Application The Connor-Winfield MSTM-S3-TR Simplified Control Timing Module acts as a complete system clock module for Stratum 3 timing applications in accordance with GR- 1244, Issue 2 and GR-253, Issue 3. Connor Winfield’s Stratum 3 timing modules helps reduce the cost of your design by minimizing your development time and maximizing your control of the system clock with our simplified design. Features • 5V Miniature Timing Module • Redundant References • 2 Synchronous Outputs Available From 8 kHz to 77.76MHz • 40 sec., Filtered, Hold Over History • Operational Status Flags MSTM-S3-TR Stratum 3 Timing Module 2111 Comprehensive Drive Aurora, Illinois 60505 Phone: 630-851-4722 Fax: 630- 851- 5040 www.conwin.com Bulletin TM027 Page 1 of 16 Revision P05 Date 02 DEC 02 Issued By MBatts
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MSTM-S3-TR Stratum 3 Timing Module · 2009-03-13 · Application The Connor-Winfield MSTM-S3-TR Simplified Control Timing Module acts as a complete system clock module for Stratum
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ApplicationThe Connor-Winfield MSTM-S3-TR
Simplified Control Timing Module acts as acomplete system clock module for Stratum 3timing applications in accordance with GR-1244, Issue 2 and GR-253, Issue 3.
Connor Winfield’s Stratum 3 timing moduleshelps reduce the cost of your design byminimizing your development time andmaximizing your control of the system clockwith our simplified design.
General DescriptionThe Connor-Winfield Stratum 3 Simplified Control Timing Mod-ule acts as a complete system clock module for general Stratum3 timing applications. The MSTM is designed to replace similarunits from TF Systems (TF118B) and Raltron (SY0001B).
Full external control input allows for selection and monitoringof any of four possible operating states: 1) Holdover, 2) ExternalReference #1, 3) External Reference #2, and 4) Free Run. Table#1 illustrates the control signal inputs and corresponding opera-tional states.
In the absence of External Control Inputs (A,B), the MSTMenters the Free Run mode and signals an External Alarm. TheMSTM will enter other operating modes upon application of aproper control signal. Mode 1 operation (A=1, B=0) results in anoutput signal that is phase locked to the External ReferenceInput #1. Mode 2 operation (A=0, B=1) results in an output sig-nal that is phase locked to External Reference Input #2. Hold-over mode operation (A=1, B=1) results in an output signal at ornear the frequency as determined by the latest (last) locked-signal input values and the holdover performance of the MSTM.Free Run ModeFree Run mode operation (A=0, B=0) is a guar-anteed output of 4.6 ppm of the nominal frequency.
Alarm signals are generated at the Alarm Output during Hold-over and Free Run operation. Alarm Signals are also generatedby Loss-of-Lock and Loss-of-Reference conditions. A high levelindicates an alarm condition. Real-time indication of the opera-tional mode is available at unique operating mode outputs onpins 1-4.
Control loop 0.1 Hz filters effectively attenuate any referencejitter, smooth out phase transients, comply with wander transferand jitter tolerances.
Absolute Maximum RatingTable 2
Symbol Parameter Minimum Nominal Maximum Units Notes
VCC Power Supply Voltage -0.5 7.0 Volts 1.0
VI Input Voltage -0.5 VCC + 0.5 Volts 1.0
Ts Storage Temperature -55 100 deg. C 1.0
Functional Block DiagramFigure 1
Stratum3OCXO
Stratum3OCXO
HoldoverFIFO
HoldoverFIFO
DACDAC
PhaseBuild Out
Circuit
PhaseBuild Out
Circuit
Tuning Voltage Monitor
Tuning Voltage Monitor
1
2
3
4
Free Run
Ref #1
Ref #2
Hold Over
CNTL A
CNTL B
Sync_Out
RefControl
RefControl
Ex Ref 1
Ex Ref 2
PLL_TVL
Free Run
Hold Over
LOL & LOR
Alarm_Out
÷N
DPLL
Reference Clock
Opt_Out*
*Only one Opt_Out option is available per module
CNTL CNTL Operational Ref 1 Ref 2 Hold Over Free Run PLL Unlock Alarm Out A B Mode
Hold Over Stability ±0.37 ppm for initial 24 hrs 4.0
Inital Offset ±0.05 ppm
Temperature ±0.28 ppm
Drift ±0.04 ppm
Maximum Hold Over History 40 seconds
Pull-in/ Hold-in Range ±13.8 ppm minimum 5.0
Lock Time 30 seconds typical
DPLL Bandwidth < 0.1 Hz
4.0: Hold Over stability is the cumulative fractional frequency offset as described byGR-1244-CORE, 5.2
5.0: Pull-in Range is the maximum frequency deviation from nominal clock rate on thereference inputs to the timing module that can be overcome to pull into synchronizationwith the reference
P o s s ib le C h o ic e s In c lu d eS ta n fo rd R e s e a rc h M o d e l: F S 7 0 0T ru e t im e M o d e l X X X
A rb itra ryW a v e fo rmG e n e ra to r
E x te rn a lR e fe re n c eIn p u t
A rb itra ryW a v e fo rmG e n e ra to r
[N o is eS o u rc e ]
D S 1 ra te R Z (1 .5 4 4 M H z ), E 1 ra te R Z o r 8 k H zc lo c k R Z w ith n o is e m o d u la t io n
T E K T R O N IX S J 3 0 0 E
C lo c k o r B IT S lo g ic le v e lc lo c k in p u t (T T L , C M O S ,e tc .)
H P 5 3 3 1 0 AM o d u la t io n A n a ly z e r / T im e In te rv a l A n a ly z e r
D S 1 ra te [1 .5 4 4 M H z ] B IT S B ip o la r
P h a s e E rro r d a ta o u tp u t
S a m p l e W a n d e r G e n e r a t i o n ( T D E V ) f o r S T M / M S T M - S 3
1 0 0 .0 E - 1 2
1 .0 E - 9
1 0 .0 E - 9
1 0 0 .0 E - 9
1 .0 E - 6
1 0 .0 E -3 1 0 0 .0 E - 3 1 .0 E + 0 1 0 .0 E + 0 1 0 0 .0 E + 0 1 .0 E + 3
I n t e g r a t i o n T i m e ( s e c )
TD
EV
(s
ec
T D E V
G R 1 2 4 4 - F ig 5 . 1
G R 1 2 4 4 - F ig 5 - 3
T yp ic a l re s p o n s e - 3 0 0 0 s e c o n d te s t - J itt e r a p p l ie d ( 2 U I @ 1 0 H z )re f d a te A P R 2 2 1 9 9 8k dh
C o p yr ig h t 1 9 9 8 C o n n o r - W in f ie ld a ll l rig h ts r e s e rv e d
S a m p l e M T I E D a t a f o r S T M - S 3 / M S T M - S 3
1 .0 E -9
1 0 .0 E -9
1 0 0 .0 E -9
1 .0 E -6
1 0 0 .0 E - 3 1 .0 E + 0 1 0 .0 E + 0 1 0 0 .0 E + 0 1 .0 E + 3 1 0 .0 E + 3
O b s e r v a t io n T im e ( s )
MT
IE (
s
M T IE
1 2 4 4 - 5 . 2 M a s k ( A )
1 2 4 4 - 5 . 2 M a s k ( B )
1 2 4 4 - 5 . 6 M a s k
G R 2 5 3 - 5 . 4 . 4 .3 . 2
C o p y rig h t 1 9 9 8 C o n n o r - W in f ie ld a ll r ig h ts re s e r v e d
T yp i c a l r e s p o n s e - 3 0 00 s e c o n d te s t - J it t e r a p p lie d ( 2 U I @ 1 0 H z )re f d a t e A P R 2 2 1 9 9 8
k dh
S ta n d a rd sC o m p lia n c eD o c u m e n ts
T im e -s ta m p e d e n s e m b leb a s e d o n a b s o lu te t im ere fe re n c e (1 0 M H z in p u t)
D S -1 , O C -3 , O C -1 2 e le c tr ic a l o r o p t ic a l s ig n a ls
W a n d e r A n a ly z e r d a ta ( IE E E -4 8 8 )
1 0M H z
T h is d e v ic e s u p p lie s s y s te m t im ein fo rm a t io n . I t c a n b e th o u g h t o f a ss u p p ly in g "a b s o lu te t im e " re fe re n c ein fo rm a t io n
1 0M H z
E x te rn a lR e fe re n c eIn p u t
Noise M
odulation Input
1 0M H z
E x te rn a lR e fe re n c eIn p u t
IE E E -4 8 8 C o n tro lle rP la t fo rm fo r s o f tw a reH P 5 3 3 0 5 A P h a s e A n a ly z e rH P E 1 7 4 8 A S y n cM e a s u re m e n tT e k t ro n ix W a n d e r A n a ly z e r
1 0M H z
E x te rn a lR e fe re n c eIn p u t
Tim
ing
Car
d
Line
Car
d
Tim
ing
Car
d
OC
-3 L
ine
Car
d
OC-
12 L
ine
Card
OC-
48 L
ine
Card
DS-1
Lin
e C
ard
. . . . . . .
M T IE , T D E V , W a n d e r T ra n s fe r ,a n d W a n d e r G e n e ra tio n P lo ts
VIA KEEP OUT AREA:It is recommended that there be no vias or feed
throughs underneath the main body of the modulebetween the pins. It is suggested that the traces inthis area be kept to a minimum and protected by alayer of solder mask. See Figure 17.
SOLDER MASK:A solder mask is recommended to cover most the
top pad to avoid excessive solder underneath theshoulder of the pin to avoid rework damage. SeeTable 6 and Figure 18.
PAD CONSTRUCTION:The recommended pad construction is shown in
Figure 17. For the pin diameter of .040” a holediameter of .055” is suggested for ease of insertionand rework. A pad diameter of .150” is alsosuggested for support. This leaves a spacing of.050” between the pads which is sufficient for mostsignal lines to pass through.
PAD ARRAY AND PAD SPACING:The pins are arranged in a dual-in-line
configuration as shown in Figure 17. There is .2”space between the pins in-line and each line isseparated by 1.6”. See Figures 16 & 17 and Table6.
MECHANICAL OUTLINE:The mechanical outline of the MSTM-S3-TR is
shown in Figure 16. The board space required is 2” x2”. The pins are .040” in diameter and are .150” inlength. The unit is spaced off the PCB by .030”shoulders on the pins. Due to the height of thedevice it is recommended to have heat sensitivedevices away where the air flow might not beblocked.
MODULE BAKEOUT:Do not bakeout the MSTM-S3-TR
WASHING RECOMMENDATIONS:The MSTM-S3-TR is not in a hermetic enclosure.
It is recommended that the leads be hand cleanedafter soldering. Do not completely immerse themodule.
SOLDERING RECOMMENDATIONS:Due to the sensitive nature of this part, hand
soldering or wave soldering of the pins isrecommended after reflow processes.
POWER SUPPLY REGULATION:Good power supply regulation is recommended for
the MSTM-S3-TR The internal oscillators areregulated to operate from 4.75 - 5.25 volts. Largejumps within this range may still produce varyingdegrees of wander. If the host system is subject tolarge voltage jumps due to hot-swapping and the like,it is suggested that there be some form of externalregulation such as a DC/DC converter.
GROUND AND POWER SUPPLY LINES:Power specifications will vary depending primarily
on the temperature range. At wider temperatureranges starting at 0 to 70 deg. C., an ovenizedoscillator, OCXO, will be incorporated. The turn-oncurrent for an OCXO requires a peak current ofabout .4A for about a minute. The steady statecurrent will the vary from 50-150 mA depending onthe temperature. It is suggested to plan for the peakcurrent in the power and ground traces pin 18 andpin 5. The other four ground pins 10, 12, 14, and 16are intended for signal grounds.