Part 2 2016 NEWLY DEVELOPED PRODUCTS of 2016 NEWLY DEVELOPED PRODUCTS of 2016 NEWLY DEVELOPED PRODUCTS of
Part 22016
NEWLY DEVELOPEDPRODUCTS of 2016NEWLY DEVELOPEDPRODUCTS of 2016NEWLY DEVELOPEDPRODUCTS of
NASA LOW OUTGASSING
Supreme 3HTND-2CCMToughened one component
epoxy for chip coating applications
EP30-2LBOptically clear, roomtemperature curing epoxy blocksUV light and transmits visible light
Blocks UV light from 200-400 nm
EP41S-5 Solvent resistant adhesive withstandsmethylene chloride, alcohols and fuels
IDEAL for TAMPER PROOFING
EP3HTS-LOOne part, silver filled epoxy passesNASA low outgassing requirements
EXCELLENT ELECTRICAL CONDUCTIVITY
EP3HTS-LOOne part, silver filled epoxy passesNASA low outgassing requirements
UV22DC80Nanosilica filled adhesive features dual curingmechanism using both UV light and heat
CAN BE CURED AT 80°C