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Page 1: NX Nastran Performance - Applied CAx · PDF fileImproving NX Nastran Performance Challenges Increased problem size !! 2004 – (1.2 million) DOF ... Page 10 Siemens PLM Software NX

Restricted © Siemens AG 2015 All rights reserved. FEMAP SYMPOSIUM 2015

Realize Innovation.

NX Nastran Performance

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2015-09-23

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Page 2 Siemens PLM Software

Improving NX Nastran Performance

Challenges Increased problem size §   2004 – (1.2 million) DOF (large model) §   2011 – (10 – 20 million) DOF(typical models) §   2015 – (30 – 50 million) DOF (expected)

Solutions q   Selecting the right hardware and OS q   Utilizing hardware efficiently - Tuning OS settings q   Defining appropriate NX Nastran keywords and

parameters for the solve q   Take advantage of nastran parallel processing q   Select appropriate solution methods to reduce

elapsed time

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Hardware and OS Selection

q   Processors §   Prefer faster processors §   Choose large L2 or L3 processor cache. Larger caches provide improved performance §   Prefer multi-core processors

q  Memory §   Install as much memory as possible. Unallocated memory will be used by the OS for I/

O cache. q   Disk §   Increase disk performance by using SSD disks. Faster I/O leads to reduced elapsed

time. §   PCIe disks are a new option. Actually outperforms SATA or SCSI hosted SSD §   Prefer multiple disks (1 + 4). One for the OS and the remaining disks in RAID0

configuration for Nastran scratch

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Hardware and OS Selection

q   GPU and Intel MIC §   GPU processing requires expensive high end card(Firepro W9100 with 16GB) §   GPU card requires enough memory to hold Nastran module data in core §   GPU processing only helps for special problems(freq response with 5000+ modes) §   Technology changing rapidly

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Hardware and OS Selection

q   Priorities for getting the most performance for the least money

§   Maximum number of fast cores with large cache

§   Add as much RAM as possible

§   Maximize I/O bandwidth and disk speed

§   Add GPU processing for some large dynamics problems

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OS Settings: I/O Cache

q  Why? §   Reading from and writing to disk are slow on

mechanical drives §   Same part of the disk is read several times §   Data that is typically written is probably read

back soon

q   How §   Keeping information in memory instead of

disk will reduce disk seek times §   Make use of unallocated memory for buffer

cache §   When application needs memory, cache

manager pages memory to disk (Application page or I/O cache page?)

Tota

l Phy

sica

l Mem

ory

O/S

O

ther

Pr

oces

ses

NX

Nas

tran

I/O

Cac

he

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Page 7 Siemens PLM Software

OS Settings: Enabling Disk I/O Cache

q   Read cache is enabled by default on Linux and Windows (superfetch feature) q   Enable write cache on Linux using “hdparm” command or equivalent q  On windows use “System Properties” advanced settings to enable write-cache

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I/O Cache and Paging - Windows

q   Reasons §   As file size becomes larger than system

memory, the OS runs out of memory §   OS cache manager will page out memory last

unused memory §   Pages from nastran can be paged out to

accommodate I/O cache

q   Prevention §   Limit windows I/O cache to 25% -50% of

physical memory using “cache_tool” (available on request)

§   Turn off file cache – Add command line option “sysfield=buffio=yes,raw=yes”

Tota

l Phy

sica

l Mem

ory

O/S

O

ther

N

X N

astr

an

I/O C

ache

Page Out

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NX Nastran Settings: Memory

q   Starting with NXN 10 new default settings in rcf file q   buffsize=32769 q  memory=.45*physical q   smem=20.0X q   buffpool=20.0X

q   More robust settings that are more appropriate for large models and

machines with more memory

q   Inspect the F04 file to see if you have optimum settings for your model Note: unless SMEM is large enough to contain all scratch files, it is better to set it to zero. Check F04 file summary.

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NX Nastran Settings: Memory

*** USER INFORMATION MESSAGE 4157 (DFMSYN) PARAMETERS FOR SPARSE DECOMPOSITION OF DATA BLOCK KLL ( TYPE=RDP ) FOLLOW MATRIX SIZE = 70345 ROWS NUMBER OF NONZEROES = 2701957 TERMS NUMBER OF ZERO COLUMNS = 0 NUMBER OF ZERO DIAGONAL TERMS = 0 CPU TIME ESTIMATE = 78216 SEC I/O TIME ESTIMATE = 25 SEC MINIMUM MEMORY REQUIREMENT = 1364 K WORDS MEMORY AVAILABLE = 32615 K WORDS MEMORY REQR'D TO AVOID SPILL = 12305 K WORDS MEMORY USED BY BEND = 3651 K WORDS EST. INTEGER WORDS IN FACTOR = 87006 K WORDS EST. NONZERO TERMS = 174758 K TERMS

§  Word Size = 8 bytes (ILP-64 – long integers) §  Word Size = 4 bytes (LP-64 – short integers)

q   Specify enough memory to avoid disk spillover §  at least 1.2 to 1.3 times the memory required to avoid spill

q   Do not specify more than 50% of the memory for NX Nastran. This will leave the OS more room for I/O cache

q   Insufficient memory can affect re-ordering method leading to very slow matrix decomposition. Make sure either BEND or METIS method is selected

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Memory Available

> Memory Required to Avoid Spill

Memory Available

< Memory Required to Avoid Spill

Memory Available

>> Memory Required to Avoid Spill

NX Nastran Settings: Memory …

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NX Nastran Settings: Memory

q   Even when memory is sufficient for matrix decomposition, other modules such as

MPYAD might make multiple passes when memory is insufficient. Multiple passes translates to more I/O

12:09:45 143:59 5182.9G 0.0 17602.1 0.0 DISPRS 293 SMPYAD BEGN METHOD 1 NT, STORAGE 2, NBR PASSES= 4, EST. CPU= 409.3, I/O= 82.3, TOTAL= 491.6 12:09:45 143:59 5182.9G 4.0 17602.1 0.0 MPYAD BGN P=4 12:12:13 146:27 5206.2G 23821.0 17817.4 215.3 MPYAD PASS= 1 12:14:43 148:57 5228.8G 23199.0 18031.6 214.2 MPYAD PASS= 2 12:17:13 151:27 5251.5G 23190.0 18246.0 214.4 MPYAD PASS= 3 12:19:43 153:57 5274.1G 93414.0 18460.5 858.4 MPYAD END

Number of Passes

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NX Nastran Settings: scratch directory

It is important to specify the correct location of the scratch file folder – use the “sdirectory” or “sdir” keyword q   Scratch folder should point to a fast disk or disks configured

in a RAID array (RAID0) q   Prefer local disks over network mounted (using dedicated

GigE or Infiniband connection) fast file systems q   Scratch folder pointing to a generic network file system

(NFS) will have significant performance penalties because slow I/O goes over a general shared network

q   Set “sdir” keyword in the rcf file

SCRATCH

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NX Nastran Settings: scratch directory

When running from Femap set File/Preferences to control Femap scratch and Nastran scratch

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NX Nastran: Parallel Processing

Types of Parallelism q   Shared memory (SMP) q   Distributed memory (DMP)

SMP DMP Hardware Desktop Desktop/Cluster Operation level Low level

operations are threaded

Higher level. Matrix partitioned at a higher level

Software Open MP and Intel MKL

Message Passing Interface (MPI)

Scalability Tapers off at 8 to12 processors

Highly scalable

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Shared Memory Architecture

Uniform Memory Access (UMA) q   Identical processors.

q   Symmetric in geometry. Also known as symmetric multiprocessor (SMP)

q   Equal access to memory

q   If one processor updates a location in the shared memory, all other processors know about it

q  Only one processor can access memory at a given instant

P: Processor C: Cache

P

C

P

C

P

C

P

C I/O

MEMORY

SYSTEM BUS

COMPUTE NODE

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NX Nastran SMP

q   Easy to use. Specify smp=n or parallel=n in nastran command line( Femap Executive and Solution Options)

q   Available on all NX Nastran supported platforms q   Available in all solution types

q  Modules parallelized §   Matrix decomposition (DCMP) §   Multiply Add (MPYAD) §   Forward-Backward Substitution (FBS) §   Frequency response (FRRD1) §   Driver module for Sol 401 (NLTRD3) §   Other modules that indirectly call DCMP, MPYAD, FBS

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NX Nastran: Distributed Memory Processing

q   Program is broken into tasks

q  Multiple tasks can reside on the same machine and/or across arbitrary number of machines

q   Tasks exchange data through communications by sending and receiving messages (message passing)

q   Data transfer requires cooperative operations to be performed by each process

Task 0 data

Task 2 data

Send

Receive

Task 1 data

Task 3 data

Send

Receive

NETWORK

NODE 1 NODE 2

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NX Nastran DMP

q   Available in Sol 101, Sol 103, Sol 105, Sol 108, Sol 111, Sol 112 and Sol 200

q   Partitioning of geometry

q   Partitioning of frequency

q   Partitioning of loads

q   Available on Linux x86_64 and on windows.

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NX Nastran Linear Contact Solutions

2.0mm 1.0mm 0.5mm

Search Distance q   Select element iterative solver

•   When 3D elements are > 90% of total number of elements

•   When solution is linear statics

q   Specify proper search distance. Large search distances typically involve more active contacts for the first few iterations

q   Adjust the global contact parameters MAXF and/or CTOL to reduce the number of iterations

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Page 21 Siemens PLM Software

0  

50000  

100000  

150000  

200000  

250000  

300000  

350000  

1   2   3   4   5   6   7   8   9   10  

Num

ber  o

f  Con

tact  Status  C

hanges  

Itera4ons  

Search  distance  =  2mm  Search  distance  =  1mm  Search  distance  =  0.5mm  

NX Nastran Linear Contact Solutions

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NX Nastran Modal Solution

q   Use RDMODES (Recursive modes). Partitions the model into “nrec” partitions •   No big triangular solves •   No orthogonalization •   Reduced I/O •   Approximate solution •   Used when large number of modes are to be computed •   Can be used with SMP, DMP or in Hybrid mode

q   Use system cell 462=1 •   When large amount of memory is available •   Frequency response runs in-core

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RDMODES Performance

0

100

200

300

400

500

600

1 2 4 8

Elap

sed

Tim

e (m

ins)

Number of Processors

SMP

DMP

DMP_SMP

Hardware Processor Intel Xeon 5690

(3.47 GHz)

L1,L2,L3 cache 32KB, 256KB, 12MB

Cores 6 per socket and 2 sockets

Memory 96GB

Disks 6 x 585 GB disks in RAID0

Engine Block Model

DOF 21945096

CTETRA 2233552

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Page 24 Siemens PLM Software

Concluding Remarks

q   Judicious selection of hardware can improve performance significantly

q  Maximize usage of machine resources by making appropriate choices in the OS and solver. §   OS Settings §   Memory Management §   Parallel Processing §   Contact settings §   Solution Methods

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Page 25 Siemens PLM Software

OS

SMEM

NX Nastran

Types of I/O Cache

Different levels of I/O cache q   Application (NX Nastran) I/O cache §   Scratch memory (smem) §   Buffer pool (bpool or buffpool)

q  OS I/O cache q   Device driver I/O cache

q   Cache Performance depends on the hardware and on the operating system

q   For efficient disks and OS cache, NX Nastran I/O cache (smem, bpool) is expected to be marginal

Disk

BPOOL

Cache

Cache Device Driver

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Windows – Excessive I/O Cache

q   Symptoms: §   Machine unresponsive and §   Solution takes a long time

Executable Paging

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Windows – Excessive I/O Cache cont…

Scratch data cached

More Scratch data cached

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NX Nastran Lanczos Performance Options

q   Space saver option −   Set system cell 229=1 (default = 0). This will not preserve factor

matrices for later use (used when the lower bound and upper bound frequency ranges are specified in the EIGRL card). This reduces scratch usage

q   Sparse solver memory in Lanczos −   Set system cell 146 (or FBSMEM) to a value > 1 (2 or 3). Reserves

more memory for factor but reduces amount of memory available for eigenvectors

q   I/O Reduction Options −   Set system cell 193=1 (result of mass matrix multiply is not saved) −   Set system cell 199 = k. Sets memory for mass matrix multiply ( 2 x

k x BUFFSIZE) . Default value is k=1.

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** MASTER DIRECTORIES ARE LOADED IN MEMORY. USER OPENCORE (HICORE) = 804910800 WORDS

EXECUTIVE SYSTEM WORK AREA = 316925 WORDS

MASTER(RAM) = 78676 WORDS

SCRATCH(MEM) AREA = 268443648 WORDS ( 8192 BUFFERS)

BUFFER POOL AREA (GINO/EXEC) = 268427231 WORDS ( 8189 BUFFERS)

TOTAL NX NASTRAN MEMORY LIMIT = 1342177280 WORDS

NX Nastran: Memory Management

Scratch (RAM)

Master (RAM)

Buffer Pool Area

User Open Core

Executive System Work Area

F04 file

Mem

ory

(from

“mem

” key

wor

d

Mem

ory

for F

ile a

nd

Exe

cutiv

e Ta

bles

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Page 30 Siemens PLM Software

Shared Memory Processing

q   Program is broken into discrete instructions as in serial run

q   Parts of the program run in serial. Some of the instructions are then spawned into threads (tasks)

q   Each of the thread then can run concurrently on a different processor

q   Threads share resources and communicate with each other through global memory (updating address space)

Processor

Processor

Processor

Processor

PRO

BLEM

INSTRUCTIONS

Shared memory processing on a single node

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Shared Memory Architecture

Non-Uniform Memory Access (NUMA) q  Memory is logically and sometimes

physically distributed.

q   Processors have access to their own memory and also have access to other memory via bus interconnect

q   Not all processors have equal access time to all memories

q   Similar to having multiple UMA

C: Cache P: Processor

SYSTEM BUS SYSTEM BUS

P

C

P

C

MEMORY

P

C

P

C

MEMORY

Distributed Shared Memory Network

COMPUTE NODE

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Hybrid Memory Architecture

q   Combines shared memory (NUMA or UMA) and distributed memory architecture

q   Communication across nodes uses

MPI

q   Intra node uses the shared memory

processing

P C

P C

MEMORY

P C

P C

MEMORY

Distributed Shared Memory Network

P C

P C

MEMORY

P C

P C

MEMORY

Distributed Shared Memory Network

MPI

SMP

SMP

NODE 1

NODE 2

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Page 33 Siemens PLM Software

Distributed Memory Architecture

q   Processors have their own local memory and resources like NUMA node group

q   Because each processor has its own local memory, it operates independently

q   Communication between nodes

is through message passing interface (MPI)

q  When a processor needs to access to data from another processor, this has to be handled programmatically

I/O

P C

P C

MEMORY

P C

P C

MEMORY

NETWORK INTERCONNECT

I/O

MPI

I/O

NODE 1

NODE 2

SYSTEM BUS

SYSTEM BUS