Printed in Korea P/NO : MFL67982514 (1402-REV00) CHASSIS : LB43T MODEL: 32LB561D/561T/563D/563T 32LB561D/561T-TC 32LB563D/563T-TD CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. LED TV SERVICE MANUAL North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com Internal Use Only
72
Embed
North/Latin America Europe/Africa ...https://телемастерская.рф/wp-content/uploads/2017/09/LG... · p/no : mfl67982514 (1402-rev00) printed in korea chassis : lb43t
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite.An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA.In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
SERVICING PRECAUTIONSCAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precau-tions. Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo-sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this service manual.CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged eas-ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam-age caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter-natively, obtain and wear a commercially available discharg-ing wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo-sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some sol-der removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads elec-trically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective mate-rial to the chassis or circuit assembly into which the device will be installed.CAUTION: Be sure no power is applied to the chassis or cir-cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity suf-ficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the compo-nent lead and the foil.CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the cir-cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close
as possible to the component body.2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed when-ever this condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec-tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con-nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
This specification sheet is applied to all of the LED TV with LB43T chassis.
2. Designation(1) The adjustment is according to the order which is
designated and which must be followed, according to the plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.(3) Magnetic Field Condition: Nil.(4) Input signal Unit: Product Specification Standard.(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °CRelative humidity : 65 ± 10 %Input voltage : 100-220 V~, 50/60 Hz
(6) Adjustment equipments: Color Analyzer(CA-210 or CA-110), Service remote control.
(7) Push the “IN STOP" key - For memory initialization.
3. Main PCB check process▪ APC - After Manual-Insert, executing APC
* Boot file Download(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.(2) Set as below, and then click "Auto Detect" and check "OK"
message.If "Error" is displayed, check connection between computer, jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin) by clicking "Read"
(4) Click "Connect" tab. If "Can't" is displayed, check connection between computer, jig and set.
(5) Click "Auto" tab and set as below.(6) Click "Run".(7) After downloading, check "OK" message.
* USB DOWNLOAD(*.epk file download)(1) Put the USB Stick to the USB socket.(2) Automatically detecting update file in USB Stick.
- If version of update file in USB Stick is lower, it will not work. But version of update file is higher, USB data will be detected automatically.
Case1 : Software version up1. After downloading S/W by USB , TV set will reboot
automatically.2. Push “In-stop” key.3. Push “Power on” key.4. Function inspection5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line1. When TV set is entering on the assembly line, Push
“In-stop” key at first.2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover channel information by itself.
3. After function inspection, Push “In-stop” key.
(1)
filexxx.bin
(4)
(5)
(6)
(7)...........OK
filexxx.bin
(2)
(3)
Please Check the Speed :To use speed betweenfrom 200KHz to 400KHz
(5) Updating Completed, the TV will restart automatically.(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)* If updated version is higher than what TV has, the TV can
lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.(1) Push "IN-START" key in service remote control.(2) Select "Tool Option 1" and push "OK" key.(3) Punch in the number. (Each model has their number)(4) Completed selecting Tool option.
* RS-232C Connection Method.Connection : PCBA (USB Port) → USB to Serial Adapter (UC-232A) → RS-232C cable → PC(RS-232C port) ● Product name of USB to Serial Adapter is UC-232A.
4. ADC Process4.1. ADC
- Enter Service Mode by pushing "ADJ" key,- Enter Internal ADC mode by pushing "►" key at "8. ADC
Calibration".
<Caution> Using "P-ONLY" key of the Adjustment remote control, power on TV.
* ADC Calibration Protocol (RS232)
Adjust Sequence▪ aa 00 00 [Enter Adjust Mode]▪ xb 00 40 [Component1 Input (480i)]▪ ad 00 10 [Adjust 480i Comp1]▪ aa 00 90 End Adjust mode* Required equipment : Adjustment remote control.
4.2. Function Check4.2.1. Check display and sound
■ Check Input and Signal items.(1) TV(2) AV (CVBS)(3) COMPONENT (480i)(4) HDMI* Display and Sound check is executed by Remote control.
<Caution> Not to push the "INSTOP" key after completion if the function inspection.
NO Item CMD 1 CMD 2 Data 0
EnterAdjust MODE
Adjust ‘Mode In’ A A 0 0 When transfer the ‘Mode In’,
Carry the command.
ADC adjust ADC Adjust A D 1 0 Automatically adjustment(The use of a internal pattern)
5. Total Assembly line process5.1. Adjustment Preparation
▪ W/B Equipment conditionCA210: CH14, Test signal: Inner pattern(80IRE)-LED Module
▪ Above 5 minutes H/run in the inner pattern. ("power on" key of Adjustment remote control)
* The spec of color temperature and coordinate.
* W/B Table in process of aging time- LGD Module
- AUO/INX/COST/SHARP/BOE Module which cool spec is 13000 K
* Connecting picture of the measuring instrument(On Automatic control)Inside Pattern is used when W/B is controlled. Connect to auto controller or push Adjustment Remote control POWER ON → Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10 lux).(2) Adhere closely the Color analyzer(CA210) to the module
less than 10 cm distance, keep it with the surface of the Module and Color analyzer's prove vertically.(80° ~ 100°).
(3) Aging time- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.
▪ Auto adjustment Map(RS-232C)RS-232C COMMAND[CMD ID DATA] Wb 00 00 White Balance Start Wb 00 ff White Balance End
<Caution>Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.(When R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)
Full White Pattern CA-210
COLORANALYZERTYPE : CA-210
RS-232C Communication
Mode Color Temp Color coordinate Remark
Cool (C50) 13,000 K X=0.271 (±0.002)Y=0.270 (±0.002)
<Test Signal>- Inner pattern
for W/B adjust- External white
pattern(80IRE, 204gray)
Medium(0) 9,300 K X=0.286 (±0.002)Y=0.289 (±0.002)
Warm(W50) 6,500 K X=0.313 (±0.002)Y=0.329 (±0.002)
(normal line) March ~ DecemberAging time(Min) Cool Medium Warmcolor coordinate X y x y x y
* Manual W/B process using adjust Remote control.■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000.■ Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.■ After enter Service Mode by pushing “ADJ” key,■ Enter White Balance by pushing “►” key at “9. White
Balance”.
■ For manual adjustment, it is also possible by the following sequence.(1) Set TV in Adj. mode using “P-ONLY” key on remote
controller and then operate heat run longer than 15 minutes.(If not executed this step, the condition for W/B may be different.)
(2) Push “Exit” key.(3) Enter White Balance mode by pushing the ADJ key and
select “9. White Balance”. When KEY (►) is pressed, 206 Gray internal pattern will be displayed.
(4) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10 cm of the surface
(5) Select each items (Red/Green/Blue Gain) using ▲/▼ (CH +/-) key on Remote control.
(6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.(7) Adjust three modes all (Cool / Medium / Warm)
- For All model w/o LS345Fix the one of R/G/B gain and change the others
- For G-FIX modelCool Mode1) Fix the one of R/G/B gain to 192 (default data) and
decrease the others. (If G gain is adjusted over 172 and R and B gain less than 192 , Adjust is O.K.)
2) If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and G gain same amount of increasing G gain.
3) If R gain or B gain is over 255, readjust G gain less than 172, Conform to R gain is 255 or B gain is 255Medium / Warm Mode - Fix the one of R/G/B gain to 192 (default data) and decrease the others.
(8) When adjustment is completed, exit adjustment mode using EXIT key on Remote control.
* CASE Cool First adjust the coordinate far away from the target value(x, y).1) x, y > target
i) Decrease the R, G. 2) x, y < target
i) First decrease the B gain, ii) Decrease the one of the others.
3) x > target, y < targeti) First decrease B, so make y a little more than the
target.ii) Adjust x value by decreasing the R.
4) x < target, y > targeti) First decrease B, so make x a little more than the
target.ii) Adjust x value by decreasing the G.
* After You finish all adjustments, Press “In-start” button and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.If it is not same, then correct it same with BOM and unplug AC cable.For correct it to the model’s module from factory JIG model.
* Push the “IN STOP" key after completing the function inspection.
5.2. DDC EDID Write (HDMI 256Byte)■ Connect HDMI Signal Cable to HDMI Jack.■ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.■ Check whether written EDID data is correct or not.* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
5.3. EDID DATA1) All Data : HEXA Value2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***: Year : Controlled ****: Check sum
- Auto Download■ After enter Service Mode by pushing “ADJ” key,■ Enter EDID D/L mode.■ Enter “START” by pushing “OK” key.
6. 3D function test(Pattern Generator MSHG-600, MSPG-6100[Support HDMI1.4])* HDMI mode No. 872 , pattern No.83(1) Please input 3D test pattern like below.
(2) When 3D OSD appear automatically, then select OK button.
(3) Don't wear a 3D Glasses, check the picture like below.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Power_PD2
2013.10.28
4
L14_M1A
Q403MMBT3904(NXP)
E
B
C
+12V
R42610K
+3.5V_ST
Q406AO3435
FET_2.5V_AOS
G
DS
PANEL_VCC
PWM_DIM
Q400MMBT3904(NXP)
E
B
C
R4201K
R4243.9K
PWM_DIM_PULL_DOWN
R40110K R442
10K
+24V
Q404MMBT3904(NXP)
E
B
C
R44110K
+3.5V_ST
R445
33K
R4482.2K
C4130.1uF16V
OPT
C4160.33uF
16V
R44410K
+12V
INV_CTL
R4302.7K
1%
+3.5V_ST
R40010K
OPT
+3.5V_ST
R42510K
R435100K
Q402MMBT3904(NXP)
E
B
C
R42910K
C4150.1uF16V
C4170.1uF16V
L410BLM18PG121SN1D
C4240.1uF16V
OPT
+3.3V_Normal
Q406-*1DMP2130L
FET_2.5V_DIODE
G
DS
R43205%
OPT
R4311.2K
1%
L403MLB-201209-0120P-N2
POWER_ON/OFF_1
C4010.1uF
50V
+1.10V_VDDC
POWER_DET
RL_ON
+3.3V_Normal
+12V
+24V
+3.5V_ST
L402MLB-201209-0120P-N2
C4290.1uF16V
R423100
PWM2_2CH_POWER
PANEL_CTL
R44310K
R40610K
R419100
+3.5V_ST POWER_DET_RESET
+3.3V_Normal
C4020.1uF
16V
C4250.1uF25V
OPTC4220.1uF
R436100K
OPT
R4515.6K
R4044.7K
R40210K
R4525.6K
R41233K
OPT
Q401
MMBT3906(NXP)
1
2
3
PWM1
L4073.6uH
R454100 5%
PD_+12V
C43022uF10V
C41410uF10V
C4282.2uF10V
C42022uF10V
C42122uF10V
C42710uF16V
ZD4005V
ZD4025V
L401CB2012PK501T
L400CB2012PK501T
L408UBW2012-121F
120OHM
+3.3V_Normal
C40610uF16V
R41810
R410100K
L4054.7uH
R4054.7K
OPT
R40910K
C40810uF10V
+3.3V_Normal
R416100K
OPT
AVDD5V_MHL
+5V_Normal
USB1_OCD
C41222uF16V
+5V_USB
10uFC405
R40710K
R4034.7K
OPT
5V_HDMI_4
USB1_CTL
+12V
/MHL_OCP_DET
C4090.047uF25V
L409
BLM18PG121SN1D
+3.3V_Normal
L411
CB2012PK501T
10uFC426
10V
+1.5V_DDR
10uFC431
10V
R4550
C41010uF10V
ZD4032.5V
ZD4012.5V
R4560
OPT
C4324.7uF
50V3216
+24V_CAP
C4001uF10V1005OPT
+24V
R4578.2K
1%
OPT
R45805%
OPT
R4384.7K
OPT
C40710uF10V2012
IC401APX803D29
1
GND
3VCC 2 RESET
IC402APX803D29
OPT
1
GND
3VCC 2 RESET
C434390pF50V
C4190.039uF
50V
C423
270pF50V
C4350.1uF16V
C4180.01uF
ZD4045V
+3.5V_POWER_DET
+3.5V_POWER_DET
+3.5V_POWER_DET
+3.3V_Normal
/VBUS_EN
MHL_OCP_EN
R4632.7K
MHL_SW_TRR46410K
MHL_SW_TR
Q408MHL_SW_TR
E
B
C
R46210K
MHL_SW_TR
Q407MHL_SW_TR E
B
C
Q409MHL_SW_TR
E
B
C
R46510K
MHL_SW_TR
R46620K
R46110K
MHL_SW_TR
R43920K1%
R44047K1%
R4332.7K1%
R44722K
C403100pF50V
OPT
R41515K5%
R4590
OPT
R4084.7K
R4491K1/16W1%
R4502001/16W1%
C41182pF50V
C4044700pF50V
D401
30VMBR230LSFT1G
L406CB2012PK501T
+3.5V_ST
C43610uF10V
OPTC437
0.1uF16V
Q405DMP2130L
G
DS
R42727K1%
OPT
R4285.1K
1%
OPT
IC404AZ1117EH-ADJTRG1
ADJ/GND
OUTIN
R437100 5%
OPT
R454-*1300
5%
PD_+3.5V
IC403TPS5432DDAR
3PH
2VIN
4GND
1BOOT
5VSENSE
6COMP
7EN
8SS
9
[EP]GND
TPS65282REGR
IC400
1EN
3SS
7FAULT2
9SW_OUT2
10
RLIM
11
AGND
12
SW_OUT1
13SW_IN_1
14SW_IN_2
15FB
16LX_1
17LX_2
18BST
19
PGND_1
20
PGND_2
21
VIN_1
22
VIN_2
23
PGOOD
24
V7V
5EN_SW2
8FAULT1
6EN_SW1
4ROSC
2COMP 25
[EP]GND
C4334.7uF16V
+12V_CAP
3216
MHL_5V_EN
MHL_5V_EN
R42118K1%
R4223.3K1%
P401SMAW200-H18S5
14 12V
924V
4 PDIM#1
18 GND
1312V
8 PDMI#2
33.5V
17GND
12 GND
7GND
2 DRV ON
16 NC
11GND
6 3.5V
1PWR ON
1512V
10 24V
53.5V
19
.
R44612K
R4530
R4671K
OPT
PANEL_VCC
+1.10V_VDDC
R1
+3.3V_Normal
+1.5V_DDR
Vout=0.808*(1+R1/R2)
Power_DET
R2
FROM LIPS or POWER B/D
L14 POWER BLOCK (POWER DETECT 2)
R1
R2
+5V_Normal & +5V_USB with OCP
R2
R1
1.3A
4A
Vout=1.25*(1+R2/R1)+Iadj*R2
Vout=0.8*(1+R1/R2)
3A
(Active High)
(Active Low)
Ready - Dual Power Det
R432, R454-*1, R438
Now is
R457, R454
Detect Valtage
O R430, R431, R454
Use Circuit Designator
Power Detect +3.5V
Power Detect +12V
Power Detect +24V
Power Detect activity
* Notice - Applying all inch models for LCD L14 - Dual Power Det is used for detecting two kinds of voltage
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. SPDIF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. LVDS_NON_EU
2013/05/22
11
L14_S7LR(M1A)
RXB0-
RXA0+
C11010.1uF16V
MO_HD
C11000.1uF16V
MO_FHD
RXBCK-
RXA1-
RXB4-
+3.3V_Normal
RXB1+
RXBCK+
PANEL_VCC
RXB3+
RXA3-
RXB4+
RXA4-
RXA4+
RXA2+
RXB2-
RXA1+
RXA2-
RXB1-
R11093.3K
OPT
RXA3+
RXA0-
PANEL_VCC
RXACK-
RXB2+
R111010K
OPT
RXB3-
RXB0+
P1100
FI-RE51S-HF-J-R1500
MO_FHD
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12RXA0-
13RXA0+
14RXA1-
15RXA1+
16RXA2-
17RXA2+
18.
19RXACK-
20RXACK+
21.
22RXA3-
23RXA3+
24RXA4-
25RXA4+
26.
27.
28RXB0-
29RXB0+
30RXB1-
31RXB1+
32RXB2-
33RXB2+
34.
35RXBCK-
36RXBCK-
37.
38RXB3-
39RXB3+
40RXB4-
41RXB4+
42.
43.
44.
45.
46.
47.
48.
49.
50.
51.
52
.
RXACK+
R1100 0
MO_FHD
R1101 0
MO_FHD
R1102 0
MO_FHD
R110410K
OPT
R11033.3K
OPT
+3.3V_Normal
L1101
UBW2012-121F120OHM
MO_HD
L1100
UBW2012-121F120OHM
MO_FHD
RXA3+
RXA3-
RXACK+
RXACK-
RXA2-
RXA2+
RXA1-
RXA1+
RXA0-
RXA0+
VCOM_SCL
VCOM_SDA
VCOM_SCL
VCOM_SDA
R11152K
VCOM_I2C_PULL_UP
VCOM_SCL
VCOM_SDA
R11142K
VCOM_I2C_PULL_UP
R11050
VCOM_I2C
URSA/VCOM_SDA
URSA/VCOM_SCLR1106
0
VCOM_I2C
+3.3V_Normal
URSA/VCOM_SDA
URSA/VCOM_SCL
P1101
10031HR-30
MO_HD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
RXB1-
RXB0-
RXA4+
RXA1-
Pol-change
RXB4+
RXACK+
RXBCK-
RXA0+
RXA2+
LVDS (NON EU)
RXA2+
RXBCK-
RXB4-
RXA3+
RXA1+
RXB2+
RXB3-
RXA3-
RXBCK-
RXACK-
RXA2+
RXA1-
RXB1-
RXB3-
RXA3+
RXA2-
RXA0+
RXA4+
Shift
RXBCK+
RXB2-
RXA4+
[51Pin LVDS Connector] (For FHD 60Hz)
RXACK+
RXA3-
RXACK-
RXB3+
RXA3+
RXA1-
RXB0-
RXA0-
RXACK+
RXB3+
RXA4-
RXB3+
RXA4+
RXA2-
RXA2+
RXA1+
RXB2-
Pol-change
RXB4+
RXB1-
RXA4-
RXACK+
RXB3-
RXB0+
RXB3+
RXBCK+
RXB4-
RXA0+
RXA2+
RXB0+
RXB1+
RXA3-
RXA2-
RXBCK+
RXB4-
RXA0+
RXA4+
RXA2+
RXB3-
RXA0-
RXB0-
RXA4-
RXACK-
RXB0-
RXA4+
RXB2+
RXA1-
RXB2+
RXACK-
RXA3-
RXA1+
RXA3-
RXA1+
RXB3+
RXB3-
RXA3-
RXB1-
RXB4+
FOR FHD REVERSE(10bit)
RXB0+
RXB3-
RXA3+
RXA0+
RXA2- RXACK-
RXB1-
RXA3+
RXB2- RXBCK-
RXBCK+
RXA1+
RXA0-
RXA3+
RXA0-
RXB2+
RXB0-
RXA0-
RXB2-
RXACK-
MIRROR
RXB4-
RXA0-
RXB2+
RXA4+
RXB4-
RXA1+
RXB3+
RXB0+
RXB1+
RXA1-
RXA0-
RXA4-
RXB2-
Change in S7LR
RXA4-
RXB2+
MIRROR
RXB1-
RXA3+
RXA1-
RXACK+
RXB3+
RXB0+
RXB4-
RXACK+
RXB1+
RXACK-
RXA4-
RXA1-
RXA2-
RXA0+
RXB0-
RXB1+
RXB4+
RXB2+
RXBCK-
RXB0-
FOR FHD REVERSE(8bit)
RXBCK-
RXBCK+
RXB4+
RXB0+
RXB2-
RXA1+
RXBCK-
RXA2-
RXB1+
RXB1+
RXB1-
RXA4-
RXB4+
[30Pin LVDS Connector] (For HD 60Hz_Normal)
Change in S7LR
RXB1+
RXB3-
RXA2+
RXA3-
RXA2-
RXB2-
LVDS_SEL
RXBCK+
RXB4-
RXB0+
RXA0+
RXB4+
RXBCK+
RXACK+
EU pin assign is different from NON EU.Because of position of HD wafer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. 1_DDR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. S_FLASH
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3V_TU
C161320pF50V
OPT
C160222uF6.3V
C1616
0.1uF16V
C160522uF6.3V
IF_N_MSTAR
IF_AGC_SEL
TU_SIF
FE_TS_VAL_ERR
+3.3V_TU
C161018pF50V
C1601
0.1uF 16VOPT
C1615100pF50V
R1607 33
C16030.1uF16V
TU_SDA
R16111.8KTU_IIC_ATSC_1.8K
R161282
OPT
FE_TS_DATA[0]
R1610-*11KTU_IIC_NON_ATSC_1K
IF_P_MSTAR
L1600
UBW2012-121F
R1609 100
C160918pF50V
IF_AGC_MAIN
R1606 0
IF_NON_FILTER_KR
C16110.1uF16V
TU_CVBS
R1606-*110
IF_FILTER_AJ
R1605-*110
IF_FILTER_AJ
TUNER_RESET
+3.3V_TU
R1605 0
IF_NON_FILTER_KR
C161420pF50V
OPT
TU_SCL
TU_GND_A
R1608 33
RF_SWITCH_CTL
C16070.1uF16V
FE_TS_SYNC
R16130
OPT
R1611-*11KTU_IIC_NON_ATSC_1K
+3.3V_Normal
FE_TS_CLK
R16101.8K
TU_IIC_ATSC_1.8K
TDJH-G101D
TU1601-*1TU_AJ_T/C
47
SHIELD
6IF[P]
7IF[N]
8NC_2
9NC_3
1B1[+3.3V]
2NC_1
3IF_AGC
4SCL
5SDA
A1A1
B1B1
TDJH-H101F
TU1601TU_ATSC
47
SHIELD
6IF[P]
7IF[N]
8NC_2
9NC_3
1B1[+3.3V]
2NC_1
3IF_AGC
4SCL
5SDA
A1A1
B1B1
Size change,0929
16
should be guarded by ground
Close to the tuner
FE_AGC_SPEED_CTL
close to the tuner pin, add,09029
CHANGE TO6.3V 2012 X5R
1. should be guarded by ground2. No via on both of them3. Signal Width >= 12mils Signal to Signal Width = 12mils Ground Width >= 24mils
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. RS232C_MSTAR_DEBUG_4P
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. IR_EYE_SENSOR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2013/09/16
MAIN1_NON_EU 51
M1A_L14
PCM_D[3]
PCM_A[1]
PCM_A[10]
PCM_A[5]
PCM_A[7]
FE_TS_DATA[3]
PCM_A[0]
PCM_D[6]
CI_TS_DATA[0]
CI_TS_DATA[2]
PCM_A[7]
PCM_A[5]
PCM_A[0]
PCM_A[2]
FE_TS_DATA[0]
PCM_A[11]
PCM_D[4]
PCM_A[14]
CI_TS_DATA[4]
PCM_A[6]
PCM_D[7]
PCM_A[4]
FE_TS_DATA[2]
CI_TS_DATA[7]
PCM_A[4]
PCM_A[13]
PCM_A[12]
FE_TS_DATA[0]
CI_TS_DATA[1]
PCM_A[3]
PCM_D[1]
FE_TS_DATA[5]
PCM_A[3]
PCM_A[1]
PCM_A[2]
CI_TS_DATA[6]
PCM_D[0]
FE_TS_DATA[1]
PCM_D[2]
PCM_A[9]
CI_TS_DATA[3]
FE_TS_DATA[7]
FE_TS_DATA[4]
PCM_D[5]
PCM_A[8]
PCM_A[6]
FE_TS_DATA[6]
CI_TS_DATA[5]
R1390
HALF_NIM/EU_NON_T2
PCM_A[0-7]
5V_DET_HDMI_2
/PCM_IOWR
I2C_SCL
MODEL_OPT_2
SPI_SDI
R129 22
DEMOD_RESET
RGB_DDC_SCL
COMP2_DET
PANEL_CTL
RXB2+
PCM_D[0-7]
SCART1_MUTE
MODEL_OPT_0
RL_ON
C1231000pFOPT
/PF_CE0AUD_MASTER_CLK_0
RXB3+
RXA4-
R12010KPDP
/SPI_CS
/PF_OE
KEY2
MODEL_OPT_4
/F_RB
PF_ALE
R108 22
SPDIF_OUT
R141 47
AV_CVBS_DET
EPHY_TP
C114-*4 30pFXTAL_LOAD_30pF
PCM_A[0-14]
R13710K
HALF_NIM/EU_NON_T2
FE_TS_DATA[0]
RXA1+
L101BLM18PG121SN1D
HALF_NIM/EU_NON_T2
C1050.1uF
/MHL_OCP_DET
IC104-*1
R1EX24256BSAS0A
NVRAM_RENESAS
EAN62389501
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
+3.5V_ST
/CI_CD1
/PCM_IORD
PF_ALE
RXB4-
/PCM_OE
R12533
FE_TS_VAL_ERR
PWM0
R135 33
/PCM_WAIT
HP_DET
C12233pF
IF_FILTER_AJ/CSA
I2C_SDA
R136
1M
+3.3V_Normal
IF_AGC_MAIN
AMP_SDA
C12433pF
IF_FILTER_AJ/CSA
CI_TS_VAL
/PCM_IRQA
C121
100pFOPT
+3.3V_Normal
+3.3V_Normal
R1103.9K
LED_R/BUZZ
SOC_RESET
R132 100
SPDIF_OPTIC
RXB0+
RXB4+
I2C_SDA
CI_TS_DATA[0-7]
POWER_DET
TU_SIF
RF_SWITCH_CTL
IC102H27U1G8F2CTR-BC
EAN35669103
NAND_FLASH_1G_HYNIX
26NC_17
27NC_18
28NC_19
29I/O0
30I/O1
31I/O2
32I/O3
33NC_20
34NC_21
35NC_22
36VSS_2
37VCC_2
38NC_23
39NC_24
40NC_25
41I/O4
42I/O5
43I/O6
44I/O7
45NC_26
46NC_27
47NC_28
48NC_29
17ALE
3NC_3
6NC_6
16CLE
15NC_10
14NC_9
13VSS_1
12VCC_1
11NC_8
10NC_7
9CE
8RE
7R/B
4NC_4
5NC_5
25NC_16
24NC_15
23NC_14
2NC_2
22NC_13
21NC_12
1NC_1
20NC_11
19WP
18WE
FRC_RESET
URSA/VCOM_SCL
EPHY_RP
SENSOR_SCL
RXB2-
R103 100
FE_TS_CLK
RXB3-
PCM_RST
R1132.2K
R134 33
C1200.047uF25VHALF_NIM/EU_NON_T2
C1048pFOPT
RXACK+
SPI_SDO
R117
4.7K
OPT
C112100pF50V
OPT
DEMOD_SDA
PM_RXD
PWM2
SPDIF_OUT
LED_R/BUZZ
PM_MODEL_OPT_0
PCM_5V_CTL
/F_RB
SENSOR_SDA
/PCM_REG
IC104M24256-BRMN6TP
EAN61548301
NVRAM_ST
3E2
2E1
4VSS
1E0
5SDA
6SCL
7WC
8VCC
EPHY_TN
USB1_OCD
IF_N_MSTAR
R128 22
EPHY_TP
PM_MODEL_OPT_0
TU_SDA
PWM2
/PCM_CE
RXA4+
URSA/VCOM_SDA
/PF_CE0
POWER_ON/OFF_1
CI_TS_SYNC
R102 10K
DEMOD_RESET
MODEL_OPT_5
+3.3V_Normal
R1051K
C116 0.1uF
RXA1-
RXB1-
R123
56
/PF_WP
FRC_RESET
KEY1
R118
4.7K/PF_WE
PM_LED
PM_LED
IF_P_MSTAR
RXB0-
USB1_CTL
MODEL_OPT_1
PWM1
R1041K
OPT
C1068pFOPT
R1071K
OPT
/CI_CD1
PWM_DIM
R11910KLCD
RXA2+
FE_TS_SYNC
AV2_CVBS_DET
IR
SPI_SDI
C1180.1uF
HALF_NIM/EU_NON_T2
IC102-*5K9F1G08U0D-SCB0
NAND_FLASH_1G_SS
EAN61857001
26NC_17
27NC_18
28NC_19
29I/O0
30I/O1
31I/O2
32I/O3
33NC_20
34NC_21
35NC_22
36VSS_2
37VCC_2
38NC_23
39NC_24
40NC_25
41I/O4
42I/O5
43I/O6
44I/O7
45NC_26
46NC_27
47NC_28
48NC_29
17ALE
3NC_3
6NC_6
16CLE
15NC_10
14NC_9
13VSS_1
12VCC_1
11NC_8
10NC_7
9CE
8RE
7R/B
4NC_4
5NC_5
25NC_16
24NC_15
23NC_14
2NC_2
22NC_13
21NC_12
1NC_1
20NC_11
19WP
18WE
SENSOR_SDA
AMP_SCL
AMP_MUTE
C1010.1uF
I2C_SCL
EPHY_RN
RXA3+
C115 0.1uF
RXBCK+
SC1/COMP1_DET
RXA3-
I2C_SCL
DEMOD_SCL
TUNER_RESET
/FLASH_WP
AR10422
/PF_OE
AUD_MASTER_CLK
R1400
HALF_NIM/EU_NON_T2
RXACK-
R1111K
R1121K
MHL_OCP_EN
/CI_CD2
MHL_CD_SENSE
+3.5V_ST
C1190.1uF
HALF_NIM/EU_NON_T2
+3.3V_Normal
TU_SCL
R116
4.7K
/PF_WP
INV_CTL
PM_TXD
AMP_RESET
RXA2-
C113-*4 30pFXTAL_LOAD_30pF
AR10322
RXA0-
/PF_WE
R12433
R142 47
RXBCK-
PWM0
5V_DET_HDMI_2
EPHY_TN
AV2_CVBS_DET
EPHY_RP
SPI_SCKR101
3.3K
RXA0+
SENSOR_SCL
RXB1+
/PCM_CD
/PCM_WE
X10124MHz
/PF_CE1
RGB_DDC_SDA
R109 22
R1380
HALF_NIM/EU_NON_T2
CI_TS_CLK
+3.3V_Normal
R1061K
/CI_DET
5V_DET_HDMI_4
/CI_CD2
R133 33
EPHY_RN
SIDE_HP_MUTE
C1030.1uF
C1170.1uF
HALF_NIM/EU_NON_T2
R115
4.7K
OPT
R1142.2K
I2C_SDA
AR102
22
MODEL_OPT_6
FE_TS_DATA[0-7]
AR10122
/PF_CE1
R121
2.7K
R122
2.7K
OPT
AMP_SDA
AMP_SCL
R127 22 DVB_T2
R126 22 DVB_T2
DEMOD_SCL
DEMOD_SDA
/VBUS_EN
C113-*2 22pFXTAL_LOAD_22pF
C114-*2 22pFXTAL_LOAD_22pF
PWM3
PWM3R143 10K
C10210uF 10V
IC101LGE2132(M1A_256M)
M1A_256M
GPIO78Y1
GPIO79W4
I2C_SCKM3/I2C_DDCR_CK/GPIO77K17
I2C_SDAM3/I2C_DDCR_DA/GPIO76J15
SDAM2/GPIO55U8
SCKM2/GPIO56T7
SCKM0/GPIO58U7
SDAM0/GPIO59V7
I2S_IN_BCK/GPIO159F6
I2S_IN_SD/GPIO160G6
I2C_SCKM1/GPIO80AA4
I2C_SDAM1/GPIO81Y4
ET_TXD[0]/GPIO62J6
EXT_TX_CLK/GPIO64K6
I2S_IN_WS/GPIO158G7
ET_COL/GPIO60J4
ET_TXD[1]/GPIO61J5
LCK/GPIO194H19
LDE/GPIO195G20
LHSYNC/GPIO196G19
LVSYNC/GPIO197G21
UART2_RX/GPIO69J17
UART2_TX/GPIO70J16
UART3_TX/GPIO52E8
UART3_RX/GPIO53D7
GPIO46[CTS]U6
GPIO47[RTS]V6
UART1_TX/GPIO48K15
UART1_RX/GPIO49L16
ET_TX_EN/GPIO63H5
ET_RXD[0]/GPIO65K5
ET_MDC/GPIO66K4
ET_MDIO/GPIO67H6
ET_RXD[1]/GPIO68L5
PCMADR[0]/NF_AD[0]/GPIO130U17
PCMADR[1]/NF_AD[1]/GPIO129R18
PCMADR[2]/NF_AD[2]/GPIO127V17
PCMADR[3]/NF_AD[3]/GPIO126R16
PCMADR[4]/NF_AD[4]/GPIO104U16
PCMADR[5]/NF_AD[5]/GPIO106T17
PCMADR[6]/NF_AD[6]/GPIO107W18
PCMADR[7]/NF_AD[7]/GPIO108U20
PCMADR[8]/GPIO113Y19
PCMADR[9]/GPIO115AA19
PCMADR[10]/GPIO119AA20
PCMADR[11]/GPIO117W21
PCMADR[12]/GPIO109V20
PCMADR[13]/GPIO112Y17
PCMADR[14]/GPIO111V18
PCMCD_N/GPIO135V19
PCMCE_N/GPIO120W19
PCMDATA[0]/GPIO131U18
PCMDATA[1]/GPIO132V16
PCMDATA[2]/GPIO133W17
PCMDATA[3]/GPIO125Y20
PCMDATA[4]/GPIO124R15
PCMDATA[5]/GPIO123AA18
PCMDATA[6]/GPIO122T15
PCMDATA[7]/GPIO121Y21
PCMIORD_N/GPIO116W20
PCMIOWR_N/GPIO114V21
PCMIRQA_N/GPIO110Y18
PCMOE_N/GPIO118T16
PCMREG_N/GPIO128R17
PCM_RESET/GPIO134T18
PCMWAIT_N/GPIO105W16
PCMWE_N/GPIO198U15
TS0CLK/GPIO92V10
TS0DATA[0]/GPIO82T14
TS0DATA[1]/GPIO83T13
TS0DATA[2]/GPIO84U13
TS0DATA[3]/GPIO85V15
TS0DATA[4]/GPIO86U12
TS0DATA[5]/GPIO87V13
TS0DATA[6]/GPIO88U14
TS0DATA[7]/GPIO89T11
TS0SYNC/GPIO91T12
TS0VALID/GPIO90V12
TS1CLK/GPIO103Y14
TS1DATA[0]/GPIO93Y16
TS1DATA[1]/GPIO94AA15
TS1DATA[2]/GPIO95Y13
TS1DATA[3]/GPIO96AA16
TS1DATA[4]/GPIO97W12
TS1DATA[5]/GPIO98AA13
TS1DATA[6]/GPIO99W14
TS1DATA[7]/GPIO100W13
TS1SYNC/GPIO102Y15
TS1VALID/GPIO101W15
PM_SPI_SCZ1/GPIO_PM[6]/GPIO13B3
PM_SPI_SCK/GPIO1A3
PM_SPI_SCZ0/GPIO0A4
PM_SPI_SDI/GPIO2C3
PM_SPI_SDO/GPIO3A2
RPB1
TNC2
TPC1
RNB2
SPDIF_IN/GPIO161D2
SPDIF_OUT/GPIO162D1
HWRESETD8
IRIN/GPIO5E5
DDCA_CK/UART0_RXG4
DDCA_DA/UART0_TXG5
PWM0/GPIO71J18
PWM1/GPIO72K18
PWM2/GPIO73K16
PWM3/GPIO74L18
PWM4/GPIO75L17
NF_ALE/GPIO146T8
NF_CEZ/GPIO142T9
NF_CLE/GPIO141U9
NF_RBZ/GPIO147U11
NF_REZ/GPIO144V9
NF_WEZ/GPIO145U10
NF_WPZ/GPIO199T10
IF_AGCW2
SIFMW1
SIFPW3
IMV2
IPV1
XINAA2
XOUTY2
IC101-*1LGE2131(M1A_128M)
M1A_128M
GPIO78Y1
GPIO79W4
I2C_SCKM3/I2C_DDCR_CK/GPIO77K17
I2C_SDAM3/I2C_DDCR_DA/GPIO76J15
SDAM2/GPIO55U8
SCKM2/GPIO56T7
SCKM0/GPIO58U7
SDAM0/GPIO59V7
I2S_IN_BCK/GPIO159F6
I2S_IN_SD/GPIO160G6
I2C_SCKM1/GPIO80AA4
I2C_SDAM1/GPIO81Y4
ET_TXD[0]/GPIO62J6
EXT_TX_CLK/GPIO64K6
I2S_IN_WS/GPIO158G7
ET_COL/GPIO60J4
ET_TXD[1]/GPIO61J5
LCK/GPIO194H19
LDE/GPIO195G20
LHSYNC/GPIO196G19
LVSYNC/GPIO197G21
UART2_RX/GPIO69J17
UART2_TX/GPIO70J16
UART3_TX/GPIO52E8
UART3_RX/GPIO53D7
GPIO46[CTS]U6
GPIO47[RTS]V6
UART1_TX/GPIO48K15
UART1_RX/GPIO49L16
ET_TX_EN/GPIO63H5
ET_RXD[0]/GPIO65K5
ET_MDC/GPIO66K4
ET_MDIO/GPIO67H6
ET_RXD[1]/GPIO68L5
PCMADR[0]/NF_AD[0]/GPIO130U17
PCMADR[1]/NF_AD[1]/GPIO129R18
PCMADR[2]/NF_AD[2]/GPIO127V17
PCMADR[3]/NF_AD[3]/GPIO126R16
PCMADR[4]/NF_AD[4]/GPIO104U16
PCMADR[5]/NF_AD[5]/GPIO106T17
PCMADR[6]/NF_AD[6]/GPIO107W18
PCMADR[7]/NF_AD[7]/GPIO108U20
PCMADR[8]/GPIO113Y19
PCMADR[9]/GPIO115AA19
PCMADR[10]/GPIO119AA20
PCMADR[11]/GPIO117W21
PCMADR[12]/GPIO109V20
PCMADR[13]/GPIO112Y17
PCMADR[14]/GPIO111V18
PCMCD_N/GPIO135V19
PCMCE_N/GPIO120W19
PCMDATA[0]/GPIO131U18
PCMDATA[1]/GPIO132V16
PCMDATA[2]/GPIO133W17
PCMDATA[3]/GPIO125Y20
PCMDATA[4]/GPIO124R15
PCMDATA[5]/GPIO123AA18
PCMDATA[6]/GPIO122T15
PCMDATA[7]/GPIO121Y21
PCMIORD_N/GPIO116W20
PCMIOWR_N/GPIO114V21
PCMIRQA_N/GPIO110Y18
PCMOE_N/GPIO118T16
PCMREG_N/GPIO128R17
PCM_RESET/GPIO134T18
PCMWAIT_N/GPIO105W16
PCMWE_N/GPIO198U15
TS0CLK/GPIO92V10
TS0DATA[0]/GPIO82T14
TS0DATA[1]/GPIO83T13
TS0DATA[2]/GPIO84U13
TS0DATA[3]/GPIO85V15
TS0DATA[4]/GPIO86U12
TS0DATA[5]/GPIO87V13
TS0DATA[6]/GPIO88U14
TS0DATA[7]/GPIO89T11
TS0SYNC/GPIO91T12
TS0VALID/GPIO90V12
TS1CLK/GPIO103Y14
TS1DATA[0]/GPIO93Y16
TS1DATA[1]/GPIO94AA15
TS1DATA[2]/GPIO95Y13
TS1DATA[3]/GPIO96AA16
TS1DATA[4]/GPIO97W12
TS1DATA[5]/GPIO98AA13
TS1DATA[6]/GPIO99W14
TS1DATA[7]/GPIO100W13
TS1SYNC/GPIO102Y15
TS1VALID/GPIO101W15
PM_SPI_SCZ1/GPIO_PM[6]/GPIO13B3
PM_SPI_SCK/GPIO1A3
PM_SPI_SCZ0/GPIO0A4
PM_SPI_SDI/GPIO2C3
PM_SPI_SDO/GPIO3A2
RPB1
TNC2
TPC1
RNB2
SPDIF_IN/GPIO161D2
SPDIF_OUT/GPIO162D1
HWRESETD8
IRIN/GPIO5E5
DDCA_CK/UART0_RXG4
DDCA_DA/UART0_TXG5
PWM0/GPIO71J18
PWM1/GPIO72K18
PWM2/GPIO73K16
PWM3/GPIO74L18
PWM4/GPIO75L17
NF_ALE/GPIO146T8
NF_CEZ/GPIO142T9
NF_CLE/GPIO141U9
NF_RBZ/GPIO147U11
NF_REZ/GPIO144V9
NF_WEZ/GPIO145U10
NF_WPZ/GPIO199T10
IF_AGCW2
SIFMW1
SIFPW3
IMV2
IPV1
XINAA2
XOUTY2
IC101LGE2132(M1A_256M)
M1A_256M
LVA4P/TTL_B[0]/HCONV/GPIO170U19
LVA4M/TTL_B[1]/E_O/GPIO171T20
LVA3P/TTL_B[2]/FB/GPIO172T21
LVA3M/TTL_B[3]/OPT_P/GPIO173T19
LVACKP/TTL_B[4]/MCLK/GPIO174R21
LVACKM/TTL_B[5]/GCLK/GPIO175R20
LVA2P/TTL_B[6]/GST/GPIO176R19
LVA2M/TTL_B[7]/POL/GPIO177P20
LVA1P/TTL_G[0]/EPI0+/GPIO178P19
LVA1M/TTL_G[1]/EPI0-/GPIO179N20
LVA0P/TTL_G[2]/EPI1+/GPIO180N21
LVA0M/TTL_G[3]/EPI1-/GPIO181N19
LVB4P/TTL_G[4]/EPI2+/GPIO182M21
LVB4M/TTL_G[5]/EPI2-/GPIO183M20
LVB3P/TTL_G[6]/EPI3+/GPIO184M19
LVB3M/TTL_G[7]/EPI3-/GPIO185L20
LVBCKP/TTL_R[0]/EPI4+/GPIO186L19
LVBCKM/TTL_R[1]/EPI4-/GPIO187K20
LVB2P/TTL_R[2]/EPI5+/GPIO188K21
LVB2M/TTL_R[3]/EPI5-/GPIO189K19
LVB1P/TTL_R[4]/EPI6+/GPIO190J21
LVB1M/TTL_R[5]/EPI6-/GPIO191J20
LVB0P/TTL_R[6]/EPI7+/GPIO192J19
LVB0M/TTL_R[7]/EPI7-/GPIO193H20
SAR0/GPIO35D5
SAR1/GPIO36F8
SAR2/GPIO37E7
SAR3/GPIO38E6
SAR4/GPIO39D6
GPIO_PM[13]/GPIO20W10
GPIO_PM[14]/GPIO21Y10
PM_LED/GPIO4P3
GPIO_PM[0]/GPIO7Y3
PM_SPI_SCZ2/GPIO_PM[10]/GPIO17Y5
GPIO_PM[15]/GPIO22W11
GPIO_PM[4]/GPIO11D3
GPIO_PM[7]/GPIO14AA3
GPIO_PM[8]/GPIO15W5
PWM_PM/GPIO200D4
PM_UART_TX/GPIO_PM[1]/GPIO8L15
PM_UART_RX/GPIO_PM[5]/GPIO12Y11
IC101-*1LGE2131(M1A_128M)
M1A_128M
LVA4P/TTL_B[0]/HCONV/GPIO170U19
LVA4M/TTL_B[1]/E_O/GPIO171T20
LVA3P/TTL_B[2]/FB/GPIO172T21
LVA3M/TTL_B[3]/OPT_P/GPIO173T19
LVACKP/TTL_B[4]/MCLK/GPIO174R21
LVACKM/TTL_B[5]/GCLK/GPIO175R20
LVA2P/TTL_B[6]/GST/GPIO176R19
LVA2M/TTL_B[7]/POL/GPIO177P20
LVA1P/TTL_G[0]/EPI0+/GPIO178P19
LVA1M/TTL_G[1]/EPI0-/GPIO179N20
LVA0P/TTL_G[2]/EPI1+/GPIO180N21
LVA0M/TTL_G[3]/EPI1-/GPIO181N19
LVB4P/TTL_G[4]/EPI2+/GPIO182M21
LVB4M/TTL_G[5]/EPI2-/GPIO183M20
LVB3P/TTL_G[6]/EPI3+/GPIO184M19
LVB3M/TTL_G[7]/EPI3-/GPIO185L20
LVBCKP/TTL_R[0]/EPI4+/GPIO186L19
LVBCKM/TTL_R[1]/EPI4-/GPIO187K20
LVB2P/TTL_R[2]/EPI5+/GPIO188K21
LVB2M/TTL_R[3]/EPI5-/GPIO189K19
LVB1P/TTL_R[4]/EPI6+/GPIO190J21
LVB1M/TTL_R[5]/EPI6-/GPIO191J20
LVB0P/TTL_R[6]/EPI7+/GPIO192J19
LVB0M/TTL_R[7]/EPI7-/GPIO193H20
SAR0/GPIO35D5
SAR1/GPIO36F8
SAR2/GPIO37E7
SAR3/GPIO38E6
SAR4/GPIO39D6
GPIO_PM[13]/GPIO20W10
GPIO_PM[14]/GPIO21Y10
PM_LED/GPIO4P3
GPIO_PM[0]/GPIO7Y3
PM_SPI_SCZ2/GPIO_PM[10]/GPIO17Y5
GPIO_PM[15]/GPIO22W11
GPIO_PM[4]/GPIO11D3
GPIO_PM[7]/GPIO14AA3
GPIO_PM[8]/GPIO15W5
PWM_PM/GPIO200D4
PM_UART_TX/GPIO_PM[1]/GPIO8L15
PM_UART_RX/GPIO_PM[5]/GPIO12Y11
C113-*3 27pFXTAL_LOAD_27pF
C114-*3 27pFXTAL_LOAD_27pF
C113 15pFXTAL_LOAD_15pF
C114 15pF
XTAL_LOAD_15pF
C113-*1 18pFXTAL_LOAD_18pF
C114-*1 18pFXTAL_LOAD_18pF
IC104-*2AT24C256C-SSHL-T
NVRAM_ATMEL
EAN61133501
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
IC104-*3BR24G256FJ-3
NVRAM_ROHM
EAN62389502
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
IC102-*6H27U4G8F2ETR-BC
NAND_FLASH_4G_HYNIX
EAN61950603
26NC_17
27NC_18
28NC_19
29I/O0
30I/O1
31I/O2
32I/O3
33NC_20
34NC_21
35NC_22
36VSS_2
37VCC_2
38NC_23
39NC_24
40NC_25
41I/O4
42I/O5
43I/O6
44I/O7
45NC_26
46NC_27
47NC_28
48NC_29
17ALE
3NC_3
6NC_6
16CLE
15NC_10
14NC_9
13VSS_1
12VCC_1
11NC_8
10NC_7
9CE
8RE
7R/B
4NC_4
5NC_5
25NC_16
24NC_15
23NC_14
2NC_2
22NC_13
21NC_12
1NC_1
20NC_11
19WP
18WE
IC102-*3TC58NVG0S3HTA00
EAN61508002
NAND_FLASH_1G_TOSHIBA
26NC_17
27NC_18
28NC_19
29I/O1
30I/O2
31I/O3
32I/O4
33NC_20
34NC_21
35NC_22
36VSS_2
37VCC_2
38NC_23
39NC_24
40NC_25
41I/O5
42I/O6
43I/O7
44I/O8
45NC_26
46NC_27
47NC_28
48NC_29
17ALE
3NC_3
6NC_6
16CLE
15NC_10
14NC_9
13VSS_1
12VCC_1
11NC_8
10NC_7
9CE
8RE
7RY/BY
4NC_4
5NC_5
25NC_16
24NC_15
23NC_14
2NC_2
22NC_13
21NC_12
1NC_1
20NC_11
19WP
18WE
IC102-*1H27U2G8F2CTR
NAND_FLASH_2G_HYNIX_OLDEAN60708702
26NC_17
27NC_18
28NC_19
29I/O0
30I/O1
31I/O2
32I/O3
33NC_20
34NC_21
35NC_22
36VSS_2
37VCC_2
38NC_23
39NC_24
40NC_25
41I/O4
42I/O5
43I/O6
44I/O7
45NC_26
46NC_27
47NC_28
48NC_29
17ALE
3NC_3
6NC_6
16CLE
15NC_10
14NC_9
13VSS_1
12VCC_1
11NC_8
10NC_7
9CE
8RE
7R/B
4NC_4
5NC_5
25NC_16
24NC_15
23NC_14
2NC_2
22NC_13
21NC_12
1NC_1
20NC_11
19WP
18WE
IC102-*2H27U2G8F2DTR-BD
NAND_FLASH_2G_HYNIX_NEWEAN60708703
26NC_17
27NC_18
28NC_19
29I/O0
30I/O1
31I/O2
32I/O3
33NC_20
34NC_21
35NC_22
36VSS_2
37VCC_2
38NC_23
39NC_24
40NC_25
41I/O4
42I/O5
43I/O6
44I/O7
45NC_26
46NC_27
47NC_28
48NC_29
17ALE
3NC_3
6NC_6
16CLE
15NC_10
14NC_9
13VSS_1
12VCC_1
11NC_8
10NC_7
9CE
8RE
7R/B
4NC_4
5NC_5
25NC_16
24NC_15
23NC_14
2NC_2
22NC_13
21NC_12
1NC_1
20NC_11
19WP
18WE
IC102-*4TC58NVG1S3HTA00
EAN60991002
NAND_FLASH_2G_TOSHIBA
26NC_17
27NC_18
28NC_19
29I/O1
30I/O2
31I/O3
32I/O4
33NC_20
34NC_21
35NC_22
36VSS_2
37VCC_2
38NC_23
39NC_24
40NC_25
41I/O5
42I/O6
43I/O7
44I/O8
45NC_26
46NC_27
47NC_28
48NC_29
17ALE
3NC_3
6NC_6
16CLE
15NC_10
14NC_9
13VSS_1
12VCC_1
11NC_8
10NC_7
9CE
8RE
7RY/BY
4NC_4
5NC_5
25NC_16
24NC_15
23NC_14
2NC_2
22NC_13
21NC_12
1NC_1
20NC_11
19WP
18WE
ANALOG SIF
DTV_IF
Close to MSTAR
for SERIAL FLASH
NAND FLASH MEMORY
EEPROM (IC104)
PM_MODEL_OPT_0 - HIGH : LCD - LOW :: PDP
EEPROM
A0’h
PM MODEL OPTIONDIMMING
<CHIP Config>(SPI_SDI, PM_LED, PWM_PM)
from CI SLOT
I2C
Internal demod out
LG-NonOS SB51_ExtSPI 3’b000 51boot from SPILG-OS HEMCU_ExtSPI 3’b001 MIPS boot from SPI
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MHL_SW_AND
Check RF signal cable (DVB satellite signal or not) Check whether other equipments have problem or not. (By connecting RF Cable at other equipment) → Set-Top-Box, Different maker TV etc
Y
Change satellite setting (match with installed ANT)
Check color condition by input -External Input -Component/AV -HDMI
Vertical/Horizontal bar, residual image, light spot
Request repair for external device
A. Video error
Vertical / Horizontal bar, residual image, light spot, external device color error
☞A10
External device screen error-Color error Connect other external device and cable (Check normal operation of External Input, Component and HDMI by connecting Jig, pattern Generator, Set-top Box etc.
N
Y
Replace Main B/D
Check screen condition by input -External Input -Component -RGB -HDMI/DVI
Request repair for external device
Connect other external device and cable (Check normal operation of External Input, Component, HDMI by connecting Jig, pattern Generator ,Set-top Box etc.
※ When the nose is severe, replace the module (For models with fix information, upgrade the S/W or provide the description)
※ If there is a “Tak Tak” noise from the cabinet,
refer to the KMS fix information and then proceed as shown in the solution manual (For models without any fix information, provide the description)
OR
※ Mechanical noise is a natural phenomenon, and apply the 1st level description. When the customer does not agree, apply the process by stage. ※ Describe the basis of the description in “Part related to nose” in the Owner’s Manual.
1. Measure DC 24V applying to inverter PCB from Power Board. 2. Output 24V from Power Board -> supply to inverter PCB. Check Pin contacting statement and connection statement.
1. Press the ADJ button on the remote controller for adjustment. 2. Enter into White Balance of item 6. 3. After recording the R, G, B (GAIN, Cut) value of Color Temp (Cool/Medium/Warm), re-
enter the value after replacing the MAIN BOARD.
Standard Repair Process Detail Technical Manual
Check White Balance value
A. Video error_No video/Normal audio
<ALL MODELS>
A3
Established date
Revised date
Error
symptom
Content
LCD TV
Entry method
1. Press the ADJ button on the remote controller for adjustment. 2. Enter into White Balance of item 7. 3. After recording the R, G, B (GAIN, Cut) value of Color Temp (Cool/Medium/Warm), re-
You can view 6 types of patterns using the ADJ Key Checking item : 1. Defective pixel 2. Residual image 3. MODULE error (ADD-BAR,SCAN BAR..) 4.Video error (Classification of MODULE or Main-B/D!)
Checking order 1. Check the contact condition of or 24V connector of Main Board 2. Measure the 24V input voltage supplied from Power Board (If there is no input voltage, remove and check the connector) 3. Connect the tester RX1 to the speaker terminal and if you hear the Chik Chik sound when you touch the GND and output terminal, the speaker is normal.
Standard Repair Process Detail Technical Manual
Voltage and speaker checking method when there is no audio