MultiMEMS MPW Design Introduction Course Part1: Introduction

MultiMEMS MPW Design Introduction CoursePart1: Introduction

The MultiMEMS Organisation

Partners: SensoNor SINTEF ICT Vestfold University

College (VUC)

Sattelite Access Centres (SAS)• LioniXs, the Netherlands

• C2V, the Netherlands

• AML, UK

• Imego, Sweden

• FraunHofer ISIT, Germany

• MicroStencil UK

Where is Horten ?In Norway:

90 km South of Oslo, on the

west side of the Oslo-fjord.

Nearest Airport: Torp

(40 km)

MultiMEMS MPW Design Introduction Course

At the end of this course you should be able to: Understand the MultiMEMS organisation. Understand the steps involved in MPW production Understand the limitations and the possibilities of

the MultiMEMS MPW process Understand the main laboratory processing steps Use the MPW design handbook in design work Have an understanding of the main possibilities

and limitations of the SensoNor foundry process Use the MultiMEMS system in product development

A total MST Concept

Assembly and

Packaging

Assembly and

Packaging

ASIC design

kit

ASIC design

kit

Package design

kit

Package design

kit

Micro-structure

designkit

Micro-structure

designkit

Micro-structure element Design

ASIC Design

Package Design

Sensor Element

Manufacture

Sensor Element

Manufacture

ASICManufacture

ASICManufacture System

Integration

System Integration

Testand

Qualification

Testand

Qualification

5

Concept

&

feasibility

Test

&

evaluation

Traditional MST development

• MEMS development has historically been very research oriented.

• The manufacturing has been done using a project specific process in a research lab

• Very costly or impossible to transform to volume production

IdeaDesign

&

modelling

Prototyping

6

Concept

&

feasibility

Development using an industrial MST process

Test

&

evaluation

IdeaDesign

&

modelling

Prototyping

• Established, documented and qualified (repeatable, reliable) processes developed for MEMS products

• Infrastructure for support from design and development to manufacturing

• Easy to ramp up to volume production since an established process is used

• An established process gives confidence in cost prediction

Production ramp-up

Trial

series

production

Qualification

in system

7

Why Multi Project Wafer?

Share the cost with other users!

Access to industrial manufacturing process in a cost effective way

Low-cost for prototyping compared with a custom run

Can be used for low volume production

Direct transfer to high volume production8

MPW Services

Today several MPW (Multi Project Wafer) services are available from MEMS Foundries.

The following MPW services are offered through Europractice:

Bulk Micromachining MPW MultiMEMS (SensoNor)MultiMEMS (SensoNor)

Surface Micromachining MPW Bosch

SOI Micromachining MPW MEMSOI (TRONIC’S Microsystems)

MPW for diffractive optical elements CSEM

9

Concept &

feasibility

Design &

modellingPrototyping Qualification

in system

Trial

series

production

Test &

evaluationProduction

ramp-up

TestVUCSINTEFSensoNorDELTA

MPWVUCSensoNorMicro-Component

ProductionSensoNorMicroComponent

Idea

MultiMEMS – From Idea to ProductionDesign

HousesSINTEFFrH-IsitLioniXImegoC2VAML

Alternative access points!

Foundry processes in MultiMEMS

Based on SensoNor’s 4th generation wafer process High-precision membrane / spring definition 3-stack glass-Si-glass Hermetically sealed Buried conductor technology (patent)

Process C Process D

N-well Diffusion

Buried Conductor Implant

Epitaxial Layer Growth

Buried PR Implant Buried PR Implant

Thick Oxide Area Definition

Surface Conductor Implant

Surface PR Implant Surface PR Implant

N + Implant

Contact Hole Etch

Metallisation

Wet Anisotropic Backside Etch

Definition of Anodic Bonding and ContactAreas

Frontside RIE

Anodic Bonding of Top and Bottom GlassWafers

Dicing

Process A Process B Process E

Buried PR ImplantBuried Piezo resistor

Surface Piezo resistor

Via etching

Standard Processes

12

MultiMEMS MPW One of SensoNor’s standard foundry

processes

Four different chip sizes (3x3, 3x6, 6x3 and 6x6 mm x mm)

10, 15 or 20 chips depending on chip size

Design tool support

Library of elements

13

Product examples

Accelerometers SA series

e.g. 20 ,30 ,50

Tyre pressuresensors

SP seriese.g. 10,11,12,13

14

Design Examples from previous MPW runs

Flow and Pressure Gas and Thermal Acceleration and Force

Flow and Pressure

Gas and Thermal

Acceleration and Force

Introduction

End of this chapter Questions or comments?