1 Rev.201601 Multi-Layer Ferrite Chip Beads ORDERING CODE BP 1005 300 T T S 5 PRODUCT CODE BF : For General Signal Lines BP : For Power Lines BH : For High Speed Signal Lines (10MHz~) BS : For Higher Speed Signal Lines (50MHz~) DIMENSION (L X W) Code Dimension EIA Code Dimension EIA 0603 0.6 X 0.3 mm 0201 2012 2.0 X 1.2 mm 0805 1005 1.0 X 0.5 mm 0402 3216 3.2 X 1.6 mm 1206 1608 1.6 X 0.8 mm 0603 IMPEDANCE CODE Code 300 301 302 Impedance (Ω) 30 300 3000 TOLERANCE CODE T= ± 25% PACKAGING CODE T = Paper Tape P = Embossed Tape TYPE CODE S=Standard Type B=GHz Band Type R=Low DCR U=High GHz Band Type THICKNESS CODE(mm) 3=0.3 5=0.5 8=0.8 9=0.9 B=1.1
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Multi-Layer Ferrite Chip Beads - 達方電子 Ferrite Bead...Multi-Layer Ferrite Chip Beads ORDERING CODE BP 1005 300 T T S 5 PRODUCT CODE BF : For General Signal Lines ...
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1 Rev.201601
Multi-Layer Ferrite Chip Beads
ORDERING CODE
BP 1005 300 T T S 5
PRODUCT CODE
BF : For General Signal Lines
BP : For Power Lines
BH : For High Speed Signal Lines (10MHz~)
BS : For Higher Speed Signal Lines (50MHz~)
DIMENSION (L X W)
Code Dimension EIA Code Dimension EIA
0603 0.6 X 0.3 mm 0201 2012 2.0 X 1.2 mm 0805
1005 1.0 X 0.5 mm 0402 3216 3.2 X 1.6 mm 1206
1608 1.6 X 0.8 mm 0603
IMPEDANCE CODE
Code 300 301 302
Impedance (Ω) 30 300 3000
TOLERANCE CODE
T= ± 25%
PACKAGING CODE
T = Paper Tape P = Embossed Tape
TYPE CODE
S=Standard Type B=GHz Band Type
R=Low DCR U=High GHz Band Type
THICKNESS CODE(mm)
3=0.3 5=0.5 8=0.8 9=0.9 B=1.1
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Standard External Dimensions
Unit: mm/(inch)
Series L W A
(Min/Max)
0603 (0201)
0.60±0.03
(0.024 ± 0.001)
0.30 ± 0.03 (0.012 ± 0.001)
0.15 ± 0.05 (0.006 ± 0.002)
1005 (0402)
1.00 ± 0.10 (0.040 ± 0.004)
0.50 ± 0.10 (0.020 ± 0.004)
0.25 ± 0.15 (0.010 ± 0.006)
1608 (0603)
1.60 ± 0.20 (0.063 ± 0.008)
0.80 ± 0.20 (0.031 ± 0.008)
0.30 ± 0.20 (0.012 ± 0.008)
2012 (0805)
2.00 +/- 0.20 (0.079 +/- 0.008)
1.20 +/- 0.20 (0.047 +/- 0.008)
0.50 +/- 0.30 (0.020 +/- 0.012)
3216 (1206)
3.20 +/- 0.20 (0.126 +/- 0.008)
1.60 +/- 0.20 (0.063 +/- 0.008)
0.50 +/- 0.30 (0.020 +/- 0.012)
Recommended pad dimensions
Size mm (EIA) L x W (mm) a (mm) b (mm) c (mm)
0603(0201) 0.6*0.3 0.2 to 0.3 0.2 to 0.3 0.25 to 0.4
1005 (0402) 1.0*0.5 0.3 to 0.5 0.35 to 0.45 0.4 to 0.5
1608 (0603) 1.6*0.8 0.7 to 1.0 0.6 to 0.8 0.7 to 0.8
2012 (0805) 2.0*1.2 1.0 to 1.3 0.7 to 0.9 1.0 to 1.2
3216 (1206) 3.2*1.6 2.1 to 2.5 1.0 to 1.2 1.3 to 1.6
a b
c
Soldering resist SMD
Inductor
Land Pattern
3 Rev.201601
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Multi-Layer
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Beads For Power Lines (BP series)
█Feature █Application The BP series can be used on high current circuits due to its low DC resistance. It can meet power lines to the maximum at DC.
1. This series is suitable for EMI suppression of the high DC current power line.
2. Various power lines of electronic equipment. 3. Mother board, tablet PC, notebook, desktop
computers and peripheral equipment. 4. DSC, DVC, LCD Television, Set Top Box. 5. Digital communication equipment.
b. Relative Humidity: 45~75%RH c. Measuring equipment: HP 4338
In accordance with electrical specification.
4 Dimension Dimension shall be measured with caliper or micrometer In accordance with dimension specification.
5 Solder-ability
Preheat: 150℃,60 seconds
Solder temperature: 245±5℃
Flux: Rosin Dip time: 4±1 seconds
More than 75% of the terminal electrode part shall be covered with new solder.
6 Bending Strength
Solder the chip to test jig then apply a force in the direction shown in below. The soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
No mechanical damage shall be observed.
7 Resistance to Soldering Heat
BF、BP_Series
Preheat: 150℃,60 seconds
Solder temperature: 270±5℃
Flux: Rosin Dip time: 10±1 seconds
The chip shall not be cracks. More than 75% of terminal electrode shall be covered with solder.
BH、BS_Series
Preheating temperature :
150 to 180℃
Preheating time :3 min.
Preheat: 150℃,60 seconds
Solder temperature: 260±5℃
Flux: Rosin Dip time: 10±0.5 seconds
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8 High Humidity Load
Life Test
Humidity: 90 to 95% RH.
Temperature: 40±2℃
BF、BP_Series
Testing time: 500±12 hours
No visible damage. Impedance: Within±30% of the initial value.
Humidity: 90 to 95% RH.
Temperature: 40±2℃
BH_Series Testing time: 500+24/-0 hours
Recovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
BF、BP_Series
Measurement: After placing for 24±2 hours min. BH_Series Measurement: After placing for 48±2 hours min.
9 Thermal Shock
Temperature:Maximum and Minimum ,kept stabilized for 30±3 minutes each Cycle:5 cycles
No visible damage
Impedance: Within±30% of the initial value.
BF、BP_Series
Measurement: After placing for 24±2 hours min.
BH_Series Measurement: After placing for 48±2 hours min.
10 High Temperature
Load
BF、BP_Series
Temperature:
85±3℃ (BP_0603 Series)
125±3℃
Testing time: 500±12 hours
No visible damage. Impedance: Within±30% of the initial value.
BH_Series
Temperature: 125±3℃
Testing time: 500+24/-0 hours
Recovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
BF、BP_Series
Measurement: After placing for 24±2 hours min.
BH_Series Measurement: After placing for 48±2 hours min.
9 Rev.201601
Soldering Profile for SMT Process with SnPb Solder Paste.
The rate of preheat should not exceed 4℃/sec and a target of 2℃/sec is preferred. Ceramic chip components
should be preheated to within 100 to 130 ℃ of the soldering.
● Soldering Profile for SMT Process with Lead Free Solder Paste.
The rate of preheat should not exceed 4℃/sec and a target of 2℃/sec is preferred. Ceramic chip components
should be preheated to within 100 to 130 ℃ of the soldering.