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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
User's GuideSLAU739–October 2017
MSP430FR2433 LaunchPad™ Development Kit(MSP‑‑EXP430FR2433)
The MSP-EXP430FR2433 LaunchPad™ Development Kit is an
easy-to-use evaluation module (EVM) based on the MSP430FR2433 Value
Line Sensing microcontroller (MCU). It contains everything needed
to start developing on the ultra-low-power MSP430FR2x Value Line
Sensing MCU platform, including onboard debug probe for
programming, debugging, and energy measurements. The board includes
two buttons and two LEDs for creating a simple user interface. It
also supports using a supercapacitor (must be purchased and
installed by the user) that acts like a rechargeable battery,
enabling stand-alone applications without an external power
supply.Figure 1 shows the MSP-EXP430FR2433 LaunchPad development
kit.
Figure 1. MSP-EXP430FR2433 LaunchPad Development Kit
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
Contents1 Getting Started
...............................................................................................................
3
1.1 Introduction
..........................................................................................................
31.2 Key Features
........................................................................................................
31.3 What's Included
.....................................................................................................
31.4 First Steps: Out-of-Box Experience
..............................................................................
41.5 Next Steps: Looking Into the Provided Code
...................................................................
4
2
Hardware......................................................................................................................
52.1 Block
Diagram.......................................................................................................
52.2 Hardware Features
.................................................................................................
62.3 Power
...............................................................................................................
102.4 Measure Current Draw of the MSP430
MCU..................................................................
122.5 Clocking
............................................................................................................
122.6 Using the eZ-FET Debug Probe With a Different Target
.................................................... 122.7
BoosterPack Pinout
...............................................................................................
132.8 Design Files
........................................................................................................
142.9 Hardware Change log
............................................................................................
14
3 Software Examples
........................................................................................................
143.1 Out-of-Box Software Example
...................................................................................
153.2 Blink LED
Example................................................................................................
16
4 Resources
...................................................................................................................
164.1 Integrated Development
Environments.........................................................................
164.2 LaunchPad Websites
.............................................................................................
194.3 MSPWare and TI Resource
Explorer...........................................................................
204.4 FRAM
Utilities......................................................................................................
204.5 MSP430FR2433 MCU
............................................................................................
214.6 Community Resources
...........................................................................................
21
5 FAQ
..........................................................................................................................
216
Schematics..................................................................................................................
22
List of Figures
1 MSP-EXP430FR2433 LaunchPad Development Kit
....................................................................
12 MSP-EXP430FR2433 Overview
...........................................................................................
53 MSP-EXP430FR2433 Block
Diagram.....................................................................................
54 MSP430FR2433
Pinout.....................................................................................................
65 eZ-FET Debug Probe
.......................................................................................................
76 eZ-FET Isolation Jumper Block Diagram
.................................................................................
87 Application Backchannel UART in Device Manager
....................................................................
98 MSP-EXP430FR2433 Power Block
Diagram...........................................................................
109 MSP-EXP430FR2433 Supercap Power Block Diagram
.............................................................. 1110
BoosterPack Checker Tool
...............................................................................................
1311 LaunchPad Kit to BoosterPack Module Connector
Pinout............................................................
1412 TI Resource Explorer Cloud
..............................................................................................
1713 CCS Cloud
..................................................................................................................
1714 Directing the Project>Import Function to the Demo Project
.......................................................... 1815
When CCS Has Found the Project
......................................................................................
1916 Using TI Resource Explorer to Browse MSP-EXP430FR2433 in
MSPWare ...................................... 2017 Schematics (1
of 2)
........................................................................................................
2218 Schematics (2 of 2)
........................................................................................................
23
List of Tables
1 EnergyTrace Technology
...................................................................................................
7
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
2 Isolation Block Connections
................................................................................................
83 Hardware Change Log
....................................................................................................
144 Software Examples
........................................................................................................
145 IDE Minimum Requirements for MSP-EXP430FR2433
............................................................... 146
Source File and Folders
...................................................................................................
157 Source File and Folders
...................................................................................................
168 How MSP Device Documentation is
Organized........................................................................
21
TrademarksLaunchPad, BoosterPack, Code Composer Studio,
EnergyTrace, MSP430, E2E are trademarks of TexasInstruments.IAR
Embedded Workbench is a registered trademark of IAR Systems.All
other trademarks are the property of their respective owners.
1 Getting Started
1.1 IntroductionThe 16-MHz MSP430FR2433 device features 15.5KB
of embedded FRAM (ferroelectric random accessmemory), a nonvolatile
memory known for its ultra-low power, high endurance, and
high-speed writeaccess. Combined with the 4KB of on-chip SRAM,
users have access to 15.5KB of memory to splitbetween their program
and data as required. For example, a data logging application may
require a largedata memory with a relatively small program memory,
so the memory may be allocated as requiredbetween program and data
memory.
Rapid prototyping is simplified by the 20-pin BoosterPack™
plug-in module headers, which support a widerange of available
BoosterPack modules. You can quickly add features like wireless
connectivity, graphicaldisplays, environmental sensing, and much
more. Design your own BoosterPack plug-in module orchoose among
many already available from TI and third-party developers.
Free software development tools are also available, such as TI's
Eclipse-based Code Composer Studio™IDE (CCS) and IAR Embedded
Workbench® IDE. Both of these IDEs support EnergyTrace™
technologyfor real-time power profiling and debugging when paired
with the MSP430FR2433 LaunchPaddevelopment kit.
1.2 Key Features• MSP ULP FRAM technology based MSP430FR2433
16-bit MCU• EnergyTrace Technology available for ultra-low-power
debugging• 20-pin LaunchPad development kit standard leveraging the
BoosterPack plug-in module ecosystem• Onboard eZ-FET debug probe• 2
buttons and 2 LEDs for user interaction
1.3 What's Included
1.3.1 Kit Contents• 1 MSP-EXP430FR2433 LaunchPad development
kit• 1 Micro USB cable• 1 Quick start guide• The supercapacitor is
not included and must be provided by the user
1.3.2 Software Examples• Out-of-Box Software
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
1.4 First Steps: Out-of-Box Experience
1.4.1
1.4.2
An easy way to get started with the EVM is by using its
preprogrammed out-of-box code. This code demonstrates some key
features of the EVM.
Connecting to the ComputerConnect the LaunchPad development kit
to a computer using the included USB cable. A green power LED
should illuminate. For proper operation, drivers are needed. It is
recommended to get drivers by installing an IDE such as TI's CCS or
IAR EW430. Drivers are also available at www.ti.com/MSPdrivers.
Running the Out-of-Box DemoThe out-of-box (OOB) demo for the
MSP-EXP430FR2433 LaunchPad development kit demonstrates how to
setup a periodic temperature data logger, by using a ring buffer
inside the FRAM memory of the MSP430FR2433 MCU. Alternatively, the
demo also implements a real-time temperature sensor.Both the logged
and the real-time temperature data can be transmitted to the PC and
visualized using the accompanying cloud GUI (visit MSP-EXP430FR2433
OOB GUI). If access to the cloud GUI is not available, the data can
still be observed using any serial terminal application
(application UART settings: 115200, 8, 1, n).By default after power
up, the LaunchPad development kit enters the FRAM Data Log mode.
The red LED1 blinks periodically (approximately every 5 seconds),
which indicates that the device is waking up to log the temperature
and going back to sleep. Press the left user button S1 to transfer
the stored temperature to the PC.Next, try pressing the S1 and S2
buttons simultaneously to enter the Live Temperature mode. The
LaunchPad development kit should start streaming live temperature
data to the PC to be visualized in the MSP-EXP430FR2433 OOB GUI or
displayed in a serial terminal. In this mode, the application also
keeps track of a temperature threshold (the default is 25°C), and
when a new temperature data is acquired, it is compared against
that threshold. If the current temperature is above the threshold,
the red LED1 illuminates, and if the current temperature is below
the threshold, the green LED2 illuminates. Pressing S1 or S2
independently increases or decreases the temperature threshold in
this mode.The user can influence the temperature of the device by
blowing hot or cold air and observing the changes in the user LED
brightness or see data changes on the GUI.
1.5 Next Steps: Looking Into the Provided CodeAfter the EVM
features have been explored, the fun can begin. It is time to open
an integrated development environment and start editing the code
examples. See Section 4 for available IDEs and where to download
them.The quickest way to get started using the LaunchPad
development kit is to use TI's Cloud Development Tools. The
cloud-based Resource Explorer provides access to all of the
examples and resources in MSPWare software. Code Composer Studio
Cloud is a simple cloud-based IDE that enables developing and
running applications on the LaunchPad development kit.The
out-of-box source code and more code examples are provided and
available on the download page. Code is licensed under BSD, and TI
encourages reuse and modifications to fit specific needs.Section 3
describes all functions in detail and provides a project structure
to help familiarize you with the code.
With the onboard eZ-FET debug probe debugging and downloading
new code is simple. A USB connection between the EVM and a PC
through the provided USB cable is all that is needed.
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Target device MSP430FR2433
Crystal 32.768 kHz
Micro-B USB
3.3-V LDO
ESD Protection
Debug MCU
LED Red, Green
Crystal, 4 MHz
UART, SBW to Target
User interface2 buttons, 2 LEDs
20-pinLaunchPad
standard headers
Power to Target
Reset button
EnergyTraceTechnology
Supercapacitor
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
2 HardwareFigure 2 shows an overview of the MSP-EXP430FR2433
hardware.
Figure 2. MSP-EXP430FR2433 Overview
2.1 Block DiagramFigure 3 shows the block diagram.
Figure 3. MSP-EXP430FR2433 Block Diagram
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RST/NMI/SBWTDIO
TEST/SBWTCK
P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4/VREF+
P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A5
P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A6
P1.7/UCA0STE/SMCLK/TDO/A7
P1.0
/UC
B0S
TE
/TA
0C
LK
/A0/V
ere
f+
P1
.1/U
CB
0C
LK
/TA
0.1
/A1
P1
.2/U
CB
0S
IMO
/UC
B0S
DA
/TA
0.2
/A2/V
ere
f-
P1.3
/UC
B0S
OM
I/U
CB
0S
CL/M
CLK
/A3
P2.2
/SY
NC
/AC
LK
P3.0
P2.3
P3.1/UCA1STE
P2.4/UCA1CLK
P2.5/UCA1RXD/UCA1SOMI
P2.6/UCA1TXD/UCA1SIMO
DVSS
P2.7
P3.2
P2.0
/XO
UT
P2.1
/XIN
DV
SS
DV
CC
MSP430FR2433IRGE
1
2
3
4
5
6
7 8 9 10 11 12
13
14
15
16
17
18
192021222324
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
2.2 Hardware Features
2.2.1 MSP430FR2433 MCUThe MSP430FR2433 is an ultra-low-power
MSP430FRx FRAM-based microcontroller (MCU), which offer extended
data logging and security capabilities. The MSP430FR2433 offers the
small VQFN package(4 mm × 4 mm) in the FRAM microcontroller
portfolio, combined with a variety of integrated peripherals and
ultra-low power consumption. FRAM is a cutting edge memory
technology, combining the best features of flash and RAM into one
nonvolatile memory. More information on FRAM can be found at
www.ti.com/fram.
Device features include:• 1.8-V to 3.6-V operation• 16-bit RISC
architecture up to 16-MHz system clock and 8-MHz FRAM access• 15KB
of program FRAM, 512B of information FRAM, and 4KB of RAM•
8-channel 10-bit ADC• Four 16-Bit timers
– Two timers with three capture/compare registers each
(Timer_A3)– Two timers with two capture/compare registers each
(Timer_A2)
• 32-bit hardware multiplier (MPY)• 19 GPIOs• Two enhanced
universal serial communication interfaces (eUSCI_A) support UART,
IrDA, and SPI• One eUSCI (eUSCI_B) supports SPI and I2C
Figure 4. MSP430FR2433 Pinout
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace TechnologyTo
keep development easy and cost effective, TI's LaunchPad
development kits integrate an onboard debug probe, which eliminates
the need for expensive programmers. The MSP-EXP430FR2433 has the
eZ-FET debug probe (see Figure 5), which is a simple and low-cost
debugger that supports all MSP430™ device derivatives.
Figure 5. eZ-FET Debug Probe
The MSP-EXP430FR2433 LaunchPad development kit features
EnergyTrace technology but does nothave support for EnergyTrace++
technology. The EnergyTrace functionality varies across the
MSPportfolio.
Table 1. EnergyTrace Technology
Features EnergyTrace Technology EnergyTrace++ TechnologyCurrent
monitoring Yes YesCPU state No YesPeripheral and system state No
Yes
Devices supported All MSP430 MCUs MSP430FR59xx andMSP430FR69xx
MCUsDevelopment tool required MSP-FET or eZ-FET MSP-FET or
eZ-FET
The dotted line through J101 shown in Figure 5 divides the
eZ-FET debug probe from the target area. The signals that cross
this line can be disconnected by jumpers on J101, the isolation
jumper block. For more details on the isolation jumper block, see
Section 2.2.3.The eZ-FET also provides a backchannel UART-over-USB
connection with the host, which can be very useful during debugging
and for easy communication with a PC. For more details, see Section
2.2.4.The eZ-FET hardware can be found in the schematics in Section
6 and in the MSP-EXP430FR2433 design files download page. The
software and more information about the debugger can be found on
the eZ-FET wiki. More information on the eZ-FET can be found in the
MSP Debuggers User's Guide.
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eZ-FET DebugProbe
Isolation Jumper Block
Spy
-Bi-W
ire (
SB
W)
Em
ulat
ion
App
licat
ion
UA
RT
3.3-
V P
ower
5-V
Pow
er
Target MSP430FR2433
eZ-F
ET
MS
P43
0 T
arg
et
USB Connector
in outLDO
Boo
ster
Pac
k H
eade
r
Boo
ster
Pac
k H
eade
r
USB
EnergyTraceTechnology
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2.2.3 Debug Probe Connection: Isolation Jumper BlockThe
isolation jumper block at jumper J101 allows the user to connect or
disconnect signals that cross from the eZ-FET domain into the
MSP430FR2433 target domain. This includes eZ-FET Spy-Bi-Wire
signals, application UART signals, and 3.3-V and 5-V power. Table 2
describes these connections.Reasons to open these connections:• To
remove any and all influence from the eZ-FET debug probe for high
accuracy target power
measurements• To control 3-V and 5-V power flow between the
eZ-FET and target domains• To expose the target MCU pins for other
use than onboard debugging and application UART
communication• To expose the programming and UART interface of
the eZ-FET so that it can be used for devices other
than the onboard MCU. See Section 2.6 for how to use the eZ-FET
Debug Probe with a different target.
Table 2. Isolation Block Connections
Jumper DescriptionGND Ground5V 5-V VBUS from USB3V3 3.3-V rail,
derived from VBUS in the eZ-FET domain
RXD > Backchannel UART: The target FR2433 sends data through
this signal. The arrows indicate the directionof the signal.SBW RST
Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as
the RST signal (active low).SBW TST Spy-Bi-Wire debug: SBWTCK clock
signal. This pin also functions as the TST signal.
Figure 6. eZ-FET Isolation Jumper Block Diagram
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
2.2.4 Application (or Backchannel) UARTThe backchannel UART
allows communication with the USB host that is not part of the
target application's main functionality. This is very useful during
development, and also provides a communication channel to the PC
host side. This can be used to create graphical user interfaces
(GUIs) and other programs on the PC that communicate with the
LaunchPad.Figure 6 shows the pathway of the backchannel UART. The
backchannel UART is the UART on eUSCI_A0.
On the host side, a virtual COM port for the application
backchannel UART is generated when the LaunchPad enumerates on the
host. You can use any PC application that interfaces with COM
ports, including terminal applications like Hyperterminal or
Docklight, to open this port and communicate with the target
application. You need to identify the COM port for the backchannel.
On Windows PCs, Device Manager can assist.
Figure 7. Application Backchannel UART in Device Manager
The backchannel UART is the MSP Application UART1 port. In this
case, Figure 7 shows COM13, but this port can vary from one host PC
to the next. After you identify the correct COM port, configure it
in your host application according to its documentation. You can
then open the port and begin communication to it from the host.On
the target MSP430FR2433 side, the backchannel is connected to the
eUSCI_A0 module. The eZ-FET has a configurable baud rate;
therefore, it is important that the PC application configures the
baud rate to be the same as what is configured on the eUSCI_A0.
2.2.5 Optional Features
2.2.5.1 SupercapacitorA through-hole component footprint is
available on the board and allows user to populate a
supercapacitorto power the system without any external power. The
recommended part is the Panasonic EEC-S0HD224H 220 mF (0.22 F)
supercapacitor and can be purchased from major electronic
componentdistributers.
NOTE: A supercapacitor is not included in the kit and must be
supplied by the user.
Using the onboard jumper headers, the supercapacitor can
configured in the following ways: charging, using (direct
connection to 3V3 rail), or disconnected. For more details on these
use modes and how to use them, see Section 2.3.
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
2.3 PowerThe board was designed to accommodate various powering
methods, including through the onboard eZ-FET as well as from
external or BoosterPack power. Figure 8 shows power from the ez-FET
and power from external source through header J5 or the BoosterPack
module.
Figure 8. MSP-EXP430FR2433 Power Block Diagram
2.3.1
2.3.2
eZ-FET USB PowerThe most common power-supply scenario is from
USB through the eZ-FET debugger. This provides 5-V power from the
USB and also regulates this power rail to 3.3 V for eZ-FET
operation and 3.3 V to the target side of the LaunchPad. Power from
the eZ-FET is controlled by jumper J101. For 3.3 V, make sure that
a jumper is connected across the J101 3V3 terminal.
BoosterPack and External Power SupplyHeader J5 is present on the
board to supply external power directly. It is important to comply
with the device voltage operation specifications when supplying
external power. The MSP430FR2433 has an operating range of 1.8 V to
3.6 V. More information can be found in the MSP430FR2433
Mixed-Signal Microcontroller data sheet.
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
2.3.3 Supercap (C6)If the supercapacitor is populated, it can be
used to evaluate the ultra-low power feature of theMSP430FR2433
target device. See how long you can run your application on the
supercap alone.
NOTE: A supercapacitor is not included in the kit and must be
supplied by the user.
Figure 9 shows charging the supercap and powering directly from
it.
Figure 9. MSP-EXP430FR2433 Supercap Power Block Diagram
2.3.3.1 Charging the SupercapThe supercapacitor can be charged
when the EVM is plugged into the PC or when the board is
externallypowered. During charging, set J4 to the “Charge” setting,
this adds in a current limiting resistor forcharging.
To charge the supercap, power must be coming from the eZ-FET
debug probe, external power throughJ5, or a BoosterPack module
powering through J1. Allow two to three minutes for the supercap to
charge(time may vary depending on initial charge of the supercap
and your power source) to full VCC.
2.3.3.2 Using the SupercapAfter charging of the supercapacitor,
you can move the J4 jumper to the Use setting and then unplugpower.
This connects the supercapacitor to the 3V3 rail without the
charging resistor in between. At thispoint, the LaunchPad kit is
being powered completely by the C6 supercapacitor.
For lowest power operation, make sure to disconnect the J101
jumpers so that the eZ-FET is not alsopowered by the C6
supercap.
2.3.3.3 Disabling the SupercapThe supercapacitor can be
completely decoupled from the board by removing the J4 jumper.
Hanging thisjumper off only one pin can prevent losing the
jumper.
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
2.4 Measure Current Draw of the MSP430 MCUTo measure the current
draw of the MSP430FR2433 using a multimeter, use the 3V3 jumper on
the J101jumper isolation block. The current measured includes the
target device and any current drawn throughthe BoosterPack
headers.
To measure ultra-low power, follow these steps:1. Remove the 3V3
jumper in the J101 isolation block, and attach an ammeter across
this jumper.2. Consider the effect that the backchannel UART and
any circuitry attached to the MSP430FR2433 may
have on current draw. Consider disconnecting these at the
isolation jumper block, or at least considertheir current sinking
and sourcing capability in the final measurement.
3. Make sure there are no floating inputs/outputs (I/Os) on the
MSP430FR2433. These causeunnecessary extra current draw. Every I/O
should either be driven out or, if it is an input, should bepulled
or driven to a high or low level.
4. Begin target execution.5. Measure the current. Keep in mind
that if the current levels are fluctuating, it may be difficult to
get a
stable measurement. It is easier to measure quiescent
states.
EnergyTrace can also be used to compare various current profiles
and better optimize your energyperformance!
2.5 ClockingThe MSP-EXP430FR2433 provides external clocks in
addition to the internal clocks in the device.• Q1: 32-kHz Epson
crystal (FC-135R) 12.5-pF crystal, part number: X1A0001410014
The 32-kHz crystal allows for lower LPM sleep currents than do
the other low-frequency clock sources.Therefore, the presence of
the crystal allows the full range of low-power modes to be
used.
By default, the crystal is not connected to the MSP430FR2433
because the target pins are multiplexedwith 2 BoosterPack header
pins. 0-Ω resistors R4 and R5 need to be removed, while R2 and R3
must beshorted across, to connect the external crystal to the
MSP430FR2433. See the onboard crystal selectionresistors silkscreen
for how to configure the resistors to select between the crystal or
the BoosterPackpins.
The internal clocks in the device default to the following
configuration:• MCLK: DCO 1 MHz• SMCLK: DCO 1 MHz• ACLK: REFO
32.768 kHz
For more information about configuring internal clocks and using
the external oscillators, see the MSP430FR4xx and MSP430FR2xx
Family User's Guide.
2.6 Using the eZ-FET Debug Probe With a Different TargetThe
eZ-FET debug probe on the LaunchPad can interface to most MSP430
derivative devices, not just the onboard MSP430FR2433 target
device.To do this, disconnect every jumper in the isolation jumper
block. This is necessary, because the debug probe cannot connect to
more than one target at a time over the Spy-Bi-Wire (SBW)
connection.Next, make sure the target board has proper connections
for SBW. To be compatible with SBW, the capacitor on RST/SBWTDIO
cannot be greater than 2.2 nF. The documentation for designing
MSP430 JTAG interface circuitry is the MSP430 Hardware Tools User's
Guide.Finally, wire together these signals from the debug probe
side of the isolation jumper block to the target hardware:• 5 V (if
5 V is needed)• 3.3 V• GND• SBWTDIO
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
• SBWTCK• TXD (if the UART backchannel is to be used)• RXD (if
the UART backchannel is to be used)
This wiring can be done either with jumper wires or by designing
the board with a connector that plugs intothe isolation jumper
block.
2.7 BoosterPack PinoutThe LaunchPad kit adheres to the 20-pin
LaunchPad pinout standard. A standard was created to
aidcompatibility between LaunchPad kits and BoosterPack modules
across the TI ecosystem.
While most BoosterPack modules are compliant with the standard,
some are not. The MSP-EXP430FR2433 LaunchPad kit is compatible with
all 20-pin BoosterPack modules that are compliant withthe standard.
If the reseller or owner of the BoosterPack module does not
explicitly indicate compatibilitywith the MSP-EXP430FR2433
LaunchPad development kit, compare the schematic of the
candidateBoosterPack module with the LaunchPad kit to ensure
compatibility. Keep in mind that sometimesconflicts can be resolved
by changing the MSP430FR2433 device pin function configuration in
software.
Figure 10. BoosterPack Checker Tool
To check the compatibility of your desired BoosterPack modules
for your design, with a LaunchPad kit of your choice, you can use
the BoosterPack Checker tool. This allows you to select any
LaunchPad kit that TI offers and determine its compatibility with
any number of BoosterPack modules. You can also add your own
BoosterPack module to check its compatibility as you prototype that
next design.Figure 11 shows the 20-pin pinout of the MSP430FR2433
LaunchPad development kit.The inner side of the dashed line shows
some of the software selectable functions on each pin, including
the functions that conform to the standard. However, each pin may
have other functionalities that can be configured by the software.
See the MSP430FR2433 data sheet for more details on individual pin
functions.
-
Hardware www.ti.com
14 SLAU739–October 2017 Submit Documentation Feedback
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
Figure 11. LaunchPad Kit to BoosterPack Module Connector
Pinout
2.8 Design Files
2.8.1
2.8.2
HardwareSection 6 shows the schematics. All design files
including schematics, layout, bill of materials (BOM), Gerber
files, and documentation are available on the MSP-EXP430FR2433
design files download page.
SoftwareAll design files including TI-TXT object-code firmware
images, software example projects, and documentation are available
on the MSP-EXP430FR2433 design files download page.
2.9 Hardware Change logTable 3 lists the revision history of the
MSP-EXP430FR2433 hardware.
Table 3. Hardware Change Log
PCB Revision DescriptionRev 1.0 Initial release
3 Software ExamplesFour software examples are included with the
MSP430FR2433 LaunchPad development kit (see Table 4), which can be
found in the MSP430FR2433 LaunchPad development kit download page
and are also available inside the MSPWare software.
Table 4. Software Examples
Demo Name BoosterPackRequired Description More Details
OutOfBox_FR2433 None The out-of-box demo preprogrammed on the
LaunchPad kit from thefactory. Demonstrates features of
MSP430FR2433 device Section 3.1
BlinkLED_FR2433 None Blinks an LED on the LaunchPad kit at a
fixed interval Section 3.2
To use any of the software examples with the LaunchPad
development kit, you must have an integrated development
environment (IDE) that supports the MSP430FR2433 device (see Table
5).
Table 5. IDE Minimum Requirements for MSP-EXP430FR2433
Code Composer Studio IDE IAR Embedded Workbench for
TexasInstruments MSP430 IDEVersion 6.1.3 or later Version 6.30 or
later
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www.ti.com Software Examples
15SLAU739–October 2017 Submit Documentation Feedback
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
For more details on how to get started quickly, and where to
download the latest CCS and IAR IDEs, see Section 4.
3.1 Out-of-Box Software Example
3.1.1
This section describes the functionality and structure of the
out-of-box software that is preloaded on the EVM.
The Out-of-Box demo for the MSP-EXP430FR2433 LaunchPad
development kit demonstrates how to setup a periodic temperature
data logger, by using a ring-buffer inside the FRAM memory of the
MSP430FR2433 MCU. The demo also implements a real-time temperature
sensor.
Source File StructureThe project is split into multiple files
(see Table 6). This makes it easier to navigate and reuse parts of
it for other projects.
Table 6. Source File and Folders
Name Descriptionmain.c Out-of-Box demo main function
FRAMLogMode.c Contains functions for the FRAM data logging
modeLiveTempMode.c Contains function for the live temperature
streaming modeLibrary: driverlib Device driver library
Library: fram-utilities Contains the CTPL and NVS software
libraries from the FRAM UtilitiesLibrary: iqmathlib Fixed Point
Math Library for MSP
Library: jsmn Third-party library for parsing JSON formatted
strings
3.1.2
3.1.3
OverviewAn online cloud GUI (MSP-EXP430FR2433 OOB GUI) can be
used to download this demo to your board and visualize the
temperature data. A serial terminal can also be used to display the
data being sent from the demo to the PC (application UART settings:
115200, 8, 1, n).Upon powering up the Out-of-Box demo, the green
LED2 lights up for 1 second, and then the board enters FRAM data
logging mode to measure and record the internal temperature of the
MSP430FR2433 MCU every 5 seconds.By default after power up, the
LaunchPad development kit enters the FRAM data logging mode. At any
time, press the S1 and S2 buttons simultaneously to switch between
the live temperature mode and the FRAM data logging mode.
FRAM Data Logging ModeThis mode shows the FRAM data logging
capabilities of the MSP430FR2433. After starting this mode, the
LaunchPad wake up from LPM3.5 approximately every 5 seconds
(indicated by short red LED1 blink) to log temperature values. Data
are stored into a ring buffer located in the FRAM memory. When the
ring buffer fills up to its capacity, the oldest temperature data
is discarded and replaced with the newest data.• Press the left
button S1 to transfer all data stored inside the ring buffer to the
PC.• Press the right button S1 to clear all data and return to an
empty ring buffer.• The compute through power loss (CTPL) and
nonvolatile storage (NVS) libraries from the FRAM
Utilities are used in this demo to simplify the code to setup
this simple data logging application.
3.1.4 Live Temperature ModeIn this mode, the LaunchPad kit
repeatedly measures the internal temperature of the MSP430FR2433MCU
and transfers the data to the PC through UART.
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Software Examples www.ti.com
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
The application also keeps track of a temperature threshold in
this mode (default is 25°C), and when anew temperature data is
acquired, it is compared against the threshold. If measured
temperature is belowthe threshold, the green LED2 illuminates, and
if the measured temperature is above the threshold, thered LED1
illuminates.
Independently pressing S1 or S2 increases or decreases,
respectively, the temperature threshold in thismode. The further
the recorded temperature is from the threshold, the brighter the
corresponding LEDsilluminate.
The user can influence the temperature of the device by blowing
hot or cold air and observing thechanges in the user LED brightness
or see data changes on the GUI.
3.2 Blink LED Example
3.2.1
This very simple software example shows how to software toggle a
GPIO to blink an LED on the LaunchPad kit.
Source File StructureThe project is split into multiple files
(see Table 7). This makes it easier to navigate and reuse parts of
it for other projects.
Table 7. Source File and Folders
Name Descriptionmain.c The Blink LED main function
Library: Driverlib Device driver library
The main code simply uses the MSP430 Driver Library to halt the
watchdog timer and to configure andtoggle the P1.0 GPIO pin
connected to the LED inside a software loop.
4 Resources
4.1 Integrated Development EnvironmentsAlthough the source files
can be viewed with any text editor, more can be done with the
projects if theyare opened with a development environment like Code
Composer Studio IDE and IAR EmbeddedWorkbench IDE.
4.1.1 TI Cloud Development ToolsTI's Cloud-based software
development tools provide instant access to MSPWare content and a
web-based IDE.
4.1.1.1 TI Resource Explorer CloudTI Resource Explorer Cloud
provides a web interface for browsing examples, libraries and
documentation found in MSPWare without having to download files to
your local drive (see Figure 12).Visit TI Resource Explorer Cloud
now at dev.ti.com.
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www.ti.com Resources
17SLAU739–October 2017 Submit Documentation Feedback
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
Figure 12. TI Resource Explorer Cloud
4.1.1.2 Code Composer Studio CloudCode Composer Studio Cloud
(CCS Cloud) is a web-based IDE that enables you to quickly create,
edit, build and debug applications for your LaunchPad development
kit. No need to download and install large software packages,
simply connect your LaunchPad development kit and begin. You can
choose to select from a large variety of examples in MSPWare
software and Energia or develop your own application. CCS Cloud
supports debug features such as execution control, breakpoints and
viewing variables.For a full comparison between CCS Cloud and CCS
Desktop, visit the TI Cloud Tools page.Visit Code Composer Studio
Cloud now at dev.ti.com.
Figure 13. CCS Cloud
-
Resources www.ti.com
18 SLAU739–October 2017 Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
4.1.2 Code Composer Studio IDECode Composer Studio Desktop is a
professional integrated development environment that supports TI's
Microcontroller and Embedded Processors portfolio. Code Composer
Studio comprises a suite of tools used to develop and debug
embedded applications. It includes an optimizing C/C++ compiler,
source code editor, project build environment, debugger, profiler,
and many other features.Learn more about CCS and download it at
www.ti.com/tool/ccstudio.CCS v7.0.0 or higher is required. When CCS
has been launched, and a workspace directory chosen, use
Project>Import Existing CCS Eclipse Project. Direct it to the
desired demo's project directory that contains main.c.
Figure 14. Directing the Project>Import Function to the Demo
Project
Selecting the \CCS subdirectory also works. The CCS-specific
files are located there.When you click OK, CCS should recognize the
project and allow you to import it. The indication that CCS has
found it is that the project appears in the box shown in Figure 15,
and it has a checkmark to the left of it.
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19SLAU739–October 2017 Submit Documentation Feedback
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
4.1.3
Figure 15. When CCS Has Found the Project
Sometimes CCS finds the project but does not show a checkmark;
this might mean that your workspace already has a project by that
name. You can resolve this by renaming or deleting that project.
(Even if you do not see it in the CCS workspace, be sure to check
the workspace directory on the file system.)
IAR Embedded Workbench for Texas Instruments 430IAR Embedded
Workbench for MSP430 is another very powerful integrated
development environment that allows you to develop and manage
complete embedded application projects. It integrates the IAR C/C++
Compiler, IAR Assembler, IAR ILINK Linker, editor, project manager,
command line build utility, and IAR C-SPY® Debugger.Learn more
about IAR Embedded Workbench for MSP430 and download it
atsupp.iar.com/Download/SW/?item=EW430-EVAL.
IAR 6.30 or higher is required. To open the demo in IAR, click
File>Open>Workspace…, and browse to the *.eww workspace file
inside the \IAR subdirectory of the desired demo. All workspace
information is contained within this file.The subdirectory also has
an *.ewp project file. This file can be opened into an existing
workspace byclicking Project>Add-Existing-Project….
Although the software examples have all of the code required to
run them, IAR users may download andinstall MSPWare, which contains
MSP430 libraries and the TI Resource Explorer. These are
alreadyincluded in a CCS installation (unless the user selected
otherwise).
4.2 LaunchPad WebsitesMore information about the LaunchPad
development kit, supported BoosterPack plug-in modules,
andavailable resources can be found at:• MSP-EXP430FR2433 Tool
Folder: Resources specific to this particular LaunchPad development
kit• TI's LaunchPad portal: Information about all LaunchPad
development kits from TI
-
Resources www.ti.com
20 SLAU739–October 2017 Submit Documentation Feedback
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
4.3 MSPWare and TI Resource ExplorerTI Resource Explorer is a
tool integrated into CCS that allows you to browse through
available design resources. TI Resource Explorer helps you quickly
find what you need inside packages including MSPWare, ControlSuite,
TivaWare, and more. TI Resource Explorer is well organized to find
everything that you need quickly, and you can import software
projects into your workspace in one click.TI Resource Explorer
Cloud is one of the TI Cloud Development tools and is tightly
integrated with CCS Cloud. See Section 4.1.1 for more
information.MSPWare is a collection of code examples, software
libraries, data sheets, and other design resources for all MSP
devices delivered in a convenient package – essentially everything
developers need to become MSP experts.In addition to providing a
complete collection of existing MSP design resources, MSPWare also
includes a high-level API called MSP Driver Library. This library
makes it easy to program MSP hardware. For more information, see
www.ti.com/tool/mspware.
Figure 16. Using TI Resource Explorer to Browse MSP-EXP430FR2433
in MSPWare
Inside TI Resource Explorer, these examples and many more can be
found, and easily imported into CCSwith one click.
4.4 FRAM Utilities
4.4.1
4.4.2
The TI FRAM Utilities is a collection of embedded software
utilities that leverage the ultra-low-power and virtually unlimited
write endurance of FRAM. The utilities are available for MSP430FRxx
FRAM microcontrollers and provide example code to help start
application development.
Compute Through Power Loss (CTPL)CTPL is a utility API set that
enables ease of use with LPMx.5 low-power modes and a powerful
shutdown mode that allows an application to save and restore
critical system components when a power loss is detected.
Nonvolatile Storage (NVS)The NVS library makes handling of
nonvolatile data easy and robust against intermittent power loss or
asynchronous device resets. To keep data storage constant, the
nonvolatile storage library contains functions that store data in a
way that is ensures recovery of the last valid entry without data
corruption.
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
4.5 MSP430FR2433 MCU
4.5.1 Device DocumentationAt some point, you will probably want
more information about the MSP430FR2433 device. For every MSP
device, the documentation is organized as shown in Table 8.
Table 8. How MSP Device Documentation is Organized
Document For MSP430FR2433 DescriptionDevice familyuser's
guide
MSP430FR4xx and MSP430FR2xx Family User's Guide
Architectural information about the device, including all
modules andperipherals such as clocks, timers, ADC, and so on.
Device-specificdata sheet
MSP430FR2433 Mixed-Signal Microcontroller data sheet
Device-specific information and all parametric information for this
device
4.5.2
4.5.3
MSP430FR2433 Code ExamplesMSP430FR243x, MSP430FR253x,
MSP430FR263x Code Examples is a set of simple C examples that
demonstrate how to use the entire set of peripherals on the
MSP4302433 MCU, including serial communication, ADC10, Timer, and
others, through direct register access. Every MSP derivative has a
set of these code examples. When starting a new project or adding a
new peripheral, these examples serve as a great starting point.
MSP430 Application Notes and TI DesignsMany application notes
can be found at www.ti.com/msp430, along with TI Designs with
practical design examples and topics.
4.6 Community Resources
4.6.1
4.6.2
5
TI E2E™ CommunitySearch the forums at e2e.ti.com. If you cannot
find your answer, post your question to the community.
Community at LargeMany online communities focus on the LaunchPad
development kits – for example, www.43oh.com. You can find
additional tools, resources, and support from these
communities.
FAQQ: I can't get the backchannel UART to connect. What's
wrong?A: Check the following:• See Section 5.8.2 of the MSP
Debuggers User's Guide for supported baud rates when using the
eZ-FET.• Do the baud-rate settings in the terminal application
on the host PC and the eUSCI match?• Are the appropriate jumpers in
place on the isolation jumper block?• Probe on RXD and send data
from the host. If you don't see data, it might be a problem on the
host
side.• Probe on TXD while sending data from the MSP. If you
don't see data, it might be a configuration
problem with the eUSCI module.• Consider the use of the hardware
flow control lines (especially for higher baud rates). Q: The MSP
G2 LaunchPad kit has a socket that allows me change the target
device. Why doesn'tthis LaunchPad kit use one?A: The target device
on this LaunchPad kit does not come in the dual in-line package.
Sockets for theavailable device package are too expensive for the
target price of this LaunchPad kit.
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7/27/2017
LaunchPad_eZFET_1.4.SchDoc
Sheet Title:
Size:
Mod. Date:
File:Sheet: of
B http://www.ti.comContact: http://www.ti.com/support
MSP-EXP430FR2433Project Title:Designed for: Public Release
Assembly Variant: [No Variations]
!Texas Instruments 2017
Drawn By:Engineer: Eric Chen
Texas Instruments and/or its licensors do not warra nt the
accuracy or completeness of this specificati on or any information
contained therein. Texas Inst ruments and/or its licensors do
notwarrant that this design will meet the specifications, will be
suitable for your application or fit for any particular purpose, or
will operate in an implementation. Texas Instruments and/or
itslicensors do not warrant that the design is product ion worthy.
You should completely validate and testyour design implementation
to confirm the system fu nctionality for your application.
Version control disabledSVN Rev:MCU024Number: Rev: 1.0
TID #: N/AOrderable: EVM_orderable
IO11
IO22
GND3
IO34
IO45
VCC6
IC102
TPD4E004DRYR
33kR123
27
R104
27
R103
1.0MR106
10pFC110
10pFC111
0.1 F!C105
IN1
OUT3
NC4
NC5
EN6
2
GND
IC101
TLV70033DSET
TP101
TP102
TP103
TP104
TP105
TP106
TP107
TP108
TP109
EZ_GNDEZFET_TEST
EZFET_TDO
EZFET_TDI
EZFET_TMS
EZFET_TCK
EZFET_RST
EZFET_DCDCRST
EZFET_DCDCTEST
EZFET_DP
EZFET_DM
1.40k
R105
EZFET_PU.0/DP
EZFET_PU.1/DM
EZFET_PUR
EZ_GND EZ_GND EZ_GND
EZ_GND
EZFET_SHIELD
EZFET_SHIELD
EZFET_SHIELD
EZFET_VBUS
EZ_GND
EZ_GND
EZ_GND
EZ_GND
EZ_GND
Change IC101 to adjust target voltage from 2.8V to
3.6VTLV7033:3.3V
USB Interface and Power Supply
P6.0/CB0/A01
P6.1/CB1/A12
P6.2/CB2/A23
P6.3/CB3/A34
P6.4/CB4/A45
P6.5/CB5/A56
P6.6/CB6/A67
P6.7/CB7/A78
P5.0/A8/VREF+/VEREF+9
P5.1/A9/VREF-/VEREF-10
AVCC111
P5.4/XIN12
P5.5/XOUT13
AVSS114
DVCC115
DVSS116
VCORE17
P1.0/TA0CLK/ACLK18
P1.1/TA0.019
P1.2/TA0.120
P1.3/TA0.221
P1.4/TA0.322
P1.5/TA0.423
P1.6/TA1CLK/CBOUT24
P1.7/TA1.025
P2.0/TA1.126
P2.1/TA1.227
P2.2/TA2CLK/SMCLK28
P2.3/TA2.029
P2.4/TA2.130
P2.5/TA2.231
P2.6/RTCCLK/DMAE032
P2.7/UCB0STE/UCA0CLK33
P3.0/UCB0SIMO/UCB0SDA34
P3.1/UCB0SOMI/UCB0SCL35
P3.2/UCB0CLK/UCA0STE36
P3.3/UCA0TXD/UCA0SIMO37
P3.4/UCA0RXD/UCA0SOMI38
DVSS239
DVCC240
P4.0/PM_UCB1STE/PM_UCA1CLK41
P4.1/PM_UCB1SIMO/PM_UCB1SDA42
P4.2/PM_UCB1SOMI/PM_UCB1SCL43
P4.3/PM_UCB1CLK/PM_UCA1STE44
P4.4/PM_UCA1TXD/PM_UCA1SIMO45
P4.5/PM_UCA1RXD/PM_UCA1SOMI46
P4.6/PM_NONE47
P4.7/PM_NONE48
VSSU49
PU.0/DP50
PUR51
PU.1/DM52
VBUS53
VUSB54
V1855
AVSS256
P5.2/XT2IN57
P5.3/XT2OUT58
TEST/SBWTCK59
PJ.0/TDO60
PJ.1/TDI/TCLK61
PJ.2/TMS62
PJ.3/TCK63
RST/NMI/SBWTDIO64
QFN PAD65
MSP101
MSP430F5528IRGCT
0.1 F!C121
0.1 F!C103
0.1 F!C113
0.1 F!C114
EZ_GND EZ_GND EZ_GND
EZ_GND
EZFET_VBUS EZFET_VCC
EZFET_VREF
EZFET_VCC
10 F!C104
EZ_GND
240kR124
150kR125
33pFC123
1000pFC112
47kR109
0.22 F!C102
0.22 F!C107
0.47 F!C101
1
2
3
4 MHzQ101
EZFET_AVBUSEZFET_AVCCOUT2ADC
EZFET_DCDCIO0EZFET_DCDCIO1EZFET_DCDCRSTEZFET_DCDCTEST
EZFET_VBUS
EZ_GND EZ_GND
EZ_GND
EZFET_VUSB
EZFET_V18
EZFET_VBUS
EZ_GND EZ_GND EZ_GND
Red
LED101
Green
LED102
470
R101
390
R102
EZ_GND
EZ_GND
EZFET_LED0EZFET_LED1
EZFET_VCCEN1EZFET_VCCEN2EZFET_DCDCPULSE
EZFET_UARTCTSEZFET_UARTRTS
EZFET_HOSTSDAEZFET_HOSTSCL
EZFET_UARTTXDEZFET_UARTRXD
EZFET_SBWTDIOEZFET_SBWTCKEZFET_NC_TMSC
EZFET_PU.0/DPEZFET_PU.1/DM
EZFET_PUR
EZ_GND
EZFET_TEST
EZFET_TDOEZFET_TDIEZFET_TMSEZFET_TCK
EZFET_RST
EZFET_VCC
EZ_GND
Host MCU for emulation
P1.0/TA0CLK/ACLK/A0/CA01
TEST/SBWTCK10
P2.7/XOUT11
P2.6/XIN/TA0.112
AVSS13
DVSS14
AVCC15
DVCC16
QFN PAD17
P1.1/TA0.0/A1/CA12
P1.2/TA0.1/A2/CA23
P1.3/ADC10CLK/CAOUT/A3/VREF-/VEREF-/CA34
P1.4/SMCLK/TA0.2/A4/VREF+/VEREF+/CA4/TCK5
P1.5/TA0.0/SCLK/A5/CA5/TMS6
P1.6/TA0.1/SDO/SCL/A6/CA6/TDI/TCLK7
P1.7/CAOUT/SDI/SDA/A7/CA7/TDO/TDI8
RST/NMI/SBWTDIO9
MSP102
MSP430G2452IRSA16R
4.7 F!C106
4.7 F!C109
33pFC115
33pFC116
221kR112
221kR113
221kR114
221kR115
221kR121
221kR122
33pFC122
4.7 F!C117
4.7 F!C119
0.1 F!C124
0.1 F!C118
0.1 F!C120
0.1 F!C125
NO11
COM18
IN27
GND6
NO25
COM24
IN13
V+2
IC103
TS5A21366RSER
1
2
3
D101
BAS40-05W,115
1
2
3
D102
BAS40-05W,115
3
1
2
T102BC850CW,115
4.7kR116
4.7kR117
470R120
2.2 H!
L101
EZ_GNDEZ_GND
EZFET_AVCCOUT2ADC
EZFET_VCCOUT
EZ_GND EZ_GND
EZ_GND EZ_GND
EZFET_VCCOUT
EZFET_VCC
EZ_GND EZ_GND3.30kR127
EZFET_AVCCOUT
EZFET_DCDCPULSEEZFET_DCDCIO0EZFET_DCDCIO1EZFET_AVCC
EZFET_DCDCTESTEZFET_DCDCRST
EZFET_VCC
EZFET_VCCOUT
EZ_GND
EZFET_DCDCCAL0EZFET_DCDCCAL2
EZFET_VCCOUT
EZFET_DCDCCAL1
2.20kR126
6.81kR128
820R118
EZFET_VBUS
0R119
EZ_GNDEZ_GND EZ_GND EZ_GND
EZFET_VCCOUT
EZ_GND EZ_GND EZ_GND
EZ_GND
EZFET_VBUSEZFET_VCCEN1
EZFET_VCCEN2
EZFET_VCCOUT
EZFET_VCC
4.70k
R107
EZ_GND
4.70k
R108
EZ_GND
EZ_GND
Software-controlled DCDC converter
Energy measurement method protected under U.S. Pate
ntApplication 13/329,073 and subsequent patent applic ations
EZFET_UARTRXDEZFET_UARTTXD
EZFET_VCCTARGET
EZFET_VCCTARGETEZFET_VBUS
EZ_GND GND
TEST/SBWTCKRST/SBWTDIOBCLUART_TXDBCLUART_RXD
3V35V0
TST/SBWTCK
RST/SBWTDIO
BCLUART_RXD
BCLUART_TXD
eZ-FET Target
0.22 F!C126
EZ_GND
10.0
R129
10.0
R130
EZFET_SBWTCK
EZFET_SBWTDIO
1 F!C108
180 ohm
L102
180 ohm
L103
3
1
2
T101DMG1013UW-7
VBUS1
D-2
D+3
ID4
GND5
678
11
109
J102
100pFDNP C127
EZ_GND
Updated: 13 Feb 2017
1 2
3 4
5 6
7 8
9 10
11 12
13 14
eZ
-FE
T
Targ
et
SBWTCKSBWTDIO
RXD>
3.3V5.0VGND
J101
J101: 1-2
SH-J101-1
J101: 3-4
SH-J101-2
J101: 5-6
SH-J101-3
J101: 7-8
SH-J101-4J101: 9-10
SH-J101-5
J101: 11-12
SH-J101-6
J101: 13-14
SH-J101-7
EZFET_HOSTSCLEZFET_HOSTSDA
Copyright © 2016, Texas Instruments Incorporated
Schematics www.ti.com
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MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
6 Schematics
Figure 17. Schematics (1 of 2)
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1
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2
2
3
3
4
4
5
5
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LaunchPad_TargetDevice.SchDoc
Sheet Title:
Size:
Mod. Date:
File:Sheet: of
B http://www.ti.comContact: http://www.ti.com/support
MSP-EXP430FR2433Project Title:Designed for: Public Release
Assembly Variant: [No Variations]
!Texas Instruments 2017
Drawn By:Engineer: Eric Chen
Texas Instruments and/or its licensors do not warra nt the
accuracy or completeness of this specificati on or any information
contained therein. Texas Inst ruments and/or its licensors do
notwarrant that this design will meet the specifications, will be
suitable for your application or fit for any particular purpose, or
will operate in an implementation. Texas Instruments and/or
itslicensors do not warrant that the design is product ion worthy.
You should completely validate and testyour design implementation
to confirm the system fu nctionality for your application.
Version control disabledSVN Rev:MCU024Number: Rev: 1.0
TID #: N/AOrderable: EVM_orderable
DVCC24
DVSS23
DVSS18
P1.0/UCB0STE/TA0CLK/A0/VEREF+7
P1.1/UCB0CLK/TA0.1/A18
P1.2/UCB0SIMO/UCB0SDA/TA0.2/A2/VEREF-9
P1.3/UCB0SOMI/UCB0SCL/MCLK/A310
P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4/VREF+3
P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A54
P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A65
P1.7/UCA0STE/SMCLK/TDO/A76
P2.0/XOUT21
P2.1/XIN22
P2.2/ACLK11
P2.313
P2.4/UCA1CLK15
P2.5/UCA1RXD/UCA1SOMI16
P2.6/UCA1TXD/UCA1SIMO17
P2.719
P3.012
P3.1/UCA1STE14
P3.220
PAD25
RST/NMI/SBWTDIO1
TEST/SBWTCK2
MSP1
MSP430FR2433IRGER
RST SBWTDIO
SBWTCKTST/SBWTCK
RST/SBWTDIOP2.0P2.1P2.2P2.3P2.4P2.5P2.6P2.7
P1.0P1.1P1.2P1.3P1.4P1.5P1.6P1.7
P3.0P3.1P3.2
3V3
GND
34
12
S1
3 4
1 2
S2
3 4
1 2
S3
GND GND
GNDGND
GND GND
47.0kR1
1000pFC1
GND
3V3
RST
SW1
SW2
1 2
32.768kHz
Q1
12pFC2
12pFC3
GNDGND
0.1 F!C4
10 F!C5
3V3
GND
+3.3V1
Analog_In2
LP_UART_RX3
LP_UART_TX4
GPIO !5
Analog In6
SPI_CLK7
GPIO !8
I2C_SCL9
I2C_SDA10
J1
GPIO !11
SPI_CS/GPIO !12
SPI_CS/GPIO !13
SPI_MISO14
SPI_MOSI15
RST16
GPIO17
GPIO !18
PWM/GPIO !19
GND20
J2
GNDGND
5V01
2
3
J5 3V31
2
3
J6
GND
3V3
1
2
J101
2
J11
470R6
392R7
RedLED1
GreenLED2
GND GND
LEDs
P1.0 P1.1
B0_SDAB0_SCL
LED1LED2
BCLUART_TXD
BCLUART_RXD
BCL_TXDBCL_RXD
P1.6P1.7
A7
A7
SW1
SW2
A6
A6
P1.5BCL_RXDP1.4BCL_TXD
P1.0A0
P2.4
A1 CLK
A1 CLK
RST
A1 MOSIA1 MISO
A1 MISOA1 MOSI
TA0.1P1.1
P3.1
P3.2
P2.6P2.5
P2.2
TA0.1 A1 CS
5V21
GND22
J35V0
GND
A1 CS
A0
LED1 LED2
0 DNP
R2
0 DNP
R3XIN
XOUT
P2.0_BP
P2.1_BP0
R4
0
R5
P2.0_BPP2.1_BPP1.3
P1.2B0_SCLB0_SDA
P2.7SW2
Super Capacitor
3V3
220000 F!DNPC6
GND
22
R8
1 2 3
J4
Use ChargeJumper Right Position 2-3Jumper Left Position 1-2
Connect jumper here
when discharging the
capacitor to bypass
resistor R8 and
connect to 3V3
Connect jumper here
when charging the
capacitor to use
current limiting
resistor R8
Bypass/DisconnectJumper not connected
When jumper is not in the
"Charge" or "Use" position,
the capacitor is not
connected (bypassed).
We recommend hanging
Hang off single pin
the jumper from one pin so
it does not get lost
J10: 1-2
SH-J10
J11: 1-2
SH-J11
DNP, J4: 2
SH-J4
XIN
XO
UT
Copyright © 2016, Texas Instruments Incorporated
www.ti.com Schematics
23SLAU739–October 2017 Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
Figure 18. Schematics (2 of 2)
-
STANDARD TERMS FOR EVALUATION MODULES1. Delivery: TI delivers TI
evaluation boards, kits, or modules, including any accompanying
demonstration software, components, and/or
documentation which may be provided together or separately
(collectively, an “EVM” or “EVMs”) to the User (“User”) in
accordancewith the terms set forth herein. User's acceptance of the
EVM is expressly subject to the following terms.1.1 EVMs are
intended solely for product or software developers for use in a
research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI
semiconductors products. EVMs have no direct function and are
notfinished products. EVMs shall not be directly or indirectly
assembled as a part or subassembly in any finished product.
Forclarification, any software or software tools provided with the
EVM (“Software”) shall not be subject to the terms and
conditionsset forth herein but rather shall be subject to the
applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs
may not be sold, sublicensed, leased, rented, loaned, assigned,or
otherwise distributed for commercial purposes by Users, in whole or
in part, or used in any finished product or productionsystem.
2 Limited Warranty and Related Remedies/Disclaimers:2.1 These
terms do not apply to Software. The warranty, if any, for Software
is covered in the applicable Software License
Agreement.2.2 TI warrants that the TI EVM will conform to TI's
published specifications for ninety (90) days after the date TI
delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable
for a nonconforming EVM if (a) the nonconformity was caused
byneglect, misuse or mistreatment by an entity other than TI,
including improper installation or testing, or for any EVMs that
havebeen altered or modified in any way by an entity other than TI,
(b) the nonconformity resulted from User's design, specificationsor
instructions for such EVMs or improper system design, or (c) User
has not paid on time. Testing and other quality controltechniques
are used to the extent TI deems necessary. TI does not test all
parameters of each EVM.User's claims against TI under this Section
2 are void if User fails to notify TI of any apparent defects in
the EVMs within ten (10)business days after delivery, or of any
hidden defects with ten (10) business days after the defect has
been detected.
2.3 TI's sole liability shall be at its option to repair or
replace EVMs that fail to conform to the warranty set forth above,
or creditUser's account for such EVM. TI's liability under this
warranty shall be limited to EVMs that are returned during the
warrantyperiod to the address designated by TI and that are
determined by TI not to conform to such warranty. If TI elects to
repair orreplace such EVM, TI shall have a reasonable time to
repair such EVM or provide replacements. Repaired EVMs shall
bewarranted for the remainder of the original warranty period.
Replaced EVMs shall be warranted for a new full ninety (90)
daywarranty period.
3 Regulatory Notices:3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:FCC NOTICE:
This kit is designed to allow product developers to evaluate
electronic components, circuitry, or softwareassociated with the
kit to determine whether to incorporate such items in a finished
product and software developers to writesoftware applications for
use with the end product. This kit is not a finished product and
when assembled may not be resold orotherwise marketed unless all
required FCC equipment authorizations are first obtained. Operation
is subject to the conditionthat this product not cause harmful
interference to licensed radio stations and that this product
accept harmful interference.Unless the assembled kit is designed to
operate under part 15, part 18 or part 95 of this chapter, the
operator of the kit mustoperate under the authority of an FCC
license holder or must secure an experimental authorization under
part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL
COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTIONThis device complies with part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1) This
device may notcause harmful interference, and (2) this device must
accept any interference received, including interference that may
causeundesired operation.Changes or modifications not expressly
approved by the party responsible for compliance could void the
user's authority tooperate the equipment.
FCC Interference Statement for Class A EVM devicesNOTE: This
equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to part 15 ofthe FCC Rules. These
limits are designed to provide reasonable protection against
harmful interference when the equipment isoperated in a commercial
environment. This equipment generates, uses, and can radiate radio
frequency energy and, if notinstalled and used in accordance with
the instruction manual, may cause harmful interference to radio
communications.Operation of this equipment in a residential area is
likely to cause harmful interference in which case the user will be
required tocorrect the interference at his own expense.
-
FCC Interference Statement for Class B EVM devicesNOTE: This
equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 ofthe FCC Rules. These
limits are designed to provide reasonable protection against
harmful interference in a residentialinstallation. This equipment
generates, uses and can radiate radio frequency energy and, if not
installed and used in accordancewith the instructions, may cause
harmful interference to radio communications. However, there is no
guarantee that interferencewill not occur in a particular
installation. If this equipment does cause harmful interference to
radio or television reception, whichcan be determined by turning
the equipment off and on, the user is encouraged to try to correct
the interference by one or moreof the following measures:
• Reorient or relocate the receiving antenna.• Increase the
separation between the equipment and receiver.• Connect the
equipment into an outlet on a circuit different from that to which
the receiver is connected.• Consult the dealer or an experienced
radio/TV technician for help.
3.2 Canada3.2.1 For EVMs issued with an Industry Canada
Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:This device
complies with Industry Canada license-exempt RSSs. Operation is
subject to the following two conditions:(1) this device may not
cause interference, and (2) this device must accept any
interference, including interference that maycause undesired
operation of the device.
Concernant les EVMs avec appareils radio:Le présent appareil est
conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitationest autorisée aux deux conditions
suivantes: (1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doitaccepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:Under Industry
Canada regulations, this radio transmitter may only operate using
an antenna of a type and maximum (or lesser)gain approved for the
transmitter by Industry Canada. To reduce potential radio
interference to other users, the antenna typeand its gain should be
so chosen that the equivalent isotropically radiated power
(e.i.r.p.) is not more than that necessary forsuccessful
communication. This radio transmitter has been approved by Industry
Canada to operate with the antenna typeslisted in the user guide
with the maximum permissible gain and required antenna impedance
for each antenna type indicated.Antenna types not included in this
list, having a gain greater than the maximum gain indicated for
that type, are strictly prohibitedfor use with this device.
Concernant les EVMs avec antennes détachablesConformément à la
réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type etd'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le
but de réduire les risques de brouillageradioélectrique à
l'intention des autres utilisateurs, il faut choisir le type
d'antenne et son gain de sorte que la puissance isotroperayonnée
équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à
l'établissement d'une communication satisfaisante. Leprésent
émetteur radio a été approuvé par Industrie Canada pour fonctionner
avec les types d'antenne énumérés dans lemanuel d’usage et ayant un
gain admissible maximal et l'impédance requise pour chaque type
d'antenne. Les types d'antennenon inclus dans cette liste, ou dont
le gain est supérieur au gain maximal indiqué, sont strictement
interdits pour l'exploitation del'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
日本国内に輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency
Products” in Japan: EVMs entering Japan may not be certifiedby TI
as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical
Regulations of Radio Law of Japan, User is required to follow
theinstructions set forth by Radio Law of Japan, which includes,
but is not limited to, the instructions below with respect to
EVMs(which for the avoidance of doubt are stated strictly for
convenience and should be verified by User):1. Use EVMs in a
shielded room or any other test facility as defined in the
notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on
Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement
of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio
Station as provided in Radio Law of Japan with respect toEVMs,
or
3. Use of EVMs only after User obtains the Technical Regulations
Conformity Certification as provided in Radio Law of Japanwith
respect to EVMs. Also, do not transfer EVMs, unless User gives the
same notice above to the transferee. Please notethat if User does
not follow the instructions above, User will be subject to
penalties of Radio Law of Japan.
-
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】
開発キットの中には技術基準適合証明を受けていないものがあります。
技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・イ
ンスツルメンツ株式会社東京都新宿区西新宿6丁目24番1号西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union3.4.1 For EVMs subject to EU Directive
2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other
than domestic environments that are connected to alow-voltage
power-supply network that supplies buildings used for domestic
purposes. In a domestic environment thisproduct may cause radio
interference in which case the user may be required to take
adequate measures.
4 EVM Use Restrictions and Warnings:4.1 EVMS ARE NOT FOR USE IN
FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT
NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.4.2 User
must read and apply the user guide and other available
documentation provided by TI regarding the EVM prior to
handling
or using the EVM, including without limitation any warning or
restriction notices. The notices contain important safety
informationrelated to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall
operate the EVM within TI’s recommended specifications and
environmental considerations stated in the user
guide, other available documentation provided by TI, and any
other applicable requirements and employ reasonable andcustomary
safeguards. Exceeding the specified performance ratings and
specifications (including but not limited to inputand output
voltage, current, power, and environmental ranges) for the EVM may
cause personal injury or death, orproperty damage. If there are
questions concerning performance ratings and specifications, User
should contact a TIfield representative prior to connecting
interface electronics including input power and intended loads. Any
loads appliedoutside of the specified output range may also result
in unintended and/or inaccurate operation and/or possiblepermanent
damage to the EVM and/or interface electronics. Please consult the
EVM user guide prior to connecting anyload to the EVM output. If
there is uncertainty as to the load specification, please contact a
TI field representative.During normal operation, even with the
inputs and outputs kept within the specified allowable ranges, some
circuitcomponents may have elevated case temperatures. These
components include but are not limited to linear
regulators,switching transistors, pass transistors, current sense
resistors, and heat sinks, which can be identified using
theinformation in the associated documentation. When working with
the EVM, please be aware that the EVM may becomevery warm.
4.3.2 EVMs are intended solely for use by technically qualified,
professional electronics experts who are familiar with thedangers
and application risks associated with handling electrical
mechanical components, systems, and subsystems.User assumes all
responsibility and liability for proper and safe handling and use
of the EVM by User or its employees,affiliates, contractors or
designees. User assumes all responsibility and liability to ensure
that any interfaces (electronicand/or mechanical) between the EVM
and any human body are designed with suitable isolation and means
to safelylimit accessible leakage currents to minimize the risk of
electrical shock hazard. User assumes all responsibility
andliability for any improper or unsafe handling or use of the EVM
by User or its employees, affiliates, contractors ordesignees.
4.4 User assumes all responsibility and liability to determine
whether the EVM is subject to any applicable international,
federal,state, or local laws and regulations related to User’s
handling and use of the EVM and, if applicable, User assumes
allresponsibility and liability for compliance in all respects with
such laws and regulations. User assumes all responsibility
andliability for proper disposal and recycling of the EVM
consistent with all applicable international, federal, state, and
localrequirements.
5. Accuracy of Information: To the extent TI provides
information on the availability and function of EVMs, TI attempts
to be as accurateas possible. However, TI does not warrant the
accuracy of EVM descriptions, EVM availability or other information
on its websites asaccurate, complete, reliable, current, or
error-free.
-
6. Disclaimers:6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY
MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF)
ARE PROVIDED "AS IS" AND "WITH ALLFAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING
BUTNOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESSFOR A PARTICULAR PURPOSE OR
NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS,
TRADESECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH
HEREIN, NOTHING IN THESE TERMS SHALL BECONSTRUED AS GRANTING OR
CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL
ORINTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY
OTHER THIRD PARTY, TO USE THEEVM IN ANY FINISHED END-USER OR
READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY
ORIMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL
DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR
REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS,
DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY,
"CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE
OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS
OBLIGATION SHALL APPLYWHETHER CLAIMS ARISE UNDER STATUTE,
REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGALTHEORY,
AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:8.1 General Limitations.
IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL,
INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION
WITH OR ARISING OUT OF THESETERMS OR THE USE OF THE EVMS ,
REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OFSUCH
DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF
REMOVAL ORREINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF
SUBSTITUTE GOODS OR SERVICES, RETESTING,OUTSIDE COMPUTER TIME,
LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS,
LOSS OFUSE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT
OR ACTION SHALL BE BROUGHT AGAINST TIMORE THAN TWELVE (12) MONTHS
AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION
HASOCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE
LIABILITY FROM ANY USE OF AN EVM PROVIDEDHEREUNDER, INCLUDING FROM
ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR
INCONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI
BY USER FOR THE PARTICULAREVM(S) AT ISSUE DURING THE PRIOR TWELVE
(12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARECLAIMED. THE
EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS
LIMIT.
9. Return Policy. Except as otherwise provided, TI does not
offer any refunds, returns, or exchanges. Furthermore, no return of
EVM(s)will be accepted if the package has been opened and no return
of the EVM(s) will be accepted if they are damaged or otherwise not
ina resalable condition. If User feels it has been incorrectly
charged for the EVM(s) it ordered or that delivery violates the
applicableorder, User should contact TI. All refunds will be made
in full within thirty (30) working days from the return of the
components(s),excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed
by and interpreted in accordance with the laws of the State of
Texas,without reference to conflict-of-laws principles. User agrees
that non-exclusive jurisdiction for any dispute arising out of or
relating tothese terms and conditions lies within courts located in
the State of Texas and consents to venue in Dallas County,
Texas.Notwithstanding the foregoing, any judgment may be enforced
in any United States or foreign court, and TI may seek injunctive
reliefin any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303,
Dallas, Texas 75265Copyright © 2017, Texas Instruments
Incorporated
-
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or
other design advice, services or information, including, but not
limited to,reference designs and materials relating to evaluation
modules, (collectively, “TI Resources”) are intended to assist
designers who aredeveloping applications that incorporate TI
products; by downloading, accessing or using any particular TI
Resource in any way, you(individually or, if you are acting on
behalf of a company, your company) agree to use it solely for this
purpose and subject to the terms ofthis Notice.TI’s provision of TI
Resources does not expand or otherwise alter TI’s applicable
published warranties or warranty disclaimers for TIproducts, and no
additional obligations or liabilities arise from TI providing such
TI Resources. TI reserves the right to make
corrections,enhancements, improvements and other changes to its TI
Resources.You understand and agree that you remain responsible for
using your independent analysis, evaluation and judgment in
designing yourapplications and that you have full and exclusive
responsibility to assure the safety of your applications and
compliance of your applications(and of all TI products used in or
for your applications) with all applicable regulations, laws and
other applicable requirements. Yourepresent that, with respect to
your applications, you have all the necessary expertise to create
and implement safeguards that (1)anticipate dangerous consequences
of failures, (2) monitor failures and their consequences, and (3)
lessen the likelihood of failures thatmight cause harm and take
appropriate actions. You agree that prior to using or distributing
any applications that include TI products, youwill thoroughly test
such applications and the functionality of such TI products as used
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that specifically described in the published documentation for a
particular TI Resource.You are authorized to use, copy and modify
any individual TI Resource only in connection with the development
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patent right, copyright, mask work right, orother intellectual
property right relating to any combination, machine, or process in
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orendorsement thereof. Use of TI Resources may require a license
from a third party under the patents or other intellectual property
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intellectual property of TI.TI RESOURCES ARE PROVIDED “AS IS” AND
WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES
ORREPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR
USE THEREOF, INCLUDING BUT NOT LIMITED TOACCURACY OR COMPLETENESS,
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Incorporated
MSP430FR2433 LaunchPad™ Development Kit
(MSP‑EXP430FR2433)1 Getting Started1.1 Introduction1.2 Key
Features1.3 What's Included1.3.1 Kit Contents1.3.2 Software
Examples
1.4 First Steps: Out-of-Box Experience1.4.1 Connecting to the
Computer1.4.2 Running the Out-of-Box Demo
1.5 Next Steps: Looking Into the Provided Code
2 Hardware2.1 Block Diagram2.2 Hardware
Features2.2.1 MSP430FR2433 MCU2.2.2 eZ-FET Onboard Debug Probe With
EnergyTrace Technology2.2.3 Debug Probe Connection: Isolation
Jumper Block2.2.4 Application (or Backchannel) UART2.2.5 Optional
Features2.2.5.1 Supercapacitor
2.3 Power2.3.1 eZ-FET USB Power2.3.2 BoosterPack and External
Power Supply2.3.3 Supercap (C6)2.3.3.1 Charging the
Supercap2.3.3.2 Using the Supercap2.3.3.3 Disabling the
Supercap
2.4 Measure Current Draw of the MSP430 MCU2.5 Clocking2.6 Using
the eZ-FET Debug Probe With a Different Target2.7 BoosterPack
Pinout2.8 Design Files2.8.1 Hardware2.8.2 Software
2.9 Hardware Change log
3 Software Examples3.1 Out-of-Box Software Example3.1.1 Source
File Structure3.1.2 Overview3.1.3 FRAM Data Logging Mode3.1.4 Live
Temperature Mode
3.2 Blink LED Example3.2.1 Source File Structure
4 Resources4.1 Integrated Development Environments4.1.1 TI Cloud
Development Tools4.1.1.1 TI Resource Explorer Cloud4.1.1.2 Code
Composer Studio Cloud
4.1.2 Code Composer Studio IDE4.1.3 IAR Embedded Workbench for
Texas Instruments 430
4.2 LaunchPad Websites4.3 MSPWare and TI Resource
Explorer4.4 FRAM Utilities4.4.1 Compute Through Power Loss
(CTPL)4.4.2 Nonvolatile Storage (NVS)
4.5 MSP430FR2433 MCU4.5.1 Device Documentation4.5.2 MSP430FR2433
Code Examples4.5.3 MSP430 Application Notes and TI Designs
4.6 Community Resources4.6.1 TI E2E Community4.6.2 Community at
Large
5 FAQ6 Schematics
Important Notice