Figure 6: Mastercam was used extensively to manufacture acrylic prototypes and check fit before the final copper version was manufactured. The above screen shot shows the virtual environment in which the user can check machining operations to ensure that material is not removed accidentally. Figure 4: Mesh density and temperature distribution modeled in Abaqus FEA software with components running at their maximum thermal design power. Netbook Passive Cooling Project Jesse Crutchfield, Eduardo Guerrero, Ronald Payne, Gerard Stabley, and Jeremy Tucker Academic Advisor: Dr. Raul Cal, Portland State University Industry Advisor: Jered Wikander, Intel Corp. Design Solution Manufacturing Process Evaluation of Design The objective of this project was to produce a passive cooling solution for an existing netbook computer. An MSI Wind netbook with an existing fan–based cooling solution was used. Figure 5: Component temperatures for a range of heat sink thicknesses gathered using FEA software. These data were used to optimize the thickness of both the copper heat sink and the graphite heat spreader. Figure 2: Solid model of graphite heat spreader Figure 1: Solid model of copper heat sink. Figure 3: Solid model of netbook case bottom, graphite heat spreader, copper heat sink, and motherboard. Figure 7: Trek 2-axis CNC mill performing finishing operations on the heat sink. Figure 8: Copper heat sink installed on netbook. Figure 9: Graphite heat spreader installed on netbook with thermocouples attached. SolidWorks™ CAE software was used to design the main components of the cooling solution. The netbook case bottom and motherboard were modeled, using CMM measurements, to ensure an accurate fit of all components. Abaqus™ FEA software was used to model the temperature distribution of the netbook components with the cooling solution design in place. Results of this modeling were used to optimize the dimensions of the heat sink and heat spreader. The final design concept consists of a copper heat sink which interacts with previously uncoupled heat sources. The copper heat sink is coupled to a graphite heat spreader. The thermo-physical properties of the graphite heat spreader are highly anisotropic, with thermal conductivity differing by orders of magnitude from one direction to the other. The final design concept requires no power, does not rely on a working fluid, is easy to manufacture, and does not significantly alter the netbook appearance. The performance of the active and the passive cooling solutions were measured while using specialized software to stress the components of the netbook. Temperature data were collected using Infrared Thermography, thermocouples attached to several heat producing components, and the internal temperature sensors on the CPU. LabVIEW Express and a National Instruments Compact-DAQ were used for all TC data collection. Actively Cooled Passively Cooled Figures 10 & 11: IR images of the top and bottom of the netbook during stress testing with the active cooling solution. •Infrared Thermography indicates the maximum skin temperature of the netbook increased by 7.4°C on the top, and 11.4°C on the bottom, with the passively cooled solution. •Thermocouple data indicates that the CPU and ICH were ~2°C cooler with the passive solution. The temperature of the GMCH and the RAM increased by 4.6°C and 11.7°C, respectively, with the passive solution. •The on-board temperature of the processor increased by only 2°C. •Passive Cooling Solution successfully cools the netbook Conclus ion Figures 12 & 13: IR images of the top and bottom of the netbook during stress testing with the passive cooling solution. Figure 15: Comparison of the temperatures of the primary heat sources with the active and passive cooling solutions. Actively Cooled Passively Cooled 0 10 20 30 40 50 60 70 80 90 ACPI Thermal Zone CPU Digital Thermal Sensor Temperature °C Figure 14: Comparison of the CPU Digital Thermal Sensor and ACPI temperatures with the active and passive cooling solutions. RAM CPU GMCH ICH 0 10 20 30 40 50 60 70 Actively Cooled Passively Cooled Temperature °C
Netbook Passive Cooling Project
Feb 23, 2016
Netbook Passive Cooling Project Jesse Crutchfield, Eduardo Guerrero, Ronald Payne, Gerard Stabley , and Jeremy Tucker Academic Advisor: Dr. Raul Cal, Portland State University Industry Advisor: Jered Wikander , Intel Corp. - PowerPoint PPT Presentation
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Figure 6: Mastercam was used extensively to manufacture acrylic prototypes and check fit before the final copper version was manufactured. The above screen shot shows the virtual environment in which the user can check machining operations to ensure that material is not removed accidentally.
Figure 4: Mesh density and temperature distribution modeled in Abaqus FEA software with components running at their maximum thermal design power.
Netbook Passive Cooling ProjectJesse Crutchfield, Eduardo Guerrero, Ronald Payne, Gerard Stabley, and Jeremy Tucker
Academic Advisor: Dr. Raul Cal, Portland State UniversityIndustry Advisor: Jered Wikander, Intel Corp.
Design Solution
Manufacturing Process
Evaluation of Design
The objective of this project was to produce a passive cooling solution for an existing netbook computer. An MSI Wind netbook with an existing fan–based cooling solution was used.
Figure 5: Component temperatures for a range of heat sink thicknesses gathered using FEA software. These data were used to optimize the thickness of both the copper heat sink and the graphite heat spreader.
Figure 2: Solid model of graphite heat spreader
Figure 1: Solid model of copper heat sink.
Figure 3: Solid model of netbook case bottom, graphite heat spreader, copper heat sink, and motherboard.
Figure 7: Trek 2-axis CNC mill performing finishing operations on the heat sink.
Figure 8: Copper heat sink installed on netbook.
Figure 9: Graphite heat spreader installed on netbook with thermocouples attached.
SolidWorks™ CAE software was used to design the main components of the cooling solution. The netbook case bottom and motherboard were modeled, using CMM measurements, to ensure an accurate fit of all components.
Abaqus™ FEA software was used to model the temperature distribution of the netbook components with the cooling solution design in place. Results of this modeling were used to optimize the dimensions of the heat sink and heat spreader.
The final design concept consists of a copper heat sink which interacts with previously uncoupled heat sources. The copper heat sink is coupled to a graphite heat spreader. The thermo-physical properties of the graphite heat spreader are highly anisotropic, with thermal conductivity differing by orders of magnitude from one direction to the other. The final design concept requires no power, does not rely on a working fluid, is easy to manufacture, and does not significantly alter the netbook appearance.
The performance of the active and the passive cooling solutions were measured while using specialized software to stress the components of the netbook. Temperature data were collected using Infrared Thermography, thermocouples attached to several heat producing components, and the internal temperature sensors on the CPU. LabVIEW Express and a National Instruments Compact-DAQ were used for all TC data collection.
Actively Cooled Passively Cooled
Figures 10 & 11: IR images of the top and bottom of the netbook during stress testing with the active cooling solution.
•Infrared Thermography indicates the maximum skin temperature of the netbook increased by 7.4°C on the top, and 11.4°C on the bottom, with the passively cooled solution. •Thermocouple data indicates that the CPU and ICH were ~2°C cooler with the passive solution. The temperature of the GMCH and the RAM increased by 4.6°C and 11.7°C, respectively, with the passive solution.•The on-board temperature of the processor increased by only 2°C.•Passive Cooling Solution successfully cools the netbook with no power consumption.
Conclusion
Figures 12 & 13: IR images of the top and bottom of the netbook during stress testing with the passive cooling solution.
Figure 15: Comparison of the temperatures of the primary heat sources with the active and passive cooling solutions.
Actively Cooled Passively Cooled0
10
20
30
40
50
60
70
80
90
ACPI Thermal ZoneCPU Digital Thermal Sensor
Tem
pera
ture
°C
Figure 14: Comparison of the CPU Digital Thermal Sensor and ACPI temperatures with the active and passive cooling solutions.
RAM CPU GMCH ICH0
10
20
30
40
50
60
70
Actively CooledPassively Cooled
Tem
pera
ture
°C
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