES

50+ COUNTRIES

$1.23BILLION

IN 2016

OVER 18%

INVESTMENT IN R&D

35,000+

CUSTOMERS WORLDWIDE

Long-Term Track Record of Growth

Re

ve

nu

e in

mill

ions U

SD

$0

$200

$400

$600

$800

$1,000

$1,200

$1,400

'87 '88 '89 '90 '91 '92 '93 '94 '95 '96 '97 '98 '99 '00 '01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16

The World of Converged Devices

More capability defined in software

Functions change rapidly

Increasingly complex to design and test

Unique Attributes of Smart Devices - Common Test Needs

More functionality

Ensure high reliability

Lowest cost

Fast time to market

CONVERGENCE LOWER PRICE RAPID CHANGE

Markets for System-in-Package

RF and wireless devices

Integrated Passive Devices

Solid-state drives (SSDs)

Automotive applications

IoT for wearable and machine to machine (M2M) products

Power modules

Source: https://www.amkor.com/go/SiP

System-in-Package Implications on Test

Diverse markets and applications

Demand for plug-and-play

Demand for lower total cost

High volumes and rapid ramp

cycles

Economics of traditional test solutions disrupted!

SiP testing lacks of standard test coverage metrics,

choice of tests to be applied at SiP has been

selected based on different company testing

strategy.

No Industrial Standard

1. Complexity of functions leads to complexity of

test

2. Test mode may not be supported, system level

of test is required.

Challenges with SiP Production Testing

Long Test Time Comparing to Traditional SOC

SiP load boards resemble that of a reference design

of the end-application device

Higher Complexity Load Boards

Communicating with an SiP usually use device

specific protocols – which is usually an IP developed

by the SiP maker but may not be readily available to

the test vendor.

High-level communication (Protocol Support)

Different SiP Test Scenarios

Traditional ATE Custom System Custom System

Parametric etc. traditional ATE System Level Test Required

Considering different scenarios needs to balance cost and time!

LBDUT DUT

Build a system on loadboard

System Level Test Required

DUT is a system

DUT

Different Solutions to Architect SiP Testing

Stability and Reliability

User Friendly

In House Design Solution

• Not reliable for production

environment

• High cost

• Need time to build and design

Handler Centric Solution

• Using system level test handler software

with traditional instruments

Traditional ATE

• Traditional ATE HW+SW Solution

• Hard to scale for customization

Open Architecture Platform

• Easy to extension and customization

• NI STS for production environment

Vendor Strategies for Test and Measurement

C L O S E D

• “Vendor knows best”

• Fixed-functionality

• Closed ecosystem

• Customer pays

P L A T F O R M

• “Customer knows best”

• Customizable solution

• Open, vibrant ecosystem

• Customer designs

NI SERVICES AND SUPPORT

NI MODULAR HARDWARE

ONE-PLATFORM APPROACH

Support 700+ Field Engineers

700+ Support Engineers

50+ Worldwide Offices

Open Connectivity10,000+ Instrument and Device Drivers

1,000+ Sensor and Motor Drivers

Add-Ons400+ Software Add-Ons

5M+ Tools Network Downloads

Community300,000+ Online Members

450+ User Groups

9,000+ Code Examples

Partners1,000+ Alliance Partners

Industry-Leading Technology Partners

Academia8,000+ Classrooms Worldwide

TH

IRD

-PA

RT

Y S

OF

TW

AR

ET

HIR

D-P

AR

TY

HA

RD

WA

RE

NI PRODUCTIVE

DEVELOPMENT SOFTWARE

NI E

CO

SY

ST

EM

NI

EC

OS

YS

TE

M

PXI System Overview

PXI Backplane

• Data Transfer

• Timing

• Synchronization

• Triggering

PXI Chassis

• Power

• Cooling

• System Monitoring

• Enclosure

PXI I/O Modules

• 600+ Products

• RF, DC, DIO…

Multicore

Embedded

Controller

Broad Modular Instrumentation Portfolio

Multifunction I/O

FPGA / Reconfigurable I/O

Digital I/O

Analog Input / Output

Vision and Motion

Counter / Timer / Clock

DAQ and Control

Oscilloscopes

High-Speed Digital I/O

DMM & SMU

Signal Generators

Switching

RF Analyzers & Generators

Instrumentation

GPIB, USB, LAN

RS232 / RS485

CAN, LIN, DeviceNet

SCSI, Ethernet

VXI - VME

Boundary Scan / JTAG

Interfaces

NI Semiconductor Test Software▪ Suite of software for test development, execution, and debug

▪ TestStand + TestStand Semiconductor Module

▪ Sequence Editor/Operator Interface

▪ Binning, Handler Integration, Pin/Channel Map, STDF, Multisite

▪ Built-in steps for common measurements (e.g. continuity, Vcc, etc)

▪ Open interface to integrate 3rd party instruments with multi-site support

▪ Digital Pattern Editor

▪ Code module development with NI LabVIEW/LabVIEW FPGA or C#/.NET

▪ STS Calibration and Diagnostics Software

Common Platform that Scales

NI STS T1NI PXI NI STS T4NI STS T2

PXI Chassis and Controller

PXI Instrumentation and Measurement Software

LabVIEW or C# (Code Module Development) and TestStand (Test Management)

STS Standardized Docking and Cabling Interface

ni.com

• The NI STS T4 is used for FEM Production Test

• Dual sites on Turret Handler

• STS Benefits:

• Roadmap support to 5G

• Short Test Time

• Lower tester capital cost

ni.com

• The NI STS T1 is used for SiP(WiFi +BT) Test

• Quad site tester that communicates to a custom-designed handler

• STS Benefits:

• Vendor-supported ATE platform

• Test time: 17s vs 65s rack & stack solution

• Lower tester capital cost

• Zero footprint

ni.com

• Traditional testers do not have parallel capacitance/inductance instruments at low cost

• Traditional boxes missing factory integration features

• Production-ready Operator Interface

• Handler Control

• Binning

• Standard Datalogging (STDF)

• System calibration and diagnostics

STS T2▪ Manipulator Support

▪ Electrical interface

▪ Docking interface

Case Study : IPD Production Test

STS T2

Integrated Passive Devices

Summary

The diversity of SiP markets and applications require test solutions that can scale to meet targeted needs.

Traditional approaches for IC package and module test over-serve some requirements while not meeting others.

A platform approach to SiP test allows customers to use the elements they need while avoiding the elements (and costs) they don’t.

When these elements are available on the same platform or within the ecosystem they can be effectively leveraged to reduce overall cost of test.

P L A T F O R M

• “Customer knows best”

• Customizable solution

• Open, vibrant ecosystem

• Customer designs