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Part 2 2016 NEWLY DEVELOPED PRODUCTS of 2016 NEWLY DEVELOPED PRODUCTS of 2016 NEWLY DEVELOPED PRODUCTS of
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Newly Developed Products 2016 - Part 2

Feb 13, 2017

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Master Bond
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Page 1: Newly Developed Products 2016 - Part 2

Part 22016

NEWLY DEVELOPEDPRODUCTS of 2016NEWLY DEVELOPEDPRODUCTS of 2016NEWLY DEVELOPEDPRODUCTS of

Page 2: Newly Developed Products 2016 - Part 2

NASA LOW OUTGASSING

Supreme 3HTND-2CCMToughened one component

epoxy for chip coating applications

Page 3: Newly Developed Products 2016 - Part 2

EP30-2LBOptically clear, roomtemperature curing epoxy blocksUV light and transmits visible light

Blocks UV light from 200-400 nm

Page 4: Newly Developed Products 2016 - Part 2

EP41S-5 Solvent resistant adhesive withstandsmethylene chloride, alcohols and fuels

IDEAL for TAMPER PROOFING

Page 5: Newly Developed Products 2016 - Part 2

EP3HTS-LOOne part, silver filled epoxy passesNASA low outgassing requirements

EXCELLENT ELECTRICAL CONDUCTIVITY

EP3HTS-LOOne part, silver filled epoxy passesNASA low outgassing requirements

Page 6: Newly Developed Products 2016 - Part 2

UV22DC80Nanosilica filled adhesive features dual curingmechanism using both UV light and heat

CAN BE CURED AT 80°C

Page 7: Newly Developed Products 2016 - Part 2

CONTACT USCONTACT USCONTACT US+1.201.343.8983

[email protected]

www.masterbond.com