MSP430 Hardware Tools User's Guide Literature Number: SLAU278W May 2009 – Revised October 2015
MSP430 Hardware Tools
User's Guide
Literature Number: SLAU278WMay 2009–Revised October 2015
Contents
Preface ........................................................................................................................................ 91 Get Started Now! ................................................................................................................ 12
1.1 Kit Contents, MSP-TS430xx .............................................................................................. 131.2 Kit Contents, MSP-FET430xx ............................................................................................ 151.3 Kit Contents, MSP-FET.................................................................................................... 151.4 Kit Contents, MSP-FET430UIF........................................................................................... 151.5 Kit Contents, MSP-FET430PIF ........................................................................................... 151.6 Kit Contents, eZ430-F2013 ............................................................................................... 151.7 Kit Contents, eZ430-T2012 ............................................................................................... 151.8 Kit Contents, eZ430-RF2500 ............................................................................................. 161.9 Kit Contents, eZ430-RF2500T............................................................................................ 161.10 Kit Contents, eZ430-RF2500-SEH ....................................................................................... 161.11 Kit Contents, eZ430-Chronos-xxx........................................................................................ 161.12 Kit Contents, FET430F6137RF900 ...................................................................................... 171.13 Kit Contents, EM430Fx1x7RF900 ....................................................................................... 171.14 Hardware Installation, MSP-FET ......................................................................................... 181.15 Hardware Installation, MSP-FET430UIF ................................................................................ 181.16 Hardware Installation, MSP-FET430PIF ................................................................................ 191.17 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900 ....... 191.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529........... 191.19 Important MSP430 Documents on the Web ............................................................................ 19
2 Design Considerations for In-Circuit Programming ................................................................ 202.1 Signal Connections for In-System Programming and Debugging ................................................... 212.2 External Power ............................................................................................................. 252.3 Bootloader (BSL) ........................................................................................................... 25
A Frequently Asked Questions and Known Issues .................................................................... 26A.1 Hardware FAQs ............................................................................................................ 27A.2 Known Issues ............................................................................................................... 29
B Hardware........................................................................................................................... 30B.1 MSP-TS430D8.............................................................................................................. 32B.2 MSP-TS430PW14.......................................................................................................... 35B.3 MSP-TS430L092 ........................................................................................................... 38B.4 MSP-TS430L092 Active Cable ........................................................................................... 41B.5 MSP-TS430PW20.......................................................................................................... 44B.6 MSP-TS430PW24.......................................................................................................... 47B.7 MSP-TS430RGE24A ...................................................................................................... 50B.8 MSP-TS430DW28.......................................................................................................... 53B.9 MSP-TS430PW28.......................................................................................................... 56B.10 MSP-TS430PW28A ........................................................................................................ 59B.11 MSP-TS430RHB32A....................................................................................................... 62B.12 MSP-TS430DA38 .......................................................................................................... 65B.13 MSP-TS430QFN23x0...................................................................................................... 68B.14 MSP-TS430RSB40......................................................................................................... 71B.15 MSP-TS430RHA40A....................................................................................................... 74
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B.16 MSP-TS430DL48........................................................................................................... 77B.17 MSP-TS430RGZ48B....................................................................................................... 80B.18 MSP-TS430RGZ48C ...................................................................................................... 83B.19 MSP-TS430PM64 .......................................................................................................... 86B.20 MSP-TS430PM64A ........................................................................................................ 89B.21 MSP-TS430PM64D ........................................................................................................ 92B.22 MSP-TS430PM64F ........................................................................................................ 95B.23 MSP-TS430RGC64B ...................................................................................................... 98B.24 MSP-TS430RGC64C..................................................................................................... 101B.25 MSP-TS430RGC64USB ................................................................................................. 105B.26 MSP-TS430PN80 ......................................................................................................... 109B.27 MSP-TS430PN80A ....................................................................................................... 112B.28 MSP-TS430PN80USB ................................................................................................... 115B.29 MSP-TS430PZ100........................................................................................................ 119B.30 MSP-TS430PZ100A ...................................................................................................... 122B.31 MSP-TS430PZ100B ...................................................................................................... 125B.32 MSP-TS430PZ100C...................................................................................................... 128B.33 MSP-TS430PZ100D...................................................................................................... 131B.34 MSP-TS430PZ5x100..................................................................................................... 134B.35 MSP-TS430PZ100USB .................................................................................................. 137B.36 MSP-TS430PZ100AUSB ................................................................................................ 141B.37 MSP-TS430PEU128...................................................................................................... 145B.38 EM430F5137RF900 ...................................................................................................... 148B.39 EM430F6137RF900 ...................................................................................................... 152B.40 EM430F6147RF900 ...................................................................................................... 156B.41 MSP-FET .................................................................................................................. 160
B.41.1 Features ......................................................................................................... 160B.41.2 Release Notes .................................................................................................. 160B.41.3 Schematics ...................................................................................................... 163B.41.4 Layout............................................................................................................ 168B.41.5 LED Signals ..................................................................................................... 168B.41.6 JTAG Target Connector ....................................................................................... 169B.41.7 Specifications ................................................................................................... 171B.41.8 MSP-FET Revision History.................................................................................... 171
B.42 MSP-FET430UIF.......................................................................................................... 172B.42.1 MSP-FET430UIF Revision History ........................................................................... 177
B.43 MSP-FET430PIF.......................................................................................................... 178
C Hardware Installation Guide ............................................................................................... 180C.1 Hardware Installation ..................................................................................................... 181
Revision History ........................................................................................................................ 186
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List of Figures2-1. Signal Connections for 4-Wire JTAG Communication................................................................. 222-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,
MSP430G2xx, and MSP430F4xx Devices.............................................................................. 232-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-Capable
Devices That are Not Part of F2xx, G2xx, F4xx Families............................................................. 24B-1. MSP-TS430D8 Target Socket Module, Schematic .................................................................... 32B-2. MSP-TS430D8 Target Socket Module, PCB ........................................................................... 33B-3. MSP-TS430PW14 Target Socket Module, Schematic ................................................................ 35B-4. MSP-TS430PW14 Target Socket Module, PCB ....................................................................... 36B-5. MSP-TS430L092 Target Socket Module, Schematic.................................................................. 38B-6. MSP-TS430L092 Target Socket Module, PCB......................................................................... 39B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic.................................................. 41B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB......................................................... 42B-9. MSP-TS430PW20 Target Socket Module, Schematic ................................................................ 44B-10. MSP-TS430PW20 Target Socket Module, PCB ....................................................................... 45B-11. MSP-TS430PW24 Target Socket Module, Schematic ................................................................ 47B-12. MSP-TS430PW24 Target Socket Module, PCB ....................................................................... 48B-13. MSP-TS430RGE24A Target Socket Module, Schematic ............................................................. 50B-14. MSP-TS430RGE24A Target Socket Module, PCB .................................................................... 51B-15. MSP-TS430DW28 Target Socket Module, Schematic ................................................................ 53B-16. MSP-TS430DW28 Target Socket Module, PCB ....................................................................... 54B-17. MSP-TS430PW28 Target Socket Module, Schematic ................................................................ 56B-18. MSP-TS430PW28 Target Socket Module, PCB ....................................................................... 57B-19. MSP-TS430PW28A Target Socket Module, Schematic .............................................................. 59B-20. MSP-TS430PW28A Target Socket Module, PCB (Red) .............................................................. 60B-21. MSP-TS430RHB32A Target Socket Module, Schematic ............................................................. 62B-22. MSP-TS430RHB32A Target Socket Module, PCB .................................................................... 63B-23. MSP-TS430DA38 Target Socket Module, Schematic ................................................................. 65B-24. MSP-TS430DA38 Target Socket Module, PCB ........................................................................ 66B-25. MSP-TS430QFN23x0 Target Socket Module, Schematic ............................................................ 68B-26. MSP-TS430QFN23x0 Target Socket Module, PCB ................................................................... 69B-27. MSP-TS430RSB40 Target Socket Module, Schematic ............................................................... 71B-28. MSP-TS430RSB40 Target Socket Module, PCB ...................................................................... 72B-29. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................. 74B-30. MSP-TS430RHA40A Target Socket Module, PCB .................................................................... 75B-31. MSP-TS430DL48 Target Socket Module, Schematic ................................................................. 77B-32. MSP-TS430DL48 Target Socket Module, PCB ........................................................................ 78B-33. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................. 80B-34. MSP-TS430RGZ48B Target Socket Module, PCB .................................................................... 81B-35. MSP-TS430RGZ48C Target Socket Module, Schematic ............................................................. 83B-36. MSP-TS430RGZ48C Target Socket Module, PCB .................................................................... 84B-37. MSP-TS430PM64 Target Socket Module, Schematic................................................................. 86B-38. MSP-TS430PM64 Target Socket Module, PCB........................................................................ 87B-39. MSP-TS430PM64A Target Socket Module, Schematic............................................................... 89B-40. MSP-TS430PM64A Target Socket Module, PCB ...................................................................... 90B-41. MSP-TS430PM64D Target Socket Module, Schematic............................................................... 92B-42. MSP-TS430PM64D Target Socket Module, PCB...................................................................... 93B-43. MSP-TS430PM64F Target Socket Module, Schematic ............................................................... 95
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B-44. MSP-TS430PM64F Target Socket Module, PCB ...................................................................... 96B-45. MSP-TS430RGC64B Target Socket Module, Schematic............................................................. 98B-46. MSP-TS430RGC64B Target Socket Module, PCB .................................................................... 99B-47. MSP-TS430RGC64C Target Socket Module, Schematic ........................................................... 102B-48. MSP-TS430RGC64C Target Socket Module, PCB .................................................................. 103B-49. MSP-TS430RGC64USB Target Socket Module, Schematic........................................................ 105B-50. MSP-TS430RGC64USB Target Socket Module, PCB............................................................... 106B-51. MSP-TS430PN80 Target Socket Module, Schematic ............................................................... 109B-52. MSP-TS430PN80 Target Socket Module, PCB ...................................................................... 110B-53. MSP-TS430PN80A Target Socket Module, Schematic.............................................................. 112B-54. MSP-TS430PN80A Target Socket Module, PCB..................................................................... 113B-55. MSP-TS430PN80USB Target Socket Module, Schematic.......................................................... 115B-56. MSP-TS430PN80USB Target Socket Module, PCB ................................................................. 116B-57. MSP-TS430PZ100 Target Socket Module, Schematic .............................................................. 119B-58. MSP-TS430PZ100 Target Socket Module, PCB ..................................................................... 120B-59. MSP-TS430PZ100A Target Socket Module, Schematic ............................................................ 122B-60. MSP-TS430PZ100A Target Socket Module, PCB ................................................................... 123B-61. MSP-TS430PZ100B Target Socket Module, Schematic ............................................................ 125B-62. MSP-TS430PZ100B Target Socket Module, PCB ................................................................... 126B-63. MSP-TS430PZ100C Target Socket Module, Schematic ............................................................ 128B-64. MSP-TS430PZ100C Target Socket Module, PCB ................................................................... 129B-65. MSP-TS430PZ100D Target Socket Module, Schematic ............................................................ 131B-66. MSP-TS430PZ100D Target Socket Module, PCB ................................................................... 132B-67. MSP-TS430PZ5x100 Target Socket Module, Schematic ........................................................... 134B-68. MSP-TS430PZ5x100 Target Socket Module, PCB .................................................................. 135B-69. MSP-TS430PZ100USB Target Socket Module, Schematic......................................................... 137B-70. MSP-TS430PZ100USB Target Socket Module, PCB................................................................ 138B-71. MSP-TS430PZ100AUSB Target Socket Module, Schematic....................................................... 141B-72. MSP-TS430PZ100AUSB Target Socket Module, PCB .............................................................. 142B-73. MSP-TS430PEU128 Target Socket Module, Schematic ............................................................ 145B-74. MSP-TS430PEU128 Target Socket Module, PCB ................................................................... 146B-75. EM430F5137RF900 Target Board, Schematic ....................................................................... 148B-76. EM430F5137RF900 Target board, PCB............................................................................... 149B-77. EM430F6137RF900 Target Board, Schematic ....................................................................... 152B-78. EM430F6137RF900 Target Board, PCB .............................................................................. 153B-79. EM430F6147RF900 Target Board, Schematic ....................................................................... 156B-80. EM430F6147RF900 Target Board, PCB .............................................................................. 157B-81. MSP-FET Top View ...................................................................................................... 161B-82. MSP-FET Bottom View .................................................................................................. 161B-83. MSP-FET USB Debugger, Schematic (1 of 5)........................................................................ 163B-84. MSP-FET USB Debugger, Schematic (2 of 5)........................................................................ 164B-85. MSP-FET USB Debugger, Schematic (3 of 5)........................................................................ 165B-86. MSP-FET USB Debugger, Schematic (4 of 5)........................................................................ 166B-87. MSP-FET USB Debugger, Schematic (5 of 5)........................................................................ 167B-88. MSP-FET USB Debugger, PCB (Top) ................................................................................. 168B-89. MSP-FET USB Debugger, PCB (Bottom) ............................................................................. 168B-90. JTAG Connector Pinout.................................................................................................. 169B-91. Pin States After Power-Up............................................................................................... 170B-92. MSP-FET430UIF USB Interface, Schematic (1 of 4) ................................................................ 172
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B-93. MSP-FET430UIF USB Interface, Schematic (2 of 4) ................................................................ 173B-94. MSP-FET430UIF USB Interface, Schematic (3 of 4) ................................................................ 174B-95. MSP-FET430UIF USB Interface, Schematic (4 of 4) ................................................................ 175B-96. MSP-FET430UIF USB Interface, PCB ................................................................................. 176B-97. MSP-FET430PIF FET Interface Module, Schematic................................................................. 178B-98. MSP-FET430PIF FET Interface Module, PCB........................................................................ 179C-1. Windows XP Hardware Wizard ......................................................................................... 181C-2. Windows XP Driver Location Selection Folder........................................................................ 182C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010 ................................... 183C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 ..................................... 184C-5. Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432 .................................... 185
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List of Tables1-1. Individual Kit Contents, MSP-TS430xx .................................................................................. 13B-1. MSP-TS430D8 Bill of Materials .......................................................................................... 34B-2. MSP-TS430PW14 Bill of Materials....................................................................................... 37B-3. MSP-TS430L092 Bill of Materials ........................................................................................ 40B-4. MSP-TS430L092 JP1 Settings ........................................................................................... 42B-5. MSP-TS430L092 Active Cable Bill of Materials ........................................................................ 43B-6. MSP-TS430PW20 Bill of Materials....................................................................................... 46B-7. MSP-TS430PW24 Bill of Materials....................................................................................... 49B-8. MSP-TS430RGE24A Bill of Materials (BOM) .......................................................................... 52B-9. MSP-TS430DW28 Bill of Materials ...................................................................................... 55B-10. MSP-TS430PW28 Bill of Materials ...................................................................................... 58B-11. MSP-TS430PW28A Bill of Materials..................................................................................... 61B-12. MSP-TS430RHB32A Bill of Materials ................................................................................... 64B-13. MSP-TS430DA38 Bill of Materials ....................................................................................... 67B-14. MSP-TS430QFN23x0 Bill of Materials .................................................................................. 70B-15. MSP-TS430RSB40 Bill of Materials ..................................................................................... 73B-16. MSP-TS430RHA40A Bill of Materials ................................................................................... 76B-17. MSP-TS430DL48 Bill of Materials ....................................................................................... 79B-18. MSP-TS430RGZ48B Bill of Materials ................................................................................... 82B-19. MSP-TS430RGZ48C Bill of Materials ................................................................................... 85B-20. MSP-TS430PM64 Bill of Materials....................................................................................... 88B-21. MSP-TS430PM64A Bill of Materials ..................................................................................... 91B-22. MSP-TS430PM64D Bill of Materials ..................................................................................... 94B-23. MSP-TS430PM64F Bill of Materials (BOM) ............................................................................ 97B-24. MSP-TS430RGC64B Bill of Materials.................................................................................. 100B-25. MSP-TS430RGC64C Bill of Materials ................................................................................. 104B-26. MSP-TS430RGC64USB Bill of Materials .............................................................................. 107B-27. MSP-TS430PN80 Bill of Materials...................................................................................... 111B-28. MSP-TS430PN80A Bill of Materials.................................................................................... 114B-29. MSP-TS430PN80USB Bill of Materials ................................................................................ 117B-30. MSP-TS430PZ100 Bill of Materials .................................................................................... 121B-31. MSP-TS430PZ100A Bill of Materials................................................................................... 124B-32. MSP-TS430PZ100B Bill of Materials................................................................................... 127B-33. MSP-TS430PZ100C Bill of Materials .................................................................................. 130B-34. MSP-TS430PZ100D Bill of Materials .................................................................................. 133B-35. MSP-TS430PZ5x100 Bill of Materials.................................................................................. 136B-36. MSP-TS430PZ100USB Bill of Materials ............................................................................... 139B-37. MSP-TS430PZ100AUSB Bill of Materials ............................................................................. 143B-38. MSP-TS430PEU128 Bill of Materials .................................................................................. 147B-39. EM430F5137RF900 Bill of Materials................................................................................... 150B-40. EM430F6137RF900 Bill of Materials................................................................................... 154B-41. EM430F6147RF900 Bill of Materials................................................................................... 158B-42. UART Backchannel Implementation ................................................................................... 160B-43. UART Backchannel Activation Commands............................................................................ 161B-44. MSP Target BSL Activation Commands............................................................................... 162B-45. MSP-FET LED Signals................................................................................................... 168B-46. JTAG Connector Pin State by Operating Mode ...................................................................... 169
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B-47. Specifications.............................................................................................................. 171B-48. MSP-FET Revision History .............................................................................................. 171C-1. USB VIDs and PIDs Used in MSP430 Tools.......................................................................... 181
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PrefaceSLAU278W–May 2009–Revised October 2015
Read This First
About This ManualThis manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is theprogram development tool for the MSP430™ ultra-low-power microcontroller. Both available interfacetypes, the parallel port interface and the USB interface, are described.
How to Use This ManualRead and follow the instructions in Chapter 1. This section lists the contents of the FET, providesinstructions on installing the hardware and according software drivers. After you see how quick and easy itis to use the development tools, TI recommends that you read all of this manual.
This manual describes the setup and operation of the FET but does not fully describe the MSP430™microcontrollers or the development software systems. For details of these items, see the appropriate TIdocuments listed in Section 1.19.
This manual applies to the following tools (and devices):• MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices)• MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices)• MSP-FET (successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430
devices)• eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all
MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices)• eZ430-T2012 (three MSP430F2012 based target boards)• eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274 and CC2500 target, for
all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21,and MSP430G2x31 devices)
• eZ430-RF2500T (one MSP430F2274 and CC2500 target board including battery pack)• eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274 and CC2500 target
and solar energy harvesting module)• eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system
contained in a watch. Includes <1 GHz RF USB access point)
Stand-alone target-socket modules (without debug interface) named as MSP-TS430TSxx.
Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respectivetarget socket module MSP-TS430TSxx, where 'xx' is the same for both names. The following tools containalso the USB debug interface (MSP-FET430UIF):
• FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages) (green PCB)• FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages) (green
PCB)
These tools contain the most up-to-date materials available at the time of packaging. For the latestmaterials (data sheets, user's guides, software, application information, and so on), visit the TI MSP430website at www.ti.com/msp430 or contact your local TI sales office.
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Information About Cautions and Warnings www.ti.com
Information About Cautions and WarningsThis document may contain cautions and warnings.
CAUTIONThis is an example of a caution statement.
A caution statement describes a situation that could potentially damage yoursoftware or equipment.
WARNINGThis is an example of a warning statement.A warning statement describes a situation that could potentiallycause harm to you.
The information in a caution or a warning is provided for your protection. Read each caution and warningcarefully.
Related Documentation From Texas InstrumentsMSP430 development tools documentation:MSP Debuggers User's Guide (SLAU647)
Code Composer Studio for MSP430 User's Guide (SLAU157)
Code Composer Studio v5.x Core Edition (CCS Mediawiki)
IAR Embedded Workbench for MSP430(tm) User's Guide (SLAU138)
IAR Embedded Workbench KickStart installer (SLAC050)
eZ430-F2013 Development Tool User's Guide (SLAU176)
eZ430-RF2480 Demonstration Kit User's Guide (SWRU151)
eZ430-RF2500 Development Tool User's Guide (SLAU227)
eZ430-RF2500-SEH Development Tool User's Guide (SLAU273)
eZ430-Chronos Development Tool User's Guide (SLAU292)
Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide (SLAU371)
MSP-EXP430F5529 Experimenter Board User's Guide (SLAU330)
MSP-EXP430F5438 Experimenter Board User's Guide (SLAU263)
MSP-EXP430G2 LaunchPad Experimenter Board User's Guide (SLAU318)
MSP Gang Programmer (MSP-GANG) User's Guide (SLAU358)
MSP430 Gang Programmer (MSP-GANG430) User's Guide (SLAU101)
MSP430 device user's guides:MSP430x1xx Family User's Guide (SLAU049)
MSP430x2xx Family User's Guide (SLAU144)
MSP430x3xx Family User's Guide (SLAU012)
MSP430x4xx Family User's Guide (SLAU056)
MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208)
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CC430 Family User's Guide (SLAU259)
MSP430FR57xx Family User's Guide (SLAU272)
MSP430FR58xx and MSP430FR59xx Family User's Guide (SLAU367)
If You Need AssistanceSupport for the MSP430 devices and the FET development tools is provided by the Texas InstrumentsProduct Information Center (PIC). Contact information for the PIC can be found on the TI website atwww.ti.com/support. The Texas Instruments E2E™ Community support forums for the MSP430 provideopen interaction with peer engineers, TI engineers, and other experts. Additional device-specificinformation can be found on the MSP430 website.
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Chapter 1SLAU278W–May 2009–Revised October 2015
Get Started Now!
This chapter lists the contents of the FET and provides instruction on installing the hardware.
Topic ........................................................................................................................... Page
1.1 Kit Contents, MSP-TS430xx ................................................................................. 131.2 Kit Contents, MSP-FET430xx .............................................................................. 151.3 Kit Contents, MSP-FET ....................................................................................... 151.4 Kit Contents, MSP-FET430UIF.............................................................................. 151.5 Kit Contents, MSP-FET430PIF .............................................................................. 151.6 Kit Contents, eZ430-F2013................................................................................... 151.7 Kit Contents, eZ430-T2012................................................................................... 151.8 Kit Contents, eZ430-RF2500 ................................................................................ 161.9 Kit Contents, eZ430-RF2500T............................................................................... 161.10 Kit Contents, eZ430-RF2500-SEH ......................................................................... 161.11 Kit Contents, eZ430-Chronos-xxx ......................................................................... 161.12 Kit Contents, FET430F6137RF900 ........................................................................ 171.13 Kit Contents, EM430Fx1x7RF900.......................................................................... 171.14 Hardware Installation, MSP-FET ........................................................................... 181.15 Hardware Installation, MSP-FET430UIF ................................................................. 181.16 Hardware Installation, MSP-FET430PIF ................................................................. 191.17 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,
EM430Fx1x7RF900 ............................................................................................. 191.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,
MSPEXP430F5529 .............................................................................................. 191.19 Important MSP430 Documents on the Web............................................................ 19
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www.ti.com Kit Contents, MSP-TS430xx
1.1 Kit Contents, MSP-TS430xx• One READ ME FIRST document• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)• One target socket module• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• MSP430 device samples (see Table 1-1 for sample type)
Table 1-1. Individual Kit Contents, MSP-TS430xxPart Number Socket Type Supported Devices Included Devices Headers and Comment
MSP-TS430D8 8-pin D 1 x MSP430G2210ID and Two PCB 1×4-pin headers (twoMSP430G2210, MSP430G2230(green PCB) (TSSOP ZIF) 1 x MSP430G2230ID male and two female)
MSP430F20xx, MSP430G2x01,MSP-TS430PW14 14-pin PW Four PCB 1×7-pin headers (twoMSP430G2x11, MSP430G2x21, 2 x MSP430F2013IPW(green PCB) (TSSOP ZIF) male and two female)MSP430G2x31
Four PCB 1×7-pin headers (twomale and two female). A "Micro-MaTch" 10-pin female connector is
MSP-TS430L092 14-pin PW also present on the PCB whichMSP-TS430L092 2 x MSP430L092IPW(green PCB) (TSSOP ZIF) connects the kit with an 'ActiveCable' PCB; this 'Active Cable'PCB is connected by 14-pin JTAGcable with the FET430UIF
MSP-TS430PW20 20-pin PW MSP430FR2311IPW20, None. Free samples can Four PCB 1×12-pin headers (two(green PCB) (TSSOP ZIF) MSP430FR2311IPW16 be ordered in the TI Store. male and two female)
MSP-TS430PW24 24-pin PW Four PCB 1×12-pin headers (twoMSP430AFE2xx 2 x MSP430AFE253IPW(green PCB) (TSSOP ZIF) male and two female)
MSP-TS430RGE24A 24-pin RGE None. Free samples can Four PCB 1×6-pin headers (twoMSP430FR2433IRGE(red PCB) (QFN ZIF) be ordered in the TI Store. male and two female)
MSP430F11x1, MSP430F11x2,MSP430F12x, MSP430F12x2,MSP-TS430DW28 28-pin DW Four PCB 1×12-pin headers (twoMSP430F21xx 2 x MSP430F123IDW(green PCB) (SSOP ZIF) male and two female)Supports devices in 20- and 28-pin
DA packages
MSP430F11x1, MSP430F11x2,MSP-TS430PW28 28-pin PW Four PCB 1×12-pin headers (twoMSP430F12x, MSP430F12x2, 2 x MSP430F2132IPW(green PCB) (TSSOP ZIF) male and two female)MSP430F21xx
MSP430F20xx, MSP430G2xxx inMSP-TS430PW28A 28-pin PW Four PCB 1×12-pin headers (two14-, 20-, and 28-pin PW packages, 2 x MSP430G2452IPW20(red PCB) (TSSOP ZIF) male and two female)MSP430TCH5E in PW package
MSP-TS430RHB32A 32-pin RHB Eight PCB 1×8-pin headers (fourMSP430i204x 2 x MSP430i2041TRHB(red PCB) (QFN ZIF) male and four female)
2 x MSP430F2274IDAMSP-TS430DA38 38-pin DA MSP430F22xx, MSP430G2x44, Four PCB 1×19-pin headers (two2 x MSP430G2744IDA(green PCB) (TSSOP ZIF) MSP430G2x55 male and two female)2 x MSP430G2955IDA
MSP-TS430QFN23x0 40-pin RHA Eight PCB 1×10-pin headers (fourMSP430F23x0 2 x MSP430F2370IRHA(green PCB) (QFN ZIF) male and four female)
MSP-TS430RSB40 40-pin RSB Eight PCB 1×10-pin headers (fourMSP430F51x1, MSP430F51x2 2 x MSP430F5172IRSB(green PCB) (QFN ZIF) male and four female)
MSP-TS430RHA40A 40-pin RHA Eight PCB 1×10-pin headers (fourMSP430FR572x, MSP430FR573x 2 x MSP430FR5739IRHA(red PCB) (QFN ZIF) male and four female)
MSP-TS430DL48 48-pin DL Four PCB 2×12-pin headers (twoMSP430F42x0 2 x MSP430F4270IDL(green PCB) (TSSOP ZIF) male and two female)
MSP-TS430RGZ48B 48-pin RGZ Eight PCB 1×12-pin headers (fourMSP430F534x 2 x MSP430F5342IRGZ(blue PCB) (QFN ZIF) male and four female)
MSP-TS430RGZ48C 48-pin RGZ MSP430FR58xx and Eight PCB 1×12-pin headers (four2 x MSP430FR5969IRGZ(black PCB) (QFN ZIF) MSP430FR59xx male and four female)
MSP430F13x, MSP430F14x,MSP430F14x1, MSP430F15x,MSP430F16x, MSP430F16x1, TS Kit:MSP430F23x, MSP430F24x, 2 x MSP430F2618IPM;MSP-TS430PM64 64-pin PM Eight PCB 1×16-pin headers (fourMSP430F24xx, MSP430F261x, FET Kit:(green PCB) (QFP ZIF) male and four female)MSP430F41x, MSP430F42x, 2 x MSP430F417IPM and
MSP430F42xA, MSP430FE42x, 2 x MSP430F169IPMMSP430FE42xA, MSP430FE42x2,
MSP430FW42x
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Kit Contents, MSP-TS430xx www.ti.com
Table 1-1. Individual Kit Contents, MSP-TS430xx (continued)Part Number Socket Type Supported Devices Included Devices Headers and Comment
MSP-TS430PM64A 64-pin PM Eight PCB 1×16-pin headers (fourMSP430F41x2 2 x MSP430F4152IPM(red PCB) (QFP ZIF) male and four female)
MSP-TS430PM64D 64-pin PM Eight PCB 1×16-pin headers (fourMSP430FR413x, MSP430FR203x 2 x MSP430FR4133IPM(white PCB) (QFP ZIF) male and four female)
MSP-TS430PM64F 64-pin PM None. Free samples can Eight PCB 1×16-pin headers (fourMSP430FR6972(purple PCB) (QFP ZIF) be ordered in the TI Store. male and four female)
MSP-TS430RGC64B 64-pin RGC Eight PCB 1×16-pin headers (fourMSP430F530x 2 x MSP430F5310IRGC(blue PCB) (QFN ZIF) male and four female)
MSP430F522x, MSP430F521x,MSP-TS430RGC64C 64-pin RGC Eight PCB 1×16-pin headers (fourMSP430F523x, MSP430F524x, 2 x MSP430F5229IRGC(black PCB) (QFN ZIF) male and four female)MSP430F525x
2 x MSP430F5510IRGCMSP-TS430RGC64USB 64-pin RGC MSP430F550x, MSP430F551x, Eight PCB 1×16-pin headers (fouror(green PCB) (QFN ZIF) MSP430F552x male and four female)2 x MSP430F5528IRGC
MSP430F241x, MSP430F261x,MSP-TS430PN80 80-pin PN MSP430F43x, MSP430F43x1, Eight PCB 1×20-pin headers (four2 x MSP430FG439IPN(green PCB) (QFP ZIF) MSP430FG43x, MSP430F47x, male and four female)
MSP430FG47x
MSP-TS430PN80A 80-pin PN Eight PCB 1×20-pin headers (fourMSP430F532x 2 x MSP430F5329IPN(red PCB) (QFP ZIF) male and four female)
MSP-TS430PN80USB 80-pin PN Eight PCB 1×20-pin headers (fourMSP430F552x, MSP430F551x 2 x MSP430F5529IPN(green PCB) (QFP ZIF) male and four female)
MSP430F43x, MSP430F43x1,MSP-TS430PZ100 100-pin PZ Eight PCB 1×25-pin headers (fourMSP430F44x, MSP430FG461x, 2 x MSP430FG4619IPZ(green PCB) (QFP ZIF) male and four female)MSP430F47xx
MSP-TS430PZ100A 100-pin PZ Eight PCB 1×25-pin headers (fourMSP430F471xx 2 x MSP430F47197IPZ(red PCB) (QFP ZIF) male and four female)
MSP-TS430PZ100B 100-pin PZ Eight PCB 1×25-pin headers (fourMSP430F67xx 2 x MSP430F6733IPZ(blue PCB) (QFP ZIF) male and four female)
MSP-TS430PZ100C 100-pin PZ MSP430F645x, MSP430F643x, Eight PCB 1×25-pin headers (four2 x MSP430F6438IPZ(black PCB) (QFP ZIF) MSP430F535x, MSP430F533x male and four female)
MSP-TS430PZ100D 100-pin PZ MSP430FR698x(1), Eight PCB 1×25-pin headers (four2 x MSP430FR6989IPZ(white PCB) (QFP ZIF) MSP430FR688x(1) male and four female)
MSP-TS430PZ5x100 100-pin PZ MSP430F543x, MSP430BT5190, Eight PCB 1×25-pin headers (four2 x MSP430F5438IPZ(green PCB) (QFP ZIF) MSP430SL5438A male and four female)
MSP-TS430PZ100USB 100-pin PZ MSP430F665x, MSP430F663x, Eight PCB 1×25-pin headers (four2 x MSP430F6638IPZ(green PCB) (QFP ZIF) MSP430F563x male and four female)
MSP-TS430PZ100AUSB 100-pin PZ None. Free samples can Eight PCB 1×25-pin headers (fourMSP430FG662x, MSP430FG642x(blue PCB) (QFP ZIF) be ordered in the TI Store. male and four female)
Four PCB 1x26-pin headers (twoMSP430F677x, MSP430F676x,MSP-TS430PEU128 128-pin PEU male and two female) and fourMSP430F674x, MSP430F677x1, 2 x MSP430F67791IPEU(green PCB) (QFP ZIF) PCB 1x38-pin headers (two maleMSP430F676x1, MSP430F674x1 and two female)
See the device data sheets for device specifications. Device errata can be found in the respective deviceproduct folder on the web provided as a PDF document. Depending on the device, errata may also befound in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
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www.ti.com Kit Contents, MSP-FET430xx
1.2 Kit Contents, MSP-FET430xx• One READ ME FIRST document• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end
of the case, and a 2×7-pin male connector on the other end of the case.• One USB cable• One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz.• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• One 14-Pin JTAG conductor cable• One small box containing two MSP430 device samples (See table for Sample Type)• One target socket module. To determine the devices used for each board and a summary of the board,
see Table 1-1. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xxkit; for example, the MSP-FET430U28A kit contains the MSP-TS430PW28A board.
Refer to the device data sheets for device specifications. Device errata can be found in the respectivedevice product folder on the web provided as a PDF document. Depending on the device, errata may alsobe found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
1.3 Kit Contents, MSP-FET• One READ ME FIRST document• One MSP-FET interface module• One USB cable• One 14-conductor cable
1.4 Kit Contents, MSP-FET430UIF• One READ ME FIRST document• One MSP-FET430UIF interface module• One USB cable• One 14-conductor cable
1.5 Kit Contents, MSP-FET430PIF• One READ ME FIRST document• One MSP-FET430PIF interface module• One 25-conductor cable• One 14-conductor cable
NOTE: This part is obsolete and is not recommended to use in new design.
1.6 Kit Contents, eZ430-F2013• One QUICK START GUIDE document• One eZ430-F2013 development tool including one MSP430F2013 target board
1.7 Kit Contents, eZ430-T2012• Three MSP430F2012-based target boards
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Kit Contents, eZ430-RF2500 www.ti.com
1.8 Kit Contents, eZ430-RF2500• One QUICK START GUIDE document• One eZ430-RF2500 CD-ROM• One eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)
1.9 Kit Contents, eZ430-RF2500T• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)
1.10 Kit Contents, eZ430-RF2500-SEH• One MSP430 development tool CD containing documentation and development software• One eZ430-RF USB debugging interface• Two eZ430-RF2500T wireless target boards• One SEH-01 solar energy harvester board• One AAA battery pack with expansion board (batteries included)
1.11 Kit Contents, eZ430-Chronos-xxx'433, '868, '915• One QUICK START GUIDE document• One ez430-Chronos emulator• One screwdriver• Two spare screws
eZ430-Chronos-433:– One 433-MHz eZ430-Chronos watch (battery included)– One 433-MHz eZ430-Chronos access pointeZ430-Chronos-868:– One 868-MHz eZ430-Chronos watch (battery included)– One 868-MHz eZ430-Chronos access pointeZ430-Chronos-915:– One 915-MHz eZ430-Chronos watch (battery included)– One 915-MHz eZ430-Chronos access point
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www.ti.com Kit Contents, FET430F6137RF900
1.12 Kit Contents, FET430F6137RF900• One READ ME FIRST document• One legal notice• One MSP-FET430UIF interface module• Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137
device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB.• Two CC430EM battery packs• Four AAA batteries• Two 868-MHz or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2x4-pin headers• One USB cable• One 14-pin JTAG conductor cable
1.13 Kit Contents, EM430Fx1x7RF900• One READ ME FIRST document• One legal notice• Two target socket module
MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on whichis soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also presenton the PCBMSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on whichis soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also presenton the PCBMSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on whichis soldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also presenton the PCB
• Two CC430EM battery packs• Four AAA batteries• Two 868- or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2×4-pin headers
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Hardware Installation, MSP-FET www.ti.com
1.14 Hardware Installation, MSP-FETFollow these steps to install the hardware for the MSP-FET tool:1. Install the IDE (CCS or IAR) that you plan to use before connecting MSP-FET to PC. During IDE
installation, USB drivers are installed automatically. Make sure to use the latest IDE version, otherwisethe USB drivers might not be able to recognize the MSP-FET.
2. Connect the MSP-FET to a USB port on the PC with the provided USB cable.3. The following procedure applies to operation under Windows:
(a) After connecting to the PC, the MSP-FET should be recognized automatically, as the USB devicedriver has been already installed together with the IDE.
(b) If the driver has not been installed yet, the Found New Hardware wizard starts. Follow theinstructions and point the wizard to the driver files.
(c) The default location for CCS is c:\ti\ccsv6\ccs_base\emulation\drivers\msp430\USB_CDC.(d) The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench
x.x\430\drivers\<Win_OS>.4. After connecting to a PC, the MSP-FET performs a self-test. If the self-test passes successfully, the
green LED stays on. For a complete list of LED signals, please refer to the MSP-FET chapter in thisdocument.
5. Connect the MSP-FET to a target board, such as an MSP-TS430xxx target socket module, with the14-conductor cable.
6. Make sure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with acircular indentation on the top surface) aligns with the "1" mark on the PCB.
1.15 Hardware Installation, MSP-FET430UIFFollow these steps to install the hardware for the MSP-FET430UIF tool:1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE
installation installs drivers automatically.2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET
should be recognized, as the USB device driver is installed automatically. If the driver has not beeninstalled yet, the install wizard starts. Follow the prompts and point the wizard to the driver files.The default location for CCS is c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, depending of firmware version ofthe tool.The default location for IAR Embedded Workbench is <InstallationRoot>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART or <InstallationRoot>\Embedded Workbench x.x\430\drivers\<Win_OS>, depending of firmware version of the tool.The USB driver is installed automatically. Detailed driver installation instructions can be found inAppendix C.
3. After connecting to a PC, the USB FET performs a self-test during which the red LED may flash forapproximately two seconds. If the self-test passes successfully, the green LED stays on.
4. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as anMSP-TS430xxx target socket module.
5. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with acircular indentation on the top surface) aligns with the "1" mark on the PCB.
6. Compared to the parallel-port debug interface, the USB FET has additional features including JTAGsecurity fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 60 mA.
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www.ti.com Hardware Installation, MSP-FET430PIF
1.16 Hardware Installation, MSP-FET430PIFFollow these steps to install the hardware for the MSP-FET430PIF tools:1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The
necessary driver for accessing the PC parallel port is installed automatically during CCS or IAREmbedded Workbench installation. Note that a restart is required after the CCS or IAR EmbeddedWorkbench installation for the driver to become active.
2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, suchas an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B.
1.17 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,EM430Fx1x7RF900Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:1. Follow steps 1 and 2 of Section 1.152. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC.
Use the 14-conductor cable to connect the FET interface module to the supplied target socket module.3. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.4. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrations
of the target socket modules and their parts are found in Appendix B.
1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,MSPEXP430F5529To install the eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools, followsteps 1 and 2 of Section 1.15
1.19 Important MSP430 Documents on the WebThe primary sources of MSP430 information are the device-specific data sheet and user's guide. TheMSP430 website (www.ti.com/msp430) contains the most recent version of these documents.
PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and thelibrarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) isavailable, and the Texas Instruments E2E Community support forums for the MSP430 and CodeComposer Studio v5 provide additional help besides the product help and Welcome page.
PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker,and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, thelatest information) are available in HTML format in the same directories. A IAR specific Wiki Page is alsoavailable.
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Chapter 2SLAU278W–May 2009–Revised October 2015
Design Considerations for In-Circuit Programming
This chapter presents signal requirements for in-circuit programming of the MSP430.
Topic ........................................................................................................................... Page
2.1 Signal Connections for In-System Programming and Debugging ............................. 212.2 External Power................................................................................................... 252.3 Bootloader (BSL)................................................................................................ 25
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www.ti.com Signal Connections for In-System Programming and Debugging
2.1 Signal Connections for In-System Programming and DebuggingMSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-FET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. Inaddition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers,thus providing an easy way to program prototype boards, if desired.
Figure 2-1 shows the connections between the 14-pin FET interface module connector and the targetdevice required to support in-system programming and debugging for 4-wire JTAG communication.Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode issupported on most MSP430 devices, except devices with low pin counts (for example, MSP430G2230).The 2-wire JTAG mode is available on selected devices only. See the Code Composer Studio for MSP430User's Guide (SLAU157) or IAR Embedded Workbench Version 3+ for MSP430 User's Guide (SLAU138)for information on which interface method can be used on which device.
The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board(through pin 2). In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCC-sense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense featuresenses the local VCC present on the target board (that is, a battery or other local power supply) andadjusts the output signals accordingly. If the target board is to be powered by a local VCC, then theconnection to pin 4 on the JTAG should be made, and not the connection to pin 2. This uses the VCC-sense feature and prevents any contention that might occur if the local on-board VCC were connected tothe VCC supplied from the FET interface module, MSP-GANG or the MSP-GANG430. If the VCC-sensefeature is not necessary (that is, if the target board is to be powered from the FET interface module, MSP-GANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAG header, and no connectionis made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplyingVCC to the target board. If this flexibility is not required, the desired VCC connections may be hard-wired toeliminate the jumper block. Pins 2 and 4 must not be connected at the same time.
The connection to the JTAG connector RST pin of Figure 2-1 is required when programming or debugginga device that supports 2-wire JTAG communication, even when using 4-wire JTAG communication modeon these devices. However, this connection is optional on devices that do not support 2-wire JTAGcommunication. The MSP430 development tools and device programmers perform a target reset byissuing a JTAG command to gain control over the device. However, if this is unsuccessful, the RST signalof the JTAG connector may be used by the development tool or device programmer as an additional wayto assert a device reset.
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TDO/TDI
TDI/VPP
TMS
TCK
GND
TEST/VPP
JTAG
VCC TOOL
VCC TARGET
J1 (see Note A)
J2 (see Note A)
VCC
R1
47 k(see Note B)
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C210 µF
C30.1 µF
V /AV /DVCCCC CC
RST/NMI
TDO/TDI
TDI/VPP
TMS
TCK
TEST/VPP (see Note C)
V /AV /DVSS SS SS
MSP430Fxxx
C110 nF/2.2 nF
(see Notes B and E)
RST (see Note D)
Important to connect
Signal Connections for In-System Programming and Debugging www.ti.com
A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,make connection J2.
B The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 familyuser's guide for the recommended configuration.
C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific datasheet to determine if this pin is available.
D The connection to the JTAG connector RST pin is required when programming or debugging a device that supports2-wire JTAG communication, even when using 4-wire JTAG communication mode on these devices. However, thisconnection is optional on devices that do not support 2-wire JTAG communication.
E When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 shouldnot exceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET).Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
Figure 2-1. Signal Connections for 4-Wire JTAG Communication
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330Ω
R2
J1 (see Note A)
J2 (see Note A)
Important to connect
V /AV /DVCCCC CC
V /AV /DVSS SS SS
R147 kΩ
C12.2 nF
(See Note B)
VCC
C210 µF
C30.1 µF
www.ti.com Signal Connections for In-System Programming and Debugging
A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,make connection J2.
B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device duringJTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection withthe device. The upper limit for C1 is 2.2 nF when using current TI tools.Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by theTEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω)and do not connect TEST/VPP to TEST/SBWTCK.
Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,MSP430G2xx, and MSP430F4xx Devices
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RST/NMI/SBWTDIOTDO/TDI
TCK
GND
JTAG
R147 kΩ
VCC TOOL
VCC TARGET
C12.2 nF
(See Note B)
J1 (see Note A)
J2 (see Note A)
Important to connect
V /AV /DVCCCC CC
V /AV /DVSS SS SS
VCC
C210 µF
C30.1 µF
Signal Connections for In-System Programming and Debugging www.ti.com
A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from thedebug or programming adapter.
B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device duringJTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection withthe device. The upper limit for C1 is 2.2 nF when using current TI tools.Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-Capable Devices That are Not Part of F2xx, G2xx, F4xx Families
NOTE: On some Spy-Bi-Wire capable MSP430 devices, TEST/SBWTCK is very sensitive to risingsignal edges that can cause the test logic to enter a state where an entry sequence (either2‑wire or 4-wire) is not recognized correctly and JTAG access stays disabled. Unintentionaledges on SBWTCK can occur when the JTAG connector is connected to the target device.
24 Design Considerations for In-Circuit Programming SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com External Power
2.2 External PowerThe MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Notethat the target should not consume more than 60 mA, even as a peak current, as it may violate the USBspecification. For example, if the target board has a capacitor on VCC more than 10 µF, it may causeinrush current during capacitor charging that may exceed 60 mA. In this case, the current should belimited by the design of the target board, or an external power supply should be used.
The VCC for the target can be selected between 1.8 V and 3.6 V in steps of 0.1 V. Alternatively, the targetcan be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pinconnector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically.Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected;not both at the same time.
When a target socket module is powered from an external supply, the external supply powers the deviceon the target socket module and any user circuitry connected to the target socket module, and the FETinterface module continues to be powered from the PC through the parallel port. If the externally suppliedvoltage differs from that of the FET interface module, the target socket module must be modified so thatthe externally supplied voltage is routed to the FET interface module (so that it may adjust its outputvoltage levels accordingly). See the target socket module schematics in Appendix B.
The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirementof the MSP430, a stand-alone FET does not exceed the available current. However, if additional circuitryis added to the tool, this current limit could be exceeded. In this case, external power can be supplied tothe tool through connections provided on the target socket modules. See the schematics and pictorials ofthe target socket modules in Appendix B to locate the external power connectors. Note that the MSP-FET430PIF is not recommended for new design.
2.3 Bootloader (BSL)The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices,these pins are shared with the device port pins, and this sharing of pins can complicate a design (orsharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devicescontain a program (a "bootloader", formerly knows as the "bootstrap loader") that permits the flashmemory to be erased and programmed using a reduced set of signals. The MSP430 Programming Withthe Bootloader (BSL) User's Guide (SLAU319) describes this interface. See the MSP430 website for theapplication reports and a list of MSP430 BSL tool developers.
TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggestsproviding access to these signals by, for example, a header).
See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins.
25SLAU278W–May 2009–Revised October 2015 Design Considerations for In-Circuit ProgrammingSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Appendix ASLAU278W–May 2009–Revised October 2015
Frequently Asked Questions and Known Issues
This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.
Topic ........................................................................................................................... Page
A.1 Hardware FAQs.................................................................................................. 27A.2 Known Issues .................................................................................................... 29
26 Frequently Asked Questions and Known Issues SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com Hardware FAQs
A.1 Hardware FAQs1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information
Due to the large capacitive coupling introduced by the device socket between the adjacent signalsXIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb theLFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire(2-wire) JTAG configuration and only to the period while a debug session is active.Workarounds:• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG
configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly.• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down
menu (at top of Debug View). This prevents the debugger from accessing the MSP430 devicewhile the application is running. Note that, in this mode, a manual halt is required to see if abreakpoint was hit. See the IDE documentation for more information on this feature.
• Use an external clock source to drive XIN directly.2. With current interface hardware and software, there is a weakness when adapting target boards
that are powered externally. This leads to an accidental fuse check in the MSP430 device. This isvalid for PIF and UIF but is seen most often on the UIF. A solution is being developed.Workarounds:• Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the
RST line, which also resets the device internal fuse logic.• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down
menu. This prevents the debugger from accessing the MCU while the application is running. Notethat in this mode, a manual halt is required to see if a breakpoint was hit. See the IDEdocumentation for more information on this feature.
• Use an external clock source to drive XIN directly.3. The 14-conductor cable that connects the FET interface module and the target socket module must
not exceed 8 inches (20 centimeters) in length.4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the
USB FET.5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket
module. See the schematic of the target socket module to populate the capacitor according to the datasheet of the device.
6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed onthe target socket module. See the schematic of the target socket module to populate the capacitoraccording to the data sheet of the device.
7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module.For MSP430 devices that contain user-selectable loading capacitors, see the device and crystal datasheets for the value of capacitance.
8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger orC-SPY (as any required clocking and timing is derived from the internal DCO and FLL).
9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.For C-SPY: "Release JTAG On Go" must be selected.
10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider usingan MSP430 device that is a "superset" of the smaller device. A very powerful feature of theMSP430 is that the family members are code and architecturally compatible, so code developed onone device (for example, one without shared JTAG and port pins) ports effortlessly to another(assuming an equivalent set of peripherals).
27SLAU278W–May 2009–Revised October 2015 Frequently Asked Questions and Known IssuesSubmit Documentation Feedback
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Hardware FAQs www.ti.com
11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.Customers should erase the information memory before its first use. Main memory of packageddevices is blank when the device is delivered from TI.
12. The device current is higher then expected. The device current measurement may not be accuratewith the debugger connected to the device. For accurate measurement, disconnect the debugger.Additionally some unused pins of the device should be terminated. See the Connection of Unused Pinstable in the device's family user's guide.
13. The following ZIF sockets are used in the FET tools and target socket modules:• 8-pin device (D package): Yamaichi IC369-0082• 14-pin device (PW package): Enplas OTS-14-065-01• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02• 28-pin device (DW package): Wells-CTI 652 D028• 28-pin device (PW package): Enplas OTS-28-0.65-01• 38-pin device (DA package): Yamaichi IC189-0382-037• 40-pin device (RHA package): Enplas QFN-40B-0.5-01• 40-pin device (RSB package): Enplas QFN-40B-0.4• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001• 48-pin device (DL package): Yamaichi IC51-0482-1163• 64-pin device (PM package): Yamaichi IC51-0644-807• 64-pin device (RGC package): Yamaichi QFN11T064-006• 80-pin device (PN package): Yamaichi IC201-0804-014• 100-pin device (PZ package): Yamaichi IC201-1004-008• 128-pin device (PEU package): Yamaichi IC500-1284-009PEnplas: www.enplas.comWells-CTI: www.wellscti.comYamaichi: www.yamaichi.us
28 Frequently Asked Questions and Known Issues SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com Known Issues
A.2 Known Issues
MSP-FET430UIF Current detection algorithm of the UIF firmware
Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequentlyswitching on and off the target power supply. This power switching puts some MSP430devices such as the MSP430F5438 in a state that requires a power cycle to return thedevice to JTAG control.
A side issue is that if the UIF firmware has entered this switch on and switch off loop, itis not possible to turn off the power supply to the target by calling MSP430_VCC(0). Apower cycle is required to remove the device from this state.
Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version2.04.00.003 and higher do not show this problem. Update the software development toolto this version or higher to update the MSP-FET430UIF firmware.
MSP-FET430PIF Some PCs do not supply 5 V through the parallel port
Problem Description Device identification problems with modern PCs, because the parallel port often does notdeliver 5 V as was common with earlier hardware.1. When connected to a laptop, the test signal is clamped to 2.5 V.2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter
through pin 4 (sense).
Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to theVCC pads of the interface. The jumper on a the target socket must be switched toexternal power.
29SLAU278W–May 2009–Revised October 2015 Frequently Asked Questions and Known IssuesSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Appendix BSLAU278W–May 2009–Revised October 2015
Hardware
This appendix contains information relating to the FET hardware, including schematics, PCB pictorials,and bills of materials (BOMs). All other tools, such as the eZ430 series, are described in separate product-specific user's guides.
30 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
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www.ti.com Appendix B
Topic ........................................................................................................................... Page
B.1 MSP-TS430D8 .................................................................................................... 32B.2 MSP-TS430PW14................................................................................................ 35B.3 MSP-TS430L092 ................................................................................................. 38B.4 MSP-TS430L092 Active Cable .............................................................................. 41B.5 MSP-TS430PW20................................................................................................ 44B.6 MSP-TS430PW24................................................................................................ 47B.7 MSP-TS430RGE24A ............................................................................................ 50B.8 MSP-TS430DW28................................................................................................ 53B.9 MSP-TS430PW28................................................................................................ 56B.10 MSP-TS430PW28A ............................................................................................. 59B.11 MSP-TS430RHB32A ............................................................................................ 62B.12 MSP-TS430DA38 ................................................................................................ 65B.13 MSP-TS430QFN23x0 ........................................................................................... 68B.14 MSP-TS430RSB40 .............................................................................................. 71B.15 MSP-TS430RHA40A ............................................................................................ 74B.16 MSP-TS430DL48 ................................................................................................ 77B.17 MSP-TS430RGZ48B ............................................................................................ 80B.18 MSP-TS430RGZ48C ............................................................................................ 83B.19 MSP-TS430PM64 ................................................................................................ 86B.20 MSP-TS430PM64A .............................................................................................. 89B.21 MSP-TS430PM64D .............................................................................................. 92B.22 MSP-TS430PM64F .............................................................................................. 95B.23 MSP-TS430RGC64B............................................................................................ 98B.24 MSP-TS430RGC64C .......................................................................................... 101B.25 MSP-TS430RGC64USB ...................................................................................... 105B.26 MSP-TS430PN80............................................................................................... 109B.27 MSP-TS430PN80A ............................................................................................ 112B.28 MSP-TS430PN80USB ........................................................................................ 115B.29 MSP-TS430PZ100 ............................................................................................. 119B.30 MSP-TS430PZ100A ........................................................................................... 122B.31 MSP-TS430PZ100B ........................................................................................... 125B.32 MSP-TS430PZ100C ........................................................................................... 128B.33 MSP-TS430PZ100D ........................................................................................... 131B.34 MSP-TS430PZ5x100 .......................................................................................... 134B.35 MSP-TS430PZ100USB ....................................................................................... 137B.36 MSP-TS430PZ100AUSB ..................................................................................... 141B.37 MSP-TS430PEU128 ........................................................................................... 145B.38 EM430F5137RF900 ........................................................................................... 148B.39 EM430F6137RF900 ........................................................................................... 152B.40 EM430F6147RF900 ........................................................................................... 156B.41 MSP-FET ......................................................................................................... 160B.42 MSP-FET430UIF ............................................................................................... 172B.43 MSP-FET430PIF................................................................................................ 178
31SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP-TS430D8 www.ti.com
B.1 MSP-TS430D8
Figure B-1. MSP-TS430D8 Target Socket Module, Schematic
32 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper J4Open to disconnect LED
D1LED connected to P1.2
Orient Pin 1 of MSP430 device
14-pin connector for debuggingin Spy-Bi-Wire mode only
(4-Wire JTAG not available)
Jumper J6Open to measure current
Jumper J51-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Connector J3External power connectorJumper J5 to “ext”
www.ti.com MSP-TS430D8
Figure B-2. MSP-TS430D8 Target Socket Module, PCB
33SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
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MSP-TS430D8 www.ti.com
Table B-1. MSP-TS430D8 Bill of Materials
No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-23 SBW 1 10-pin connector, male, TH HRP10H-ND4 J3 1 3-pin header, male, TH SAM1035-03-ND5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 2926 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND7 R5 1 47K, 0805 541-47000ATR-ND8 C5 1 100nF, CSMD0805 311-1245-2-ND9 R2, R3 2 330R, 0805 541-330ATR-ND
DNP: headers enclosed with kit.10 J1, J2 2 4-pin header, TH SAM1029-04-ND Keep vias free of solder.10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND DNP: receptacles enclosed with kit.11 U1 1 SO8 Socket: Type IC369-0082 Manuf.: Yamaichi12 D1 1 red, LED 0603
DNP: enclosed with kit. Is supplied13 MSP430 2 MSP430G2210, MSP430G2230 by TIMSP-TS430D8 Rev.14 PCB 1 50,0mmx44,5mm 1.0
34 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
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www.ti.com MSP-TS430PW14
B.2 MSP-TS430PW14
Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic
35SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper J4Open to disconnect LED
Orient Pin 1 of MSP430 device Jumper J6Open to measure current
Connector J3External power connectorJumper J5 to "ext"D1
LED connected to P1.0
Jumpers J7 to J12Close 1-2 to debug in Spy-Bi-Wire mode.Close 2-3 to debug in 4-wire JTAG mode.
Jumper J51-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
MSP-TS430PW14 www.ti.com
Figure B-4. MSP-TS430PW14 Target Socket Module, PCB
36 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PW14
Table B-2. MSP-TS430PW14 Bill of Materials
No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C34 C8 0 2.2nF, SMD0805 DNP5 D1 1 green LED, SMD0603 475-1056-2-ND
DNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder6 J1, J2 0 7-pin header, TH
SAM1029-07-ND : HeaderSAM1213-07-ND : Receptacle
J3, J5, J7, Place jumpers on headers J5, J7, J8,7 J8, J9, J10, 8 3-pin header, male, TH SAM1035-03-ND J9, J10, J11, J12; Pos 1-2J11, J128 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2
14-pin connector, male,10 JTAG 1 HRP14H-NDTHMicro Crystal MS1V-T1K
12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder12.5pF
13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND15 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas17 PCB 1 56 x 53 mm 2 layers
For example, 3MAdhesive Approximately 6mm width,18 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet 2mm height 530219 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI
37SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
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MSP-TS430L092 www.ti.com
B.3 MSP-TS430L092
Figure B-5. MSP-TS430L092 Target Socket Module, Schematic
38 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Connector J3External power connector
Jumper JP3Open to measure current
Jumper JP1Write enable for EPROM
Orient pin 1 ofMSP430 device
www.ti.com MSP-TS430L092
Settings of the MSP-TS430L092 Target SocketFigure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning isrecommended:• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device
current consumption. For default operation, they should be closed.
Figure B-6. MSP-TS430L092 Target Socket Module, PCB
39SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430L092 www.ti.com
Table B-3. MSP-TS430L092 Bill of Materials
No. PerPos. Ref Des No. Description Digi-Key Part No. CommentBoard1 C1, C2 2 330nF, SMD06032 C5 1 100n, SMD06033 C6 1 10u, SMD08054 C10 1 100n, SMD06035 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7 J1, J2 2 7-pin header, TH
SAM1213-07-ND : HeaderSAM1035-07-ND : Receptacle
8 J3 1 3-pin header, male, TH SAM1035-03-ND9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe DNP; Keep vias free of solder.
Reichelt: MicroMaTch-11 J13 1 MICRO_STECKV_10 Connector: MM FL 10G12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-555716 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 168606517 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC18 R0, R6, R7 3 2K7, SMD060319 R1 1 1k, SMD060320 R2 1 47k, SMD0603
R4,R5, R8,21 6 10k, SMD0603R10, RC, RD22 RA 1 3.9k, SMD060323 RB 1 6.8k, SMD0603
14 Pin Socket - IC189-0142-24 U1 1 Manuf. Yamaichi146DNP: Enclosed with kit. Is22 MSP430 2 MSP430L092PWR supplied by TI.
40 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430L092 Active Cable
B.4 MSP-TS430L092 Active Cable
Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic
41SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Connector JTAG
For JTAG Tool
JP2
JP1
MSP-TS430L092 Active Cable www.ti.com
Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.
Table B-4. MSP-TS430L092 JP1 Settings
Jumper 1 Jumper 2 DescriptionOff Off The active cable has no power and does not function.
The active cable receives power from target socket. For this option, theOff On target socket must have its own power supply.On Off The active cable receives power from the JTAG connector.
The JTAG connector powers the active cable and the target socket. ForOn On this option, the target socket must not have its own power source, as this
would cause a not defined state.
• JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin tohigh and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.
Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB
42 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430L092 Active Cable
Table B-5. MSP-TS430L092 Active Cable Bill of Materials
No. PerPos. Ref Des Description Digi-Key Part No. CommentBoardC1, C3, C5,1 4 100nF, SMD0603C6
2 C2, C4 2 1uF, SMD08053 R1, R10 2 10K, SMD06034 R2 1 4K7, SMD0603
R5, R6, R7,5 4 100, SMD0603R96 R8 1 680k, SMD06037 R11, R15 2 1K, SMD06038 R12 0 SMD0603 DNP9 R13 0 SMD0603 DNP10 R14 1 0, SMD060311 IC1 1 SN74AUC1G04DBVR Manu: TI12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI
Reichelt: MicroMaTch-13 J2 1 MICRO_STECKV_10 Connector: MM FL 10GPut jumper on Position 1 and14 JP1 1 2x2 Header JP2Q 2. Do not mix direction.
15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header16 JTAG 1 14-pin connector, male, TH HRP14H-ND
BC817-25LT1SMD, SOT23- Digi-Key: BC817-17 Q1 1 BEC 25LT1GOSCT-ND18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI
43SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
DN
P
I2C
UA
RT
P1.3
Jum
pers
JP
3 to
JP
8C
lose 1
-2 to
debug in
Spy-B
i-Wire
mode.
Clo
se 2
-3 to
debug in
4-w
ire J
TA
G m
ode.
BS
LTool S
ele
ct:
Open =
BS
LC
onnecto
rC
losed =
JTA
G C
onnecto
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DN
P
DN
P
12p
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SA
M1029-1
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0
If exte
rnal s
upply
volta
ge:
rem
ove R
3 a
nd a
dd R
2 (0
Ohm
)
Ext_
PW
R
MS
P-T
S4
30
PW
20
Vcc
int
ext
DN
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G ->
SB
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Socket: E
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7
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61
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U1
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12345678910
J4
11
12
13
14
15
16
17
18
19
20
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11
P1.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
P1
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P1.1
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
P1.5
/TM
S
P1.5
/TM
S
P1.4
/TC
KP1.4
/TC
K
P1.2
P1
.2
P1.2
XO
UT XO
UT
XIN
XIN
XTLGND
DV
CC
DV
CC
DVCC
DV
CC
DV
CC
DV
SS
DV
SS
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RX
D/S
IMO
RX
D/S
IMO
TX
D/S
OM
I/SD
A
TX
D/S
OM
I/SD
A
SP
ICLK
/SC
L
SP
ICLK
/SC
L
TX
D/S
OM
I/SD
A1
PIN
14
PIN
14
PIN
15
PIN
15
PIN
15
PIN
15
PIN
16
PIN
16
PIN
16
TD
X
TD
X
RX
D
RX
D
P1.3
P1.3
IPW
16
IPW
20
1 2 3 4 5 6
1 2 3 4 5 6
Title
:
Da
te:
Pa
ge
1/1
MS
P-T
S4
30
PW
20
8/2
7/2
01
5 3
:37
:12
PM
A3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Re
v.:
MSP-TS430PW20 www.ti.com
B.5 MSP-TS430PW20The development board MSP-TS430PW20 supports the MSP430FR231x FRAM devices in the 20-pin andthe 16-pin TSSOP packages. MSP430FR2311IPW20 devices are not included in the MSP-TS430PW20kit. Free samples can be ordered from the TI Store.
Figure B-9. MSP-TS430PW20 Target Socket Module, Schematic
44 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
141
2
101
2
JP
11
Jumper JP1Open to measure current
Orient Pin 1 of MSP430 device
Jumpers JP9, JP2, JP10Open to disconnect LEDs
D1 to D3LEDs connected to P1.0 to P1.2
Connector J2External power connector
Jumper J1 to "ext"
Jumpers JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector JTAGFor JTAG Tool
Connector BSLFor ToolBootloader
Jumper J11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
SW1Close to reset
www.ti.com MSP-TS430PW20
Figure B-10. MSP-TS430PW20 Target Socket Module, PCB
45SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430PW20 www.ti.com
Table B-6. MSP-TS430PW20 Bill of Materials
No. PerPos. Ref Des No. Description Digi-Key Part No. CommentBoard1 PCB 1 90.0 x 92.5 mm MSP-TS430PW20 Rev. 1.0 2 layers, green solder mask
JP1, JP9,2 JP13, JP14, 5 2-pin header, male, TH SAM1035-02-ND place jumper on header
JP153 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only4 JP2, JP10 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
JP3, JP4, JP5,6 JP6, JP7, JP8, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
JP167 J2 1 3-pin header, male, TH SAM1035-03-ND
PW20: Place jumpers on pins 1-3 and 2-48 JP11 1 2x3pin header, male, TH SAM1034-03-ND PW16: Place jumpers on pins 3-5 and 4-6
9 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP10 R3, R13 2 0R, 0805 541-0.0ATR-ND11 C5 1 1.1nF, CSMD0805 490-1623-2-ND12 C7 1 1uF/10V, CSMD0805 490-1702-2-ND13 R7, R15 1 10k, 0805 541-10KATR-ND14 R4 1 47k, 0805 541-47KATR-ND15 C6, C11 2 100nF, CSMD0805 490-1666-1-ND16 C8, C9 2 12p, DNP, CSMD0805 BC1257TR-ND DNP17 R1 1 330R, 0805 541-330ATR-ND18 R5, R6 2 330R, 0805 541-330ATR-ND DNP19 R14 1 47k, 0805 541-47KATR-ND DNP20 SW2 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder21 SW1 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder
DNP: headers are enclosed with22 J3, J4 2 10-pin header, TH SAM1029-10-ND kit.
Keep vias free of solderDNP: Receptacles are enclosed
23 J3, J4 2 10-pin receptacle, TH SAM1213-10-ND with kit.Keep vias free of solder
24 TP1, TP2, TP3 3 Test point DNP, keep pads free of solder25 BSL 1 10-pin connector, male, TH HRP10H-ND26 JTAG 1 14-pin connector, male, TH HRP14H-ND27 IC1 1 Socket: OTS-20S-0.65-007 Manuf. Enplas
DNP: Free samples can be28 IC1 1 MSP430FR2311IPW20 ordered in the TI Store29 Q2 1 Crystal 4MHz Buerklin: 78D134 DNP: Crystal is enclosed with kit
MSV3V-T1R (32.768KHz /30 Q2 (1) 1 DNP: Crystal is enclosed with kit20ppm / 12.5pF)green LED, HSMG-C17031 D1 1 516-1434-1-ND Avago, Farnell 5790852DIODE0805
32 D3 1 red LED, DIODE0805 DNP33 D2 1 yellow LED, DIODE0805 DNP
Rubber stand34 4 Buerklin: 20H1724 apply to corners at bottom sideoff(1) One symbol in schematic; footprint supports two crystal types
46 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PW24
B.6 MSP-TS430PW24
Figure B-11. MSP-TS430PW24 Target Socket Module, Schematic
47SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP2Open to measure current
Orient Pin 1 of MSP430 device
D1LED connected to P1.0
Jumper JP3Open to disconnect LED
Connector J5External power connectorJumper JP1 to "ext"
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
MSP-TS430PW24 www.ti.com
Figure B-12. MSP-TS430PW24 Target Socket Module, PCB
48 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PW24
Table B-7. MSP-TS430PW24 Bill of Materials
No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C5 1 2.2nF, SMD08053 C3, C7 2 10uF, 10V, SMD08054 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND5 D1 1 green LED, SMD0805 P516TR-ND
DNP: Headers and receptaclesSAM1029-07-ND6 J1, J2 0 12-pin header, TH enclosed with kit. Keep vias free ofSAM1213-07-ND solder. (Header and Receptacle)J5, JP1,
JP4, JP5, Place jumper on 1-2 of JP4-JP97 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, Place on 1-2 on JP1JP8, JP9
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND see Pos 7 and 8
14-pin connector, male,10 JTAG 1 HRP14H-NDTH11 Q1 0 Crystal DNP: keep vias free of solder12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND
R5, R6, R8,13 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6R9,14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND
Socket: OTS 24(28)-065-15 U1 1 Manuf.: Enplas02-0016 PCB 1 68.5 x 61 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons17 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-530218 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI
49SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
DN
P
Socket:
EN
PLA
S Q
FN
-24B
-0.5
-0.1
c
I2C
UA
RT
P1.3
P1.5
Jum
pers
JP
3 to
JP
8C
lose 1
-2 to
debug in
Spy-B
i-Wire
mode.
Clo
se 2
-3 to
debug in
4-w
ire J
TA
G m
ode.
BS
LTool S
ele
ct:
Open =
BS
LC
onnecto
rC
losed =
JTA
G C
onnecto
r
DN
P
DN
P
DN
P
DN
P
GN
D
GN
D
33
0R
0R0R
GN
D
GN
D
1.1
nF
47
kG
ND0R 0R
QU
AR
Z5
10
0n
F
1uF/10V
gre
en
GN
D
EV
Q11
0R
DNP
DN
P
10
0n
F
GN
D1
0k
10
k
MS
P430F
R2433IR
GE
SA
M1029-0
6-N
D1-6
SAM1029-06-ND7-12
SA
M1029-0
6-N
D13-1
8
SAM1029-06-ND19-24
33
0R
yello
w D
NP3
30
R
red D
NP
If exte
rnal s
upply
volta
ge:
rem
ove R
3 a
nd a
dd R
2 (0
Ohm
)
Ext_
PW
R
MS
P-T
S4
30
RG
E2
4A
Vcc
int
ext
DN
PD
NP
DN
P
JTA
G ->
SB
W ->
1.0
DN
P
P1
.3
Ta
rge
t So
cke
t Bo
ard
for M
SP
43
0F
R2
43
3 d
evic
e
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C9
C8
R1
12
34
56
78
91
0
BS
L
R2R3
123
J2
1 2 3
J1
1 2
JP
1
12J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R9 R8
Q2
C11
C7
D1
SW
1
R1
3
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R1
4
C6
12
JP
13
12
JP
14
12
JP
15
123
JP
16
1 2
JP17
1 2
JP18
R7
R1
5
RS
T/N
MI/S
BW
TD
IO1
TE
ST
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WT
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2
P1.4
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43
P1.5
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OM
I/TA
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/TM
S/A
54
P1.6
/UC
A0C
LK
/TA
1C
LK
/TD
I/TC
LK
/A6
5
P1.7
/UC
A0S
TE
/SM
CLK
/TD
O/A
76
P2.3
13
P3.1
/UC
A1S
TE
14
P2.4
/UC
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LK
15
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OM
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17
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18
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P1.1/UCB0CLK/TA0.1/A18
P1.2/UCB0SIMO/UCB0SDA/TA0.2/A29
P1.3/UCB0SOMI/UCB0SCL/MCLK/A310
P2.2/ACLK11
P3.012
P2.719
P3.220
P2.0/XOUT21
P2.1/XIN22
DVSS23
DVCC24
IC1
123456
J3
7
8
9
10
11
12
J4
13
14
15
16
17
18
J5
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R5
12J
P2
D2
R6
12J
P10
D3
TP
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P1.0
RS
T/N
MI
TM
ST
DI
VC
C
P1.1
P1
.1 TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
P1.7
/TD
O
P1.7
/TD
O
P1.5
/TM
S
P1.5
/TM
S
P1.5
/TM
S
P1.4
/TC
K
P1.4
/TC
K
P1.4
/TC
K
P1.6
/TD
I
P1.6
/TD
I
P1.2
P1.2
P1
.2
XO
UT
XOUT
XIN
XIN
XTLGNDD
VC
C
DV
CC
DVCC
DVCC
DV
CC
DV
SS
DV
SS
DVSS
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RX
D/S
IMO
RX
D/S
IMO
TX
D/S
OM
I/SD
A
TX
D/S
OM
I/SD
A
SP
ICLK
/SC
L
SP
ICLK
/SC
LS
PIC
LK
/SC
L1
SPICLK/SCL1
SP
ICLK
/SC
L1
TX
D/S
OM
I/SD
A1
1 2 3 4 5 6
1 2 3 4 5 6
Title
:
Da
te:
Pa
ge
1/1
MS
P-T
S4
30
RG
E2
4A
4/2
8/2
01
5 3
:52
:36
PM
A3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Re
v.:
MSP-TS430RGE24A www.ti.com
B.7 MSP-TS430RGE24A
Figure B-13. MSP-TS430RGE24A Target Socket Module, Schematic
50 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Connector JTAGFor JTAG tool
Connector BSLFor bootloader tool
Orient Pin 1 of MSP430 device
Jumper J11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Connector J2External power connector
Jumper J1 to “ext”
Jumpers JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
www.ti.com MSP-TS430RGE24A
Figure B-14. MSP-TS430RGE24A Target Socket Module, PCB
51SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430RGE24A www.ti.com
Table B-8. MSP-TS430RGE24A Bill of Materials (BOM)
No. perPosition Ref Des Description Digi-Key Part No. CommentBoard"MSP-TS430RGE24A" Rev.1 PCB 1 90.0 x 92.5 mm 2 layers, red solder mask1.0
JP1, JP9,2 JP13, JP14, 5 2-pin header, male, TH SAM1035-02-ND place jumper on header
JP153 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only
DNP, keep pads free of4 JP2, JP10 2 2-pin header, male, TH SAM1035-02-ND solder5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
JP3, JP4,JP5, JP6,6 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP7, JP8,
JP167 J2 1 3-pin header, male, TH SAM1035-03-ND8 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP9 R3, R13 2 0R, 0805 541-0.0ATR-ND10 C5 1 1.1nF, CSMD0805 490-1623-2-ND11 C7 1 1uF/10V, CSMD0805 490-1702-2-ND12 R7, R15 1 10k, 0805 541-10KATR-ND13 R4 1 47k, 0805 541-47KATR-ND14 C6, C11 2 100nF, CSMD0805 490-1666-1-ND15 R1 1 330R, 0805 541-330ATR-ND16 R5, R6 2 330R, 0805 541-330ATR-ND DNP17 R14 1 47k, 0805 541-47KATR-ND DNP18 C8, C9 2 DNP, CSMD0805 DNP
DNP, Keep vias free of19 SW2 1 EVQ-11L05R P8079STB-ND solder. Lacon: 1251459DNP, Keep vias free of20 SW1 1 EVQ-11L05R P8079STB-ND solder, Lacon: 1251459DNP: headers enclosed in
21 J3, J4, J5, J6 4 6-pin header, TH SAM1029-06-ND kit.Keep vias free of solder.DNP: receptacles enclosed in
22 J3, J4, J5, J6 4 6-pin receptacle, TH SAM1213-06-ND kit.Keep vias free of solder.
TP1, TP2, DNP, keep pads free of23 3 Test pointTP3 solder24 BSL 1 10-pin connector, male, TH HRP10H-ND25 JTAG 1 14-pin connector, male, TH HRP14H-ND26 IC1 1 Socket:QFN-24B-0.5-0.1c Manuf. Enplas
DNP: Free samples can be27 IC1 1 MSP430FR2433IRGER ordered in the TI StoreDNP: MS3V-TR1 DNP: Micro Crystal, enclosed28 Q2 1 depends on application(32,768kHz/ 20ppm/12,5pF) in kit. Keep vias free of soldergreen LED, HSMG-C17029 D1 1 516-1434-1-ND Avago, Farnell 5790852DIODE0805
30 D3 1 red (DNP), DIODE0805 DNP31 D2 1 yellow (DNP), DIODE0805 DNP
Rubber stand Apply to corners at bottom32 4 Buerklin: 20H1724off side
52 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
ML
14
LE
D3
12
pF
12
pF
GN
D
GND
10
0n
F
56
0R
ML
10
JP
1Q
JP
1Q
10
uF
/10
V
50
K1
0n
F
0R
0R
0R
-
-0R
-
U1
SO
CK
28
DW
F1
23
FE
14
HF
E1
4L
0R
GN
D
rem
ove
R8
an
d a
dd
R9
(0 O
hm
)
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R11
an
d a
dd
R1
0 (0
Oh
m)
SM
D-F
oo
tprin
t
So
cke
t:Y
am
aic
hi
2.0
MS
P-T
S4
30
DW
28
Ta
rge
t So
cke
t DW
28
Typ
e: IC
18
9-0
28
2-0
42
If exte
rna
l su
pp
ly v
olta
ge
:
R1
, C1
, C2
no
t asse
mb
led
no
t asse
mb
led
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
D1
C2
C1
C5
R3
BO
OT
ST
12
34
56
78
91
0
1 2
J5
J4
12
C7
R5
C8
R6
R7
R8
R9
R1
0
R11
R1
12345678910
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
TS
T1
VC
C2
P2
.53
VS
S4
XO
UT
5
XIN
6
RS
T7
P2
.08
P2
.19
P2
.21
0P
2.3
19
P2
.42
0P
1.0
21
P1
.12
2P
1.2
23
P1
.32
4P
1.4
25
P1
.52
6P
1.6
27
P1
.72
8
P3
.011
P3
.11
2
P3
.21
3
P3
.31
4P
3.4
15
P3
.51
6P
3.6
17
P3
.71
8
U2
15
16
17
18
19
20
21
22
23
24
25
26
27
28
J2
J1
12345678910
11
12
13
14
R2
123
J3
Q1
QUARZ3
P1
.0
P1
.0
P1
.3
P1
.3
P1
.2
P1
.2
P1
.1
P1
.1R
ST
/NM
I
RS
T/N
MI
RS
T/N
MIRS
T/N
MI
RS
T/N
MI
TC
K
TC
K
TC
K
TM
S
TM
S
TM
S
TD
I
TD
I
TD
I
TD
O
TD
O
TD
O
XO
UT
XO
UT
VC
C
GN
D
GN
D
GN
D
P2
.3
P2
.3
P2
.4
P2
.4
XIN
XIN
P2
.5
P2
.5
P2
.2
P2
.2P
2.1
P2
.1
P2
.0
P2
.0
TS
T/V
PP
TS
T/V
PP
TS
T/V
PP
P3
.0
P3
.0
P3
.1
P3
.1
P3
.2
P3
.2
P3
.3
P3
.3
P3
.7
P3
.7
P3
.6
P3
.6
P3
.5
P3
.5
P3
.4
P3
.4
VC
C4
30
Ext_
PW
R
Da
te:
11
/14
/20
06
1:2
6:0
4 P
MS
he
et:
1/1 R
EV
:
TIT
LE
:
Do
cu
me
nt N
um
be
r:
MS
P-T
S4
30
DW
28
+
VC
C4
30
www.ti.com MSP-TS430DW28
B.8 MSP-TS430DW28
Figure B-15. MSP-TS430DW28 Target Socket Module, Schematic
53SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper J4Open to disconnect LED
Orient Pin 1 ofMSP430 device
Jumper J5Open to measure current
Connector J3External power connector
Remove R8 and jumper R9
D1LED connected to P1.0
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
MSP-TS430DW28 www.ti.com
Figure B-16. MSP-TS430DW28 Target Socket Module, PCB
54 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430DW28
Table B-9. MSP-TS430DW28 Bill of Materials
No. perPosition Ref Des Description Digi-Key Part No. CommentBoardDNP: C1, C2, Cover holes while1 C1, C2 0 12pF, SMD0805 soldering
2 C5 1 100nF, SMD08053 C7 1 10uF, 10V Tantal Elko B4 C8 1 10nF SMD08055 D1 1 LED3 T1 3mm yellow RS: 228-4991
Micro Crystal MS1V-T1K6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = DNP: Cover holes while soldering
12.5pFDNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder.7 J1, J2 2 14-pin header, TH male: Header: ReceptacleDNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder.7.1 2 14-pin header, TH female: Header: Receptacle
8 J3 1 3-Pin Connector, male9 J4, J5 2 2-Pin Connector, male With jumper10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121
R1, R2, R6,12 R7, R8,R9, 4 0R, SMD0805 DNP: R1, R2, R9, R10
R10, R1113 R3 1 560R, SMD080514 R5 1 47K, SMD0805
Yamaichi: IC189-0282-15 U1 1 SOP28DW socket 04216 U2 0 TSSOP DNP
55SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
12pF
12pF
GN
D
GN
D
100nF
33
0R
10uF
/10V
-
0R
GN
D
GN
D
gre
en
2.2
nF
47
kG
ND
0R
0R
33
0R
MS
P430F
12xx
If exte
rnal s
upply
volta
ge:
rem
ove R
11 a
nd a
dd R
10 (0
Ohm
)
3.1
MS
P-T
S4
30
PW
28
:
OT
S-2
8-0
.65-0
1S
ocket: E
npla
s
Vcc
int
ext
Targ
et S
ocket B
oard
for M
SP
430
's in
PW
28 p
ackage
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
JTA
G ->
SB
W ->
JTA
G-M
ode s
ele
ctio
n:
4-w
ire J
TA
G: S
et ju
mpers
JP
4 to
JP
9 to
positio
n 2
-32-w
ire "S
pyB
iWire
": Set ju
mpers
JP
4 to
JP
9 to
positio
n 1
-2
DN
P
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2C1
C4
R1
12
34
56
78
91
0
BO
OT
ST
C3
R2
R3
123
J5
JP
1
1 2 3
JP
2
1 212J
P3
D1
C5
R4
JP
4
1 2 3
JP
5
1 2 3
JP
6
1 2 3
JP
7
1 2 3
JP
8
1 2 3
JP
9
1 2 3
R5
R6
21
Q1
R7
J1
12345678910
11
12
13
14
J2
1 2 3 4 5 6 7 8 91
011
12
13
14
U1 TS
T1
VC
C2
P2
.53
VS
S4
XO
UT
5
XIN
6
RS
T7
P2
.08
P2
.19
P2
.21
0P
2.3
19
P2
.42
0P
1.0
21
P1
.12
2P
1.2
23
P1
.32
4P
1.4
25
P1
.52
6P
1.6
27
P1
.72
8
P3
.011
P3
.11
2
P3
.21
3
P3
.31
4P
3.4
15
P3
.51
6P
3.6
17
P3
.71
8
P1.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
GN
D
GN
D
VC
C430
VC
C430
P2.0
P1.1
P1.1
P3.3
P3.2
P3.1
P3.0
P2.2
P2.2
XIN
/P2.6
XIN
/P2.6
XO
UT
/P2.7
XO
UT
/P2.7
P2.1
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
P3.4
P3.5
P3.6
P3.7
P2.3
P2.4
P1.2
P1.3
P1.4
/TC
K
P1.4
/TC
K
P1.5
/TM
S
P1.5
/TM
S
P1.6
/TD
I
P1.6
/TD
I
P1.7
/TD
O
P1.7
/TD
O
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
P2.5
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
XT
LG
ND
Ext_
PW
R
+
MSP-TS430PW28 www.ti.com
B.9 MSP-TS430PW28
Figure B-17. MSP-TS430PW28 Target Socket Module, Schematic
56 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP2Open to measure current
Jumper JP3Open to disconnect LED
D1LED connected to P5.1
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP4 to JP9:Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Connector J5External power connectorJumper JP1 to “ext”
www.ti.com MSP-TS430PW28
Figure B-18. MSP-TS430PW28 Target Socket Module, PCB
57SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430PW28 www.ti.com
Table B-10. MSP-TS430PW28 Bill of Materials (1)
No. perPos. Ref Des Description Digi-Key Part No. CommentBoardDNP: C1, C2 , Cover holes1 C1, C2 0 12pF, SMD0805 while soldering
2 C3 1 10uF, 10V Tantal Elko B3 C4 1 100nF, SMD08054 C5 0 2.2nF, SMD0805 DNP5 D1 1 LED green SMD0603
Micro Crystal MS1V-T1K DNP: Cover holes and6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = neighboring holes while
12.5pF solderingDNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2 2 14-pin header, TH male: Header: ReceptacleDNP: headers andreceptacles enclosed withkit.Keep vias free of solder.7.1 2 14-pin header, TH female: Header: Receptacle
8 J5, IP1 1 3-Pin Connector , maleJP1, JP4,JP5, JP6,8a 7 3-Pin Connector , male Jumper on Pos 1-2JP7, JP8,
JP99 JP2, JP3 2 2-Pin Connector , male with Jumper
DNP: Cover holes while10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 soldering11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-12112 R1, R7 2 330R, SMD0805
R2, R3, R5,12 0 0R, SMD0805 DNPR614 R4 1 47K, SMD080515 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01
(1) PCB 66 x 79 mm, two layers; Rubber stand off, four pieces
58 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
JTAG Mode selection:
4-wire JTAG: Set jumpers J4 to J9 to position 2-3
2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1
www.ti.com MSP-TS430PW28A
B.10 MSP-TS430PW28A
Figure B-19. MSP-TS430PW28A Target Socket Module, Schematic
59SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP2Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP3Open to disconnect LED
D1LED connected to P1.0
Connector J5External power connectorJumper JP1 to "ext"
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
MSP-TS430PW28A www.ti.com
Figure B-20. MSP-TS430PW28A Target Socket Module, PCB (Red)
NOTE: For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to bepopulated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board issupplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.
60 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PW28A
Table B-11. MSP-TS430PW28A Bill of Materials
No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C5 1 2.2nF, SMD08053 C3 1 10uF, 10V, SMD08054 C4, C6, 2 100nF, SMD0805 478-3351-2-ND5 D1 1 green LED, SMD0805 P516TR-ND
DNP: Headers and receptacles6 J1, J2 0 14-pin header, TH enclosed with kit. Keep vias free of
solder: (Header and Receptacle)J5, JP1,
JP4, JP5, Place jumper on 1-2 of JP4-JP9 Place7 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, on 1-2 on JP1JP8, JP9
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND see Pos 7 an 8
14-pin connector, male,10 JTAG 1 HRP14H-NDTH11 BOOTST 0 DNP Keep vias free of solder
Micro Crystal MS3V12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder
12.5pF13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND
R2, R3,R5,14 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6R6,15 R4 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas17 PCB 1 63.5 x 64.8 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons18 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-530219 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI
61SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
GN
D
0R
330R
2.2
nF
PWR3
GN
D
GN
D
0R
47K
470nF
100nF
100nF
10uF
GN
D
GND
20k/0
.1%
10k
10k
10k
10k
GN
DAV
SS
AVSS
10k
10k
10k
10k
GN
D
SA
M1
02
9-0
8-N
D1
-8
SA
M1
02
9-0
8-N
D9
-16
MS
P4
30
I20
40
TR
HB
QF
N11
T0
32
-00
3
SA
M1
02
9-0
8-N
D1
7-2
41
7-2
4
SA
M1
02
9-0
8-N
D2
5-3
2
1.0
for M
SP
43
0i2
04
0
MS
P4
30
:Ta
rge
t-So
cke
tM
SP
-TS
43
0R
HB
32
A
DN
P
<-
SB
W
<-
JTA
G
Vcc
int
ext
So
cke
t:Ya
ma
ich
iQ
FN
11
T0
32
-00
3
1 3 5 7 9 11 13
2 4 6
12
148
10
JTA
GR1
R3
C8
J51
2
3
JP
112
1
2
JP
2
R4
123
JP
4123
JP
9123
JP
8123
JP
7123
JP
6123 JP
5
R5
D1
C9
1 2 3
JP
3
C14
C13
C12
R2
R6
R8
R9
R10
R11
R12
R13
R14
12345678
J1
910
1112
13
14
15
16
J2
A0.0
+1
A0.0
-2
A1.0
+3
A1.0
-4
A2.0
+5
A2.0
-6
A3.0
+7
A3.0
-8
VR
EF
9
AV
SS
10
RO
SC
11
DV
SS
12
VC
C13
VC
OR
E14
P2.3
/VM
ON
IN28
P2.2
/TA
1.2
27
P2.1
/TA
1.1
26
P2.0
/TA
1.0
/CLK
IN25
P1.7
/UC
B0S
DA
/UC
B0S
IMO
/TA
1C
LK
24
P1.6
/UC
B0S
CL/U
CB
0S
OM
I/TA
0.2
23
P1.5
/UC
B0C
LK
/TA
0.1
22
P1.4
/UC
B0S
TE
/TA
0.0
21
P1
.3/U
CA
0T
XD
/UC
A0S
IMO
/TA
0C
LK
/TD
O/T
DI
20
P1.2
/UC
A0R
XD
/UC
A0S
OM
I/AC
LK
/TD
I/TC
LK
19
P1.1
/UC
A0C
LK
/SM
CLK
/TM
S18
P1.0
/UC
A0S
TE
/MC
LK
/TC
K17
TE
ST
/SB
WT
CK
16
RS
T/N
MI/S
BW
TD
IO15
U1
P2.4
/TA
1.0
29
P2.5
/TA
0.0
30
P2.6
/TA
0.1
31
P2.7
/TA
0.2
32
17
18
19
20
21
22
23
24
J3
25
26
27
28
29
30
31
32
J4
TM
S
TM
S
TD
I
TD
I
TD
O
TD
O
TD
O
VC
C
GN
D
GN
D
P1
.4
P1
.4
DV
CC
DV
CC
DV
CC
AV
SS
M
M
I
I
O
O
RS
T/N
MI
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MSP-TS430RHB32A www.ti.com
B.11 MSP-TS430RHB32A
Figure B-21. MSP-TS430RHB32A Target Socket Module, Schematic
62 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Orient Pin 1 of MSP430 device
D1LED connected to P1.4
Jumper JP1Open to measure current
Connector J5External power connectorJumper JP3 to “ext”
Connector JTAGFor JTAG Tool
Jumper JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Jumper JP2Open to disconnect LED
P1
.4
14
1
2
GN
D
GN
D
VC
C
12
3
123
15
8
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17
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4
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9
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8
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7
JP
6
JP
5
R5
D1
C9
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3
C1
4
C13
C12
R2
R6
R8
R9
R10
R11
R12
R13
R14
J1
J2
U1
J3
J4
12
3
12
3
12
3
12
3
12
3
www.ti.com MSP-TS430RHB32A
Figure B-22. MSP-TS430RHB32A Target Socket Module, PCB
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MSP-TS430RHB32A www.ti.com
Table B-12. MSP-TS430RHB32A Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 PCB 1 76.9 x 67.6 mm MSP-TS430RHB32A Rev. 1 2 layers, red solder mask2 D1 1 green LED, DIODE0805 P516TR-ND3 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header4 JP3, JP4, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
JP5, JP6, (SBW)JP7, JP8,JP9
5 R1, R4 2 0R, 0805 541-0.0ATR-ND6 C8 1 2.2nF, CSMD0805 490-1628-2-ND DNP7 R6, R8, R9, 8 10k, 0805 311-10KARTR-ND DNP
R10, R11,R12, R13,R14
8 C12 1 10uF, CSMD0805 445-1371-2-ND9 R2 1 20k/0.1%, 0805 P20KDACT-ND10 R5 1 47K, 0805 311-47KARTR-ND11 C13, C14 2 100nF, CSMD0805 311-1245-2-ND12 R3 1 330R, 0805 541-330ATR-ND13 C9 1 470nF, CSMD0805 445-1357-2-ND14 J1, J2, J3, J4 1 8-pin header, TH SAM1029-08-ND DNP: headers and
receptacles, enclosed withkit.Keep vias free of solder.
15 J1, J2, J3, J4 1 8-pin receptable, TH SAM1213-08-ND DNP: headers andreceptacles, enclosed withkit.Keep vias free of solder.
16 JTAG 1 14-pin connector, male, TH HRP14H-ND17 U1 1 Socket QFN11T032-003 Manuf.: Yamaichi18 U1 1 MSP430i2041TRHB DNP: enclosed with kit.
Is supplied by TI19 J5 1 3-pin header, male, TH SAM1035-03-ND20 Rubber stand 4 Buerklin: 20H1724 apply to corners at bottom
off side
64 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
12
pF
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www.ti.com MSP-TS430DA38
B.12 MSP-TS430DA38
Figure B-23. MSP-TS430DA38 Target Socket Module, Schematic
65SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Orient pin 1 of MSP430 device
D1LED connected to P1.0
Connector J3External power connector
Jumper JP1 to "ext"
Jumper JP3Open to disconnect LED
Jumper JP2Open to measure current
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
MSP-TS430DA38 www.ti.com
Figure B-24. MSP-TS430DA38 Target Socket Module, PCB
66 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430DA38
Table B-13. MSP-TS430DA38 Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 0 2.2nF, SMD0805 DNP5 D1 1 green LED, SMD0603 475-1056-2-ND
DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2 0 19-pin header, TH
SAM1029-19-ND : HeaderSAM1213-19-ND : Receptacle
"J3, JP1, Place jumpers on headersJP4, JP5,7 8 3-pin header, male, TH SAM1035-03-ND JP1, JP4,JP5, JP6, JP7, JP8,JP6, JP7, JP9; Pos 1-2JP8, JP9"8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND Place on: JP1 - JP9; Pos 1-210 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP: Keep vias free of11 BOOTST 0 10-pin connector, male, TH solderMicro Crystal MS1V-T1K DNP: Keep vias free of12 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF
13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP15 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi17 PCB 1 67 x 66 mm 2 layers
Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: enclosed with kit19 MSP430 2 MSP430F2274IDA supplied by TI
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MSP-TS430QFN23x0 www.ti.com
B.13 MSP-TS430QFN23x0
Figure B-25. MSP-TS430QFN23x0 Target Socket Module, Schematic
68 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
D1LED connected to P1.0
Connector J5External power connectorJumper JP1 to "ext"
Jumper JP3Open to disconnect LED
Jumper JP2Open to measure current
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Orient Pin 1 of MSP430 device
www.ti.com MSP-TS430QFN23x0
Figure B-26. MSP-TS430QFN23x0 Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to bepopulated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board issupplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.
69SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430QFN23x0 www.ti.com
Table B-14. MSP-TS430QFN23x0 Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C4 1 100nF, SMD0805 478-3351-2-ND4 C5 1 10nF, SMD0805 478-1383-2-ND5 D1 1 green LED, SMD0603 475-1056-2-ND
DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2, J3, J4 0 10-pin header, TH
SAM1034-10-ND : HeaderSAM1212-10-ND : Receptacle
Place jumper on header JP1;7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND Pos 1-2.8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP310 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP: Keep vias free of11 BOOTST 0 10-pin connector, male, TH solderMicro Crystal MS1V-T1K DNP: Keep vias free of12 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF
13 R1 1 330 Ω, SMD0805 541-330ATR-ND14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP15 R4 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas17 PCB 1 79 x 66 mm 2 layers
Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: enclosed with kit19 MSP430 2 MSP430F2370IRHA supplied by TI
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www.ti.com MSP-TS430RSB40
B.14 MSP-TS430RSB40
Figure B-27. MSP-TS430RSB40 Target Socket Module, Schematic
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Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP2Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP3Open to disconnect LED
D1LED connected to P1.0
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector J5External power connectorJumper JP1 to "ext"
Connector JTAGFor JTAG Tool
Connector BOOTSTFor ToolBootloader
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
MSP-TS430RSB40 www.ti.com
Figure B-28. MSP-TS430RSB40 Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to bepopulated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board issupplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.
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Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430RSB40
Table B-15. MSP-TS430RSB40 Bill of Materials
No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
C3, C7, C10,2 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12C12C4, C6, C8,3 3 100nF, SMD0805 311-1245-2-ND DNP C11C11
4 C5 1 2.2nF, SMD08055 C9 1 470nF, SMD08056 D1 1 green LED, SMD0805 P516TR-ND
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7 J1, J2, J3, J4 4 10-pin header, TH: Header: ReceptacleDNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7.1 4 10-pin header, TH: Header: Receptacle
JP1, JP4,JP5, Jumper: 1-2 on JP1, JP10; 2-38 JP6, JP7, JP8, 9 3-pin header, male, TH SAM1035-03-ND on JP4-JP9JP9, J5, JP109 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10 JTAG 1 14-pin connector, male, TH HRP14H-ND11 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder
QFN-40B-0.4_12 U1 1 EnplasENPLAS_SOCKETMicro Crystal MS3V-T1R DNP: Q1. Keep vias free of13 Q1 0 Crystal 32.768kHz, C(Load) = 12.5pF solder
Place on: JP1, JP2, JP3, JP4,15 10 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9, JP1016 R1,R7 2 330R SMD0805
R2, R3, R5,17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6
R1018 R4 1 47k SMD0805
DNP: enclosed with kit. Is19 MSP430 2 MSP430F5132 supplied by TIRubber stand select appropriate; for example,20 4 apply to corners at bottom sideoff Buerklin: 20H1724
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Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430RHA40A www.ti.com
B.15 MSP-TS430RHA40A
Figure B-29. MSP-TS430RHA40A Target Socket Module, Schematic
74 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP2Open to measure current
Connector J5External power connectorJumper JP1 to "ext"
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
D1LED connected to P1.0
Jumper JP3Open to disconnect LED
Orient Pin 1 of MSP430 device
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor ToolBootloader
www.ti.com MSP-TS430RHA40A
Figure B-30. MSP-TS430RHA40A Target Socket Module, PCB
75SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430RHA40A www.ti.com
Table B-16. MSP-TS430RHA40A Bill of Materials
No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP: C1, C22 C5 0 2.2nF, SMD0805 DNP C123 C3, C7 2 10uF, 10V, SMD0805 5 DNP C114 C4, C6 2 100nF, SMD0805 478-3351-2-ND5 C9 1 470nF, SMD08056 D1 1 green LED, SMD0805 P516TR-ND
DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.J1, J2, J3,7 4 10-pin header, THJ4 : Header: ReceptacleDNP: headers and receptacles enclosedwith kit. Keep vias free of solder.
7.1 4 10-pin header, TH : Header: Receptacle
J5, JP1,JP4, JP5, Place jumper on 1-2 of JP4-JP9; Place8 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, on 1-2 on JP1JP8, JP9
9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10 9 Jumper 15-38-1024-ND see Pos 8 an 9
14-pin connector, male,11 JTAG 1 HRP14H-NDTH10-pin connector, male,12 BOOTST 0 DNP. Keep vias free of solderTH
13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: EnplasMicro Crystal MS3V-T1R
14 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1. Keep vias free of solder12.5pF
15 R1,R7 2 330R SMD0805 541-330ATR-NDR2, R3, R5,16 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6R6, R8, R9,
17 R4 1 47k SMD080518 PCB 1 79 x 66 mm 2 layers
select appropriate; forRubber19 4 example, Buerklin: apply to corners at bottom sidestand off 20H172420 MSP430 2 MSP430N5736IRHA DNP: enclosed with kit. Is supplied by TI
76 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
ML
14
LE
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C3
P1
.0
P1
.0
RS
T/N
MI
RS
T/N
MI
RS
T/N
MI
TC
K
TC
K
TC
K
TM
S
TM
S
TD
I
TD
I
TD
O
TD
O
XO
UT
XO
UT
GN
D
GN
DG
ND
XIN
XIN
BS
L_
TX
VC
C
BS
L_
RX
Ext_
PW
R
Date
:11/1
4/2
006 1
:24:4
4 P
MS
heet:
1/1 R
EV
:
TIT
LE
:
Docum
ent N
um
ber:
MS
P-T
S430D
L48
+
+
Vcc
ext
int
int
ext Vcc
www.ti.com MSP-TS430DL48
B.16 MSP-TS430DL48
Figure B-31. MSP-TS430DL48 Target Socket Module, Schematic
77SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper J4Open to disconnect LED
D1LED connected to P1.0
Orient pin 1 of MSP430 device
Jumper J5Open to measure current
Connector J3External power connector
Jumper JP2 to "ext"
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP21-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
MSP-TS430DL48 www.ti.com
Figure B-32. MSP-TS430DL48 Target Socket Module, PCB
78 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430DL48
Table B-17. MSP-TS430DL48 Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND3 C3, C5 2 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND
DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2 0 24-pin header, TH
SAM1034-12-ND : HeaderSAM1212-12-ND : Receptacle
Place jumper on header JP1;7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND Pos 1-2. DNP: JP28 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J510 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP: Keep vias free of11 BOOTST 0 10-pin connector, male, TH solderMicro Crystal MS1V-T1K DNP: Keep vias free of12 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF
13 R3 1 560 Ω, SMD0805 541-560ATR-NDR4, R6, R7,14 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7R12
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC51-1387 KS-15186 Manuf.: Yamaichi17 PCB 1 58 x 66 mm 2 layers
Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: Enclosed with kit19 MSP430 2 MSP430F4270IDL supplied by TI
79SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430RGZ48B www.ti.com
B.17 MSP-TS430RGZ48B
Figure B-33. MSP-TS430RGZ48B Target Socket Module, Schematic
80 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP2Open to disconnect LED
Connector J5External power connectorJumper JP3 to "ext"
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
D1LED connected to P1.0
Jumper JP1Open to measure current
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
www.ti.com MSP-TS430RGZ48B
Figure B-34. MSP-TS430RGZ48B Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must bepopulated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board issupplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
81SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430RGZ48B www.ti.com
Table B-18. MSP-TS430RGZ48B Bill of Materials
No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C3, C4 0 47pF, SMD0805 DNP3 C6, C7, C12 3 10uF, 6.3V, SMD0805
C5, C11,4 4 100nF, SMD0805 311-1245-2-NDC13, C145 C8 1 2.2nF, SMD08056 C9 1 470nF, SMD0805 478-1403-2-ND7 D1 1 green LED, SMD0805 P516TR-ND
SAM1029-12-ND DNP: Headers and receptaclesJ1, J2, J3,8 0 12-pin header, TH (Header) SAM1213-12- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:9 J5 1 3-pin header, male, TH
JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,JP6, JP7,10 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers onJP8, JP9, pins 1-2 on JP3,JP1011 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11
14-pin connector, male,13 JTAG 1 HRP14H-NDTH10-pin connector, male,14 BOOTST 0 "DNP Keep vias free of solder"TH
Micro Crystal MS3V-T1R15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pFQ2: 4MHz Buerklin:16 Q2 0 Crystal DNP: Q2 Keep vias free of solder78D134http://www.ettinger.de/Art_Insulating17 0 Insulating disk to Q2 Detail.cfm?ART_ARTNUMdisk to Q2 =70.08.121
18 R3, R7 2 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,
R6, R8,19 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,R11, R12
20 R5 1 47k Ω, SMD0805 541-47000ATR-NDSocket: QFN11T048-21 U1 1 Manuf.: Yamaichi008_A101121_RGZ48
22 PCB 1 81 x 76 mm 2 layersAdhesive Approximately 6mm width, for example, 3M Bumpons23 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-5302
24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI
82 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
DN
P
DN
P
DN
P
GN
D
GN
D
100nF
330R
-0R
GN
D
GN
D
1.1
nF
47k
GN
D
0R 0R
0R
QU
AR
Z5
1uF
/10V
100nF
1uF
/10V
gre
en
DN
P
yello
w (D
NP
) DN
P
red (D
NP
)
0R
GN
D
DN
P
DN
P
0R0R
QUARZ5
EV
Q11
0R
DNP
DN
P
If exte
rnal s
upply
volta
ge:
rem
ove R
3 a
nd a
dd R
2 (0
Ohm
)
1.2
Ext_
PW
R
MS
P-T
S4
30
RG
Z4
8C
Vcc
int
ext
Targ
et S
ocket B
oard
for M
SP
430F
R58xx, F
R59xx IR
GZ
DN
PD
NP
DN
P
DN
P
DN
P
JTA
G ->
SB
W ->
JTA
G-M
ode s
ele
ctio
n:
4-w
ire J
TA
G: S
et ju
mpers
JP
4 to
JP
9 to
positio
n 2
-32-w
ire "S
pyB
iWire
": Set ju
mpers
JP
4 to
JP
9 to
positio
n 1
-2
connectio
n b
y v
ia
DN
P
DN
P
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2
C1
C4
R1
12
34
56
78
910
BO
OT
ST
R2R3
123
J2
J1
1 2 3
JP
1
1 2
12J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R5 R6
R7
Q1
C3
C6
C7
D1
R10
12J
P10
D2
R11
12J
P11
D3
R12
JP
2
1 2
C8
C9
R8R9
Q2
SV
4
12345678910
11
12
SV1
123456789
101112
SV
2
1 2 3 4 5 6 7 8 910
11
12
SV3
123456789101112
1_P
1.0
1
2_P
1.1
2
3_P
1.2
3
4_P
3.0
4
5_P
3.1
5
6_P
3.2
6
7_P
3.3
7
8_P
4.7
8
9_P
1.3
9
10_P
1.4
10
11_P
1.5
11
12_P
J.0
_T
DO
12
13_PJ.1_TDI13
14_PJ.2_TMS14
15_PJ.3/TCK15
16_P4.016
17_P4.117
18_P4.218
19_P4.319
20_P2.520
21_P2.621
22_TEST/SBWTCK22
23_RST/SBWTDIO23
24_P2.024
25_P
2.1
25
26_P
2.2
26
27_P
3.4
27
28_P
3.5
28
29_P
3.6
29
30_P
3.7
30
31_P
1.6
31
32_P
1.7
32
33_P
4.4
33
34_P
4.5
34
35_P
4.6
35
36_D
VS
S36
37_DVCC 3738_P2.7 3839_P2.3 3940_P2.4 40
41_AVSS 4142_HFXIN 42
43_HFXOUT 4344_AVSS 4445_LFXIN 45
46_LFXOUT 4647_AVSS 4748_AVCC 48
U1
SW
1
R13
TP2TP1
SW2
R14
P1.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
GN
D
P1.1
P1.1
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IORST/SBWTDIO
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
PJ.0
/TD
O
PJ.0
/TD
O
PJ.2
/TM
S
PJ.2/TMS
PJ.3
/TC
K
PJ.3/TCK
PJ.1
/TD
I
PJ.1/TDI
P1.2
P1.2
P2.0
P2.0
P2.1
P2.1
P1.3
P1.3
P1.4
P1.5
AVCC
AV
CC
AVSS
AV
SS
AVSS
AVSS
LF
XO
UT
LF
XIN
LF
GN
DH
FG
ND
HF
XO
UT
HF
XIN
P2.4P2.3P2.7DVCC
DV
CC
DV
CC
DVCC
DV
SS
DV
SS
P4.6
P4.5
P4.4
P1.7
P1.6
P3.7
P3.6
P3.5
P3.4
P2.2
P2.6P2.5P4.3P4.2P4.1P4.0
P4.7
P3.3
P3.2
P3.1
P3.0
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
1
TEST/SBWTCK
TE
ST
/SB
WT
CK
www.ti.com MSP-TS430RGZ48C
B.18 MSP-TS430RGZ48C
Figure B-35. MSP-TS430RGZ48C Target Socket Module, Schematic
83SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP1Open to measure current
Connector J2External power connectorJumper J1 to "ext"
Jumpers JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Switch SW1Device reset
LEDs connected toP1.0, P1.1, P1.2 viaJP9, JP10, JP11(only D1 assembled)
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor ToolBootloader
Jumper J11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP2Analog/digital power
Switch SW2Connected to P1.3
HF ands LF oscillators with capacitorsand resistors to connect pinheads
1
Vccext
int
Vcc
GND
GND
JTAG
SBW
5
10
1520
25
30
35
40 45
RESET
Ext.Pwr.
PWR
DVCCAVCC
TCK TMS TDI TDO
RST/SBWTDIO TEST/SBWTCK
GND
GND
P1
.3
14
1
2
10
1
2
12
3
123
123
123
123
123
123
QFN11T048-008 A101121
Clamshell
MSP-TS430RGZ48CRev. 1.2 RoHS
Q2
Q1
P1
.0
P1
.1
P1
.2
JTA
G
C2
C1
C4
R1
BO
OT
ST
R2
R3
J2
J1
JP
1
JP
9
C5
R4
JP3JP4JP5JP6JP7JP8
R5
R6
R7
C3
C6
C7
D1
R1
0JP
10
D2
R11
JP
11
D3
R1
2
JP
2
C8
C9
R8
R9
U1
SW
1
R1
3
TP2
TP1
SW
2
R1
4
MSP-TS430RGZ48C www.ti.com
Figure B-36. MSP-TS430RGZ48C Target Socket Module, PCB
NOTE: LFOSC and HFOSC pins are swapped at SV1.42_HFXIN (pin 42) → SV1 (pin 7)43_HFXOUT (pin 43) → SV1 (pin 6)45_LFXIN (pin 45) → SV1 (pin 10)46_LFXOUT (pin 46) → SV1 (pin 9)
84 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430RGZ48C
Table B-19. MSP-TS430RGZ48C Bill of MaterialsNumber
Pos Ref Des Per Description Digi-Key Part Number CommentBoard
1 SV1, SV2, SV3, 4 12-pin header, TH DNP: headers and receptacles enclosed with kit.SV4 Keep vias free of solder.
SAM1029-12-ND : Header
: Receptacle
1.1 SV1, SV2, SV3, 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit.SV4 Keep vias free of solder.
: Header
SAM1213-12-ND : Receptacle
2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP
4 J1, JP3, JP4, JP5, 7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP6, JP7, JP8
5 J2 1 3-pin header, male, TH SAM1035-03-ND
6 JP1, JP2, JP9, J1, 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,JP3, JP4, JP5, JP6, JP7, JP8JP7, JP8
7 R2, R3, R5, R6, R8, 9 DNP, 0805 DNPR9, R10, R11, R14
8 R12, R13, R7 3 0R, 0805 541-000ATR-ND
9 C5 1 1.1nF, CSMD0805 490-1623-2-ND
10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND
11 R4 1 47k, 0805 541-47000ATR-ND
12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND
13 R1 1 330R, 0805 541-330ATR-ND
14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP
15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP
16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
17 JTAG 1 14-pin connector, male, TH HRP14H-ND
18 Q1 1 DNP: MS3V-TR1 (32768kHz, depends on application Micro Crystal, DNP, enclosed in kit, keep vias free of20ppm, 12.5pF) solder
19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder
20 U1 1 Socket: QFN11T048-008 Manuf.: YamaichiA101121-001
20.1 U1 1 MSP430FR5969IRGZ DNP: enclosed with kit. Is supplied by TI.
21 D1 1 green LED, DIODE0805 P516TR-ND
22 D3 1 red (DNP), DIODE0805 DNP
23 D2 1 yellow (DNP), DIODE0805 DNP
24 TP1, TP2 2 Testpoint DNP, keep pads free of solder
25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side
26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48C 2 layers, black solder maskRev. 1.2
85SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
ML
14
LED3
0R
12
pF
12
pF
12
pF
12
pF
GN
D
GND
0R
100nF
56
0R
ML
10
JP1Q
JP
1Q
10uF/6,3V
10uF/10V
47K10nF
0R
0R
0R
-
-
0R
-
0R
0R
FE
16
-1-1
FE16-1-2
FE
16
-1-3
FE16-1-4
PWR3
GN
DG
ND
-
MS
P6
4P
M
not assembled
not a
ssem
ble
d
not a
ssem
ble
d
not a
ssem
ble
d
enhancement
reserved forfuture
JTA
G
1 3 5 7 9 11
13
2 4 6
12
148
10
D1
R2
C2
C1
C3
C4
R1
C5
R3
BO
OT
ST
12
34
56
78
91
0
J71 2
J6
12
C6
C7
R5C8
R6
R7
R8
R9
R10
R11
R12
R13
R14
12345678910
11
12
13
14
15
16
J1
J2
17181920212223242526272829303132
J3
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49505152535455565758596061626364
J4
J5123
R4
Q1
LFXTCLK
XTCLK
U2
DV
CC
234567XIN
XO
UT
10
11
12
13
14
15
16
17181920212223242526272829303132
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
4950515253
TDOTDI
TMSTCKRST
596061
AVSSDVSSAVCC
RS
T/N
MI
TC
KT
MS
TD
IT
DO
VC
C
Da
te:
3/1
4/2
00
6 1
0:4
6:3
0A
MS
he
et:
1/1 R
EV
:
TIT
LE
:
Do
cu
me
nt N
um
be
r:
MS
P-T
S4
30
PM
64
+
+
1
MS
P-T
S4
30
PM
64
Ta
rge
t So
cke
t PM
64
Ya
ma
ich
iIC
51
-06
44
-80
7
So
cke
t:
1.2
for F
14
x a
nd
F4
1x
Op
en
J6
if LC
D
is c
on
ne
cte
d
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R8
an
d a
dd
R9
(0 O
hm
)
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R11
an
d a
dd
R1
0 (0
Oh
m)
Fo
r BS
Lu
sa
ge
ad
d:
R6
R7
R1
3 R
14
MS
P4
30
F1
4x : 0
0 o
pe
n o
pe
nM
SP
43
0F
41
x : o
pe
n o
pe
n 0
0
MSP-TS430PM64 www.ti.com
B.19 MSP-TS430PM64
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not bemade.
Figure B-37. MSP-TS430PM64 Target Socket Module, Schematic
86 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Connector J5External power connectionRemove R8 and jumper R9
D1LED connected to pin 12
Jumper J6Open to disconnect LED
Jumper J7Open to measure current
Orient Pin 1 ofMSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
www.ti.com MSP-TS430PM64
Figure B-38. MSP-TS430PM64 Target Socket Module, PCB
87SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430PM64 www.ti.com
Table B-20. MSP-TS430PM64 Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only recommendation.1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C63 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND
DNP: Headers and receptaclesenclosed with kit.Keep vias freeof solder.7 J1, J2, J3, J4 0 16-pin header, TH
SAM1029-16-ND : HeaderSAM1213-16-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header11 2 Jumper 15-38-1024-ND Place on: J6, J712 JTAG 1 14-pin connector, male, TH HRP14H-ND13 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
Q1: Micro Crystal MS1V-T1K14 Q1, Q2 0 Crystal DNP: Keep vias free of solder32.768kHz, C(Load) = 12.5pF15 R3 1 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,R6, R7, R8, DNP: R4, R6, R7, R9, R10,16 3 0 Ω, SMD0805 541-000ATR-NDR9, R10, R11, R11, R12, R13, R14
R12, R13, R1417 R5 1 47k Ω, SMD0805 541-47000ATR-ND18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi19 PCB 1 78 x 75 mm 2 layers
Rubber20 4 select appropriate Apply to corners at bottom sidestandoffMSP430F2619IPM DNP: Enclosed with kit supplied21 MSP430 22 MSP430F417IPM by TI
88 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
0R
12
pF
12
pF
GN
D
GN
D
0R
10
0n
F
33
0R
10
uF
/6.3
V
0R
0R
0R
0R
PWR3
GN
D
47
k
2.2
nF
33
0R
GN
D
GN
D
10
0n
F
GN
D
0R
0R
MS
P-T
S4
30
PM
64
ATa
rge
t So
cke
t
DN
P
Yam
aic
hi
IC51-0
644-8
07
Socket:
DN
P
1.1
for F
41
52
Open J
P1 if L
CD
is c
onnecte
d
JTA
G ->
SB
W ->
DN
P
DN
P
DN
P
DN
PD
NP
DN
PD
NP
Vccext
int
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IOP
7.0
/TD
OP
7.1
/TD
IP
7.2
/TM
SP
7.3
/TC
K
AD
D L
CD
-CA
P!
DN
PDN
P
JTA
G
1 3 5 7 9 11
13
2 4 6
12
148
10
R2
C2
C1 R
1
C5
R3
BO
OT
ST
12
34
56
78
91
0
C6
R1
0R
11
R1
3R
14
12345678910
11
12
13
14
15
16
J1
17181920212223242526272829303132
J2
J3
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49505152535455565758596061626364
J4
J5123
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32313029282726252423222120191817
16 12345678911
12
13
14
15
10
64636261605958575655545352515049
21
Q1
R4
C3
1 2 3JP
4JP
5
1 2 3
JP
6
1 2 3
JP
7
1 2 3
JP
8
1 2 3
R6
JP
9
1 2 3
12
JP
1
JP
2
1 2
JP
3
1 2 3
D1
C4R
5
R7
RS
T/N
MI
TM
ST
DI
VC
C
GN
D XT
LG
ND
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
VC
C430
VC
C430
VC
C430
P5.1
P5.1 A
VC
C
AV
CC
AV
SS
AV
SS
P1.0
P1.1
XIN
XO
UT
A
AA
B
BB
C
C
D
D
E
E
F
F
Da
te:
3/2
9/2
011
3:0
7:0
2 P
MS
he
et:
1/1 R
EV
:
TIT
LE
:
Do
cu
me
nt N
um
be
r:
MS
P-T
S4
30
PM
64
A
+
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IO
If supplie
d lo
cally
: popula
te R
10 (0
R), re
move R
11
If supplie
d b
y in
terfa
ce: p
opula
te R
11 (0
R), re
move R
10
www.ti.com MSP-TS430PM64A
B.20 MSP-TS430PM64A
Figure B-39. MSP-TS430PM64A Target Socket Module, Schematic
89SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP2Open to measure current
Jumper JP1Open to disconnect LED
D1LED connected to P5.1
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Connector J5External power connectorJumper JP3 to "ext"
MSP-TS430PM64A www.ti.com
Figure B-40. MSP-TS430PM64A Target Socket Module, PCB
90 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PM64A
Table B-21. MSP-TS430PM64A Bill of Materials
Pos. Ref Des No. per Board Description Digi-Key Part No. Comment1 C1, C2, 0 12pF, SMD0805 DNP2 C3 0 2.2nF, SMD0805 DNP3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND4 C4, C5 2 100nF, SMD0805 478-3351-2-ND5 D1 1 green LED, SMD0805 P516TR-ND
DNP: Headers and receptaclesenclosed with kit. Keep viasfree of solder.6 J1, J2, J3, J4 0 16-pin header, TH
SAM1029-16-ND : HeaderSAM1213-16-ND : Receptacle
J5, JP3, JP4,7 JP5, JP6, JP7, 8 3-pin header, male, TH SAM1035-03-ND
JP8, JP98 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 2 Jumper 15-38-1024-ND Place on: J6, J710 JTAG 1 14-pin connector, male, TH HRP14H-ND11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
Micro Crystal MS1V-T1K12 Q1 0 Crystal DNP: Keep vias free of solder32.768kHz, C(Load) = 12.5pF13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R5, DNP: R5, R7, R9, R10, R11,14 R7, R9, R10, 2 0 Ω, SMD0805 541-000ATR-ND R13, R14R11, R13, R1415 R4 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi17 PCB 1 78 x 75 mm 4 layers
Rubber stand18 4 select appropriate Apply to corners at bottom sideoffDNP: Enclosed with kit19 MSP430 2 MSP430F4152IPM supplied by TI
91SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
DN
P
DN
PD
NP
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
Socket:
Yam
aic
hi IC
51-0
644-8
07
12pF
12pF
100nF
33
0R
47
K
1.1nF
QUARZ5
10uF
/10V
0R
0R
LE
D_G
reen
33
0R
LE
D_G
reen
33
0R
LE
D_G
reen
EV
Q11
EV
Q11
MS
P430F
R413xIP
M / M
SP
430F
R203xIP
M
0R
0R
10
0n
F
10
0n
F
10
0n
F
10
0n
F
Ext_
PW
R
Vcc
ext
int
to m
easure
supply
curre
nt
JTA
G ->
SB
W ->
JTA
G-M
ode s
ele
ctio
n:
4-w
ire J
TA
G: S
et ju
mpers
J4 to
J9 to
positio
n 2
-32-w
ire "S
pyB
iWire
": Set ju
mpers
JP
4 to
JP
9 to
positio
n 2
-1
DN
P
DN
P
BS
LT
XB
SLR
X
MS
P-T
S430P
M64D
Targ
et S
ocket B
oard
for M
SP
430F
R413xIP
M a
nd M
SP
430F
R203xIP
M
1.0
Disconnect JP3 andJP4 before BSL use.
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2
C1
C4
R1
R4
C5
123
J5
12J
P3
1 2
JP
2
JP
1
1 2 3
JP
10
1 2 3
JP
9
1 2 3
JP
8
1 2 3
JP
7
1 2 3
JP
6
1 2 3
JP
5
1 2 3
Q1
C3
12
34
56
78
91
0
BS
LR
10
R11
D1
R5
D2
R6
D3
SW
1
SW
2
P4
.7/R
13
1
P4
.6/R
23
2
P4
.5/R
33
3
P7.5/L5 59
DV
SS
8
DV
CC
9
TE
ST
/SB
WT
CK
111
RS
T/N
MI/S
BW
TD
IO1
0
P1.0/UCA0TXD/UCA0SIMO/A024P1.1/UCA0RXD/UCA0SOMI/A123P1.2/UCA0CLK/A222P1.3/UCA0STE/A321P1.4/MCLK/TCK/A420P1.5/TA0CLK/TMS/A519P1.6/TA0.2/TDI/TCLK/A618P1.7/TA0.1/TDO/A717
P7.1/L1 63
P7.2/L2 62
P7.3/L3 61
P7.4/L4 60
P7.0/L0 64
P4
.4/L
CD
C2
4
P4
.3/L
CD
C1
5
P4
.2/X
OU
T6
P4
.1/X
IN7
P4
.0/T
A1
.11
2
P8
.3/T
A1
.21
3
P8
.2/T
A1
CL
K1
4
P5.5/L3727
P5.4/L3628
P5.3/UCB0SOMI/UCB0SCL/L3529
P5.2/UCB0SIMO/UCB0SDA/L3430
P5.1/UCB0CLK/L3331
P5.0/UCB0STE/L3232
P3.0/L8 56
P3.1/L9 55
P3.2/L10 54
P3.3/L11 53
P3.4/L12 52
P3.5/L13 51
P3.6/L14 50
P3.7/L15 49
P6
.0/L
16
48
P6
.1/L
17
47
P6
.2/L
18
46
P6
.3/L
19
45
P6
.4/L
20
44
P6
.5/L
21
43
P2
.0/L
24
40
P2
.1/L
25
39
P2
.2/L
26
38
P2
.3/L
27
37
P2
.4/L
28
36
P2
.5/L
29
35
P2
.6/L
30
34
P2
.7/L
31
33
P8
.1/A
1C
LK
/A9
15
P8
.0/S
MC
LK
/A8
16
P5.6/L3826P5.7/L3925
P6
.6/L
22
42
P6
.7/L
23
41
P7.6/L6 58
P7.7/L7 57
U1
12345678910
11
12
13
14
15
16
J1
17181920212223242526272829303132
J2
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
J3
49505152535455565758596061626364
J4
R2
R3
C6
C7
C8
C9
TP2TP1
12J
P4
XO
UT
XO
UT
GND
GND
GN
D
XIN
XIN
VC
C
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
TC
K
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
VC
C430
VC
C430
P1.4
/TC
K
P1.4/TCK
P1.5
/TM
S
P1.5/TMS
P1.6
/TD
I
P1.6/TDI
P1.7
/TD
O
P1.7/TDO
TD
O/S
BW
TD
IO
RS
T/N
MI
TM
ST
DI
P1.0
P1.0
P1.0
P1.1
P1.1
P1.1
P1.2
P1.2
P1.3
P1.3
P4.7
P4.7
P4.6
P4.6
P4.5
P4.5
P4.4
P4.4
P4.3
P4.3
BS
LIn
terfa
ce
1 2 3 4 5 6
1 2 3 4 5 6
Tite
l:
Datu
m:
Seite
1/1
MS
P-T
S430P
M64D
9/3
/2014 3
:08:1
8 P
MA
3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Rev.:
MSP-TS430PM64D www.ti.com
B.21 MSP-TS430PM64D
Figure B-41. MSP-TS430PM64D Target Socket Module, Schematic
92 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
P1.2
P1.1
P1.0
P1.3
RESET
VCCint
ext
JTAG->
SBW->
MS
P-T
S4
30
PM
64
DR
ev.
1.0
Ro
HS
Cu
rr.
Me
as. GND
GND
Disconnect JP3 andJP4 before BSL use!
14
1
2
GND
GND
VCC
12
3
12
3
12
3
12
3
12
3
12
3
12
3
10
1
2
IC51-0644-807
Clamshell
116
510
32 17202530
33
48
35
40
45
49 6455 60
JTA
G
C2
C1
C4
R1
R4 C5
J5
JP3
JP
2JP
1
JP
10
JP
9
JP
8
JP
7
JP
6
JP
5
Q1
C3
BS
L
R10
R11
D1
R5 D2
R6 D3
SW
1S
W2U1
J1
J2
J3
J4
R2
R3
C6
C7
C8
C9
TP2
TP1
JP4
Connector J5External power connector
Jumper JP1 to "ext"
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Switch SW1Device reset
Orient Pin 1 ofMSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP2Open to measure current
Switch SW2Connected to P1.3
www.ti.com MSP-TS430PM64D
Figure B-42. MSP-TS430PM64D Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must bepopulated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board issupplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
93SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430PM64D www.ti.com
Table B-22. MSP-TS430PM64D Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 PCB 1 90x96 mm MSP-TS430PM64D Rev. 1.0 2 layers, 90x96mm, white solder
mask2 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder3 D1 1 Green LED, HSMG-C170, 516-1434-1-ND Avago, Farnell 5790852
DIODE08054 D2, D3 2 LED, DIODE0805 DNP5 JP2, JP3, 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
JP46 JP1, JP5, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 (JTAG)
JP6, JP7,JP8, JP9,JP10
7 R1 1 330R, 0805 541-330ATR-ND8 R5, R6 2 330R, 0805 541-330ATR-ND DNP9 R2, R3, 4 0R, 0805 541-0.0ATR-ND DNP
R10, R1110 R4 1 47K, 0805 311-47KARTR-ND11 C1, C2 2 12pF, CSMD0805 709-1169-2-ND12 C3 1 10uF/10V, CSMD0805 445-1371-2-ND13 C4 1 100nF, CSMD0805 311-1245-2-ND14 C6, C7, 4 100nF, CSMD0805 311-1245-2-ND DNP
C8, C915 C5 1 1.1nF, CSMD0805 490-1623-2-ND16 J1, J2, J3, 1 16-pin header, TH SAM1029-16-ND DNP: headers and receptacles,
J4 enclosed with kit. Keep vias freeof solder.
17 J1, J2, J3, 1 16-pin receptable, TH SAM1213-16-ND DNP: headers and receptacles,J4 enclosed with kit. Keep vias free
of solder.18 JTAG 1 14-pin connector, male, TH HRP14H-ND19 U1 1 Socket IC51-0644-807 Manuf.: Yamaichi20 U1 2 MSP430FR4133IPM DNP: enclosed with kit. Is
supplied by TI.21 J5 1 3-pin header, male, TH SAM1035-03-ND22 Q1 1 Microcrystal 32768Hz, MS3V-T1R
(32.768kHz, 20ppm, 12.5pF)23 SW1, SW2 2 Panasonic EVQ11 P8079STB-ND DNP, Lacon: 125145924 Rubber 4 Buerklin: 20H1724 apply to corners at bottom side
stand off
94 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
DN
P
Socket:
Yam
aic
hi C
51-0
644-8
07
I2C
UA
RT
P1.7
P2.1
Jum
pers
JP
3 to
JP
8C
lose 1
-2 to
debug in
Spy-B
i-Wire
mode.
Clo
se 2
-3 to
debug in
4-w
ire J
TA
G m
ode.
BS
LTool S
ele
ct:
Open =
BS
LC
onnecto
rC
losed =
JTA
G C
onnecto
r
DN
P
DN
P
GN
D
GN
D
100nF
33
0R
0R0R
GN
D
GN
D
1.1
nF
47
kG
ND
0R 0R
QU
AR
Z5
1uF
/10V
100nF
1uF/10V
gre
en
DN
P
yello
w (D
NP
) DN
P
red (D
NP
)
0R
GN
DD
NP
DN
P
0R0R
QUARZ5
EV
Q11
0R
DNP
DN
P
100nF
GN
D
100nF
GN
D
4u7
GN
D
MS
P4
30
FR
69
7X
PM
/RG
C
SAM1129-16-ND
SA
M1129-1
6-N
D
SAM1129-16-ND
SA
M1129-1
6-N
D
10
k1
0k
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R3
an
d a
dd
R2
(0 O
hm
)
Ext_
PW
R
MS
P-T
S4
30
PM
64
F
Vcc
int
ext
DN
PD
NP
DN
P
JTA
G ->
SB
W ->
DN
P
DN
P
1.0
DN
P
DN
PD
NP
connectio
n b
y v
ia
Ta
rge
t So
cke
t Bo
ard
for M
SP
43
0F
R6
97
x/6
87
x d
evic
es
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C9
C8
C4
R1
12
34
56
78
91
0
BS
L
R2R3
123
J2
1 2 3
J1
1 2
JP
1
12J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R9 R8
Q2
C3
C11
C7
D1
R1
0
12J
P10
D2
R11
12J
P11
D3
R1
2
1 2
JP
2
C1
C2
R6R5
Q1
SW
1
R1
3
TP2TP1
SW2
R1
4
C10
C6
C15
P4
.3/U
CA
0S
OM
I/UC
A0
RX
D/U
CB
1S
TE
/S4
1
P1
.4/U
CB
0C
LK
/UC
A0
ST
E/T
A1
.0/S
32
P1
.5/U
CB
0S
TE
/UC
A0
CL
K/T
A0
.0/S
23
P1
.6/U
CB
0S
IMO
/UC
B0
SD
A/T
A0
.1/S
14
P1
.7/U
CB
0S
OM
I/UC
B0
SC
L/T
A0
.2/S
05
R3
3/L
CD
CA
P6
P6
.0/R
23
7
P6
.1/R
13
/LC
DR
EF
8
P6
.2/C
OU
T/R
03
9
P6
.3/C
OM
01
0
P6
.4/T
B0
.0/C
OM
1/S
30
11
P6
.5/T
B0
.1/C
OM
2/S
29
12
P6
.6/T
B0
.2/C
OM
3/S
28
13
P3
.0/U
CB
1C
LK
/TA
3.2
/S2
71
4
P3
.1/U
CB
1S
IMO
/UC
B1
SD
A/T
A3
.3/S
26
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www.ti.com MSP-TS430PM64F
B.22 MSP-TS430PM64F
Figure B-43. MSP-TS430PM64F Target Socket Module, Schematic
95SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
1412
1012
IC51-0644-807
Clamshell
15
10
15
202530
35
40
45
50 55 60
R1
C11
D1
R1
0D
2
R11
D3
U1
J3
J4
J5
J6
R7
R15
Jumper J11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Orient Pin 1 of MSP430 device
LEDs connected toP1.0, P1.1, P1.2 from
JP9, JP10, JP11(only D1 assembled)
Switch SW2Connected to P1.3
Switch SW1Device reset
Connector J2External power connector
Jumper J1 to “ext”
HF and LF oscillators with capacitorsand resistors to connect pinheads
Connector JTAGFor JTAG Tool
Connector BSLFor Bootloader
Jumper JP1, JP2Open to measure
digital or analog current
Jumper JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
BSL Tool SelectJumper JP13 to JP15Open = BSL ConnectorClose = JTAG Connector
Close JP17 and JP18to enable BSL pullups
BSL Interface SelectJumper J16
Close 1-2 for I CClose 2-3 for UART
2
Jumper Configuration UART BSL Configuration I C BSL Configuration2
JP17 and JP18 Open Close
JP16 Close 2-3 (UART) Close 1-2 (I2C)
This target board supports UART or I C BSL configuration. To select the configuration to use, set thejumpers as shown in the following table.
2
MSP-TS430PM64F www.ti.com
Figure B-44. MSP-TS430PM64F Target Socket Module, PCB
96 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PM64F
Table B-23. MSP-TS430PM64F Bill of Materials (BOM)
NumberPos. Ref Des per Description DigiKey Part Number Comment
Board1 PCB 1 90.0 x 92.5 mm MSP-TS430PM64F Rev. 1.0 2 layers, purple solder mask
JP1, JP2, JP9,2 6 2-pin header, male, TH SAM1035-02-ND place jumper on headerJP13, JP14, JP15,3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on header's pin1 only4 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
JP3, JP4, JP5, JP6,6 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP7, JP8, JP167 J2 1 3-pin header, male, TH SAM1035-03-ND8 R2, R5, R6, R8, R9 5 0R, 0805 541-0.0ATR-ND DNP9 R3, R12, R13 3 0R, 0805 541-0.0ATR-ND10 C5 1 1.1nF, CSMD0805 490-1623-2-ND11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND12 C15 1 4u7, CSMD0805 445-1370-1-ND DNP13 R7, R15 1 10k, 0805 541-10KATR-ND14 R4 1 47k, 0805 541-47KATR-ND15 C4, C6, C10, C11 4 100nF, CSMD0805 490-1666-1-ND16 R1 1 330R, 0805 541-330ATR-ND17 R10, R11 2 330R, 0805 541-330ATR-ND DNP18 R14 1 47k, 0805 541-47KATR-ND DNP19 C1, C2, C8, C9 4 DNP, CSMD0805 DNP20 SW2 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 125145921 SW1 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459
DNP: headers enclosed with kit.22 J3, J4, J5, J6 4 16-pin header, TH SAM1029-16-ND Keep vias free of solder.DNP: receptacles enclosed with kit.23 J3, J4, J5, J6 4 16-pin receptacle, TH SAM1213-16-ND Keep vias free of solder.
24 TP1, TP2 2 Testpoint DNP, keep pads free of solder25 BSL 1 10-pin connector, male, TH HRP10H-ND26 JTAG 1 14-pin connector, male, TH HRP14H-ND27 U1 1 Socket:IC51-0644-807 Manuf. Yamaichi
DNP: enclosed with kit.28 U1 2 MSP430FR6972IPMR Is supplied by TI.DNP: MS3V-TR1 Micro Crystal, DNP, enclosed in kit,29 Q1 1 depends on application(32,768kHz/ 20ppm/12,5pF) keep vias free of solder
30 Q2 1 DNP, Crystal depends on application DNP, keep vias free of soldergreen LED, HSMG-C17031 D1 1 516-1434-1-ND Avago, Farnell 5790852DIODE0805
32 D3 1 red (DNP), DIODE0805 DNP33 D2 1 yellow (DNP), DIODE0805 DNP34 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side
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MSP-TS430RGC64B www.ti.com
B.23 MSP-TS430RGC64B
Figure B-45. MSP-TS430RGC64B Target Socket Module, Schematic
98 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP2Open to disconnect LED
Connector J5External power connectorJumper JP3 to "ext"Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
D1LED connected to P1.0
If the system shouldbe supplied from LDOI (J6),close JP4 and set JP3 to "ext"
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1Open to measure current
www.ti.com MSP-TS430RGC64B
Figure B-46. MSP-TS430RGC64B Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R11 or R12 must bepopulated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board issupplied externally, R12 (0 Ω) must be assembled, and R11 must be removed.
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MSP-TS430RGC64B www.ti.com
Table B-24. MSP-TS430RGC64B Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C3, C4 0 47pF, SMD0805 DNP3 C6, C7, C10 3 10uF, 6.3V, SMD0805
C5, C11,4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND
C155 C8 1 2.2nF, SMD08056 C9 1 470nF, SMD0805 478-1403-2-ND7 C16 1 4.7uF, SMD08058 C17 1 220nF, SMD08059 D1 1 green LED, SMD0805 P516TR-ND
SAM1029-16-ND (Header) DNP: Headers and receptacles enclosed10 J1, J2, J3, J4 0 16-pin header, TH SAM1213-16-ND with kit. Keep vias free of solder:(Receptacle)11 J5 , J6 2 3-pin header, male, TH
JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,JP6, JP7,12 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers onJP8, JP9, pins 1-2 on JP3,JP10JP1, JP2,13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4
14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 1315 JTAG 1 14-pin connector, male, TH HRP14H-ND16 BOOTST 0 10-pin connector, male, TH "DNP Keep vias free of solder"
Micro Crystal MS3V-T1R17 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pFQ2: 4MHz Buerklin:18 Q2 0 Crystal DNP: Q2 Keep vias free of solder78D134http://www.ettinger.de/Art_Insulating19 0 Insulating disk to Q2 Detail.cfm?ART_ARTNUMdisk to Q2 =70.08.121
20 R3, R7 2 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,
R6, R8,21 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10, R11,R12
22 R5 1 47k Ω, SMD0805 541-47000ATR-NDSocket: QFN11T064-006-23 U1 1 Manuf.: YamaichiN-HSP
24 PCB 1 85 x 76 mm 2 layersAdhesive Approximately 6mm width, for example, 3M Bumpons25 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-5302
26 D3,D427 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI
100 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430RGC64C
B.24 MSP-TS430RGC64CThe MSP-TS430RGC64C target board has been designed with the option to operate with the targetdevice DVIO input voltage supplied via header J6 (see Figure B-47). This development platform does notsupply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper deviceoperation. For correct JTAG connection, programming, and debug operation, it is important to follow thisprocedure:1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully
discharged to 0 V.2. Enable the 1.8-V external DVIO power supply.3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSP-
FET430UIF JTAG debugger interface).4. Connect the MSP-FET430UIF JTAG connector to the target board.5. Start the debug session using IAR or CCS IDE.
For more information on debugging the MSP4and MSP430F525x, see the device-specific data sheets(MSP430F522x: SLAS718; MSP430F525x: SLAS903) and Designing with MSP430F522x andMSP430F521x Devices (SLAA558).
For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain,short JP4 with the jumper.
101SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
1.1
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23 P1.5/TA0.4
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25 P1.7/TA1.0
26 P2.0/TA1.1
27 P2.1/TA1.2
28 P2.2/TA2CLK/SMCLK
29 P2.3/TA2.0
30 P2.4/TA2.1
31 P2.5/TA2.2
32 P2.6/RTCCLK/DMAE0
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54P7.5/TB0.5
55BSLEN
56RST/NMI
57P5.2/XT2IN
58P5.3/XT2OUT
59TEST/SBWTCK
60PJ.0/TDO
61PJ.1/TDI/TCLK
62PJ.2/TMS
63PJ.3/TCK
64RSTDVCC/SBWTDIO
65 THERMAL_1
66 THERMAL_2
67 THERMAL_3
68 THERMAL_4
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MSP-TS430RGC64C www.ti.com
Figure B-47. MSP-TS430RGC64C Target Socket Module, Schematic
102 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Connector J5External power connector for DVCCSet jumper JP3 to "ext"
IMPORTANT NOTE:Rev1.0 of the board does not haveconnection from pin 4 of BOOTST topin 64 of MCU. To use BSL, these pinsshould be connected by a wire.
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Orient Pin 1 of MSP430 device
Jumper JP4For F524x devices, close.For F522x, F523x, and F525x devices,close only if one power supply is usedfor VCC and DVIO, and if VCC is nothigher then 1.98 V. Otherwise, supplyDVIO over J6.Do not close if VCC > 1.98 V, as it maydamage the chip.
Connector J6External power connectorto supply DVIO
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supplyJumper JP1Open to measure current
www.ti.com MSP-TS430RGC64C
Figure B-48. MSP-TS430RGC64C Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R11 or R12 must bepopulated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board issupplied externally, R12 (0 Ω) must be assembled, and R11 must be removed.
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Table B-25. MSP-TS430RGC64C Bill of MaterialsItem Qty Reference Value Description Comment Supplier No.
1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2
2 0 C3, C4 CAP, SMD, Ceramic, 0805 DNP C3 C4
4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805
5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 Digi-Key: 311-1245-2-ND
5 5 C8 2.2nF CAP, SMD, Ceramic, 0805
6 1 C9 470nF CAP, SMD, Ceramic, 0805 Digi-Key: 478-1403-2-ND
7 1 C16 4.7uF CAP, SMD, Ceramic, 0805
8 1 D1 Green LED LED, SMD, 0805
DNP: headers andreceptacles enclosed withPin header 1x16: Grid: 100mil9 4 J1-J4 16-pin header kit. Keep vias free of solder.(2.54 mm) : Header SAM1029-16-ND: Receptacle SAM1213-16-ND
Pin header 1x3: Grid: 100mil (2.5410 2 J5, J6 3-pin header, male, TH SAM1035-03-NDmm)
JP5, JP6, JP7, Pinheader 1x3: Grid: 100mil (2.5411 3-pin header, male, TH place jumpers on pins 2-3 SAM1035-03-NDJP8, JP9, JP10 mm)
Pin header 1x3: Grid: 100mil (2.5412 JP3 3-pin header, male, TH place jumper on pins 1-2 SAM1035-03-NDmm)
Pin header 1x2; Grid: 100mil (2.5413 JP1, JP2, JP4 2-pin header, male, TH place jumper on header SAM1035-02-NDmm)
Place on: JP1, JP2, JP3,14 10 Jumper JP4, JP5, JP6, JP7, JP8, 15-38-1024-ND
JP9, JP10
Header, THD, Male 2x7 Pin,15 1 JTAG 2x7Pin,Wanne HRP14H-NDWanne, 100mil spacing
Header, THD, Male 2x5 Pin,16 0 BOOTST 2x5Pin,Wanne DNPWanne, 100mil spacing
17 1 Q1 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz Only Kit.
18 0 Q2 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz 300-8219-1-ND
19 1 D3 LL103A DIODE, SMD, SOD123, Schottky Buerklin: 24S3406
20 2 R3, R7 330 Ohm, SMD0805 541-330ATR-ND
21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-47000ATR-ND
R1, R2, R4, R6, DNP: R6, R8, R9, R10,22 R8, R9, R10, 0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-000ATR-NDR11,R12R11, R12
23 1 U1 Socket: QFN11T064-006-N-HSP Manuf.: Yamaichi
IC, MCU, SMD, 9.15x9.15mm24 2 MSP430 MSP430F5229IRGCR Thermal Pad with Socket
apply to corners at bottom25 4 Rubber stand off Rubber stand off Buerklin: 20H1724side
26 1 PCB 84 x 76 mm 84 x 76 mm
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B.25 MSP-TS430RGC64USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.
Figure B-49. MSP-TS430RGC64USB Target Socket Module, Schematic
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141
2
GN
D
GN
D
VC
C
12
3
12
3
12
3
12
3
12
3
12
3
123
123
4964
11
6
3217
33
48
QFN11T064-006
Clamshell
Vccext int
MSP-TS430RGC64USBRev.: 1.4 RoHS
SBW ->
JTAG ->
1
JTA
G
R2
C2C1
C3
C4
R1
C5
R3
+
C6
+C
7
C8
J5
JP
1
JP
2
R4
JP
5
JP
6
JP
7
JP
8
JP
9
JP
10
R7R
5
C11C1
2
D1
C9
C1
3
C1
0
R6
R8
R9
R1
2
JP3
US
B1
R3
3
C3
5
C36
R3
4R
35
R3
6
C39
D2
IC7
C4
0C
33
C3
8
JP4
LE
D3
S1
S2
R1
3 LE
D1
R1
5L
ED
2R
16
LED
S3
R1
0
C1
4
R11
D3
D4
J4
J1
J2
J3
U1
Q1
Q2
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
USB1USB connector
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumper JP1Open to measure current
MSP-TS430RGC64USB www.ti.com
Figure B-50. MSP-TS430RGC64USB Target Socket Module, PCB
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Table B-26. MSP-TS430RGC64USB Bill of Materials
No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD08052 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
C5, C11, C13,3 4 100nF, SMD0805 311-1245-2-NDC143.1 C10, C12 0 10uF, SMD0805 DNP: C10, C124 C8 1 2.2nF, SMD08055 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7 J1, J2, J3, J4 4 16-pin header, TH
SAM1029-16-ND : HeaderSAM1213-16-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-NDJP5, JP6, JP7,
9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP10
10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
Place on: JP1, JP2, JP3, JP4,12 10 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND
Q1: Micro Crystal MS1V-T1K DNP: Q114 Q1 0 Crystal 32.768kHz, C(Load) = 12.5pF Keep vias free of solder15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D13416 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
R1218 R10 1 100 Ω, SMD0805 Buerklin: 07E50018 R11 1 1M Ω, SMD080518 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi20 PCB 1 79 x 77 mm 2 layers
Rubber stand21 4 Buerklin: 20H1724 Apply to corners at bottom sideoffDNP: enclosed with kit. Is22 MSP430 2 MSP430F5509 RGC supplied by TI
http://www.ettinger.de/Art_DetaInsulating disk23 1 Insulating disk to Q2 il.cfm?ART_ARTNUM=70.08.1to Q2 2127 C33 1 220n SMD0603 Buerklin: 53D207428 C35 1 10p SMD0603 Buerklin: 56D10229 C36 1 10p SMD0603 Buerklin: 56D10230 C38 1 220n SMD0603 Buerklin: 53D207431 C39 1 4u7 SMD0603 Buerklin: 53D208632 C40 1 0.1u SMD0603 Buerklin: 53D206833 D2, D3, D4 3 LL103A Buerklin: 24S340634 IC7 1 TPD4E004 Manu: TI36 LED 0 JP3QE SAM1032-03-ND DNP
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Table B-26. MSP-TS430RGC64USB Bill of Materials (continued)No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard
37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP40 R13, R15, R16 0 470R Buerklin: 07E564 DNP41 R33 1 1k4 / 1k5 Buerklin: 07E61242 R34 1 27R Buerklin: 07E44443 R35 1 27R Buerklin: 07E44444 R36 1 33k Buerklin: 07E74045 S1 0 PB P12225STB-ND DNP46 S2 0 PB P12225STB-ND DNP46 S3 1 PB P12225STB-ND47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885
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B.26 MSP-TS430PN80
NOTE: For MSP430F47x and MSP430FG47x devices:Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1.
Figure B-51. MSP-TS430PN80 Target Socket Module, Schematic
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Connector J5External power connectorJumper JP1 to "ext"
D1LED connected to pin 12
Jumper J6Open to disconnect LED
Orient Pin 1 ofMSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Jumper JP2Open to measure current
MSP-TS430PN80 www.ti.com
Figure B-52. MSP-TS430PN80 Target Socket Module, PCB
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Table B-27. MSP-TS430PN80 Bill of Materials
Pos. Ref Des No. per Board Description Digi-Key Part No. Comment1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
DNP: Only recommendation.1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 D1 1 green LED, SMD0603 475-1056-2-ND
DNP: Headers and receptaclesenclosed with kit.Keep viasfree of solder.6 J1, J2, J3, J4 0 25-pin header, TH
SAM1029-20-ND : HeaderSAM1213-20-ND : Receptacle
7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 3 Jumper 15-38-1024-ND Place on: J6, JP2, JP1/Pos1-210 JTAG 1 14-pin connector, male, TH HRP14H-ND11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
Q1: Micro Crystal MS1V-T1K12 Q1, Q2 0 Crystal DNP: Keep vias free of solder32.768kHz, C(Load) = 12.5pF13 R3 1 560 Ω, SMD0805 541-560ATR-ND
R1, R2, R4, DNP: R4, R6, R7, R10, R11,14 R6, R7, R10, 2 0 Ω, SMD0805 541-000ATR-ND R12R11, R1215 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC201-0804-014 Manuf.: Yamaichi17 PCB 1 77 x 77 mm 2 layers
Adhesive for example, 3M Bumpons Part18 4 ~6mm width, 2mm height Apply to corners at bottom sidePlastic feet No. SJ-5302DNP: Enclosed with kit19 MSP430 2 MSP430FG439IPN supplied by TI
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B.27 MSP-TS430PN80A
Figure B-53. MSP-TS430PN80A Target Socket Module, Schematic
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Connector J5External power connectorJumper JP3 to "ext"
Orient Pin 1 ofMSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
D1LED connected to P1.0
Jumper JP2Open to disconnect LED
Connector J6If the system is supplied from LDOI,close JP4 and set JP3 to external
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supplyJumper JP1Open to measure current
www.ti.com MSP-TS430PN80A
Figure B-54. MSP-TS430PN80A Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must bepopulated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board issupplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
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Table B-28. MSP-TS430PN80A Bill of Materials
No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C3, C4 0 47pF, SMD0805 DNP
C6, C7,3 3 10uF, 6.3V, SMD0805 DNP C10C10, C12C5, C11,
4 C13, C14, 5 100nF, SMD0805 311-1245-2-NDC15
5 C8 1 2.2nF, SMD08056 C9 1 470nF, SMD0805 478-1403-2-ND7 C16 1 4.7uF, SMD08058 C17 1 220nF, SMD08059 D1 1 green LED, SMD0805 P516TR-ND
SAM1029-20-ND DNP: Headers and receptaclesJ1, J2, J3,10 0 20-pin header, TH (Header) SAM1213-20- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:11 J5 , J6 2 3-pin header, male, TH
JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,JP6, JP7,12 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers onJP8, JP9, pins 1-2 on JP3,JP10JP1, JP2,13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4
14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 1314-pin connector, male,15 JTAG 1 HRP14H-NDTH10-pin connector, male,16 BOOTST 0 "DNP Keep vias free of solder"TH
Micro Crystal MS3V-T1R17 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pFQ2: 4MHz Buerklin:18 Q2 0 Crystal DNP: Q2 Keep vias free of solder78D134http://www.ettinger.de/Art_Insulating19 0 Insulating disk to Q2 Detail.cfm?ART_ARTNUMdisk to Q2 =70.08.121
20 D3,D4 2 LL103A Buerklin: 24S340621 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,R6, R8,22 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,
R11, R1223 R5 1 47k Ω, SMD0805 541-47000ATR-ND24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi25 PCB 1 77 x 91 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons26 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-530227 MSP430 2 MSP430F5329IPN DNP: enclosed with kit, supplied by TI
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B.28 MSP-TS430PN80USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.
NOTE: R11 should be populated.
Figure B-55. MSP-TS430PN80USB Target Socket Module, Schematic
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Jumper JP31-2 (int): Power supply from JTAG debug interface2-3 (ext): External power supply
Connector J5External power connectorJumper JP3 to "ext"
USB Connector
Button S3BSL invoke
Jumper JP4Close for USB bus powered device
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumper JP1Open to measure current
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector JTAGFor JTAG Tool
Orient Pin 1 of MSP430 device
MSP-TS430PN80USB www.ti.com
Figure B-56. MSP-TS430PN80USB Target Socket Module, PCB
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Table B-29. MSP-TS430PN80USB Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD08052 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
C5, C11,3 4 100nF, SMD0805 311-1245-2-NDC13, C143.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C124 C8 1 2.2nF, SMD08055 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND
DNP: headers and7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-ND receptacles enclosed with kit.
Keep vias free of solder.DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7.1 4 20-pin header, TH
SAM1213-20-ND : Header: Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-NDJP5, JP6,
JP7,9 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP8,JP9,JP10
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4 1 SAM1035-02-ND Place jumper only on one pin
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2Place on: JP1, JP2, JP3,
12 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-NDMicro Crystal MS1V-T1K DNP: Q1 Keep vias free of14 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF
15 Q2 1 Crystal "Q2: 4MHzBuerklin: 78D134"16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
R1218 R10 1 100 Ω, SMD0805 Buerklin: 07E50018 R11 0 1M Ω, SMD0805 DNP18 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi20 PCB 1 79 x 77 mm 2 layers
Rubber Apply to corners at bottom21 4 Buerklin: 20H1724standoff sideDNP: Enclosed with kit22 MSP430 2 MSP430F5529 supplied by TI
http://www.ettinger.de/Art_DeInsulating23 1 Insulating disk to Q2 tail.cfm?ART_ARTNUM=70.0disk to Q2 8.12127 C33 1 220n Buerklin: 53D207428 C35 1 10p Buerklin: 56D10229 C36 1 10p Buerklin: 56D10230 C38 1 220n Buerklin: 53D2074
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Table B-29. MSP-TS430PN80USB Bill of Materials (continued)No. perPos. Ref Des Description Digi-Key Part No. CommentBoard
31 C39 1 4u7 Buerklin: 53D208632 C40 1 0.1u Buerklin: 53D206833 D2, D3, D4 3 LL103A Buerklin: 24S340634 IC7 1 TPD4E004 Manu: TI36 LED 0 JP3QE SAM1032-03-ND DNP37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP
R13, R15,40 0 470R Buerklin: 07E564 DNPR1641 R33 1 1k4 Buerklin: 07E61242 R34 1 27R Buerklin: 07E44443 R35 1 27R Buerklin: 07E44444 R36 1 33k Buerklin: 07E74045 S1 0 PB P12225STB-ND DNP46 S2 0 PB P12225STB-ND DNP46 S3 1 PB P12225STB-ND47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885
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B.29 MSP-TS430PZ100
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not bemade.
Figure B-57. MSP-TS430PZ100 Target Socket Module, Schematic
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Connector J5External power connection
Remove R8 and jumper R9
D1LED connected to pin 12
Jumper J6Open to disconnect LED
Orient Pin 1 of MSP430 device
Jumper J7Open to measure current
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
MSP-TS430PZ100 www.ti.com
Figure B-58. MSP-TS430PZ100 Target Socket Module, PCB
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Table B-30. MSP-TS430PZ100 Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only recommendation.1b C3, C4 0 47pF, SMD0805 Check your crystal spec.2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C63 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND
DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2, J3, J4 0 25-pin header, TH
SAM1029-25-ND : HeaderSAM1213-25-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10 2 Jumper 15-38-1024-ND Place on: J6, J711 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP: Keep vias free of12 BOOTST 0 10-pin connector, male, TH solderQ1: Micro Crystal MS1V-T1K DNP: Keep vias free of13 Q1, Q2 0 Crystal 32.768kHz, C(Load) = solder12.5pF
14 R3 1 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,
15 R8, R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12R11, R12
16 R5 1 47k Ω, SMD0805 541-47000ATR-NDSocket: IC201-1004-008 or17 U1 1 Manuf.: YamaichiIC357-1004-53N
18 PCB 1 82 x 90 mm 2 layersAdhesive for example, 3M Bumpons Apply to corners at bottom19 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 side
DNP: enclosed with kit20 MSP430 2 MSP430FG4619IPZ supplied by TI
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Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430PZ100A www.ti.com
B.30 MSP-TS430PZ100A
Figure B-59. MSP-TS430PZ100A Target Socket Module, Schematic
122 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumper JP1Open to measure current
Jumper JP2Open to disconnect LED
D1LED connected to P5.1
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Orient Pin 1 ofMSP430 Device
Connector J5External power connector
Jumper JP3 to "ext"
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
www.ti.com MSP-TS430PZ100A
Figure B-60. MSP-TS430PZ100A Target Socket Module, PCB
123SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430PZ100A www.ti.com
Table B-31. MSP-TS430PZ100A Bill of Materials
No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only recommendation.1b C3, C4 0 47pF, SMD0805 Check your crystal spec.2 C7, C9 2 10uF, 10V, Tantal Size B 511-1463-2-ND3 C5, C11, C14 3 100nF, SMD0805 311-1245-2-ND4 C8 1 10nF, SMD0805 478-1358-1-ND5 C6 0 470nF, SMD0805 478-1403-2-ND DNP6 D1 1 green LED, SMD0805 67-1553-1-ND
DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2, J3, J4 0 25-pin header, TH
SAM1029-25-ND : HeaderSAM1213-25-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-212 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP313 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP: Keep vias free of14 BOOTST 0 10-pin connector, male, TH solderQ1: Micro Crystal MS1V-T1K DNP: Keep vias free of15 Q1, Q2 0 Crystal 32.768kHz, C(Load) = solder12.5pF
16 R3 1 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,R6, R7, R8, DNP: R4, R6, R7, R8, R9,17 2 0 Ω, SMD0805 541-000ATR-NDR9, R10, R10, R11, R12R11, R12
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi20 PCB 1 90 x 82 mm 4 layers
Rubber Apply to corners at bottom21 4 Select appropriatestandoff sideDNP: Enclosed with kit22 MSP430 2 MSP430F47197IPZ supplied by TI
124 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PZ100B
B.31 MSP-TS430PZ100B
Figure B-61. MSP-TS430PZ100B Target Socket Module, Schematic
125SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Connector J5External power connector
Jumper JP3 to "ext"
Jumper JP1Open to measure current
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
JP11, JP12, JP13Connect 1-2 to connectAUXVCCx with DVCCor drive AUXVCCx externally
D1LED connected to P1.0
Jumper JP2Open to disconnect LED
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
MSP-TS430PZ100B www.ti.com
Figure B-62. MSP-TS430PZ100B Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must bepopulated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board issupplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
126 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PZ100B
Table B-32. MSP-TS430PZ100B Bill of Materials
No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP
C4, C5,2 C6 , C7, 6 100nF, SMD0805 311-1245-2-ND
C8, C93 C10, C26 2 470 nF, SMD0805 478-1403-2-ND4 C11, C12 1 10 uF / 6.3 V SMD0805 C12 DNP
C13, C14,5 C16, C18, 6 4.7 uF SMD0805
C19, C296 D1 1 green LED, SMD0805 P516TR-ND
SAM1029-25-ND DNP: Headers and receptaclesJ1, J2, J3,7 0 25-pin header, TH (Header) SAM1213-25- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:8 J5 1 3-pin header, male, TH
JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,JP6, JP7,9 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers onJP8, JP9, pins 1-2 on JP3,JP10JP1, JP2,10 3 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4
JP11, JP12,11 3 4-pin header, male, TH place jumper on header 1-2JP1312 13 Jumper 15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11
14-pin connector, male,15 JTAG 1 HRP14H-NDTH10-pin connector, male,16 BOOTST 0 "DNP Keep vias free of solder"TH
17 Q1 0 Crystal DNP: Q1 Keep vias free of solder21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,22 R6, R8, 2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11
R10, R1123 R5 1 47k Ω, SMD0805 541-47000ATR-ND24 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi25 PCB 1 90 x 82 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons26 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-530227 MSP430 2 MSP430F6733IPZ DNP: enclosed with kit, supplied by TI
127SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
DN
PD
NP
DN
P
DN
P
DN
P
DN
P
0R
12pF
12pF
47pF
47pF
GN
D
0R
100nF
330R
10 /6.3uF V
10 /6.3uF V
2.2
nF
PWR3
GN
D
GN
D
GN
D
GN
D0R
330R
47K
100nF
100nF
PT
RN
D516
-
470nF
100nF
100nF
0R
0R
0R
0R
GN
D
VCC
100nF
GN
D
100nF
100nF
GN
D
100nF
LL
A103
GN
D
4.7n
HCTC XTL_ _4
HCTC XTL_ _4
HCTC XTL_ _4
HCTC XTL_ _4
GN
D
0R
0R
GN
DG
ND
GN
D
4.7uF
GN
D
100nF
220nF
GN
D
VCC
LL A103
1.1
MS
PTa
rge
tS
ocke
tM
SP
TS
PZ
C430:
--
430
100
Socket:
Ya
maich
iIC
201-1
004-0
08
LFXTCLK
<-
SB
W
<-
JTA
G
Vccint
ext
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
BS
LR
x-
BS
LT
x-
DN
P
1 3 5 7 9 11 13
2 4 6
12
148
10
JTA
G
R2
C2
C1
C3
C4
R1
C5
R3
C6
C7
C8
123
J5
8079787776
75
74
73
72
71
70
69
68
67
66
65
60
59
58
57
56
55
54
53
52
51
504948474645
3635343332313029282726
25
24
23
22
21
16
15
14
13
12
11 10
9 8 7 6 5 4 3 2 1
64
63
62
61
44434241
37383940
17
18
19
20
81828384858687888990919293949596979899
100
U1
QF
P1
00
PZ
12345678910
1112
13
14
15
16
17
18
19
20
21
22
23
24
25
J1
26272829303132333435363738394041424344454647484950
J2
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
J3
767778798081828384858687888990919293949596979899
100
J4
1JP
1
2
1
JP2
2
R4
123
JP
5123
JP
6123
JP
7123
JP
8123
JP
9123
JP
10
R7
R5
C11
C12
D1
C9
C13
C10
R6
R8
R9
R12
1 2 3
JP
3
C17
C18
C19
C14
D3
C16
1 2 3
JP
11
4
21Q G1 $1
43Q G1 $2
2 1
Q G2 $1
4 3
Q G2 $2
12
34
56
78
910
BO
OT
ST
R10
R11
C15
C20
C21
1JP
4
2
D4
123
J6
TM
S
TM
S
TD
I
TD
I
TD
O
TD
O
TD
O
XO
UT
VC
C
GND
GND
GN
D
XIN
P1.0
DV
CC
1
DV
CC
1
DV
CC
1
DVCC1
DV
CC
1
DVCC1
AV
CC
XT
OU
T2
AVSS
AVSS
AV
SS
M
M
I
I
O
O
XT
IN2
RS
TN
MI
/R
ST
NM
I/
TC
K
TC
K
TC
KC
C
TE
ST
SB
WT
CK
/
TE
ST
SB
WT
CK
/
TE
ST
SB
WT
CK
/
RS
T
RS
T
RS
T
XTLGND2
XTLGND1
PU.0
PU.1
P1.6P1.7
P8.0
P8.1
P8.2
VBAKVBAT
VBAT
VB
AT
P1.1
P1.1
P1.2
P1.2
LD
OI
LDOI
LD
OO
LDOO
BS
LIn
terfa
ce
LD
OI
LD
OO
Inte
rface
/
+
+
Note
Ifth
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should
be
:supplie
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se
JP
(6)
4and
set
JP
toexte
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3
MSP-TS430PZ100C www.ti.com
B.32 MSP-TS430PZ100C
Figure B-63. MSP-TS430PZ100C Target Socket Module, Schematic
128 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
If the system shouldbe supplied from LDOI (J6),close JP4 and set JP3 to external
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Orient Pin 1 of MSP430 device
LDOI LDOO/
14
1
2
GN
D
GN
D
VC
C
12
55
10
15
20
26 5030 3540 45 51
75
55
60
65
70
76100 80859095
12
3
12
3
12
3
12
3
12
3
12
3
1231 2 3 4
10
1
2
1 2 3
1
JTA
GS
BW
Vcc
int
ext
GN
D
VB
AT
DV
CC
JTA
G
R2
C2
C1
C3
C4
R1
C5
R3
+C6
+
C7
C8
J5
U1
J1
J2
J3
J4
JP
1
JP2
R4
JP
5
JP
6
JP7
JP
8
JP
9
JP
10
R7
R5
C11
C1
2
D1
C9
C1
3
C10
R6
R8
R9
R1
2
JP3
C1
7
C1
8
C1
9
C1
4
D3
C16
JP11
Q1
Q2
BOOTSTR1
0
R1
1C
15
C20
C2
1
JP
4
D4
J6
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP1Open to measure current
www.ti.com MSP-TS430PZ100C
Figure B-64. MSP-TS430PZ100C Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must bepopulated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board issupplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
129SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430PZ100C www.ti.com
Table B-33. MSP-TS430PZ100C Bill of Materials
NumberPos. Ref Des Per Description Digi-Key Part No. Comment
Board1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805 DNP: C3, C42 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
C5, C11,3 C13, C14, 6 100nF, SMD0805 311-1245-2-ND
C19, C20C10, C12,3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C18,17
4 C8 1 2.2nF, SMD0805 Buerklin 53 D 2925 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND
DNP: headers and receptacles enclosed7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND with kit. Keep vias free of solder.DNP: headers and receptacles enclosed7.1 4 25-pin header, TH SAM1213-25-ND with kit. Keep vias free of solder.
8 J5, J6 2 3-pin header, male, TH SAM1035-03-NDJP5, JP6,
JP7,9 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP8,JP9,JP10
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
Place on: JP1, JP2, JP3, JP4, JP5, JP6,12 10 Jumper 15-38-1024-ND JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND14 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
DNP: Q115 Q1 0 CrystalKeep vias free of solder
16 Q2 1 Crystal DNP: Q2 Keep vias free of solder17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND
R1, R2, R4,R6, R8, R9,18 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11, R12R10, R11,
R1219 R5 1 47k Ohm, SMD0805 541-47000ATR-ND20 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi21 PCB 1 79.5 x 99.5 mm MSP-TS430PZ100C Rev 1.0 2 layers
Rubber stand22 4 Buerklin: 20H1724 apply to corners at bottom sideoff
23 MSP430 2 MSP430F643x DNP: enclosed with kit. Is supplied by TI.24 C16 1 4.7 nF SMD0603 Buerklin 53 D 204226 D3, D4 2 LL103A Buerklin: 24S340627 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and Pin 228 C15 1 4.7 uF, SMD0805 Buerklin 53 D 243029 C21 1 220nF, SMD0805 Buerklin 53 D 2381
130 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
DN
P
Socket:
Yam
aic
hi IC
201-1
004-0
08
DN
P
DN
P
GN
D
GN
D
100nF
33
0R
-0R
GN
D
GN
D
1.1
nF
47
kG
ND
0R 0R
QU
AR
Z5
1uF
/10V
100nF
1uF
/10V
gre
en
DN
P
yello
w (D
NP
)
DN
P
red (D
NP
)
0R
GN
D
DN
P
DN
P
0R0R
QUARZ5
EV
Q11
0R
DNP
DN
P
MS
P4
30
FR
69
8X
PZ
FE
25-1
A1
FE25-1A2
FE
25-1
A3
FE25-1A4
100nF
GN
D
100nF
GN
D
1uF
/10V
100nF
GND
GN
D
470nF
GN
D
0R
4u7
GN
D
If exte
rnal s
upply
volta
ge:
rem
ove R
3 a
nd a
dd R
2 (0
Ohm
)
Ext_
PW
R
MS
P-T
S4
30
PZ
10
0D
Vcc
int
ext
Targ
et S
ocket B
oard
for M
SP
430F
R698xP
Z, F
R688xP
Z
DN
PD
NP
DN
P
DN
P
DN
P
JTA
G ->
SB
W ->
JTA
G-M
ode s
ele
ctio
n:
4-w
ire J
TA
G: S
et ju
mpers
JP
3 to
JP
8 to
positio
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ire "S
pyB
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": Set ju
mpers
JP
3 to
JP
8 to
positio
n 1
-2
connectio
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y v
iaD
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DN
P
Pe
ters
en
10
99
/1/0
01
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.1
1.2
DN
P
DN
PD
NP
DN
P
DN
P
DN
PD
NP
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2
C1
C4
R1
12
34
56
78
91
0
BS
L
R2R3
123
J2
1 2 3
J1
1 2
JP
1
12J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R5 R6
Q1
C3
C6
C7
D1
R1
0
12JP
10
D2
R11
12J
P11
D3
R1
2
1 2
JP
2
C8
C9
R8R9
Q2
SW
1
R1
3
TP2TP1
SW2
R1
4
P4
.3/U
CA
0S
OM
I/UC
A0
RX
D/U
CB
1S
TE
1
P1
.4/U
CB
0C
LK
/UC
A0
ST
E/T
A1
.0/S
12
P1
.5/U
CB
0S
TE
/UC
A0
CL
K/T
A0
.0/S
03
P1
.6/U
CB
0S
IMO
/US
B0
SD
A/T
A0
.14
P1
.7/U
CB
0S
OM
I/UC
B0
SC
L/T
A0
.25
R3
3/L
CD
CA
P6
P6
.0/R
23
7
P6
.1/R
13
/LC
DR
EF
8
P6
.2/C
OU
T/R
03
9
P6
.3/C
OM
01
0
P6
.4/T
B0
.0/C
OM
111
P6
.5/T
B0
.1/C
OM
21
2
P6
.6/T
B0
.2/C
OM
31
3
P2
.4/T
B0
.3/C
OM
4/S
43
14
P2
.5/T
B0
.4/C
OM
5/S
42
15
P2
.6/T
B0
.5/C
OM
6/S
41
16
P2
.7/T
B0
.6/C
OM
7/S
40
17
P1
0.2
/TA
1.0
/SM
CL
K/S
39
18
P5
.0/T
A1
.1/M
CL
K/S
38
19
P5
.1/T
A1
.2/S
37
20
P5
.2/T
A1
.0/T
A1
CL
K/A
CL
K/S
36
21
P5
.3/U
CB
1S
TE
/S3
52
2
P3
.0/U
CB
1C
LK
/S3
42
3
P3
.1/U
CB
1S
IMO
/UC
B1
SD
A/S
33
24
P3
.2/U
CB
1S
OM
I/UC
B1
SC
L/S
32
25
DVSS126
DVCC127
TEST/SBWTCK28
XRST/NMI/SBWTDIO29
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG130
PJ.1/TDI/TCLK/MCLK/SRSCG031
PJ.2/TMS/ACLK/SROSCOFF32
PJ.3/TCK/COUT/SRCPUOFF33
P6.7/TA0CLK/S3134
P7.5/TA0.2/S3035
P7.6/TA0.1/S2936
P10.1/TA0.0/S2837
P7.7/TA1.2/TB0OUTH/S2738
P3.3/TA1.1/TB0CLK/S2639
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S2540
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S2441
P3.6/UCA1CLK/TB0.2/S2342
P3.7/UCA1STE/TB0.3/S2243
P8.0/RTCCLK/S2144
P8.1/DMAE0/S2045
P8.2/S1946
P8.3/MCLK/S1847
P2.3/UCA0STE/TB0OUTH48
P2.2/UCA0CLK/TB0.4/RTCCLK49
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE050P
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AVSS1 83
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DVCC3 99
DVSS3 98
P4.1/UCB1SOMI/UCB1SCL/ACLK/S2 97
P4.0/UCB1SIMO/UCB1SDA/MCLK/S3 96
P10.0/SMCLK/S4 95
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S5 94
P4.6/UCB1SIMO/UCB1SDA/TA1.1/S6 93
P4.5/UCB1CLK/TA1.0/S7 92
P4.4/UCB1STE/TA1CLK/S8 91
P5.7/UCA1STE/TB0CLK/S9 90
P5.6/UCA1CLK/S10 89
P5.5/UCA1SOMI/UCA1RXD/S11 88
P5.4/UCA1SIMO/UCA1TXD/S12 87
AVSS2 86
PJ.5/LFXOUT 85
PJ.4/LFXIN 84
IC1
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www.ti.com MSP-TS430PZ100D
B.33 MSP-TS430PZ100D
Figure B-65. MSP-TS430PZ100D Target Socket Module, Schematic
131SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
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1
Vccext
int
Vcc
GND
GND
JTAG
SBW
RESET
Ext.
Pwr.
PW
R
DVCC
AVCC
TC
K
TM
S
TD
I
TD
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RST/SBWTDIO
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WT
CK
GND
GND
P1.3
ESIVCC
14
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2
10
1
2
1
111111
12
55
10
15
20
2650 30354045
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55
60
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P1
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P1
.1
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C2
C1
C4
R1
BSL
R2
R3
J2
J1
JP
1JP
9
C5R4
JP
3
JP
4
JP
5
JP
6
JP
7
JP
8
R5
R6
C3
C6C7
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R1
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10
D2
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11
D3
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C8
C9
R8
R9
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R1
3
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TP1
SW
2
R14 IC1
J3
J4
J5
J6
C10
C11
JP12
C1
2C
13
C14
R7
C1
5 Orient Pin 1 of MSP430 deviceLEDs connected to
P1.0, P1.1, P1.2 throughJP9, JP10, JP11
(only D1 assembled)
Switch SW2Connected to P1.3
Jumper JP1Open to measure current
Connector J2External power connector
Jumper J1 to “ext”
Connector BSLFor Bootloader Tool
Connector JTAGFor JTAG Tool
Jumper JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper J11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Switch SW1Device reset
HF and LF oscillators withcapacitors and resistorsto connect pinheads
MSP-TS430PZ100D www.ti.com
Figure B-66. MSP-TS430PZ100D Target Socket Module, PCB
132 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PZ100D
Table B-34. MSP-TS430PZ100D Bill of Materials
NumberPos. Ref Des Per Description Digi-Key Part No. Comment
Board1 PCB 1 90.0 x 100.0 mm MSP-TS430PZ100D 2 layers, white solder mask
Rev 1.22 JP1, JP2, 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
JP93 JP10, JP11, 3 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
JP124 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-25 JP3, JP4, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
JP5, JP6,JP7, JP8
6 J2 1 3-pin header, male, TH SAM1035-03-ND7 R2, R3, R5, 6 0R, 0805 541-0.0ATR-ND DNP
R6, R8, R98 R7, R12, R13 3 0R, 0805 541-0.0ATR-ND9 C5 1 1.1nF, CSMD0805 490-1623-2-ND10 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND11 C12 1 1uF/10V, CSMD0805 490-1702-2-ND DNP12 R4 1 47k, 0805 541-47KATR-ND13 C4, C6, C10, 4 100nF, CSMD0805 490-1666-1-ND
C1114 C13 1 100nF, CSMD0805 490-1666-1-ND DNP15 C15 1 4u7, CSMD0805 445-1370-1-ND DNP16 R1 1 330R, 0805 541-330ATR-ND17 C14 1 470nF, CSMD0805 587-1290-2-ND DNP18 R10, R11 2 330R, 0805 541-330ATR-ND DNP19 R14 1 47k, 0805 541-47KATR-ND DNP20 C1, C2, C8, 4 DNP, CSMD0805 DNP
C921 SW2 1 EVQ-11L05R P8079STB-ND DNP22 SW1 1 EVQ-11L05R P8079STB-ND DNP23 J3, J4, J5, J6 4 25-pin header, TH DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.SAM1029-25-ND : Header
24 J3, J4, J5, J6 4 25-pin receptacle, TH DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.
SAM1213-25-ND : Receptacle25 TP1, TP2 2 Testpoint DNP, keep pads free of solder26 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder27 JTAG 1 14-pin connector, male, TH HRP14H-ND28 IC1 1 Socket: IC201-1004-008 Manuf. Yamaichi29 IC1 1 MSP430FR6989 DNP: enclosed with kit. Is supplied by TI30 Q1 1 DNP: MS3V-TR1 depends on application Micro Crystal, DNP, enclosed in kit, keep
(32768kHz/20ppm/12,5pF) vias free of solder31 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder32 D1 1 green LED, DIODE0805 P516TR-ND33 D3 1 red (DNP), DIODE0805 DNP34 D2 1 yellow (DNP), DIODE0805 DNP35 Rubber 4 Buerklin: 20H1724 apply to corners at bottom side
stand off
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MSP-TS430PZ5x100 www.ti.com
B.34 MSP-TS430PZ5x100
Figure B-67. MSP-TS430PZ5x100 Target Socket Module, Schematic
134 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Connector J5External power connector
Jumper JP3 to "ext"
Jumper JP1Open to measure current
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Orient Pin 1 ofMSP430 device
www.ti.com MSP-TS430PZ5x100
Figure B-68. MSP-TS430PZ5x100 Target Socket Module, PCB
135SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430PZ5x100 www.ti.com
Table B-35. MSP-TS430PZ5x100 Bill of Materials
No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only recommendation.1b C3, C4 47pF, SMD0805 Check your crystal spec.2 C6, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND
C5, C10, C11,3 4 100nF, SMD0805 311-1245-2-ND DNP: C12, C14C12, C13, C144 C8 0 2.2nF, SMD0805 DNP5 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 67-1553-1-ND
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7 J1, J2, J3, J4 0 25-pin header, TH
SAM1029-25-ND : HeaderSAM1213-25-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-NDJP5, JP6, JP7,
9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP10
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
Place on JP1, JP2, JP3, JP5,12 9 Jumper 15-38-1024-ND JP6, JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND14 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
Q1: Micro Crystal MS1V-T1K15 Q1, Q2 0 Crystal DNP: Keep vias free of solder32.768kHz, C(Load) = 12.5pF16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4, DNP: R6, R8, R9, R10, R11,17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND R12R10, R11, R1218 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi20 PCB 1 90 x 82 mm 2 layers
Rubber21 4 Select appropriate Apply to corners at bottom sidestandoffDNP: Enclosed with kit22 MSP430 2 MSP430F5438IPZ supplied by TI
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www.ti.com MSP-TS430PZ100USB
B.35 MSP-TS430PZ100USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.
Figure B-69. MSP-TS430PZ100USB Target Socket Module, Schematic
137SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumpers LED 1, 2, 3Open to disconnect LED1, D2, D3LE LE
LED1, D2, D3LEDs connected to P8.0,
LE LEP8.1, P8.2
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
USB1USB connector
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumper JP1Open to measure current
MSP-TS430PZ100USB www.ti.com
Figure B-70. MSP-TS430PZ100USB Target Socket Module, PCB
138 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PZ100USB
Table B-36. MSP-TS430PZ100USB Bill of Materials
No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD08052 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
C5, C11, C13,3 5 100nF, SMD0805 311-1245-2-NDC14, C19C10, C12,3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C18, C17
4 C8 1 2.2nF, SMD08055 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND
DNP: headers and receptaclesenclosed with kit. Keep vias
7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND free of solder.: Header: ReceptacleDNP: headers and receptaclesenclosed with kit. Keep vias
7.1 4 25-pin header, TH SAM1213-25-ND free of solder.: Header: Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-NDJP5, JP6, JP7,
9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP10
10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
Place on: JP1, JP2, JP3, JP4,12 10 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND
Micro Crystal MS1V-T1K DNP: Q1. Keep vias free of14 Q1 0 Crystal 32.768kHz, C(Load) = 12.5pF solder15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D13416 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R12
R1218 R10 1 100 Ω, SMD0805 Buerklin: 07E50018 R11 1 1M Ω, SMD0603 not existing in Rev 1.018 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket:IC201-1004-008 Manuf.: Yamaichi20 PCB 1 79 x 77 mm 2 layers
Rubber stand21 4 Buerklin: 20H1724 apply to corners at bottom sideoffDNP: enclosed with kit. Is22 MSP430 2 MSP430F6638IPZ supplied by TI
http://www.ettinger.de/Art_DetaInsulating disk23 1 Insulating disk to Q2 il.cfm?ART_ARTNUM=70.08.1to Q2 2124 C16 1 4.7 nF SMD060327 C33 1 220n SMD0603 Buerklin: 53D207428 C35, C36 2 10p SMD0603 Buerklin: 56D10230 C38 1 220n SMD0603 Buerklin: 53D207431 C39 1 4u7 SMD0603 Buerklin: 53D2086
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MSP-TS430PZ100USB www.ti.com
Table B-36. MSP-TS430PZ100USB Bill of Materials (continued)No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard
32 C40 1 0.1u SMD0603 Buerklin: 53D206833 D2, D3, D4 3 LL103A Buerklin: 24S340634 IC7 1 TPD4E004 Manu: TI35 LED 0 JP3QE SAM1032-03-ND DNP
LED1, LED2,36 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNPLED337 R13, R15, R16 0 470R SMD0603 Buerklin: 07E564 DNP38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E61239 R34 1 27R SMD0603 Buerklin: 07E44440 R35 1 27R SMD0603 Buerklin: 07E44441 R36 1 33k SMD0603 Buerklin: 07E74042 S1, S2, S3 1 PB P12225STB-ND DNP S1 and S2. (Only S3)43 USB1 1 USB_RECEPTACLE FARNELL: 117-788544 JP11 1 4-pin header, male, TH SAM1035-04-ND place jumper only on Pin 1
140 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
0R
12pF
12pF
47pF
47pF
GN
D
0R
100nF
330R
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2.2
nF
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D
GN
D
GN
D
GN
D0R
47K
100nF
100nF
470nF
100nF
100nF
0R0
R
0R
0R
GN
D
GN
DG
ND
GN
DG
ND
1k4
10p
10p
27R
27R
33k
4u7
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D
LL103A
TPD4E004
0.1
u
220n
220n
GN
D
GN
D
VCC
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DG
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470R
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470R
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100nF
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100nF
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12
LE
D-2
34
LE
D-3
56
C17
C18
C19
R10S3
1 2
C14
D4
R11
C16
JP
11
1 2 3 4
Q2G$1
2 1
Q2G$2
4 3
P6.4
/CB
4/A
D0+
/OA
0O
1
P6.5
/CB
5/A
D0-/O
A0N
2
P6.6
/CB
6/A
D1+
/GS
W0A
3
P6.7
/CB
7/A
D1-/G
SW
0B
4
P7.4
/CB
8/A
D2+
/OA
1O
5
P7.5
/CB
9/A
D2-/O
A1N
6
P7.6
/CB
10/A
D3+
/GS
W1A
7
P7.7
/CB
11/A
D3-/G
SW
1B
8
P5.0
/VR
EF
+/V
ER
EF
+9
P5.1
//A4/D
AC
010
P5.6
/A5/D
AC
111
NR
12
AV
SS
113
XO
UT
14
XIN
15
AV
CC
16
CP
CA
P17
P2.0
/P2M
AP
0/D
AC
018
P2.1
/P2M
AP
1/D
AC
119
P2.2
/P2M
AP
220
P2.3
/P2M
AP
321
P2.4
/P2M
AP
4/R
03
22
P2.5
/P2M
AP
523
P2.6
/P2M
AP
6/L
CD
RE
F/R
13
24
P2.7
/P2M
AP
7/R
23
25
DVCC126
DVSS127
VCORE28
LCDCAP/R3329
COM030
P5.3/COM1/S4231
P5.4/COM2/S4132
P5.5/COM3/S4033
P1.0/TA0CLK/ACLK/S3934
P1.1/TA0.0/S3835
P1.2/TA0.1/S3736
P1.3/TA0.2/S3637
P1.4/TA0.3/S3538
P1.5/TA0.4/S3439
P1.6/TA0.1/S3340
P1.7/TA0.2/S3241
P3.0/TA1CLK/CBOUT/S3142
P3.1/TA1.0/S3043
P3.2/TA1.1/S2944
P3.3/TA1.2/S2845
P3.4/TA2CLK/SMCLK/S2746
P3.5/TA2.0/S2647
P3.6/TA2.1/S2548
P3.7/TA2.2/S2449
P4.0/TB0.0/S2350
P4.1
/TB
0.1
/S22
51
P4.2
/TB
0.2
/S21
52
P4.3
/TB
0.3
/S20
53
P4.4
/TB
0.4
/S19
54
P4.5
/TB
0.5
/S18
55
P4.6
/TB
0.6
/S17
56
P4.7
/TB
0O
UT
H/S
VM
OU
T/S
16
57
P8.0
/TB
0C
LK
/S15
58
P8.1
/UC
B1S
TE
/UC
A1C
LK
/S14
59
P8.2
/UC
A1T
XD
/UC
A1S
IMO
/S13
60
P8.3
/UC
A1R
XD
/UC
A1S
OM
I/S12
61
P8.4
/UC
B1C
LK
/UC
A1S
TE
/S11
62
DV
SS
263
DV
CC
264
P8.5
/UC
B1S
IMO
/UC
B1S
DA
/S10
65
P8.6
/UC
B1S
OM
I/UC
B1S
CL/S
966
P8.7
/S8
67
P9.0
/S7
68
P9.1
/S6
69
P9.2
/S5
70
P9.3
/S4
71
P9.4
/S3
72
P9.5
/S2
73
P9.6
/S1
74
P9.7
/S0
75
VSSU76
PU.0/DP77
PUR78
PU.1/DM79
VBUS80
VUSB81
V1882
AVSS283
P7.2/XT2IN84
P7.3/XT2OUT85
VBAK86
VBAT87
P5.7/DMAE0/RTCCLK88
DVCC389
DVSS390
TEST/SBWTCK91
PJ.0/TDO92
PJ.1/TDI/TCLK93
PJ.2/TMS94
PJ.3/TCK95
RST/NMI/SBWTDIO96
P6.0/CB0/A097
P6.1/CB1/A198
P6.2/CB2/A2/OA0IP099
P6.3/CB3/A3/OA1IP0100
U1
R14
C15
TP2TP1
Q3
TM
S
TM
S
TD
I
TD
I
TD
O
TD
O
TD
O
XIN
XIN
VC
C
GND
GN
D
GND
GN
D
GN
D
GND
XO
UT
XO
UT
P1.0
P1.0
DV
CC
1
DV
CC
1
DV
CC
1
DV
CC
1
DV
CC
1
DV
CC
1
DVCC1
AV
CC
AV
CC
XT
2O
UT
AVSS
AVSS
AV
SS
AV
SS
M
M
I
I
O
O
XT
2IN
RS
T/N
MI
RS
T/N
MI
TC
K
TC
K
TC
KC
C
TE
ST
/SB
WT
CK
1
RS
T
RS
T
XTLGND2
XTLGND1
PU
.0/D
P
PU.0/DP
PU.0/DP
PU
R
PUR
PUR
PU
.1/D
M
PU.1/DM
PU.1/DM
VBUS
VBUS
VB
US
D-
D+
VUSB
VU
SB
VUSB
V18
V18
P1.6
P1.6
P1.7
P1.7
P8.0
P8.0
P8.1
P8.1
P8.2
P8.2
VBAK
VB
AK
VBAT
VB
AT
CP
CA
P
NR
NR
TE
ST
/SB
WT
CK
US
BIn
terfa
ce
Mis
ce
llan
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DN
P
+
+
www.ti.com MSP-TS430PZ100AUSB
B.36 MSP-TS430PZ100AUSBThe development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642xflash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSP-TS430PZ100AUSB kit. Free samples can be ordered fromwww.ti.com/product/MSP430FG6626/samplebuy.
Figure B-71. MSP-TS430PZ100AUSB Target Socket Module, Schematic
141SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Jumpers LED 1, 2, 3Open to disconnect LED1, D2, D3LE LE
LED1, D2, D3LEDs connected to P8.0,
LE LEP8.1, P8.2
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
USB1USB connector
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumper JP1Open to measure current
141
2
GN
D
GN
D
VC
C
12
55
10
15
20
26 5030 35 40 45 51
75
55
60
65
70
76100 80859095
12
3
12
3
12
3
12
3
12
3
12
3
123
1 2 3
1 2 3 4
+
+
J1 J2
U1
MSP-TS430PZ100AUSB www.ti.com
Figure B-72. MSP-TS430PZ100AUSB Target Socket Module, PCB
142 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-TS430PZ100AUSB
Table B-37. MSP-TS430PZ100AUSB Bill of Materials
No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard1 PCB Rev. 1.1 1 99.65mm x 79.54mm 2 layers, red solder mask2 C1, C2 2 12pF, SMD0805 DNP: C1, C2
C10, C12,3 9 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C17, C184 C15 1 22nF, CSMD0805 311-1242-1-ND5 C16 1 4.7 nF SMD0603 311-1250-1-ND6 C3, C4 2 47pF, CSMD0805 709-1337-1-ND7 C33, C38 2 220n SMD0603 Buerklin: 53D20748 C35, C36 2 10p SMD0603 Buerklin: 56D1029 C39 1 4u7 SMD0603 Buerklin: 53D208610 C40 1 0.1u SMD0603 Buerklin: 53D2068
C5, C11, C13,11 5 100nF, SMD0805 311-1245-2-NDC14, C1912 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND13 C8 1 2.2nF, CSMD0805 709-1339-1-ND14 C9 1 470nF, SMD0805 478-1403-2-ND
green LED, HSMG-C17015 D1 1 516-1434-1-ND Avago, Farnell 5790852DIODE080516 D2, D4 2 LL103A, SOD-80 Buerklin: 24S340617 IC7 1 TPD4E004DRYR 296-23618-1-ND Manu: TI
DNP: Headers enclosed in kit.18 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND Keep vias free of solder.DNP: Receptacles enclosed in19 J1, J2, J3, J4 4 25-pin receptacle, TH SAM1213-25-ND kit. Keep vias free of solder.
20 J5 1 3-pin header, male, TH SAM1035-03-ND21 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header22 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and 223 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
JP5, JP6, JP7,24 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
JP10Jumpers for
JP1, JP2, JP3,25 JP4, JP5, JP6, 11 Jumper 15-38-1024-ND
JP7, JP8, JP9,JP10, JP11
26 JTAG 1 14-pin connector, male, TH HRP14H-ND27 LED 1 JP3QE SAM1032-03-ND DNP
LED1, LED2,28 3 FARNELL: 852-9833 DNPLED3DNP: Free samples can be29 MSP430 2 MSP430FG6626IPZ ordered in the TI Store
Q2: 4MHz30 Q2 1 Crystal Buerklin: 78D134MS3V-T1R (32.768kHz/31 Q3 1 20ppm/12.5pF)
32 R1, R2, R4 3 0 Ohm, SMD0805 541-0.0ATR-ND33 R10 1 100R, R0603 541-100GCT-ND34 R11 1 1M, R0603 541-1.0MGCT-ND35 R13, R15, R16 3 470R SMD0603 Buerklin: 07E564 DNP36 R14 1 0 Ohm, SMD0805 541-0.0ATR-ND37 R3 1 330 Ohm, SMD0805 541-330ATR-ND
143SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-TS430PZ100AUSB www.ti.com
Table B-37. MSP-TS430PZ100AUSB Bill of Materials (continued)No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard
38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E61239 R34, R35 2 27R SMD0603 Buerklin: 07E44440 R36 1 33k SMD0603 Buerklin: 07E74041 R5 1 47k Ohm, SMD0805 541-47000ATR-ND
R6, R8, R9,42 4 0 Ohm, SMD0805 541-000ATR-ND DNPR1243 S1, S2 1 PB P12225STB-ND DNP44 S3 1 PB P12225STB-ND45 TP1, TP2 2 Test point DNP, Keep vias free of solder46 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi47 USB1 1 USB Receptacle FARNELL: 117-7885
Insulating disk48 1 Insulating disk for Q2 ettinger.de 70.08.121for Q2Rubber stand49 4 Buerklin: 20H1724 Apply to corners at bottom sideoff
144 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
0R
12pF
12pF
GN
D
GN
D
0R
100nF
330R
2.2
nF
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PWR3
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330R
47K
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100nF
4.7
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D
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VCC1
VC
C1
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C1
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C1
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C1
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GN
D
GN
D
GN
D
GN
D
AV
SS
AV
SS
AV
CC
DV
CC
GND
VC
C
VCC
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MS
P4
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MS
P-T
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PE
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1.1
12345678910
1112
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
J1
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
J2
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
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81
82
83
84
85
86
87
88
89
90
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95
96
97
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99
100
101
102
J3
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126127
128
J4
1 3 5 7 9 11 13
2 4 6
12
148
10
JTA
G
R2
C2
C1
R1
C5
R3
12
34
56
78
910
BO
OT
ST
C3
R10
R11
J51
2
3
12
JP
1
JP
2
1 2
123
JP
5123
JP
6123
JP
7123
JP
8123
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9123 JP
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R7
R5
D1
R6
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C6
C29
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Q1
JP
12
1234
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11
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13
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C11
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4
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3
1 2 3 4
C15
C17
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IC1
MS
P430F
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1
XO
UT
2
AU
XV
CC
33
RT
CC
AP
14
RT
CC
AP
05
P1.5
/SM
CLK
/CB
0/A
56
P1.4
/MC
LK
/SD
CLK
/CB
1/A
47
P1.3
/AD
C10C
LK
/TA
CLK
/RT
CC
LK
/A3
8
P1.2
/AC
LK
/TA
3.1
/A2
9
P1.1
/TA
2.1
/VE
RE
F+
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10
P1.0
/TA
1.1
/TA
0.0
/VE
RE
F-/A
011
P2.4
/PM
_TA
2.0
12
P2.5
/PM
_U
CB
0S
OM
I/PM
_U
CB
0S
CL
13
P2.6
/PM
_U
SB
0S
IMO
/PM
_U
CB
0S
DA
14
P2.7
/PM
_U
CB
0C
LK
15
P3.0
/PM
_U
CA
0R
XD
/PM
_U
CA
0S
OM
I16
P3.1
/PM
_U
CA
0T
XD
/PM
_U
CA
0S
IMO
17
P3.2
/PM
_U
CA
0C
LK
18
P3.3
/PM
_U
CA
1C
LK
19
P3.4
/PM
_U
CA
1R
XD
/PM
_U
CA
1S
OM
I20
P3.5
/PM
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CA
1T
XD
/PM
_U
CA
1S
IMO
21
CO
M0
22
CO
M1
23
P1.6
/CO
M2
24
P1.7
/CO
M3
25
P5.0
/CO
M4
26
P5.1
/CO
M5
27
P5.2
/CO
M6
28
P5.3
/CO
M7
29
LC
DC
AP
/R33
30
P5.4
/SD
CLK
/R23
31
P5.5
/SD
0D
IO/L
CD
RE
F/R
13
32
P5.6
/SD
1D
IO/R
03
33
P5.7
/SD
2D
IO/C
B2
34
P6.0
/SD
3D
IO35
P3.6
/PM
_U
CA
2R
XD
/PM
_U
CA
2S
OM
I36
P3.7
/PM
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CA
2T
XD
/PM
_U
CA
2S
IMO
37
P4.0
/PM
_U
CA
2C
LK
38
P4.1/PM_UCA3RXD/PM_UCA3SOMI39
P4.2/PM_UCA3TXD/PM_UCA3SIMO40
P4.3/PM_UCA3CLK41
P4.4/PM_UCB1SOMI/PM_UCB1SCL42
P4.5/PM_UCB1SIMO/PM_UCB1SDA43
P4.6/PM_UCB1CLK44
P4.7/PM_TA3.045
P6.1/SD4DIO/S3946
P6.2/SD5DIO/S3847
P6.3/SD6DIO/S3748
P6.4/S3649
P6.5/S3550
P6.6/S3451
P6.7/S3352
P7.0/S3253
P7.1/S3154
P7.2/S3055
P7.3/S2956
P7.4/S2857
P7.5/S2758
P7.6/S2659
P7.7/S2560
P8.0/S2461
P8.1/S2362
P8.2/S2263
P8.3/S2164
P8.4
/S20
65
P8.5
/S19
66
P8.6
/S18
67
P8.7
/S17
68
DV
SY
S69
DV
SS
270
P9.0
/S16
71
P9.1
/S15
72
P9.2
/S14
73
P9.3
/S13
74
P9.4
/S12
75
P9.5
/S11
76
P9.6
/S10
77
P9.7
/S9
78
P10.0
/S8
79
P10.1
/S7
80
P10.2
/S6
81
P10.3
/S5
82
P10.4
/S4
83
P10.5
/S3
84
P10.6
/S2
85
P10.7
/S1
86
P11
.0/S
087
P11
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A3.1
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388
P11
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A1.1
89
P11
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A2.1
90
P11
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BO
UT
91
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AC
LK
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CC
LK
92
P2.0
/PM
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0.0
93
P2.1
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0.1
94
P2.2
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0.2
95
P2.3
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1.0
96
TE
ST
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WT
CK
97
PJ.0
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PJ.1
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99
PJ.2
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S100
PJ.3
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102
SD0P0103
SD0N0104
SD1P0105
SD1N0106
SD2P0107
SD2N0108
SD3P0109
SD3N0110
VASYS2111
AVSS2112
VREF113
SD4P0114
SD4N0115
SD5P0116
SD5N0117
SD6P0118
SD6N0119
AVSS1120
AVCC121
VASYS1122
AUXVCC2123
AUXVCC1124
VDSYS125
DVCC126
DVSS1127
VCORE128
P1.0
P1.0
P2.0
P2.0
P2.1
P2.1
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SD4P0SD4N0SD5P0SD5N0SD6P0SD6N0
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SY
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SY
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TM
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TD
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TD
O
TD
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TD
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GND
XIN
DVCC
AVCC
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DS
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DS
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AVSS
PJ.2
PJ.2
PJ.1
PJ.1
PJ.0
PJ.0
RS
T/N
MI
RS
T/N
MI
TC
K
TC
K
TC
KP
J.3
PJ.3
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
RS
T
RS
T
RS
T
RS
T
LC
DC
AP
LC
DC
AP
VR
EF
VREF
VE
RE
F+
VE
RE
F+
VCORE
AU
XV
CC
2
AUXVCC2
AU
XV
CC
1
AUXVCC1
AU
XV
CC
3
AU
XV
CC
3
1 2 3 4 5 6
1 2 3 4 5 6
Tite
l:
Da
tum
:
Be
arb
.:
Se
ite1
/1
MS
P-T
S4
30
PE
U1
28
22
.05
.20
12
09
:37
:33
A3
IH
GF
ED
CB
A AB
CD
EF
GH
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File
:
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v.:
www.ti.com MSP-TS430PEU128
B.37 MSP-TS430PEU128
Figure B-73. MSP-TS430PEU128 Target Socket Module, Schematic
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1
P1.0
SB
W
JTA
G
DVDSYS
ext
int
MSP-TS430PEU128Rev. 1.1 RoHS
DVCC
AUXVCC
GND
AU
XV
CC
1
AU
XV
CC
2
AU
XV
CC
3
GND
GND
RST/NMI
TCK
TDI
TDO
TEST/SBWTCK
TMS1
25
51
01
52
03
03
5
6040 45 50 55 64
65
90
70
75
80
85
95
10
0
125 105110115120128
14
12
10
12G
ND
GN
D
VC
C
123
123
123
123
123
123
12
34
12
34
12
34
1
J1
J2
J3
J4
JTA
G
R2
C2
C1
R1
C5R3
BOOTST
C3
R1
0R
11
J5
JP
1
JP
2
JP5
JP6
JP7
JP8
JP9
JP
10
R7
R5
D1
R6
R8
C6
C29
C7
C1
0
R4
JP
12
JP
11
JP
13
C4
C11
C1
2
C8
C1
3
C1
4
C9
C1
6
C1
9
C1
8
C2
6
JP
4
JP3
C1
5C
17
TP1
TP2
IC1
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP1Open to measure current
Orient Pin 1 ofMSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
JP11, JP12, JP13Connect 1-2 to connect AUXVCCx with DVCC or
drive AUXVCCx externally
D1LED connected to P1.0
Jumper JP2Open to disconnect LED
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
MSP-TS430PEU128 www.ti.com
Figure B-74. MSP-TS430PEU128 Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must bepopulated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board issupplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
NOTE: The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:• R7 value is changed to 0 Ω instead of 330 Ω.• JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2.• JP5 pin 2 is connected to IC1 pin 97.• BOOTST pin 7 is connected to IC1 pin 97.
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www.ti.com MSP-TS430PEU128
Table B-38. MSP-TS430PEU128 Bill of MaterialsNo. PerPos. Ref Des Description Digi-Key Part No. CommentBoard
94x119.4mm, 4 layers MSP-TS430PEU128 4 layers, green solder mask1 PCB 1 Rev. 1.1
2 D1 1 green LED, DIODE0805 516-1434-1-ND
3 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP5, JP6, JP7, JP8, 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW)4 6JP9, JP10
5 JP11, JP12, JP13 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC)
6 JP3 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2
JP1, JP2, JP3, JP4, Jumper WM4592-NDJP5, JP6, JP7, JP8,7 13JP9, JP10, JP11,
JP12, JP13
8 R1, R2, R4, R6, R8 5 0R, 0805 541-0.0ATR-ND
9 R10, R11 2 0R, 0805 541-0.0ATR-ND DNP
10 C3 1 2.2nF, CSMD0805 490-1628-2-ND DNP
C13, C14, C16, C17, 4.7uF, 6.3V, CSMD0805 587-1302-2-ND11 7C18, C19, C29
12 C11 1 10uF, 6.3V, CSMD0805 445-1372-2-ND
13 C12 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP
14 C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP
15 R5 1 47K, 0805 311-47KARTR-ND
C4, C5, C6, C7, C8, 100nF, CSMD0805 311-1245-2-ND16 6C15
17 C9 1 100nF, CSMD0805 311-1245-2-ND DNP
18 R3, R7 2 330R, 0805 541-330ATR-ND
19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND
20 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
21 JTAG 1 14-pin connector, male, TH HRP14H-ND
22 IC1 Socket 1 Socket: IC500-1284-009P Manuf. Yamaichi
23 IC1 2 MSP430F67791IPEU DNP: enclosed with kit. Is supplied by TI
24 J5 1 3-pin header, male, TH SAM1035-03-ND
Crystal: MS3V-T1R 32.768kHz DNP: Crystal enclosed with kit. Keep vias free25 Q1 1 12.5pF ±20ppm of solder
26 TP1, TP2 2 Test point DNP, keep vias free of solder
26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias free27 J2,J4 2 of solder.
26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep vias28 J2,J4 2 free of solder.
38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias free29 J1, J3 2 of solder.
38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep vias30 J1, J3 2 free of solder.
31 Rubber feet 4 Rubber feet Buerklin: 20H1724 apply to bottom side corners
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B.38 EM430F5137RF900
Figure B-75. EM430F5137RF900 Target Board, Schematic
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CON12External power connector
Jumper JP2 to "EXT" GND
GND
VCC
Jumpers JP5, JP10Open to disconnect LEDs
D2LED (red) connectedto P3.6 through JP10
D1LED (green) connected
to P1.0 through JP5
Crystal Q1RF - 26 MHz
X1RF - Signal SMA
Button S1Reset
Push-button S2Connected to P1.7
Jumper JP1 in Spy-Bi-Wire mode
Q3Footprint for 32-kHz crystal
R431 and R441
Use 0- resistor to make XIN and XOUTavailable on connector Port 5
W
Jumper JP3Open to measure current
Jumper JP2Close INT for power supply from JTAG interfaceClose EXT to external power supply (CON12)
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP1
Close SBW position to debug in Spy-Bi-Wire modeClose JTAG position to debug in 4-wire JTAG mode
www.ti.com EM430F5137RF900
Figure B-76. EM430F5137RF900 Target board, PCB
The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.
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Table B-39. EM430F5137RF900 Bill of Materials
No. per Manufacturer's PartItem Reference Description Value Manufacturer CommentBoard Number( CUSTOMER SUPPLY ) AKER1 Q1 1 26M ASX-531(CS)CRYSTAL, SMT, 4P, 26MHz ELECTRONIC
C1-C5, C082,C222, C271, CAPACITOR, SMT, 0402, CER,2 C281, C311, 14 0.1uF 0402YC104KAT2A AVX16V, 10%, 0.1uFC321, C341,C412, C452
CAPACITOR, SMT, 0603,3 C071 1 CERAMIC, 0.47uF, 16V, 10%, 0.47uF 0603YD474KAT2A AVX
X5R4 R401 1 RES0402, 47.0K 47kΩ CRCW04024702F100 DALE
HEADER, THU, MALE, 14P,5 CON11 1 09 18 514 6323 HARTING2X7, 25.4x9.2x9.45mmHEADER, THU, MALE, 10P,6 CON10 0 09 18 510 6323 HARTING DNP2X5, 20.32x9.2x9.45mm
7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT
UNINSTALLED CRYSTAL, SMT, MICRO9 Q3 0 32.768k MS1V-T1K (UN) DNP3P, MS1V (Customer Supply) CRYSTALHEADER, THU, MALE, 3P, 1x3,10 CON12 1 22-03-5035 MOLEX9.9x4.9x5.9mm
11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATAFERRITE, SMT, 0402, 1.0kΩ,12 L341 1 1kΩ BLM15HG102SN1D MURATA250mACAPACITOR, SMT, 0402,
13 C293 1 CERAMIC, 100pF, 50V, 0.25pF, 100pF GRM1555C1H101JZ01 MURATAC0G(NP0)INDUCTOR, SMT, 0402, 2.2nH, 0.0022u14 L304 1 LQP15MN2N2B02 MURATA0.1nH, 220mA, 500MHz HINDUCTOR, SMT, 0402, 15nH,15 L303, L305 2 0.015uH LQW15AN15NG00 MURATA2%, 450mA, 250MHzINDUCTOR, SMT, 0402, 18nH,16 L292, L302 2 0.018uH LQW15AN18NG00 MURATA2%, 370mA, 250MHzCAPACITOR, SMT, 0402,
17 C291 1 CERAMIC, 1pF, 50V, 0.05pF, 1pF GRM1555C1H1R0WZ01 MURATAC0G(NP0)CAPACITOR, SMT, 0402,
18 C303 1 CERAMIC, 8.2pF, 50V, 0.05pF, 8.2pF GRM1555C1H8R2WZ01 MURATAC0G(NP0)CAPACITOR, SMT, 0402,C292, C301-19 4 CERAMIC, 1.5pF, 50V, 0.05pF, 1.5pF GRM1555C1H1R5WZ01 MURATAC302, C304 C0G(NP0)INDUCTOR, SMT, 0402, 12nH,20 L291, L301 2 0.012uH LQW15AN12NG00 MURATA2%, 500mA, 250MHz
C282, C312, CAPACITOR, SMT, 0402,21 C351, C361, 5 CERAMIC, 2pF, 50V, 0.1pF, 2.0pF GRM1555C1H2R0BZ01 Murata
C371 C0GINDUCTOR, SMT, 0402, 6.2nH,22 L1 1 6.2nH LQP15MN6N2B02 Murata0.1nH, 130mA, 500MHzULTRA-SMALL TACTILE
23 S1-S2 2 SWITCH, SMT, 2P, SPST-NO, B3U-1000P OMRON1.2x3x2.5mm, 0.05A, 12V
R4-R5, R051, UNINSTALLED24 R061, R431, 0 RESISTOR/JUMPER, SMT, 0Ω ERJ-2GE0R00X PANASONIC DNP
R441 0402, 0 Ω, 5%, 1/16WRESISTOR/JUMPER, SMT,24a R7 1 0Ω ERJ-2GE0R00X PANASONIC0402, 0 Ω, 5%, 1/16W
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Table B-39. EM430F5137RF900 Bill of Materials (continued)No. per Manufacturer's PartItem Reference Description Value Manufacturer CommentBoard Number
RESISTOR, SMT, 0402, THICK25 R2-R3, R6 3 330Ω ERJ-2GEJ331 PANASONICFILM, 5%, 1/16W, 330CAPACITOR, SMT, 0402, CER,26 C431, C441 0 12pF ECJ-0EC1H120J PANASONIC12pF, 50V, 5%, NPOCAPACITOR, SMT, 0402, CER,27 C401 1 0.0022uF ECJ-0EB1H222K PANASONIC2200pF, 50V, 10%, X7RRESISTOR, SMT, THICK FILM,28 R331 1 56kΩ ERJ-2GEJ563 PANASONIC56K, 1/16W, 5%CAPACITOR, SMT, 0603,C081, C221,29 4 CERAMIC, 10uF, 6.3V, 20%, 10uF ECJ-1VB0J106M PANASONICC411, C451 X5RRESISTOR/JUMPER, SMT,30 R1 1 0Ω ERJ-2GE0R00X PANASONIC0402, 0 Ω, 5%, 1/16WUNINSTALLED CAP CERAMIC31 C041 0 4.7uF ECJ-1VB0J475K Panasonic DNP4.7UF 6.3V X5R 0603
32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER33 Q2 0 Crystal, SMT, 32.768 kHz 32.768k MS3V-T1R Micro Crystal DNP
DUT, SMT, PQFP, RGZ-48,34 U1 1 0.5mmLS, 7.15x7.15x1mm, CC430F5137 TI
THRM.PAD35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH
JP3, JP5,38 3 Pin Connector 1x2pin 61300211121 WUERTHJP1038a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH
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B.39 EM430F6137RF900
Figure B-77. EM430F6137RF900 Target Board, Schematic
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CON12External power connector
Jumper JP2 to "EXT"
Jumpers JP5, JP10Open to disconnect LEDs
D2LED (red) connectedto P3.6 JP10through
D1LED (green) connected
to P1.0 JP5through
Crystal Q1RF - 26 MHz
X1RF - Signal SMA
Button S1Reset
Push-button S2Connected to P1.7
Q2/Q3Footprint for 32-kHz crystal
Jumper JP3Open to measure current
GND
GND
VCC
C392C422
L451
Jumper JP1 in Spy-Bi-Wire mode
Jumper JP2Close INT for power supply from JTAG interfaceClose EXT to external power supply (CON12)
Jumper JP1
Close SBW position to debug in Spy-Bi-Wire modeClose JTAG position to debug in 4-wire JTAG mode
R541 and R551
Use 0- resistor to make P5.0 and P5.1available on connector Port 5
W
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
www.ti.com EM430F6137RF900
Figure B-78. EM430F6137RF900 Target Board, PCB
The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.
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Table B-40. EM430F6137RF900 Bill of Materials
No. perPos. Ref Des Description Part No. ManufacturerBoard( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, AKER1 Q1 1 ASX-531(CS)26MHz ELECTRONIC
C1-C5, C112,C252, C381, CAPACITOR, SMT, 0402, CER, 16V, 10%,2 C391, C421, 14 0402YC104KAT2A AVX0.1uFC431, C451,C522, C562
CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,3 C101 1 0603YD474KAT2A AVX16V, 10%, X5R4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE
HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm, 90deg7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA12 L451 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA BLM15HG102SN1D MURATA
CAPACITOR, SMT, 0402, CERAMIC, 100pF,13 C403 1 GRM1555C1H101JZ01 MURATA50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,14 L414 1 LQW15AN2N2C10 MURATA1000mA, 250MHzINDUCTOR, SMT, 0402, 15nH, ±5%, 460mA,15 L413, L415 2 LQW15AN15NJ00 MURATA250MHzINDUCTOR, SMT, 0402, 18nH, ±5%, 370mA,16 L402, L412 2 LQW15AN18NJ00 MURATA250MHzCAPACITOR, SMT, 0402, CER, 1pF, 50V,17 C401 1 GJM1555C1H1R0CB01D MURATA±0.25pF, NP0CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,18 C413 1 GRM1555C1H8R2CZ01 MURATA50V, ±0.25pF, C0G(NP0)
C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,19 4 GRM1555C1H1R5CZ01 MURATAC412, C414 50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,20 L401, L411 2 LQW15AN12NJ00 MURATA250MHz
C46-C48, C392, CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,21 5 GRM1555C1H2R0CZ01 MurataC422 50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH, 700mA,22 L1 1 LQW15AN6N2D00 Murata250MHzULTRA-SMALL TACTILE SWITCH, SMT, 2P,23 S1-S2 2 B3U-1000P OMRONSPST-NO, 1.2x3x2.5mm, 0.05A, 12VRESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,24 R7 1 ERJ-2GE0R00X (UN) PANASONIC1/16WRESISTOR, SMT, 0402, THICK FILM, 5%,25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC1/16W, 330CAPACITOR, SMT, 0402, CER, 2200pF, 50V,27 C511 1 ECJ-0EB1H222K PANASONIC10%, X7R
C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 10uF,28 4 ECJ-1VB0J106M PANASONICC521, C561 6.3V, 20%, X5R28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC
RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,30 R1 1 ERJ-2GE0R00X PANASONIC1/16W31 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER
DUT, SMT, PQFP, RGC-64, 0.5mmLS,33 U1 1 CC430F6137 TI9.15x9.15x1mm, THRM.PAD34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH
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www.ti.com EM430F6137RF900
Table B-40. EM430F6137RF900 Bill of Materials (continued)No. perPos. Ref Des Description Part No. ManufacturerBoard
35 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH
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B.40 EM430F6147RF900
Figure B-79. EM430F6147RF900 Target Board, Schematic
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Orient pin 1 of MSP430 device
D1LED (green) connected
to P1.0 JP5through
Jumpers JP5 and JP10Open to disconnect LEDs
D2LED (red) connectedto P3.6 through JP10
Jumpers JP6 and JP8Close 1-2 for Bypass modeClose 2-3 for TPS modeJumper JP9
TPS status
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
TPS62730
Jumper JP2Close INT: Power supply from JTAG interfaceClose EXT: External power supply
Button S2Connected to P1.7
32-kHz crystal
R554 and R551
Use 0- resistor to make P5.0 and P5.1available on connector Port 5
W
Button S1Reset
Jumper JP3Open to measure current
CON12External poser connector
Jumper JP2 to "EXT"
Crystal Q1RF - 26 MHz
SMA1RF - Signal SMA
Jumper JP1Close JTAG position to debug in JTAG modeClose SBW position to debug in Spy-BI-Wire mode
www.ti.com EM430F6147RF900
Figure B-80. EM430F6147RF900 Target Board, PCB
The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.
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EM430F6147RF900 www.ti.com
Table B-41. EM430F6147RF900 Bill of Materials
No. perPos. Ref Des Description Part No. ManufacturerBoard( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, AKER1 Q1 1 ASX-531(CS)26MHz ELECTRONIC
C1-5 C112C252 C381 CAPACITOR, SMT, 0402, CER, 16V, 10%,2 C391 C421 14 0402YC104KAT2A AVX0.1uFC431 C451C522 C562
CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,3 C101 1 0603YD474KAT2A AVX16V, 10%, X5R4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE
HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm, 90deg7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA
CAPACITOR, SMT, 0402, CERAMIC, 100pF,13 C403 1 GRM1555C1H101JZ01 MURATA50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,14 L414 1 LQW15AN2N2C10 MURATA1000mA, 250MHzInductor, SMD, 0402, 15nH, 5%, 370mA,15 L413 1 LQW15AN15NJ00 MURATA250MHzINDUCTOR,SMT,0402,15nH,±5%,460mA,250M15 L415 1 LQW15AN15NJ00 MURATAHzInductor, SMD, 0402, 18nH, 5%, 460mA,16 L402, L412 2 LQW15AN18NJ00 MURATA250MHzCAPACITOR, SMT, 0402, CER, 1pF, 50V,17 C401 1 GJM1555C1H1R0CB01D MURATA±0.25pF, NP0CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,18 C413 1 GRM1555C1H8R2CZ01 MURATA50V, ±0.25pF, C0G(NP0)
C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,19 4 GRM1555C1H1R5CZ01 MURATAC412, C414 50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,20 L1, L401, L411 3 LQW15AN12NJ00 MURATA250MHzCAPACITOR, SMT, 0402, CERAMIC, 2.0pF,21 C46-C48, C392 4 GRM1555C1H2R0CZ01 MURATA50V, ±0.25pF, C0G(NP0)Inductor, SMD, 0805, 2.2uH, 20%, 600mA,22 L2 1 LQM21PN2R2MC0 MURATA50MHzULTRA-SMALL TACTILE SWITCH, SMT, 2P,23 S1-S2 2 B3U-1000P OMRONSPST-NO, 1.2x3x2.5mm, 0.05A, 12V
R1, R7, R551, RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,24 4 ERJ-2GE0R00X (UN) PANASONICR554 1/16WRESISTOR, SMT, 0402, THICK FILM, 5%,25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC1/16W, 330CAPACITOR, SMT, 0402, CER, 2200pF, 50V,27 C511 1 ECJ-0EB1H222K PANASONIC10%, X7R
C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 1uF, 6.3V,28 4 ECJ-1VB0J105K PANASONICC521, C561 20%, X5R28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC30 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER
DUT, SMT, PQFP, RGC-64, 0.5mmLS,31 U1 1 CC430F6147 TI9.15x9.15x1mm, THRM.PAD
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www.ti.com EM430F6147RF900
Table B-41. EM430F6147RF900 Bill of Materials (continued)No. perPos. Ref Des Description Part No. ManufacturerBoard
IC, Step Down Converter with Bypass Mode for33 U2 1 TPS62370 TILow Power Wireless34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH
JP3, JP5, JP9,36a 4 Pin Connector 1x2pin 61300211121 WUERTHJP1038 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA
CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,38 C041 1 MURATAX5R
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MSP-FET www.ti.com
B.41 MSP-FETThe MSP-FET is a powerful flash emulation tool to quickly begin application development on MSP430microcontrollers.
The MSP-FET provides a USB interface to program and debug the MSP430 devices in-system throughthe JTAG interface or the pin-saving Spy-Bi-Wire (2-wire JTAG) protocol. Furthermore, the USB interfacecan be used for UART backchannel and MSP target BSL communication. UART and I2C BSLcommunication modes are supported.
The MSP-FET development tool supports development with all MSP430 devices and is designed for usewith PCBs that contain MSP430 devices; for example, the MSP430 target socket boards.
B.41.1 Features• USB debugging interface to connect a MSP430 MCU to a PC for real-time in-system programming and
debugging• Software configurable supply voltage between 1.8 V and 3.6 V at 100 mA• Supports JTAG Security Fuse blow to protect code• Supports all MSP430 boards with JTAG header• Supports both JTAG and Spy-Bi-Wire (2-wire JTAG) debug protocols
B.41.2 Release NotesThe MSP-FET is supported by MSP Debug Stack (MSPDS) revision 3.4.0.20 and higher. Observe thefollowing MSPDS-specific MSP-FET limitations.
B.41.2.1 MSPDS 3.4.0.20 Limitations• EEM access to F149 and L092 devices is possible only when JTAG speed is set to slow.• Poly Fuse Blow in Spy-Bi-Wire mode is in beta state and is not officially supported.• The UART backchannel function is not implemented (even though an additional COM port is shown on
the PC).
B.41.2.2 MSPDS UART Backchannel ImplementationIn MSPDS v3.4.1.0 and later, the UART backchannel function is implemented and supported for the MSP-FET. The baud rates that are supported depend on the target configuration and the debug settings.Table B-42 shows which baud rates are supported with certain configuration combinations.A green cell with means that the corresponding baud rate is supported without any data loss with thespecified combination of settings.A red cell with means that the corresponding baud rate is not supported (data loss is expected) with thespecified combination of settings.
Table B-42. UART Backchannel Implementation
Target MCLK 1 MHz 1 MHz 8 MHz 8 MHz 1 MHz 1 MHz 8 MHz 8 MHzFrequency:Debugger: Active Active Active Active Inactive Inactive Inactive InactiveFlow Control: No Yes No Yes No Yes No Yes4800 baud 9600 baud 19200 baud 28800 baud 38400 baud 57200 baud 115200 baud
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Figure B-81. MSP-FET Top View
Figure B-82. MSP-FET Bottom View
B.41.2.3 MSPDS UART Backchannel Activation CommandsThe MSP-FET supports two different backchannel UART modes, one with flow control and one without.The different modes can be selected by opening the corresponding COM port with a dedicated baud rate.See Table B-43 for the specific baud rates for each command.
NOTE: The baud rates used by these commands cannot be used for communication.
If none of the specified commands are transferred before setting the communication baud rate,communication starts with these default settings: 3.3-V target VCC, no flow control mechanism.
Table B-43. UART Backchannel Activation Commands
Baud Rate Command9620 Set all backchannel UART pins to high impedance – no current flow into target device9621 Configure backchannel UART communication without handshake (default start behavior)9622 Configure backchannel UART communication with handshake9623 Voltage configuration command.
When this command is received, target VCC is set to 3300 mV. After target VCC is configured, it is switchedthrough to the target device.
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B.41.2.4 MSPDS MSP Target BSL Activation CommandsThe MSP-FET can be used for communication with the target device BSL through the I2C and UARTprotocols. The activation of the different protocols is equivalent to the MSP-FET backchannel UART. SeeTable B-44 for command details. In MSP-FET BSL communication mode, flow control is not available,because this is not supported by the MSP target device BSL.
UART BSL: The MSP-FET BSL UART mode supports the following baud rates: 9600, 14400, 19200,28800, 38400, 56000, 57600, and 115200. For the BSL UART, 8 + 1 + even parity is used.
I2C BSL: The MSP-FET is always the I2C master, and the target device BSL is always the I2C slave. 7-bitI2C addressing mode is used with a fixed I2C slave address of 0x48.
NOTE: If the MSP-FET is configured to support BSL communication, debugger functionality isdisabled. To switch to debugger mode, either perform a power cycle (unplug the USB cable)or configure the baud rate to 8001.
Table B-44. MSP Target BSL Activation Commands
Baud Rate Command9620 Set all UART or I2C pins to high impedance – no current flow into target device9601 BSL entry sequence and power up 3.3 V (UART BSL)
100000 or 100001 BSL entry sequence and power up 3.3 V (I2C BSL)400000 or 400001 BSL entry sequence and power up 3.3 V (I2C BSL)
9623 Power up 3.3 V8001 Activate debugger
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MS
P-F
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Rev
1
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Genera
lpow
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upply
Additio
nalsupply
LED
USB in
terfa
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Host M
CU
DVCC1
DVCC3
DVCC2
AVCC1
Debug i/f
USB B
SL a
ctiv
atio
n
VBU
S b
ypass
1P6.4
/CB4/A
4
2P6.5
/CB5/A
5
3P6.6
/CB6/A
6/D
AC0
4P6.7
/CB7/A
7/D
AC1
5P7.4
/CB8/A
12
6P7.5
/CB9/A
13
7P7.6
/CB10/A
14/D
AC0
8P7.7
/CB11/A
15/D
AC1
9P5.0
/VREF+
/VEREF+
10
P5.1
/VREF-/V
EREF-
11
AVCC1
12
AVSS1
13
XIN
14
XO
UT
15
AVSS2
16
P5.6
/AD
C12CLK/D
MAE0
17
P2.0
/P2M
AP0
18
P2.1
/P2M
AP1
19
P2.2
/P2M
AP2
20
P2.3
/P2M
AP3
21
P2.4
/P2M
AP4
22
P2.5
/P2M
AP5
23
P2.6
/P2M
AP6/R
03
24
P2.7
/P2M
AP7/L
CD
REF/
25
DVCC1
26DVSS1
27VCORE(2)
28P5.2/R23
29LCDCAP/R33
30COM0
31P5.3/COM1/S42
32P5.4/COM2/S41
33P5.5/COM3/S40
34P1.0/TA0CLK/ACLK/S3
35P1.1/TA0.0/S38
36P1.2/TA0.1/S37
37P1.3/TA0.2/S36
38P1.4/TA0.3/S35
39P1.5/TA0.4/S34
40P1.6/TA0.1/S33
41P1.7/TA0.2/S32
42P3.0/TA1CLK/CBOUT/S
43P3.1/TA1.0/S30
44P3.2/TA1.1/S29
45P3.3/TA1.2/S28
46P3.4/TA2CLK/SMCLK/S
47P3.5/TA2.0/S26
48P3.6/TA2.1/S25
49P3.7/TA2.2/S24
50P4.0/TB0.0/S23
51
P4.1
/TB0.1
/S22
52
P4.2
/TB0.2
/S21
53
P4.3
/TB0.3
/S20
54
P4.4
/TB0.4
/S19
55
P4.5
/TB0.5
/S18
56
P4.6
/TB0.6
/S17
57
P4.7
/TB0O
UTH
/SVM
OU
T
58
P8.0
/TB0CLK/S
15
59
P8.1
/UCB1STE
60
P8.2
/UCA1TXD
61
P8.3
/UCA1RXD
62
P8.4
/UCB1CLK/U
CA1ST 6
3D
VSS2
64
DVCC2
65
P8.5
/UCB1SIM
O
66
P8.6
/UCB1SO
MI
67
P8.7
/S8
68
P9.0
/S7
69
P9.1
/S6
70
P9.2
/S5
71
P9.3
/S4
72
P9.4
/S3
73
P9.5
/S2
74
P9.6
/S1
75
P9.7
/S0
76VSSU
77PU.0/DP
78PUR
79PU.1/DM
80VBUS
81VUSB
82V18
83AVSS3
84P7.2/XT2IN
85P7.3/XT2OUT
86VBAK
87VBAT
88P5.7/RTCCLK
89DVCC3
90DVSS3
91TEST/SBWTCK
92PJ.0/TDO
93PJ.1/TDI/TCLK
94PJ.2/TMS
95PJ.3/TCK
96RST/NMI/SBWTDIO
97P6.0/CB0/A0
98P6.1/CB1/A1
99P6.2/CB2/A2
100P6.3/CB3/A3
U1
MSP430F6638IP
ZR
C6
100n
+C5
10uF/6
.3V
C7
100n
C9
100n
C11
100n
R1
0R
C15
68p
C16
470n
C17
220n
C18
4.7
nD
1D
2
R47 470R
R50
0R
1 IO1
2 IO2
3 GND 4IO3
5IO4
6VCC
U5
TPD4E004DRYR
R2
1k4
C14
4.7
u, d
np
C23
100n
R60
33k
C31
10p
C33
10p
R61
1M
R62
100R
J5
C8
220n
13
2
P1
R17
0R
AC
D7
B0530W
-7-F
R76
27k
C70
4.7
u, d
np
C71
100n
R85
0R, dnp
C55
1n
R3
27R
R45
27R
R46 470R
+C12
10uF/6
.3V
12345
67
1110
J1
R28
4k7
R30
4k7
1
1
11
111
11
1
11
1
11
1
11
11
1
1
VCC_D
T_REF
VCC_D
CD
C_REF
VCC_D
T2TRG
T_CTRL
VCC_SU
PPLY
2TRG
T_CTRL
LED1
TDIOFF_CTRL
PW
M_SETVF
FPG
A_TCK
FPG
A_TD
I
FPG
A_TM
S
FPG
A_TD
O
FPG
A_TRST
VF2TEST_CTRL
VF2TDI_CTRL
AVCC_PO
D
VCC_PO
D33
VCC_PO
D33
VCC_POD33
VREF+
VCORE
VBAK
MCU
_D
MAE0
DCD
C_PU
LSE
MCU
_P2.2
MCU
_P2.3
MCU
_P2.4
MCU
_P2.5
MCU
_P2.6
MCU
_P2.7
MCU_P1.0
MCU_P1.1
MCU_P1.2
MCU_P1.3
MCU_P1.4
MCU_P1.5
MCU_P1.6
MCU_P1.7
MCU_P3.0
MCU_P3.1
MCU_P3.2
MCU_P3.3
MCU_P3.4
MCU_P3.5
MCU_P3.6
MCU_P3.7
MCU_P4.0
MCU
_P4.1
MCU
_P4.2
MCU
_P4.3
MCU
_P4.4
MCU
_P4.5
MCU
_P4.6
MCU
_P4.7
MCU
_P8.1
MCU
_P8.2
MCU
_P8.3
PUR
PU.1/DM
PU.0/DP
VBUS
VUSB
AVCC_PO
D
VCC_PO
D33
VCC_PO
D33
VCC_PO
D33
AVCC_PO
DVCC_PO
D33
VREF+
VCORE
V18
V18
VBAK
HOST_TEST
HOST_RST
FPG
A_RESET
LED0
LED1
PU
R
VU
SB
PU
.1/D
M
PU
.0/D
P
DCD
C_RST
HO
ST_SCL
HO
ST_SD
A
DCD
C_IO
0
LED
0
A_VBUS5
VBU
S
A_VCC_SUPPLY_HOST
DCD
C_TEST
A_VF
MCU
_P9.5
DCDC_IO1
HOST_TCK
HOST_TMS
HOST_TDI
HOST_TDO
VCC_POD33
HO
ST_RST
VCC_PO
D33
GN
D1
VBU
S5
MCU
_P2.1
GN
D1
GN
D1
VCC_D
T2SU
PPLY
_CTRL
A_VCC_D
T
A_VCC_D
T_BSR
A_VCC_SENSE0_TRGT
VCC_POD33
VCC_D
T_SEN
SE
www.ti.com MSP-FET
B.41.3 Schematics
Figure B-83. MSP-FET USB Debugger, Schematic (1 of 5)
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MS
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VCC_PU
MP
VCC_JT
AG
FPG
A
1G
ND
2G
AA2/IO
51RSB1
3IO
52RSB1
4G
AB2/IO
53RSB1
5IO
95RSB1
6G
AC2/IO
94RSB1
7IO
93RSB1
8IO
92RSB1
9G
ND
10
GFB1/IO
87RSB1
11
GFB0/IO
86RSB1
12
VCO
MPLF
13
GFA0/IO
85RSB1
14
VCCPLF
15
GFA1/IO
84RSB1
16
GFA2/IO
83RSB1
17
VCC
18
VCCIB
1
19
GEC1/IO
77RSB1
20
GEB1/IO
75RSB1
21
GEB0/IO
74RSB1
22
GEA1/IO
73RSB1
23
GEA0/IO
72RSB1
24
VM
V1
25
GN
DQ
26GEA2/IO71RSB1
27FF/GEB2/IO70RSB1
28GEC2/IO69RSB1
29IO68RSB1
30IO67RSB1
31IO66RSB1
32IO65RSB1
33IO64RSB1
34IO63RSB1
35IO62RSB1
36IO61RSB1
37VCC
38GND
39VCCIB1
40IO60RSB1
41IO59RSB1
42IO58RSB1
43IO57RSB1
44GDC2/IO56RSB1
45GDB2/IO55RSB1
46GDA2/IO54RSB1
47TCK
48TDI
49TMS
50VMV1
51
GN
D
52
VPU
MP
53
NC
54
TD
O
55
TRST
56
VJT
AG
57
GD
A1/IO
49RSB0
58
GD
C0/IO
46RSB0
59
GD
C1/IO
45RSB0
60
GCC2/IO
43RSB0
61
GCB2/IO
42RSB0
62
GCA0/IO
40RSB0
63
GCA1/IO
39RSB0
64
GCC0/IO
36RSB0
65
GCC1/IO
35RSB0
66
VCCIB
0
67
GN
D
68
VCC
69
IO31RSB0
70
GBC2/IO
29RSB0
71
GBB2/IO
27RSB0
72
IO26RSB0
73
GBA2/IO
25RSB0
74
VM
V0
75
GN
DQ
76GBA1/IO24RSB0
77GBA0/IO23RSB0
78GBB1/IO22RSB0
79GBB0/IO21RSB0
80GBC1/IO20RSB0
81GBC0/IO19RSB0
82IO18RSB0
83IO17RSB0
84IO15RSB0
85IO13RSB0
86IO11RSB0
87VCCIB0
88GND
89VCC
90IO10RSB0
91IO09RSB0
92IO08RSB0
93GAC1/IO07RSB0
94GAC0/IO06RSB0
95GAB1/IO05RSB0
96GAB0/IO04RSB0
97GAA1/IO03RSB0
98GAA0/IO02RSB0
99IO01RSB0
100IO00RSB0
U2
A3PN
125-V
QG
100
R4
1k
R5
1k
12
L3
33n
+C19
10uF/6
.3V
C20
100n
C21
10n
C22
100n
C34
10n
C35
100n
C36
10n
C37
100n
C38
10n
C39
100n
C40
10n
C41
100n
C42
10n
C43
100n
C44
10n
C45
100n
C46
10n
C47
100n
C48
10n
C49
100n
C50
10n
C51
100n
C52
10n
R44
27R
1
111
1
1 1 1
1
1
1
1
1111
1
VCC_PLF
VCC_PO
D15
VCC_POD15
VCC_PO
D15
VCC_POD15
VCC_PO
D33
VCC_PO
D33
VCC_POD33
VCC_POD33
VCC_PO
D33
VCC_PO
D33
VCC_PO
D33
VCC_PO
D33
VCC_POD33
FPGA_TCK
FPGA_TDI
FPGA_TMS
FPG
A_TRST
MCU_DMAE0
MCU_P2.2
MCU_P2.3
MCU_P2.4
MCU_P2.5
MCU_P2.6
MCU_P1.0
MCU_P1.1
MCU_P1.2
MCU_P1.3
MCU_P1.4
MCU_P1.5
MCU_P1.6
MCU_P1.7
MCU_P3.0
MCU_P3.1
MCU_P3.2
MCU_P3.3
MCU_P3.4
MCU
_P3.5
MCU
_P3.6
MCU
_P3.7
MCU
_P4.0
MCU
_P4.1
MCU
_P4.2
MCU
_P4.3
MCU
_P4.4
MCU
_P4.5
MCU
_P4.6
MCU
_P4.7
MCU
_P8.1
MCU
_P8.2
MCU
_P8.3
FPG
A_IO
_TCK
FPG
A_D
IR_CTRL_TCK
FPG
A_IO
_TM
S
FPG
A_D
IR_CTRL_TM
S
FPG
A_IO
_TD
I
FPG
A_D
IR_CTRL_TD
I
FPG
A_IO
_TD
O
FPG
A_D
IR_CTRL_TD
O
MCU
_P2.7
FPG
A_D
IR_CTRL_RST
FPG
A_IO
_TEST
FPG
A_D
IR_CTRL_TEST
FPG
A_IO
_U
ART_TXD
FPG
A_D
IR_CTRL_U
ART_TXD
FPG
A_IO
_U
ART_RXD
FPG
A_D
IR_CTRL_U
ART_RXD
FPG
A_IO
_U
ART_CTS
FPGA_DIR_CTRL_UART_CTS
FPGA_IO_UART_RTS
FPGA_DIR_CTRL_UART_RTS
FPG
A_TD
O
FPGA_RESET
VCC_PO
D15
VCC_PO
D15
VCC_PO
D33
VCC_PLF
VCC_PO
D33
VCC_PO
D33
FPGA_IO_RST
FPGA_TP0
FPGA_TP1
FPGA_TP2
MCU_P9.5
MCU_P2.1
MSP-FET www.ti.com
Figure B-84. MSP-FET USB Debugger, Schematic (2 of 5)
164 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
3/1
2/2
014
3/1
2/2
014
C
4
AB
CD
Date
E
Sheet
of
F
4 2
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and s
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1D
VCC
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3P1.1
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6P1.4
/TA0.2
7P1.5
/TA0.0
8P1.6
/TA0.1
9P1.7
/SD
I
10
NM
I-RST
11
TEST/S
BW
TCK
12
XO
UT/P
2.7
13
XIN
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14
DVSS
U4
MS
P430G
2452P
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MSP430G
2452PW
12
L4
R53
R55
R56
R64
1
2
3
D4
R65
220k
C28
33p
R63
C53
100n
1N
O1
2CO
M1
3N
O2
4CO
M2
5IN
2
6IN
3
7G
ND
8N
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M3
10
CO
M4
11
NO
4
12
IN4
13
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14
V+
U20
TS
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47
51
PW
R
TS3A4751PW
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np
C56
4.7
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C63
100n
R19
1 A1
2 A2
3C1,C2
D8
C66
1n
R200R
R23180k
R25
150k
R15
220k
1G
2S3
D
Q3
R26
27k, d
np
1IN
2G
ND
3EN
4N
R
5O
UT
U7
TPS73401D
DCT
C54 1n
C26
2.2
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R24160k
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C62
10n
C29
4.7
u
C10
1u
2 E
1B
3C
Q4
R6
220k
C1
33p
R7
220k
C65 100n
5IN
-
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REF
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GND
3
V+
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CKT
C67 10p
C68 1n
R49
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R54
10R
R57
0.2
C69
2.2
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C72
2.2
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C73
2.2
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11
DCD
C_CAL0
DCD
C_CAL2
DCD
C_TEST
DCD
C_RST
HO
ST_SD
A
DCD
C_CAL1
VCC_PO
D33
DCD
C_PU
LSE
DCD
C_IO
0
VCC_D
CD
C_REF
A_VCC_SU
PPLY
VBU
S5
VCC_SU
PPLY
A_VCC_SU
PPLY
DCD
C_CAL0
VCC_SUPPLY
VCC_DT
DCD
C_CAL1
DCD
C_CAL2
DCD
C_RST
VCC_PO
D33
GN
D1
GND1
GN
D1
GN
D1
GN
D1
VBU
S
GN
D1
GN
D1
GN
D1
DCD
CG
ND
GN
D1
DCD
CG
ND
DCD
CG
ND
DCD
CG
ND
DCD
CG
ND
DCD
CG
ND
GN
D1
VCC_SU
PPLY
GN
D1
GN
D1
VCC_D
T_REF
GN
D1
DCD
C_IO
1
VCC_D
T
HO
ST_SCL
VCC_D
T_BSR
VCC_SU
PPLY
A_VCC_SU
PPLY
_H
OST
VCC_SU
PPLY
VCC_PO
D33
VCC_D
T_SEN
SE
VCC_D
T
VCC_D
T_BSR
GN
D1
GN
D1
GN
D1
www.ti.com MSP-FET
Figure B-85. MSP-FET USB Debugger, Schematic (3 of 5)
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3/1
2/2
014
5
1A
4
Rev
3 2
F
Num
ber
Siz
e
ED
CB
A
13
1
24
F
of
Sheet
E
Date
DC
BA
4
C
3/1
2/2
014
VF =
+5V ... 6
.5V
Fuse b
low
ste
p-u
p c
onverte
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Fuse v
olta
ge m
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lexer / V
CC_D
T to
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MSP-F
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D2
IN1
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D
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dnp
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SZ5232B-7
-F
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D1
IN2
GN
DS2
D2
IN1
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E
B
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1
12345678910
11
12
13
14
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1
2IO
2
3IO
3
4IO
45
IO5
6IO
6
7IO
7
8IO
8
9 GND
U3
TPD
8E003D
QD
TPD
8E003D
QD
R
1IO
1
2IO
2
3IO
3
4IO
45
IO5
6IO
6
7IO
7
8IO
8
9 GND
U21
TPD
8E003D
QD
TPD
8E003D
QD
R
R22
47k
R29
47k
R421k
D3dnp
DD
Z9692-7
1VCCA
2G
ND
3A
4B
5D
IR
6VCCB
U12
SN
74LVC1T45D
CKR
1VCCA
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ND
3A
4B
5D
IR
6VCCB
U13
SN
74LVC1T45D
CKR
1VCCA
2G
ND
3A
4B
5D
IR
6VCCB
U14
SN
74LVC1T45D
CKR
1VCCA
2G
ND
3A
4B
5D
IR
6VCCB
U15
SN
74LVC1T45D
CKR
1VCCA
2G
ND
3A
4B
5D
IR
6VCCB
U16
SN
74LVC1T45D
CKR
1VCCA
2G
ND
3A
4B
5D
IR
6VCCB
U17
SN
74LVC1T45D
CKR
1VCCA
2G
ND
3A
4B
5D
IR
6VCCB
U22
SN
74LVC1T45D
CKR
1VCCA
2G
ND
3A
4B
5D
IR
6VCCB
U26
SN
74LVC1T45D
CKR
1VCCA
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ND
3A
4B
5D
IR
6VCCB
U27
SN
74LVC1T45D
CKR
1VCCA
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ND
3A
4B
5D
IR
6VCCB
U28
SN
74LVC1T45D
CKR
R27
47k
R31
47k
R84
47k, d
np
R86
47k
R87
47k
R88
47k
R89
47k
R90
47k
R91
47k
R92
47k
R93
47k
R94
47k
R95
47k
R96
47k
R97
47k
R98
47k
R99
47k
R100
47k
R101
47k
R102
47k
C77
100n
C78
100n
C79
100n
C80
100n
C82
100n
C83
100n
C84
100n
C85
100n
R32
100R
R33
100R
R34
100R
R37
100R
R38
100R
R39
100R
R40
100R
R41
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R43
100R
AC
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R48
47k
R58
47k
R59
47k
1
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VF
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I
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TC_TEST_BSR
TC_TD
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VCC_SEN
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T
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TC_TCK_FD
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TC_RST_FD
TC_U
ART_TXD
_FD
TC_U
ART_RTS_FD
TC_U
ART_RXD
_FD
VCC_SU
PPLY
_TRG
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_TRG
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_FD
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_FD
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_TCK
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_TM
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FPG
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TC_TM
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VCC_PO
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A_IO
_TD
I
FPG
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IR_CTRL_TD
I
TC_TD
I_FD
VCC_D
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VCC_D
T_TRG
T
VCC_PO
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FPG
A_IO
_TD
O
FPG
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IR_CTRL_TD
O
TC_TD
O_FD
VCC_D
T_TRG
T
VCC_D
T_TRG
T
VCC_PO
D33
FPG
A_IO
_RST
FPG
A_D
IR_CTRL_RST
TC_RST_FD
VCC_D
T_TRG
T
VCC_D
T_TRG
T
VCC_PO
D33
FPG
A_IO
_TEST
FPG
A_D
IR_CTRL_TEST
TC_TEST_FD
VCC_D
T_TRG
T
VCC_D
T_TRG
T
VCC_PO
D33
FPG
A_IO
_U
ART_TXD
FPG
A_D
IR_CTRL_U
ART_TXD
TC_U
ART_TXD
_FD
VCC_D
T_TRG
T
VCC_D
T_TRG
T
VCC_PO
D33
FPG
A_IO
_U
ART_RXD
FPG
A_D
IR_CTRL_U
ART_RXD
TC_U
ART_RXD
_FD
VCC_D
T_TRG
T
VCC_D
T_TRG
T
VCC_PO
D33
FPG
A_IO
_U
ART_CTS
FPG
A_D
IR_CTRL_U
ART_CTS
TC_U
ART_CTS_FD
VCC_D
T_TRG
T
VCC_D
T_TRG
T
VCC_PO
D33
FPG
A_IO
_U
ART_RTS
FPG
A_D
IR_CTRL_U
ART_RTS
TC_U
ART_RTS_FD
VCC_D
T_TRG
T
VCC_D
T_TRG
T
VCC_PO
D33
GN
D1
VCC_D
T_TRG
T
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
GN
D1
VCC_PO
D33
GND1
GN
D1
VF_TD
I
VF_TEST
MSP-FET www.ti.com
Figure B-86. MSP-FET USB Debugger, Schematic (4 of 5)
166 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
3/1
2/2
014
3/1
2/2
014
C
4
AB
CD
Date
E
Sheet
of
F
4 2
1
3 1
AB
CD
E
Siz
eN
um
ber
F
23
Rev
5
A1
5
MSP-F
ET p
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240k
R52
150k
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270k
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150k
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33p
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TP5
TP6
TP1
TP2
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150k
R21
47k
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J2
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R78
150k
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150k
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TP9
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150k
R18
150k
1
11
11
1
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SE0_TRG
T
A_VCC_SEN
SE0_TRG
T
VBU
S5
A_VBU
S5
VF
A_VF
DCD
C_PU
LSE
VCC_SU
PPLY
FPG
A_TP0
FPG
A_TP1
FPG
A_TP2
VBU
S
GN
D1
VBU
SH
OST_TEST
HO
ST_TD
OH
OST_TD
IH
OST_TM
SH
OST_TCK
HO
ST_RST
DCD
C_RST
DCD
C_TEST
VCC_PO
D33
FPG
A_TRST
FPG
A_TCK
FPG
A_TM
SFPG
A_TD
IFPG
A_TD
O
GN
D1
GN
D1
A_VCC_SU
PPLY
_H
OST
VCC_PO
D15
VBU
S5
VCC_D
T
A_VCC_D
T
GN
D1
DCD
C_IO
1D
CD
C_IO
0
VCC_D
T
HO
ST_SCL
HO
ST_SD
A
VCC_SU
PPLY
_TRG
T
VCC_SU
PPLY
_TRG
T
VBU
S
VCC_SU
PPLY
2TRG
T_CTRL
VCC_SU
PPLY
VCC_D
T
VCC_D
T2SU
PPLY
_CTRL
GN
D1
GN
D1
GN
D1
VCC_PO
D15
VCC_PO
D33
VBU
S
PW
RG
ND
PW
RG
ND
PW
RG
ND
PW
RG
ND
PW
RG
ND
VCC_D
T_BSR
A_VCC_D
T_BSR
www.ti.com MSP-FET
Figure B-87. MSP-FET USB Debugger, Schematic (5 of 5)
167SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
MSP-FET www.ti.com
B.41.4 Layout
Figure B-88. MSP-FET USB Debugger, PCB (Top) Figure B-89. MSP-FET USB Debugger, PCB (Bottom)
B.41.5 LED SignalsThe MSP-FET shows its operating states using two LEDs, one green and one red. Table B-45 lists allavailable operation modes. An or icon indicates that the LED is off, an or icon indicates thatthe LED is on, and an or icon indicates that the LED flashes.
Table B-45. MSP-FET LED Signals
Function Power LED Mode LEDMSP-FET not connected to PC, or MSP-FET not ready; for example, after a major firmwareupdate. Connect or reconnect MSP-FET to PC.
MSP-FET connected and ready
MSP-FET waiting for data transfer
Ongoing data transfer
An error has occurred; for example, target VCC overcurrent. Unplug MSP-FET from target,and cycle the power off and on. Check target connection, and reconnect MSP-FET.
Firmware update in progress. Do not disconnect MSP-FET while both LEDs are blinking.
FPGA update in progress. Do not disconnect MSP-FET while both LEDs are blinking rapidly.
168 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-FET
B.41.6 JTAG Target ConnectorFigure B-90 shows the pinout of the JTAG connector.
Figure B-90. JTAG Connector Pinout
Table B-46. JTAG Connector Pin State by Operating Mode
When JTAG Protocol is When Spy-Bi-Wire ProtocolPin Name After Power-Up Selected is Selected1 TDO/TDI Hi-Z, pulled up to 3.3 V In, TDO In and Out, SBWTDIO2 VCC_TOOL 3.3 V VCC VCC
3 TDI/VPP Hi-Z, pulled up to 3.3 V Out, TDI Hi-Z, pulled up to VCC
4 VCC_TARGET In, external VCC sense In, external VCC sense In, external VCC sense5 TMS Hi-Z, pulled up to 3.3 V Out, TMS Hi-Z, pulled up to VCC
6 N/C N/C N/C N/C7 TCK Hi-Z, pulled up to 3.3 V Out, TCK Out, SBWTCK8 TEST/VPP Out, Gnd Out, TEST Hi-Z, pulled up to VCC
9 GND Ground Ground GroundOut, Target UART Clear-To- Out, Target UART Clear-To-10 UART_CTS/SPI_CLK/I2C_SCL Hi-Z, pulled up to 3.3 V Send Handshake input Send Handshake input
11 RST Out, VCC Out, RST Out12 UART_TXD/SPI_SOMI/I2C_SDA Hi-Z, pulled up to 3.3 V In, Target UART TXD output In, Target UART TXD output
In, Target UART Ready-to- In, Target UART Ready-to-13 UART_RTS Hi-Z, pulled up to 3.3 V Send Handshake output Send Handshake output14 UART_RXD/SPI_SIMO Hi-Z, pulled up to 3.3 V Out, Target UART RXD input Out, Target UART RXD input
169SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
12 UART_TXD
11 RST
8 TEST
7 TCK
5 TMS
3 TDI
1 TDO/TDI
2 VCC_TOOL
- USB Power
10 UART_CTS
14 UART_RXD
13 UART_RTS
Pin Signal
MSP-FET www.ti.com
Figure B-91 shows the state of each pin in the connector after power-up.
Figure B-91. Pin States After Power-Up
170 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
www.ti.com MSP-FET
B.41.7 SpecificationsTable B-47 shows the physical and electrical specifications of the MSP-FET.
Table B-47. Specifications
MechanicalSize (without cables) 80 mm x 50 mm x 20 mm
InterfacesUSB interface USB 2.0, full speedTarget interface JTAG 14-pin See Table B-46 for pinoutJTAG cable length 20 cm (max)
JTAG and Spy-Bi-Wire Interface, ElectricalUSB powered, 200 mAPower supply (max)
Target output voltage 1.8 V to 3.6 V Selectable in 0.1-V steps. VCC_TOOL available from JTAG pin 2.VCC_TOOLTarget output current 100 mA (max) Current supplied through JTAG pin 2Target output overcurrent 160 mA (max)detection levelJTAG signal overcurrent 30 mA (max) Total current supplied through JTAG pins 1, 3, 5, 7, 8, 10, 11, 12, 13, 14detection level
Connect external target voltage VCC_TARGET to JTAG pin 4. JTAGExternal target supply Supported (1.8 V to 3.6 V) and SBW signals are regulated to external target voltage ±100 mV.Fuse blow Supported For devices with poly-fuse
JTAG and Spy-Bi-Wire Interface, TimingJTAG clock speed 8 MHz (max) Protocol speed selectable by software
Protocol speed selectable by software. System limitations due toSpy‑Bi‑Wire clock speed 8 MHz (max) external RC components on reset pin (SBWTDIO) might apply.JTAG and Spy-Bi-Wire Interface, Speed
Flash write speed (JTAG) Up to 20 kB/secFlash write speed Up to 7 kB/sec(Spy‑Bi‑Wire)FRAM write speed (JTAG) Up to 50 kB/secFRAM write speed Up to 14 kB/sec(Spy‑Bi‑Wire)
EnergyTrace™ TechnologyTarget output current For target output voltage = 1.8 V to 3.6 V, target output current <75 mA± 2%, ± 500 nAaccuracy and USB voltage = 5 V constant during and after calibration
B.41.8 MSP-FET Revision HistoryRevision numbers are printed on the PCB and are stored in nonvolatile memory in firmware. Table B-48shows the revision history of the MSP-FET.
Table B-48. MSP-FET Revision History
Revision Date CommentsRevision 1.2 March 2014 Initial release
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B.42 MSP-FET430UIF
Figure B-92. MSP-FET430UIF USB Interface, Schematic (1 of 4)
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Figure B-93. MSP-FET430UIF USB Interface, Schematic (2 of 4)
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Figure B-94. MSP-FET430UIF USB Interface, Schematic (3 of 4)
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Figure B-95. MSP-FET430UIF USB Interface, Schematic (4 of 4)
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Figure B-96. MSP-FET430UIF USB Interface, PCB
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B.42.1 MSP-FET430UIF Revision HistoryRevision 1.3• Initial released hardware version
Assembly change on 1.3 (May 2005)• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R
Changes 1.3 to 1.4 (Aug 2005)• J5: VBUS and RESET additionally connected• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R• U1, U7: F1612 can reset TUSB3410; R44 = 0R added• TARGET-CON.: pins 6, 10, 12, 13, 14 disconnected from GND• Firmware-upgrade option through BSL: R49, R52, R53, R54 added; R49, R52 are currently DNP• Pullups on TCK and TMS: R78, R79 added• U2: Changed from SN74LVC1G125DBV to SN74LVC1G07DBV
NOTE: Using a locally powered target board with hardware revision 1.4
Using an MSP-FET430UIF interface hardware revision 1.4 with populated R62 in conjunctionwith a locally powered target board is not possible. In this case, the target device RESETsignal is pulled down by the FET tool. It is recommended to remove R62 to eliminate thisrestriction. This component is located close to the 14-pin connector on the MSP-FET430UIFPCB. See the schematic and PCB drawings in this document for the exact location of thiscomponent.
Assembly change on 1.4a (January 2006)• R62: not populated
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B.43 MSP-FET430PIF
Figure B-97. MSP-FET430PIF FET Interface Module, Schematic
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Figure B-98. MSP-FET430PIF FET Interface Module, PCB
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Appendix CSLAU278W–May 2009–Revised October 2015
Hardware Installation Guide
This section describes the hardware installation process of the following USB debug interfaces on a PCrunning Windows XP:• MSP-FET430UIF• eZ430-F2013• eZ430-RF2500• eZ430-Chronos• eZ430-RF2780• eZ430-RF2560• MSP-WDSxx "Metawatch"• LaunchPad (MSP-EXP430G2)• MSP-EXP430FR5739• MSP-EXP430F5529
The installation procedure for other supported versions of Windows is very similar and, therefore, notshown here.
Topic ........................................................................................................................... Page
C.1 Hardware Installation ........................................................................................ 181
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C.1 Hardware InstallationTable C-1 shows the USB VIDs and PIDs used in MSP430 tools.
Table C-1. USB VIDs and PIDs Used in MSP430 Tools
Tool USB VID USB PID INF File NameeZ430-F2013 0x0451 0xF430 usbuart3410.infeZ430-RF2500 0x0451 0xF432 430CDC.infeZ430-RF2780 0x0451 0xF432 430CDC.infeZ430-RF2560 0x0451 0xF432 430CDC.infMSP-WDSxx "Metawatch" 0x0451 0xF432 430CDC.infeZ430-Chronos 0x0451 0xF432 430CDC.infMSP-FET430UIF (1) 0x2047 0x0010 msp430tools.infMSP-FET 0x2047 0x0204 msp430tools.infeZ-FET 0x2047 0x0203 msp430tools.infLaunchPad (MSP-EXP430G2) 0x0451 0xF432 430CDC.infMSP-EXP430FR5739 0x0451 0xF432 430CDC.infMSP-EXP430F5529 0x0451 0xF432 430CDC.inf
(1) The older MSP-FET430UIF used with IAR versions before v5.20.x and CCS versions before v5.1 has VID 0x0451 and PID0xF430. With the firmware update, it is updated to the 0x2047 and 0x0010, respectively.
1. Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one ofIDEs (CCS or IAR) should be installed. The IDE installation isntalls also drivers for USB DebugInterfaces without user interaction. After IDE installation the USB Debug Interface can be connectedand will be ready to work within few seconds.
2. The driver can be also installed manually. After plug in the USB Debug Interface to USB port of the PCthe Hardware Wizard starts automatically and opens the "Found New Hardware Wizard" window.
3. Select "Install from a list or specific location (Advanced)" (see Figure C-1).
Figure C-1. Windows XP Hardware Wizard
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4. Browse to the folder where the driver information files are located (see Figure C-2).For CCS, the default folder is: c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC, orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_eZ-RF depending of firmware version of the tool.For IAR Embedded Workbench, the default folder is: <Installation Root>\Embedded Workbenchx.x\430\drivers\TIUSBFET\eZ430-UART, or<Installation Root>\Embedded Workbench x.x\430\drivers\<Win_OS>.
Figure C-2. Windows XP Driver Location Selection Folder
5. The Wizard generates a message that an appropriate driver has been found.
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6. The wizard installs the driver files.7. The wizard shows a message that it has finished the installation of the software USB Debug Interface.8. The USB debug interface is installed and ready to use. The Device Manager lists a new entry as
shown in Figure C-3, Figure C-4, or Figure C-5.
Figure C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010
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Figure C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430
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Figure C-5. Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432
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Revision History
Changes from May 21, 2015 to October 13, 2015 ........................................................................................................... Page
• Added MSP Debuggers User's Guide to Related Documentation From Texas Instruments .................................. 10• Deleted former Section 1.1, Flash Emulation Tool (FET) Overview .............................................................. 12• Changed the order of the sections in Chapter 1, Get Started Now! .............................................................. 12• Added MSP-TS430PW20 to Table 1-1 ............................................................................................... 13• Added MSP-TS430RGE24A to Table 1-1 ............................................................................................ 13• Changed the paragraph that starts "The connection to the JTAG connector RST pin..." in Section 2.1, Signal Connections
for In-System Programming and Debugging ......................................................................................... 21• Changed note D of Figure 2-1, Signal Connections for 4-Wire JTAG Communication ........................................ 22• Added note that starts "On some Spy-Bi-Wire capable MSP430 devices..." .................................................... 24• Throughout document, changed "bootstrap loader" to "bootloader" .............................................................. 25• Added Section B.5, MSP-TS430PW20 ............................................................................................... 44• Added Section B.7, MSP-TS430RGE24A ............................................................................................ 50• Added note following Figure B-20 ..................................................................................................... 60• Added note following Figure B-26 ..................................................................................................... 69• Added note following Figure B-28 ..................................................................................................... 72• Added note following Figure B-34 ..................................................................................................... 81• Added note following Figure B-42 ..................................................................................................... 93• Added note following Figure B-46 ..................................................................................................... 99• Added note following Figure B-48.................................................................................................... 103• Updated Figure B-50, MSP-TS430RGC64USB Target Socket Module, PCB, with Rev 1.4 board ......................... 106• Added note following Figure B-54.................................................................................................... 113• Added note following Figure B-62.................................................................................................... 126• Added note following Figure B-64.................................................................................................... 129• Added note that starts "For bootloader use..." following Figure B-74 ........................................................... 146
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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