LCD TV SERVICE MANUAL CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. CHASSIS : LA04A MODEL : 32LD350 32LD350-UA North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com Internal Use Only Printed in Korea P/NO : MFL62863204 (1003-REV00)
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LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LA04A
MODEL : 32LD350 32LD350-UA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62863204 (1003-REV00)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
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CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
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SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
1. Application rangeThis spec sheet is applied all of the 19”, 22”, 26”, 32” LCD TVwith LA04A chassis.
2. Requirement for TestEach part is tested as below without special appointment.
1) Temperature: 25±5ºC, (77°±9ºF), CST: 40±5°C 2) Relative Humidity: 65±10%3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models4) Specification and performance of each parts are followed
each drawing and specif ication by part number inaccordance with BOM.
5) The receiver must be operated for about 20 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
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No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
PC DDC
1 640*350 31.469 70.08 25.17 EGA X
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1280*768 47.776 59.87 79.50 CVT(WXGA) X
7 1360*768 47.720 59.799 84.75 CVT(WXGA) O
DTV
1 720*480 31.5 60 27.027 SDTV 480P
2 720*480 31.47 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
6 1920*1080 33.72 59.94 74.176 HDTV 1080I
7 1920*1080 67.500 60 148.50 HDTV 1080P
8 1920*1080 67.432 59.939 148.352 HDTV 1080P
9 1920*1080 27.000 24.000 74.25 HDTV 1080P
10 1920*1080 26.97 23.976 74.176 HDTV 1080P
11 1920*1080 33.75 30.000 74.25 HDTV 1080P
12 1920*1080 33.716 29.97 74.176 HDTV 1080P
8. HDMI input (PC/DTV)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
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ADJUSTMENT INSTRUCTION
1. Application range This spec. sheet applies to LA04A Chassis applied LCD TV allmodels manufactured in TV factory
2. Specification2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use ofisolation transformer will help protect test instrument.
2.2 AdjThe adjustment must be performed in thecircumstance of 25 ±5 C of temperature and65±10% of relative humidity if there is no specificdesignation.
2.4 The input voltage of the receiver must keep100~240V, 50/60Hz.
2.5 The receiver must be operated for about 5 minutesprior to the adjustment when module is in thecircumstance of over 15
In case of keeping module is in the circumstance of0°C, it should be placed in the circumstance of above15°C for 2 hours
In case of keeping module is in the circumstance ofbelow -20°C, it should be placed in the circumstance ofabove 15°C for 3 hours,.
Caution) When still image is displayed for a period of 20minutes or longer (especially where W/B scale isstrong. Digital pattern 13ch and/or Cross hatchpattern 09ch), there can some afterimage in theblack level area.
3. Adjustment items3.1 Board Level Adjustment
•Adjust 480i Comp1(ADC) •EDID/DDC download
Above adjustment items can be also performed in FinalAssembly if needed. Both Board-level and Final assemblyadjustment items can be check using In-Star Menu 1.ADJUSTCHECK. Component 1080p and RGB-PC Adjust will becalculated by 480i adjust value.
3.2 Final assembly adjustment •White Balance adjustment •RS-232C functionality check •Factory Option setting per destination •Ship-out mode setting (In-Stop)
Generator- Resolution: 480i, 1024*768- Pattern : Horizontal 100% Color Bar Pattern- Pattern level: 0.7±0.1 Vp-p- Image
3) Must use standard cable
(3) Adjust method
• ADC 480i/1080p Comp1, RGB 1) Check connected condition of Comp1 cable to the
equipment 2) Give a 480i Mode, Horizontal 100% Color Bar Pattern
to Comp1. (MSPG-925FA -> Model: 209, Pattern: 65)
3) Change input mode as Component1 and picture modeas “Standard”
4) Press the In-start Key on the ADJ remote after at least1 min of signal reception. Then, select 5.ADC Calibration. And Press OK Button on the menu “Start”.The adjustment will start automatically.
5) If ADC Comp 480i is successful, “ADC ComponentSuccess” is displayed and Comp480i/1080p iscompleted. If ADC calibration is failure, “ADC Component Fail” isdisplayed.
6) If ADC calibration is failure, after rechecking ADCpattern or condition, retry calibration
7) After completing ADC Component, input mode will bechanged to RGB automatically.
8) If ADC calibration is successful, “ADC RGB Success”is displayed. If ADC calibration is failure, “ADC RGBFail” is displayed.
9) If ADC calibration is failure, after recheck ADC patternor condition, retry calibration
5.2 EDID/DDC Download
(1) OverviewIt is a VESA regulation. A PC or a MNT will display anoptimal resolution through information sharing without anynecessity of user input. It is a realization of “Plug and Play”.
(2) Equipment• Adjust remocon. • Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
(3) Download method1) Press Adj. key on the Adj. R/C, 2) Select EDID D/L menu. 3) By pressing Enter key, EDID download will begin 4) If Download is successful, OK is display, but If
Download is failure, NG is displayed. 5) If Download is failure, Re-try downloads.
•Caution) When EDID Download, must remove RGB/HDMICable.
(4) EDID DATA 1)LD350 Tool(HD) • HDMI I [C/S: XXBA]
EDID Block 0 table =
EDID Block 1 table =
- 12 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
• HDMI II [C/S: XXAA] EDID Block 0 table =
EDID Block 1 table =
• RGB [C/S: XX] EDID Block 0 table =
5.3. White Balance Adjustment(1) Overview
• W/B adj. Objective & How-it-works- Objective: To reduce each Panel’s W/B deviation- How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full DynamicRange. In order to prevent saturation ofFull Dynamic range and data, one ofR/G/B is fixed at 192, and the other two islowered to find the desired value.
- Adj. condition : normal temperature1) Surrounding Temperature: 25±5ºC2) Warm-up time: About 5 Min3) Surrounding Humidity: 20% ~ 80%
(2) Equipment1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12)2) Adj. Computer(During auto adj., RS-232C protocol is
needed)3) Adjust Remocon4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model:217, Pattern:78)-> Only when internal pattern is not available
• Color Analyzer Matrix should be calibrated using CS-1000
(3) Equipment connection MAP
(4) Adj. Command (Protocol)1) RS-232C Command used during auto-adj.
Ex) wb 00 00 -> Begin white balance auto-adj.wb 00 10 -> Gain adj.ja 00 ff -> Adj. datajb 00 c0......wb 00 1f -> Gain adj. complete*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.wb 00 ff -> End white balance auto adj.
Color Analyzer
Computer
Pat tern Generator
RS-232C
RS-232C
RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed
Connection Diagram of Automatic Adjustment
RS-232C COMMANDMeaning
[CMD ID DATA]
wb 00 00 Begin White Balance adj.
wb 00 ff End White Balance adj.(Internal pattern disappeared)
- 13 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
2) Adjustment MapApplied Model : 19LD350-UB, 22LD350-UB, 26LD350-UB,
32LD350-UB
(5) Adj. method• Auto adj. method
1) Set TV in adj. mode using POWER ON key2) Zero calibrate probe then place it on the center of the
Display3) Connect Cable(RS-232C)4) Select mode in adj. Program and begin adj.5) When adj. is complete (OK Sing), check adj. status pre
mode (Warm, Medium, Cool)6) Remove probe and RS-232C cable to complete adj.
* W/B Adj. must begin as start command “wb 00 00” , andfinish as end command “wb 00 ff”, and Adj. offset ifneed
• Manual adj. method1) Set TV in Adj. mode using POWER ON2) Zero Calibrate the probe of Color Analyzer, then place
it on the center of LCD module within 10cm of thesurface..
3) Press ADJ key -> EZ adjust using adj. R/C > 6. White-Balance then press the cursor to the right (KEYG).(When KEY(G) is pressed 216 Gray internal patternwill be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at192, and the rest will be lowered to meet the desiredvalue.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modesof color temperature.
- If internal pattern is not available, use RF input. In EZAdj. menu 6.White Balance, you can select one of 2Test-pattern: ON, OFF. Default is inner(ON). Byselecting OFF, you can adjust using RF signal in 216Gray pattern.
* Adj. condition and cautionary items1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try toisolate adj. area into dark surrounding.
2) Probe location- LCD: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the modulesurface (80°~ 100°)
3) Aging time- After Aging Start, Keep the Power ON status during 5
Minutes.- In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
(6) Reference (White Balance Adj. coordinate and colortemperature)• Luminance: 216 Gray• Standard color coordinate and temperature using CS-
1000 (over 26 inch)
• 26/32LD350-UB
• 19/22LD350-UB (Small size panel have different colorcoordinate)
• Standard color coordinate and temperature using CA-210(CH 9)
• 26/32LD350-UB
• 19/22LD350-UB (Small size panel have different colorcoordinate)
ITEM Command Data Range Default
(Hex.) (Decimal)
Cmd 1 Cmd 2 Min Max
Cool R-Gain j g 00 C0
G-Gain j h 00 C0
B-Gain j i 00 C0
R-Cut
G-Cut
B-Cut
Medium R-Gain j a 00 C0
G-Gain j b 00 C0
B-Gain j c 00 C0
R-Cut
G-Cut
B-Cut
Warm R-Gain j d 00 C0
G-Gain j e 00 C0
B-Gain j f 00 C0
R-Cut
G-Cut
Mode Color Coordination Temp ∆UV
x y
COOL 0.269 0.273 13000K 0.0000
MEDIUM 0.285 0.293 9300K 0.0000
WARM 0.313 0.329 6500K 0.0000
Mode Color Coordination Temp ∆UV
x y
COOL 0.285 0.293 9300K 0.0000
MEDIUM 0.295 0.305 8000K 0.0000
WARM 0.313 0.329 6500K 0.0000
Mode Color Coordination Temp ∆UV
x y
COOL 0.269±0.002 0.273±0.002 13000K 0.0000
MEDIUM 0.285±0.002 0.293±0.002 9300K 0.0000
WARM 0.313+0.002 0.329±0.002 6500K 0.0000
Mode Color Coordination Temp ∆UV
x y
COOL 0.285±0.002 0.293±0.002 9300K 0.0000
MEDIUM 0.295±0.002 0.305±0.002 8000K 0.0000
WARM 0.313+0.002 0.329±0.002 6500K 0.0000
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5.4. HDCP SETTING- HDCP setting is not necessary in Saturn5 model.
5.5 Option selection per country(1) Overview
- Option selection is only done for models in Non-USANorth America due to rating
- Unit fully inserted Power cord, Antenna cable and A/Varrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER- Auto CONTROLLER(GWS103-4) ON- Perform GND TEST- If NG, Buzzer will sound to inform the operator.- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX)- Perform I/P test- If NG, Buzzer will sound to inform the operator.- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
6.2. Checkpoint• TEST voltage
- GND: 1.5KV/min at 100mA- SIGNAL: 3KV/min at 100mA
• TEST time: 1 second• TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLEMETAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &NEUTRAL
• LEAKAGE CURRENT: At 0.5mArms
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
Model Tool 1 Tool 2 Tool 3 Tool 4 Menu
19LD350(CMO) 1 HDMI
19LD350(LGD) 2689 548 1442 1824 1 HDMI
22LD350(CMO) 1HDMI
22LD350(LGD) 6785 548 1442 1824 1 HDMI
26LD350(Sharp) 2HDMI
26LD350(AUO) 10897 1576 1442 1824 2 HDMI
32LD350(AUO) 19089 1576 34210 1824 2 HDMI
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
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7. USB S/W Download (option)(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,it didn’t work.But your downloaded version is High, USB data isautomatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have tochannel recover. if all channel data is cleared, you didn’thave a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.1) Push "IN-START" key in service remote controller.2) Select "Tool Option 1" and Push “OK” button.3) Punch in the number. (Each model has their number.)
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300 50
0
510
120
A10
200
800
530
550
810
900
910
540
521
400
A21
A2
A5
LV1
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_USB
C467
0.1uF
50V
R41110KOPT
C482100pF50V
OPT
C47222uF10V
R461
4.7K
1%
R45610K
R452
101/10W1%
+1.8V_DDR
R441 0
IC403MP2212DN
3IN
2GND
4BS
1FB
5VCC
6SW_1
7SW_2
8EN/SYNC
POWER_ON/OFF1
POWER_ON/OFF1
L4233.6uH
NR8040T3R6N
POWER_ON/OFF2_1
C439
100pF
50V
R416
33K
1%
R442
22K 1%
L4213.6uH
NR8040T3R6N
R444
24K 1%
R46410K
C463
100pF
50V
L420CIC21J501NE
R417
6.2K
1%
+5V_USB
+12V/+15V
C429
100pF
50V
OPT
+12V/+15V
C4100.1uF
R460
27K
1%
C45322uF10V
C444
1uF10V
L416
+3.5V_ST
L401
IC405AOZ1073AIL
3AGND
2VIN
4FB
1PGND
5COMP
6EN
7LX_1
8LX_2
C423100pF50V
OPT
C43022uF10V
C4240.1uF16V
+1.26V_VDDC
C4730.1uF16V
C45710uF25V
+3.3V_Normal
C448
0.1uF
50V
R455 0
C46122uF10V
0.1uFC456
R43275K1/8W1%
C40510uF25V
C45910uF25V
L413
C465
1uF10V
0.1uFC476
R436
101/10W1%
C4280.1uF16V
C464
2200pF
C4141uF50V
+3.5V_ST
R4549.1K
L4063.6uH
NR8040T3R6N
POWER_ON/OFF1
IC407MP2212DN
3IN
2GND
4BS
1FB
5VCC
6SW_1
7SW_2
8EN/SYNC
R41010K
R462
10K
1%
L4153.6uH
NR8040T3R6N
IC401MP8706EN-C247-LF-Z
3SW_2
2SW_1
4BST
1IN
5EN/SYNC
6FB
7VCC
8GND
R44510K
OPTC42022uF10V
C46922uF10V
L424CIC21J501NE
C4850.1uF16V
R48722
C4780.1uF50V
C4792.2uF
19"~22"50V
R469
026"~32"
2012
C4810.1uF50V
C4800.01uF50V
RL_ON
R4760
1/10W
19"~22"
2012
+24V/+15V
+12V
R4770
26"~32"
2012
R4282.2K19"~22"
AMP_VCCR46822K19"~22"
+12V/+15V
Q41119"~22"
RT1C3904-T112
E
B
C
Q4072SC3052
E
B
C
C4360.01uF
25V
+5V_Normal
L412
12V_PANEL
Q4062SC3052
E
B
CR43522K
R440
1.8K
12V_PANEL
R439-*1
22K
5V_PANEL
R440-*1
2.7K
5V_PANEL
PANEL_VCC
C4550.1uF16V
C4511uF25V
PANEL_CTL
1:AK10
C4380.1uF16V
R42947K
L411
5V_PANEL
C44210uF16VOPT
R439
10K
12V_PANEL
R43122K
R43010K
OPT
+12V/+15V
C4434.7uF
16V
R450
14K
1%
PD_+3.5V
R448-*1
16K
PD_+15V
+12V/+15V
R446
30K
1%
PD_+24V
R480100
OPT
IC408
NCP803SN293
1
GND
3VCC 2 RESET
IC409NL17SZ08DFT2G
OPT
3
2
4
1 5
R488100K
+24V/+15V
POWER_DET
+3.5V_ST
R481
3K
R482
20K
+12V
R463
10K
OPT
R446-*1
24K
PD_+20V
R483
10K
C4830.1uF
+3.5V_ST
+3.5V_ST
R447
5.1K
1/16W
5%
EXCEPT_PD_+3.5V
R448
12K
1%
PD_+12V
R423
0 1/4W
3216
R4064.7K
R453 0
LGD_26"~32"
0
R472AUO
OPC_OUT
P403FW20020-24S
NORMAL_26~32
1912V
14 GND
93.5V
4 24V
18 INV_ON
13GND
8 GND
324V
1712V
12 3.5V
7GND
2 24V
16 GND/OLP
113.5V
6 GND
1PWR_ON
20 A.DIM
15GND
10 3.5V
5GND
2112V 22 P.DIM
23GND 24 Err_OUT/NC
0R471
NON_AUO_26"~32"
0R420
LGD
Q4012SC3052
E
B
C
L404MLB-201209-0120P-N2
C4070.1uF16V
0R437
AUO/SHARP
+24V/+15V
C4191uF25VOPT
R418
6.8K
OPT
L407MLB-201209-0120P-N2
C4180.1uF
50V
C401100uF
16V
P402
SMAW200-12
NORMAL_19~22
1+15V
2+15V‘
3GND
4GND
5+3.5V_ST
63.5V_ST
7GND
8OLP
9INV_EN
10PWM_DIM
11A_DIM
12NC
+3.3V_Normal
+3.5V_ST
+3.5V_ST
C42668uF35V
R42110K
+3.5V_ST
C4160.1uFOPT
R40110K
26"~32"
C4040.1uF16V
C402100uF
16V
L402MLB-201209-0120P-N2
R4130
19"~22"
PWM_DIM
A_DIM
ERROR_OUT
C4060.1uF16V
C4080.1uF16V
R486
4.7K
0R424
NON_OPC
Q402
RT1P141C-T112
1
2
3
RL_ON
Q4052SC3052E
B
C
0R470
LGD_OPC
R42610K
R42710KOPT
OLP
+12V
INV_CTL
+3.3V_Normal
+3.5V_ST
C4000.1uF16V
+3.3V_AVDD_MPLL
L400BLM18PG121SN1D
L417
R45910K
C4770.1uF16V
C47122uF10V
R465
51K
5%
C45810uF25V
+5V_Normal
R467
10K
1%
POWER_ON/OFF1
L4223.6uH
NR8040T3R6N
+12V/+15V
C466
2200pF
C46010uF25V
R466
1.5K
1%
C427100pF50V
OPT
IC406AOZ1073AIL
3AGND
2VIN
4FB
1PGND
5COMP
6EN
7LX_1
8LX_2
R4191K
R412
1K
26"~32"
R98251K
Sharp
C4030.1uF16V
C4110.1uF16V
C980922uF10V
C981022uF10V
POWER_ON/OFF1
+3.3V_Normal
R407
10K
OPT
R408
10K
OPT
R457
15K 5%
R44912K1/10W5%
R4140
19"~22"
R4090
19"~22"
R4790
Q410
19"~22"AO3407A
G
D
S
Q409AO3407A
G
DS
+3.3V_Normal
R434
10K
OPT
R451
22K
OPT
R47322KOPT
R43810K
R44347K
OPT
Q4002SC3052OPT
E
B
C
R4050
19"~22"
R4000
OPT
R402
100K
R415
100K
OPT R422
120K OPT
R425120K
OPT
R40333K
OPT
R40433K
OPT
R433
33K
OPT
+3.3V_Normal
R47410K
R47510KOPT
+3.3V_Normal
R4589.1K
IC400TJ3965S-3.3V-3L
GND
OUTIN
R2
R2
3A
Placed on SMD-TOP
Vout=0.8*(1+R1/R2)
3A
Placed on SMD-TOP
+5V_USB
C IN
1074 mA
S7M DDR 1.8V
3A
1934 mA
Vout=(1+R1/R2)*0.8
Placed on SMD-TOP
R2
Placed on SMD-TOP
R1
Replaced Part
R1
R1
R1
Close to IC
Vout=(1+R1/R2)*0.8
MAX 2000mA
2026 mA
Close to IC
C IN
Vout=0.8*(1+R1/R2)Replaced Part
S7M core 1.26V volt
3A
+3.3V_Normal
R2
+15V Control
New item
PANEL_POWER
UNDER CHECKING
12V-->3.58V
20V-->3.5V
15V-->3.6V
Power_DET
ST_3.5V-->3.5V
24V-->3.48V
INV_ON
20
GND
18 A-DIM
PWM_DIM PWM_DIM
LGD
Err_out
AUO
PWM_DIM
<OS MODULE PIN MAP>
Err_out
24
INV_ON
22
INV_ON
Err_out
V4:VBR-AV5:NC
A-DIM
PWM_DIM
FROM LIPS & POWER B/D
SHARP
NC
PIN No
INV_ON
CMO(09)
Power Block
LD350 09.09.03
2
+3.3V_AVDD_MPLL
Vout=0.8*(1+R1/R2)
Vout=0.8*(1+R1/R2)
MAX 1A
+5V_Normal
R2
R13A
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
KEY2
D2404
5.6VCDS3C05HDMI1
OPT
R2412100
EYEQ
R240322
COMERTIAL
R240847K
COMERTIAL
C24081000pF50VOPT
R240947K
COMERTIAL
+3.5V_ST
C24050.1uF
16V
C24020.1uF
26"~32"
D24015.6V
AMOTECH
26"~32"
R2402100
C2407100pF50V
C24041000pF50V
L2402BLM18PG121SN1D
26"~32"
C24010.1uF
26"~32"
LED_R/BUZZ
+3.3V_Normal
+3.5V_ST
C24061000pF50V
D2403
5.6VCDS3C05HDMI1
OPT
R2410100
C24100.1uF
16V
OPT
R2401100
LED_B/LG_LOGO
C24091000pF50VOPT
+3.5V_ST
KEY1
L2403BLM18PG121SN1D
L2401BLM18PG121SN1D
26"~32"
R2411100
EYEQ
C24030.1uF
16V
R241610K
Q24022SC3052
COMERTIAL
E
BC
D24055.6V
AMOTECH
L2404BLM18PG121SN1D
IR_OUT
D24025.6V
AMOTECH26"~32"
R240410K1%
R240510K1%
P2401
12507WR-12L
1SCL
2SDA
3GND
4KEY1
5KEY2
6ST_3.3V
7GND
8LED_B
9IR
10GND
11+3.3V
12LED_R
13
GND
R242547K
Q24062SC3052
EB
C
R242947K
R243010K
R243147K
R242822
+3.5V_ST
Q24052SC3052
E
BC
+3.5V_ST
IR+3.5V_ST
R24263.3KOPT
R24270
OPT
SCL_SUB/AMP
SDA_SUB/AMP
L2405
BLM18PG121SN1D
19"~22"
D2407
5.6V19"~22"
C24120.1uF16V
19"~22"
P2402
12507WR-03L
19"~22"
1
2
3
4
C24110.1uF16V
19"~22"
D2406
5.6V19"~22"
L2406
BLM18PG121SN1D
19"~22"
R24131.5K
R24141.5K
CONTROL
IR & LED
IR & LED
COMMERCIAL
6
LD350 09.09.03
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R7709 0
R7711 0
R7756
4.7K
CK+_HDMI2
R7738 0
D1-_HDMI4
D7701
DDC_SCL_4
D1+_HDMI2
Q77022SC3052
E
B
C
R7735 100
R7710 0
R7702
1K
R7730
1K
R7755
10K
C77000.1uF16V
R7736 0
R7737 0
R7706 22
HPD4
D2+_HDMI2
D0+_HDMI2
DDC_SDA_4
R7713 0
R7705
3.3K
OPT
D2-_HDMI2
5V_HDMI_2
D0-_HDMI4
R7749 22
DDC_SCL_2
C7704
0.1uF
D7702
R7715 0
CK-_HDMI2
IC7701
AT24C02BN-10SU-1.8
HDMI_2
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
+5V_Normal
D1-_HDMI2
Q77012SC3052
E
B
C
D7705ENKMC2838-T112
A1
C
A2
R7712 0
D0-_HDMI2
DDC_SDA_4
C7705
0.1uF
DDC_SDA_2
R7731
1.8K
D2-_HDMI4
5V_HDMI_4
DDC_SDA_2
HPD2
R7741 0
R7760
4.7K
HDMI_CEC
5V_HDMI_2
D1+_HDMI4
R7743 0
5V_HDMI_4R7744
10K
CK-_HDMI4
D0+_HDMI4
R7742 0
CK+_HDMI4
R7714 0
R770722
R7757
10K
R7750 22
IC7702
AT24C02BN-10SU-1.8
HDMI_4
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
C77020.1uF16V
DDC_SCL_4
R7703
1.8K
EEPROM_WP
R7732
3.3K
OPT
R7739 0
D2+_HDMI4
D7706ENKMC2838-T112
A1
C
A2
+5V_Normal
5V_DET_HDMI_2
EEPROM_WP
R772910K
R7740 0
R7716 0
HDMI_CECR7708 100
DDC_SCL_2
5V_DET_HDMI_4
VR7700
AVRL161A1R1NT
GND
HDMI_CEC CEC_REMOTE
C77060.1uF16V
+3.5V_ST
GND
R7762
10K
D7703
R7746
0OPT
R7733 22
R7734 22
R7751 22
R7752 22
R7758
4.7K
R7761
4.7K
JK7702
EAG42463001
HDMI_4
14
13
5D1_GND
20
JACK_GND
12
11
2D2_GND
19
18
10CK+
4D1+
1D2+
17
9D0-
8D0_GND
3D2-
16
7D0+
6D1-
15
VR7701AVRL161A1R1NT
OPT
GND
BSS83Q7703
S B D
G
R7745
68K
R770068KOPT
MDS62110201
M1 OPT
MDS62110201
M2 OPT
MDS62110201
M3 OPT
JK7700
EAG59023301
HDMI_2
14
13
5D1_GND
20
SHIELD
12
11
2D2_GND
19
18
10CK+
4D1+
1D2+
17
9D0-
8D0_GND
3D2-
16
7D0+
6D1-
15
HDMI
HDMI_4
$0.253
HDMI_2
$0.055
HDMI EEPROM
$0.253
$0.055
For CEC
8
LD350 09.09.03
Fiber Optic
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C1125OPTOPT
R11120
D1116
5.6VOPT
SPDIF_OUT
2:X18
+3.3V_Normal
C112718pF50V
R114210K
D1113
30V
JK1104
SPG09-DB-010
1RED
2GREEN
3BLUE
4GND_1
5DDC_GND
6RED_GND
7GREEN_GND
8BLUE_GND
9NC
10
SYNC_GND
11
GND_2
12
DDC_DATA
13
H_SYNC
14
V_SYNC
15
DDC_CLOCK
16SHILED
D11175.6V
D111030V
EEPROM_WP
D1114
5.6VOPT
DSUB_G
C1108100pF50V
C112668pF50VOPT
D111130V
R112622
DSUB_HSYNC
C112818pF50V
ISP_RXD
R1103470K
PC_R_IN 2:S16
R11404.7K
DSUB_R
D1101
5.6VOPT
AMOTECH
C11170.1uF16V
R1102470K
IC1105
AT24C02BN-10SU-1.8
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
JK1103
JST1223-0011
GND
2
VCC
3
VINPUT
4FIX_POLE
C11290.1uF16V
R11394.7K
+3.3V_Normal
C1121100pF50V
R11471K
C1123OPT
OPT
ISP_TXD
DSUB_B
DSUB_VSYNC
D110930V
C1107100pF50V
D1102
5.6VOPT
AMOTECH
C1124OPT
OPT
C112268pF50VOPT
+5V_Normal
R114322
D1115ENKMC2838-T112
A1
C
A2
PC_L_IN 2:S16R11130
IC1104NL17SZ00DFT2G
3GND
2B
4Y
1A
5VCC
DSUB_DET
D111230V
R11480
R11500
R114610K
R11270OPT
C1131
0.1uF16V R1141
22
R1152
4.7K
Q1103MMBT3904-(F)
E
B
C
HP_ROUT
2:X19
+3.5V_ST
R1130
10K
C11151000pF50VOPT
SIDE_HP_MUTE
C11161000pF50VOPT
+3.3V_Normal
HP_DET
R112910KO
PT
R11551K
HP_LOUT
2:X19
Q1101MMBT3904-(F)
E
B
C
Q1102MMBT3904-(F)
E
B
C
Q1104MMBT3904-(F)
E
B
CR11251K
OPT
R11281KOPT
R113375
R113575
R113775
JK3301KJA-PH-0-0177
3DETECT
4L
5GND
1R
JK1102
PEJ027-01
6B T_TERMINAL2
7B B_TERMINAL2
5 T_SPRING
4 R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3 E_SPRING
R111520K
C1106
100uF16V
C1109100uF16V
C110410uF10V
C11030.22uF
16V
R1100
HP_MUTE
HP_ROUT
HP_LOUT
+5V_EARPHONE
C11020.1uF16V
H/P_L
002:Y10
Q11002SC3052
E
B
C
R1104
10K
+5V_Normal
C11001uF10V
IC1100
TPA6110A2DGNRG4
3SHUTDOWN
2GND
4IN2-
1BYPASS
5VO2
6VDD
7VO1
8IN1-
C11101000pFOPT
+5V_EARPHONE
+3.5V_ST
H/P_R
002:Y10
+5V_EARPHONE
Q11052SC3052
E
B
C
C110510uF10V
R110610K
R1118
1K
D1100ENKMC2838-T112
A1
C
A2
R1101
10K
C11111000pFOPT
C11010.22uF16V
R1117
1K
R111420K
R1105
10K
R111616K
R110916K
R110815K
R110715K
R111010K
R111110K
R11190
1/10W5%
R11200
1/10W5%
COMMON AREA
5.15 Mstar Circuit Application
PC AUDIO RGB PCSPDIF OPTIC JACK
COMMON AREANew Item DevelopmentEARPHONE BLOCK
9
LD350 09.09.03
EARPHONE AMP
360mVrms(8mW) => 450mVrms(13mW)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RS-232C
R1285 100
OPT
R1281100
L1209BLM18PG121SN1D
C12340.1uF16V
R1302220
R1282100
R1299220
+3.5V_ST
C124347pF50V
R12750
C124247pF50V
R1278
4.7K
C1229 0.33uF
C1239220pF50V
DBG_TX
R1279
4.7K
DBG_RX
R12760
C1235220pF
50V
R1284 100OPT
C12320.1uF
C1233 0.1uF
C1231 0.1uF
C1230 0.1uF
IC1201MAX3232CDR
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7DOUT2
8RIN2
9ROUT2
10DIN2
11DIN1
12ROUT1
13RIN1
14DOUT1
15GND
16VCC
D123630VOPT
ADUC30S03010L
D123730VOPT
ADUC30S03010L
IR_OUT
JK1201
SPG09-DB-009
1
2
3
4
5
6
7
8
9
10
TxD
RxD
male
Serial Port
RS-232C
RS-232C
LD350 09.09.03
10
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDEAV_R_IN
SIDEAV_L_IN
D33025.6V
SIDE_AV_OPT
R3306
10K
SIDE_AV_OPT
R330812K
SIDE_AV_OPT
SIDEAV_CVBS_IN
D33045.6V
SIDE_AV_OPT
R3307
10K
SIDE_AV_OPT
C3303100pF50V
SIDE_AV_OPT
L3303BLM18PG121SN1D
SIDE_AV_OPT
D330130V
SIDE_AV_OPT
L3301BLM18PG121SN1D
SIDE_AV_OPT
R33051K
SIDE_AV_OPT
R3302
10KSIDE_AV_OPT
C3302100pF50V
SIDE_AV_OPTD33035.6V
SIDE_AV_OPT
+3.3V_Normal
R3304470K
SIDE_AV_OPT
R3303
470K
SIDE_AV_OPT
R330912K
SIDE_AV_OPT
L3302BLM18PG121SN1D
SIDE_AV_OPT
C3301100pF
SIDE_AV_OPT
C3304100pFOPT
SIDEAV_DET
R330175
SIDE_AV_OPT
JK3302
PPJ235-01
SIDE_AV_OPT
4A [YL]O-SPRING
5A [YL]E-LUG
3A [YL]CONTACT
4B [WH]O-SPRING
3C [RD]CONTACT
4C [RD]O-SPRING
5C [RD]E-LUG
SIDE AV
(New Item Developmen H:9.2mm)SIDE_AV
11
LD350 09.09.03
USB DOWN STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D1452
5.6VCDS3C05HDMI1
OPT
JK1450
KJA-UB-4-0004
12
34
5
L1451
MLB-201209-0120P-N2
120-ohm
SIDE_USB_DP
SIDE_USB_DM
D1451
5.6VCDS3C05HDMI1
OPT
C1451
22uF
10V
IC1450AP2191SG-13
3IN_2
2IN_1
4EN
1GND
5FLG
6OUT_1
7OUT_2
8NC
C145210uF10V
+5V_USB
C1453
0.1uF
R14554.7KOPT
+3.3V_Normal
R1456 0
USB_CTL
R145410K
R1451 47 USB_OCD
USB_DIODES
$0.077
09.09.03LD350
14USB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SERIAL FLASH
R104
33
+3.3V_Normal
+3.3V_Normal
Flash_WP_1
001:AR30
R102 0OPT
SPI_CS
001:AR36
+3.3V_Normal
C1260.1uF
R103
10K
SPI_DI
001:AR36
SPI_CK
001:AR35
R101 0
SPI_DO
001:AR36
R105
4.7K
L110
Q100KRC103S
E
B
C
IC101MX25L3205DM2I-12G
3WP#
2SO
4GND
1CS#
5SI
6SCLK
7HOLD#
8VCC
SERIAL FLASH
Serial FLASH MEMORYfor BOOT
LD350 09.09.03
21
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_TU
TUNER_RESET
IF_AGC
C5006100pF50V
FE_VMAIN
R5009100
+3.3V_TU
R50010
OPT
C50030.1uF16V
L5003
BLM18PG121SN1D
+3.3V_Normal
+3.3V_TU
C50240.1uF16V
C501822uF16VOPT
+1.26V
+5V_TU
IF_N_MSTAR
Q5005ISA1530AC1
TU_CVBS_BUFER
E
B
C
+3.3V_TU
+3.3V_TU
C50100.1uF16V
C50070.1uF16V
FE_TUNER_SDA
R50271K
OPT
R5015100
L5002
BLM18PG121SN1D
5V_TU_Normal
R5003 0
R50183.3K
C50210.1uF16V
R50254.7K
R50261K
OPT
R5011100K
C50220.1uF16V
C5025
100pF 50V
R50020
OPT
C5001100pF50V
+3.3V_TU
R50221K
C50160.1uF16V
C50230.1uF16V
R503282
+5V_TU
C501722uF16VOPT
FE_SIF
Q5004ISA1530AC1
E
B
C
C502022uF16V
R5016100
C501922uF16V
IF_P_MSTAR
R5023 0
FE_TUNER_SCL
+5V_TU
+5V_Normal
R50203.3K
+1.26V
R50331
C50280.1uF16V
C502910uF10V
R5034 0
R5035 0
C500482pF50VINNOTEK
L5000INNOTEK
VCOMO
C50000.047uF50V
R500010KOPT
R5004
0 1/16W
5%
TU_CVBS_BUFER
R50052.2KOPT
C5005
0.1uF
OPT
R500647OPT
SIFMO
R5007
5.6K
1/16W
5%OPT
VSB_RESET
R98230
R98240
OPT
R5029470
1608
TU5001TDVJ-H001F
143.3V
131.2V
5AS
12GND
11VIDEO
2BST_CNTL
10NC
4NC[RF_AGC]
1ANT_PWR[OPT]
17DIF_1
9SIF
8NC(IF_TP)
3+B
16IF_AGC_CNTL
7SDA
6SCL
15RESET
18DIF_2
19
SHIELD
+5V_USB
L5004BLM18PG121SN1D
5V_TU_USB
IC5001AP1117EG-13
ADJ/GND
OUTIN
R5008
120
C500222uF10V
R50302202012
TU_CVBS_BUFER
R50312202012TU_CVBS_BUFER
R5010100KOPT
C501247pF50V
C501347pF50V
R5024 0
TU_CVBS_BUFER
R50120
TU_CVBS_BYPASS
ATSC_CAN TUNER
Close to the tuner
200mA
should be guarded by ground
LGIT CAN H/N TUNER for US
60mA
26
LD350 09.09.03
MStar Option
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
VSB_DEMOD
TS_DATA[1]
TS_DATA[6]
TS_DATA[2]
TS_DATA[4]
TS_DATA[5]
TS_DATA[0]
TS_DATA[3]
TS_DATA[0-7]
TS_DATA[0-7]
TS_DATA[7]
C102810uF16V
3216
+1.2V_DVDD_PVSB
+3.3V_PVSB
C102310uF16V
3216
C103810uF16V
3216
R1034
0
1/4W5%
+1.2V_PVSB
+3.3V_AVDD_PVSB
+3.3V_DVDD_PVSB
+3.3V_PVSB
+5V_Normal
C10200.1uF50V
C1002100uF16VOPT
C1018100uF16V
L1000MLB-201209-0120P-N2
OPT
+3.3V_PVSB
R1015
8.2KOPT
R101415K OPT
R10014.7KOPT
R10021K
OPT
C10030.1uF50VOPT
IC1001
SC156515M-1.8TR
OPT
2VIN
1EN
3
GND
5ADJ
4VO
VSB_RESET
TS_DATA[0-7]
C10680.1uF
R1063 1K
TS_SYNC
X1005
25MHz
R107722
TS_SYNC
C10670.1uF
R1065 0OPT
TS_VALID
AR1070 100
+3.3V_DVDD_PVSB
TS_CLK
R107822
C107227pF
+3.3V_DVDD_PVSB
R10730
R1069
470
AR10791001/16W
LD1000
FE_DEMOD_SCL
JP1004
C107127pF
D10001N4148W
R1072 1M
FE_DEMOD_SDA
+3.3V_AVDD_PVSB
JP1007
+3.3V_AVDD_PVSB
C10731uF10V
AR1071 100
R1076
0OPT
TS_VALID
R107447K
C10700.01uF
R1075OPT
R1066 OPT
JP1005
+1.2V_DVDD_PVSB
IF_AGC
JP1006
IF_N_MSTAR
C10690.01uF
R10685.1KOPT
R10601K
R1064 100
IF_P_MSTAR
TS_CLK
C10260.1uF50V
C10300.1uF
50V
C10320.1uF
50V
C10330.1uF
50V
C10430.1uF
50V
C10440.1uF50V
C10660.1uF
R1061 100
R1062 100
L1005500
L1007500
L1008500
R1067 OPT
C10761uF16V
R101120K
R1035100OPT
IC1000SC4215ISTRT
3VIN
2EN
4NC_2
1NC_1
5NC_3
6VO
7ADJ
8GND
POWER_ON/OFF2_2001:AR30;007:AH18
C1019100uF16V
+1.2V_PVSB
C10790.1uF50V
R101210K
IC1004
LGDT3305
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
L1219CB3216PA501E
C21380.1uF50V
R103620K
C10782.2uF16V
C10772.2uF16V
+3.3V_TU
C107422pF50V
OPT
C107522pF50V
OPT
VSB +1.0V B+ BLOCK
VSB +3.3V B+ BLOCK
VDD3
3
VSSA
D10
VCCA
AD10
A
VDD
VSS3
3
SLIM
_SCA
N
OPM
VSS
XTAL
I
TPDA
TA[1
]
TPDA
TA[2
]
TPDA
TA[3
]
TPDA
TA[4
]
TPDA
TA[5
]
TPDA
TA[6
]
TPER
R
TPDA
TA[7
]
VDD3
3
JTAG
TPVA
LID
TPDA
TA[0
]
VSS3
3
VSSAAD10A
IF OUT
I2CRPT_SDA
I2CRPT_SCL
VINA1
I2CSEL
VINA2
RF OUT
VDD
INCAP
ANTCON
VROA
VSS
VDD33
SCL
TPCLK
SDA
VSS33
VDD
PLLAVDD
PLLAVSS
TPSOP
VSS
NIRQ
XM
XTAL
O
NRST
V0 = 0.8(R1+R2) / R2
R1
R2
VSB B+ BLOCK
VSB_DEMOD
LD350 09.09.03
28
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMP1_PR
C9800100pF50VOPT
D98065.6V
D9802
30V
D98085.6V
D9800
5.6V
D98015.6V
R980010K
R9813470K
R980210K
R981710K
C980310pF50V
OPT
R9814470K
R9810470K
AV_CVBS_DET
R981610K
C98081000pF50V
COMP1_Y
D98055.6V
C980110pF50V
OPT
+3.3V_Normal
R981510K
R981810K
AV_CVBS_IN
D980430V
R981912K
+3.3V_Normal
R980775
COMP1_PB
AV_R_IN
R982112K
C98061000pF50V
D980330V
AV_L_IN
R982212K
COMP1_DET
R981275
COMP1_L_IN
C980210pF50V
OPT
C98041000pF50V
C98051000pF50V
R98011K
R982012K
R9811470K
COMP1_R_IN
D98075.6V
R980975
D980930V
R980875
R98031K
C980710pF50V
OPT
JK9800
PPJ238-01
5D [GN2]O-SPRING
6D [GN2]E-LUG
4D [GN2]CONTACT
7E [BL2]E-LUG-S
5E [BL2]O-SPRING
7F [RD2]E-LUG-S
5F [RD2]O-SPRING_1
5G [WH2]O-SPRING
4H [RD2]CONTACT
5H [RD2]O-SPRING_2
6H [RD2]E-LUG
6A [YL1]E-LUG
5A [YL1]O-SPRING
4A [YL1]CONTACT
5B [WH1]O-SPRING
4C [RD1]CONTACT
5C [RD1]O-SPRING
6C [RD1]E-LUG
COMPONENT&AV
LD350 09.09.03
31
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TXAC-[5]
TXA4+[0]
TXA3+[2]
R8180
HD
TXA1-[9]
R8170
HD
R8160HD
R8150
HD
R8140
HDTXAC+[4]
R8130
HD
R8120
HD
R8110
HD
R8100
HD
TXA2+[6]
R8090
HD
TXA4-[1]
TXA3-[3]
TXA1+[8]
TXA2-[7]
LVDS_TXA1+
LVDS_TXA3+
LVDS_TXA2+
LVDS_TXA3-
LVDS_TXA0+
LVDS_TXA0-
LVDS_TXA2-
LVDS_TXA1-
LVDS_TXAC-
LVDS_TXAC+ LVDS_TXA0-
LVDS_TXA0+
LVDS_TXA1-
LVDS_TXA1+
LVDS_TXA2-
LVDS_TXA3+
LVDS_TXA3-
LVDS_TXAC+
LVDS_TXAC-
LVDS_TXA2+
P802FF10001-30
HD_60Hz_Normal
1 GND
2 GND
3 NC
4 NC
5 GND
6 TXA3+
7 TXA3-
8 GND
9 TXAC+
10 TXAC-
11 GND
12 TXA2+
13 TXA2-
14 GND
15 TXA1+
16 TXA1-
17 GND
18 TXA0+
19 TXA0-
20 GND
21 NC
22 LVDS_SEL
23 GND
24 GND
25 GND
26 GND
27 VCC
28 VCC
29 VCC
30 VCC
31
GND
PANEL_VCC
L802CB3216PA501E
HD_60Hz_Normal
C80822uF25V
HD_60Hz_Normal
C8041000pF
HD_60Hz_Normal
C8060.1uF
HD_60Hz_Normal
+3.3V_Normal
R82310K
AUO26"~32"
PANEL_VCC
L801CB3216PA501E
HD_60Hz_SMALL
C80722uF25VHD_60Hz_SMALL
C8031000pF
HD_60Hz_SMALL
C8050.1uF
HD_60Hz_SMALL
R8190
26"~32"
R806 0
26"~32"
R822
5.1KCMO&Sharp
OPC_OUT
P801FF10001-30
HD_60Hz_SMALL
1 VCC
2 VCC
3 VCC
4 VCC
5 VCC
6 GND
7 GND
8 GND
9 NC
10 NC
11 NC
12 GND
13 TXA3+
14 TXA3-
15 GND
16 TXAC+
17 TXAC-
18 GND
19 TXA2+
20 TXA2-
21 GND
22 TXA1+
23 TXA1-
24 GND
25 TXA0+
26 TXA0-
27 GND
28 NC
29 PWM_OUT
30 NC
31
GND
R808100 LGD_OPC
R8201K
22"CMO
R8210 26"~32"
TXA4+[0]
TXA4-[1]
TXA3+[2]
TXA3-[3]
TXAC+[4]
TXA2+[6]
TXAC-[5]
TXA1+[8]
TXA2-[7]
TXA1-[9]
09.09.03LD350
32LVDS
VESA(NS)
JEIDA
LVDS_SEL
[30Pin LVDS Connector] (For HD 60Hz_Normal)
CMO 22"
LOW
HIGH LOW/OPEN
AUO 26"/32"
HIGH
HIGH/OPEN(Defult)
LOW(GND)
Sharp 26"/32"
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.