-
MTD6505
Features 180 Sinusoidal Drive for high efficiency and low
acoustic noise
Position Sensorless BLDC Drivers (No Hall effect sensor
required)
Integrated Power Transistors
Supports 2V to 5.5V Power Supplies
Programming Resistor (RPROG) settings to fit motor constant (KM)
range from 3.25 mV/Hz to 52 mV/Hz
Direction Control:
- Forward direction: connect DIR pin to GND or leave
floating
- Reverse direction: connect DIR pin to VBIAS or 3V
Speed Control through Power Supply Modulation (PSM) and/or
Pulse-Width Modulation (PWM)
Built-in Frequency Generator (FG Output Signal)
Built-in Lockup Protection and Automatic Recovery Circuit
Built-in Overcurrent Limitation
Built-in Thermal Shutdown Protection
Built-in Over Voltage Protection
No External Tuning Required
Available Package:10-Lead 3mm x 3mm UDFN
Applications Notebook CPU Cooling Fans
5V 3-Phase BLDC
DescriptionThe MTD6505 device is a 3-phase full-wavesensorless
driver for brushless DC (BLDC) motors. Itfeatures 180 sinusoidal
drive, high torque output andsilent drive. With the adaptive
features, parameters andwide range of power supplies (2V to 5.5V),
theMTD6505 is intended to cover a broad range of
motorcharacteristics, while requiring minimum externalcomponents.
Speed control can be achieved througheither PSM or PWM.
The compact packaging and the minimal bill-of-material make the
MTD6505 device extremely cost-efficient in fan applications. For
example, the CPUcooling fans in notebook computers require
designsthat provide low acoustic noise, low mechanicalvibration,
and are highly efficient. The frequencygenerator (FG) output
enables precision speed controlin closed-loop applications.
The MTD6505 device includes Lockup Protectionmode to turn off
the output current when the motor is ina lock condition, with an
automatic recovery feature torestart the fan when the lock
condition is removed.Motor overcurrent limitation and thermal
shutdownprotection are included for safety enhanced operations.
The MTD6505 is available in a compact, thermallyenhanced, 3mm x
3mm 10-lead UDFN package.
Package Types
MTD65053x3 UDFN*
VBIAS
RPROG
OUT2
FG PWMDIRVDD
GND
123
5
10
98
6
OUT1 OUT34 7
EP11
Sinusoidal Sensorless 3-Phase Brushless DC (BLDC) Fan Motor
Driver 2011-2013 Microchip Technology Inc. DS20002281B-page 1
*Includes Exposed Thermal Pad (EP); see Table 3-1.
-
MTD6505
Functional Block Diagram
Thermal protection
VBIAS
OUT1
OUT2CPU + peripherals
PWM
FG
OUT3
VDD
Short-circuitprotection
Out
put D
rive
Circ
uit
Motor PhaseDetection
Circuit
Overcurrentprotection
GNDDIR
Non-volatile memory
RPROG senseRPROG
VDD
Adjustable KmDS20002281B-page 2 2011-2013 Microchip Technology
Inc.
-
MTD6505
Typical Application
MTD
6505
1
2
3
4
5
10
9
8
7
6
FG
VBIAS
OUT1
OUT2 GND
OUT3
VDD
DIR
PWMR2
C1
VDD
C2
VDD
R1
KM0 KM3KM1, 2
RPROG
VBIASVBIAS
Recommended External Components for Typical Application
Element Type/Value Comment
C1 >1 F Connect as close as possible to IC input pinsC2 >1
F Connect as close as possible to IC input pinsR1 >10 k Connect
to Vlogic on microcontroller side (FG pull up)R2 3.9 k or 24 k
Select appropriate programming resistor value, see
Table 4-2 2011-2013 Microchip Technology Inc. DS20002281B-page
3
-
MTD6505
NOTES:DS20002281B-page 4 2011-2013 Microchip Technology Inc.
-
MTD65051.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum RatingsPower Supply Voltage (VDD_MAX)
...................... -0.7 to +7.0VMaximum Output Voltage
(VOUT_MAX) ............... -0.7 to +7.0VMaximum Output Current(2)
(IOUT_MAX) ....................1000 mAFG Maximum Output Voltage
(VFG_MAX) ........... -0.7 to +7.0VFG Maximum Output Current
(IFG_MAX) ......................5.0 mAVBIAS Maximum Voltage
(VBIAS_MAX) ................ -0.7 to +4.0VPWM Maximum Voltage
(VPWM_MAX) ................ -0.7 to +7.0VAllowable Power
Dissipation(1)(PD_MAX).........................1.5WMax Junction
Temperature (TJ)................................... +150CESD
protection on all pins
...................................................2 kV
Notice: Stresses above those listed under MaximumRatings may
cause permanent damage to the device.This is a stress rating only
and functional operation ofthe device at those or any other
conditions above thoseindicated in the operational listings of this
specificationis not implied. Exposure to maximum rating
conditionsfor extended periods may affect device reliability.
Note 1: Reference PCB, according to JEDECstandard EIA/JESD
51-9.
2: IOUT is also internally limited, according to thelimits
defined in the Electrical Charac-teristics table.
ELECTRICAL CHARACTERISTICSElectrical Specifications: Unless
otherwise specified, all limits are established for VDD = 2.0V to
5.5V, TA = +25C
Parameters Sym Min Typ Max Units Conditions
Power Supply Voltage VDD 2 5.5 V
Power Supply Current IVDD 5 10 mA VDD = 5V
Standby Current IVDD_STB 30 40 A PWM = 0V, VDD = 5V (Standby
mode)
OUT1, 2, 3High Resistance
RON(H) 0.75 1.1 IOUT = 0.5A, VDD = 5VNote 3
OUT1, 2, 3Low Resistance
RON(L) 0.75 1.3 IOUT = 0.5A, VDD = 5VNote 3
OUT1, 2, 3Total Resistance
RON(H+L) 1.5 IOUT = 0.5A, VDD = 5V
VBIAS InternalSupply Voltage
VBIAS 3 V VDD = 3.2V to 5.5V
VDD 0.2 V VDD < 3.2V
PWM Input Frequency fPWM 1 100 kHz
PWM Input H Level VPWM_H 0.55*VDD VDD V VDD 4.5V
PWM Input L Level VPWM_L 0 0.2*VDD V VDD 4.5V
PWM Internal Pull-Up Resistor
RPWM_0 266 k PWM = 0V
PWM Internal Pull-Up Resistor
RPWM 133 k PWM duty-cycle > 0%
DIR Input H Level VDIR_H 0.55*VDD VDD V VDD 4.5V
DIR Input L Level VDIR_L 0 0.2*VDD V VDD 4.5V
DIR Internal Pull-Down Resistor
RDIR 100 200 k
FG Output Pin Low Level Voltage
VOL_FG 0.25 V IFG = -1 mA
Note 1: 750 mA is the standard option for MTD6505. Additional
overcurrent protection levels are available upon request. Please
contact factory for different overcurrent protection values.
2: Related to the internal oscillator frequency (see Figure
2-1).3: Minimum and maximum parameter is not production tested and
is specified by design and validation. 2011-2013 Microchip
Technology Inc. DS20002281B-page 5
-
MTD6505FG Output Pin Leakage Current
ILH_FG -10 10 A VFG = 5.5V
Lock Protection Operating Time
TRUN 0.5 s
Lock Protection Waiting Time
TWAIT 4.5 5 5.5 s Note 2
Overcurrent Protection IOC_MOT 750 mA
Overvoltage Protection VOV 7.2 V
Short Protection on High Side
IOC_SW_H 2.57 A
Short Protection on Low Side
IOC_SW_L -2.83 A
Thermal Shutdown TSD 170 C
Thermal Shutdown Hysteresis
TSD_HYS 25 C
TEMPERATURE SPECIFICATIONSElectrical Specifications: Unless
otherwise specified, all limits are established for VDD = 5.5V to
2.0V, TA = +25C.
Parameters Sym Min Typ Max Units Conditions
Temperature RangesOperating Temperature TOPR -40 +125 CStorage
Temperature Range TSTG -55 +150 CThermal Package ResistancesThermal
Resistance, 10L-UDFN JA 96.6 C/W
JC 12 C/W
ELECTRICAL CHARACTERISTICS (CONTINUED)Electrical Specifications:
Unless otherwise specified, all limits are established for VDD =
2.0V to 5.5V, TA = +25C
Parameters Sym Min Typ Max Units Conditions
Note 1: 750 mA is the standard option for MTD6505. Additional
overcurrent protection levels are available upon request. Please
contact factory for different overcurrent protection values.
2: Related to the internal oscillator frequency (see Figure
2-1).3: Minimum and maximum parameter is not production tested and
is specified by design and validation.DS20002281B-page 6 2011-2013
Microchip Technology Inc.
-
MTD65052.0 TYPICAL PERFORMANCE CURVES
Note: Unless indicated, TA = +25C, VDD = 5.5V to 2.0V, OUT1, 2,
3 and PWM open.
FIGURE 2-1: Oscillator Frequency Deviation vs. Temperature.
FIGURE 2-2: Internal Regulated Voltage (VBIAS) vs
Temperature.
FIGURE 2-3: Internal Regulated Voltage (VBIAS) vs Supply Voltage
(VDD).
FIGURE 2-4: Inputs (PWM, DIR) VIL vs. Temperature.
FIGURE 2-5: Inputs (PWM, DIR) VIH vs. Temperature.
FIGURE 2-6: Outputs RON High Side Resistance vs.
Temperature.
Note: The graphs and tables provided following this note are a
statistical summary based on a limited number ofsamples and are
provided for informational purposes only. The performance
characteristics listed hereinare not tested or guaranteed. In some
graphs or tables, the data presented may be outside the
specifiedoperating range (e.g., outside specified power supply
range) and therefore outside the warranted range.
-3-2.5
-2-1.5
-1-0.5
00.5
1
or F
requ
eny
Dev
iatio
n (%
)
VDD = 5.5V
VDD = 2V
-4.5-4
-3.5-3
-2.5-2
-1.5-1
-0.50
0.51
-40 -25 -10 5 20 35 50 65 80 95 110 125
Osc
illat
or F
requ
eny
Dev
iatio
n (%
)
Temperature (C)
VDD = 5.5V
VDD = 2V
3 04
3.06
3.08
3.1
3.12
3.14
V BIA
S(V
)
3
3.02
3.04
3.06
3.08
3.1
3.12
3.14
-40 -25 -10 5 20 35 50 65 80 95 110 125
V BIA
S(V
)
Temperature (C)
1
1.5
2
2.5
3
3.5
V BIA
S(V
)
0
0.5
1
1.5
2
2.5
3
3.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
V BIA
S(V
)
VDD(V)
1
1.5
2
2.5
PWM
VIL
(V)
VDD = 5.5VDD = 5.5VDD = 5.5V
VDD = 2V
0
0.5
1
1.5
2
2.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
PWM
VIL
(V)
Temperature (C)
VDD = 5.5VDD = 5.5VDD = 5.5V
VDD = 2V
1
1.5
2
2.5
3PW
M V
IH(V
)
VDD = 5.5V
VDD = 2V
0
0.5
1
1.5
2
2.5
3
-40 -25 -10 5 20 35 50 65 80 95 110 125
PWM
VIH
(V)
Temperature (C)
VDD = 5.5V
VDD = 2V
1 52
2.53
3.54
4.55
5.56
RO
N H
igh
Side
() VDD = 2V
00.5
11.5
22.5
33.5
44.5
55.5
6
-40 -25 -10 5 20 35 50 65 80 95 110 125
RO
N H
igh
Side
()
Temperature (C)
VDD = 5.5V
VDD = 2V 2011-2013 Microchip Technology Inc. DS20002281B-page
7
-
MTD6505
Note: Unless indicated, TA = +25C, VDD = 5.5V to 2.0V, OUT1, 2,
3 and PWM open.
FIGURE 2-7: Outputs RON Low Side Resistance vs. Temperature.
FIGURE 2-8: Supply Current vs. Temperature.
FIGURE 2-9: Stand-By Current vs. Temperature.
FIGURE 2-10: PWM Pull-Up Current vs. Temperature.
FIGURE 2-11: Typical Output on Start-up.
FIGURE 2-12: Typical Outputs on Closed Loop.
22.5
33.5
44.5
55.5
6
ON
Low
Sid
e (
)
VDD = 2V
00.5
11.5
22.5
33.5
44.5
55.5
6
-40 -25 -10 5 20 35 50 65 80 95 110 125
RO
N L
ow S
ide
()
Temperature (C)
VDD = 5.5V
VDD = 2V
2
3
4
5
6
7
VDD
Cur
rent
(mA
)
VDD = 2V
VDD = 5.5V
0
1
2
3
4
5
6
7
-40 -25 -10 5 20 35 50 65 80 95 110 125
I VD
DC
urre
nt (m
A)
Temperature (C)
VDD = 2V
VDD = 5.5V
20
30
40
50
60
D_S
TBC
urre
nt (
A)
VDD = 5.5V
0
10
20
30
40
50
60
-40 -25 -10 5 20 35 50 65 80 95 110 125
I VD
D_S
TBC
urre
nt (
A)
Temperature (C)
VDD = 5.5V
VDD = 2V
-30
-25
-20
-15
-10
-5
0
Pull-
Up
Cur
rent
(A
)
VDD = 2V
-40
-35
-30
-25
-20
-15
-10
-5
0
-40 -25 -10 5 20 35 50 65 80 95 110 125
PWM
Pul
l-Up
Cur
rent
(A
)
Temperature (C)
VDD = 2V
VDD = 5.5VDS20002281B-page 8 2011-2013 Microchip Technology
Inc.
-
MTD65053.0 PIN DESCRIPTIONSThe descriptions of the pins are
listed in Table 3-1.
TABLE 3-1: MTD6505 PIN FUNCTION TABLEPin
Number Type Name Function
1 O FG Motor speed indication output2 I RPROG Km parameter
setting with external resistors, see Table 4-2 for values3 VBIAS
Internal regulator output (for decoupling only)4 O OUT1 Single
phase coil output pin5 O OUT2 Single phase coil output pin6 GND
Negative voltage supply (ground)7 O OUT3 Single phase coil output
pin8 VDD Positive voltage supply for motor driver9 I DIR Motor
Rotation Direction
- Forward direction: connect pin to GND or leave floating-
Reverse direction: connect pin to VBIAS
10 I PWM PWM input signal for speed control11 EP Exposed pad
(Connect to the ground plan for better thermal dissipation)
Legend: I = Input; O = Output 2011-2013 Microchip Technology
Inc. DS20002281B-page 9
-
MTD6505
NOTES:DS20002281B-page 10 2011-2013 Microchip Technology
Inc.
-
MTD65054.0 FUNCTIONAL DESCRIPTIONThe MTD6505 generates a
full-wave signal to drive a3-phase BLDC motor. High efficiency and
low-powerconsumption are achieved due to CMOS transistorsand
synchronous rectification drive type.
4.1 Speed ControlThe rotational speed of the motor can be
controlledeither through the PWM digital input signal or by
actingdirectly on the power supply (VDD). When the PWMsignal is
High (or left open), the motor rotates at fullspeed. When the PWM
signal is low, the IC outputs areset to high-impedance and the
motor is stopped.
By changing the PWM duty cycle, the speed can beadjusted. Thus,
the user has freedom to choose thePWM system frequency within a
wide range (from1 kHz to 100 kHz).
Since the PWM pin has an internal pull-up resistorconnected to
VDD, it is recommended to drive itbetween 0V and High-Z. The PWM
driver must be ableto support the pull-up resistor current, to
drive the pin.See PWM Internal Pull-Up Resistor in Section
1.0,Electrical Characteristics.The output transistor activation
always occurs at a fixedrate of 30 kHz, which is outside the range
of audiblefrequencies.
4.2 Motor Rotation DirectionThe current-carrying order of the
outputs depends onthe DIR pin state (Rotation Direction) and is
describedin Table 4-1. The DIR pin is not designed for
dynamicdirection change during operation.
4.3 Frequency Generator FunctionThe Frequency Generator output
(FG) is a Hall effectsensor equivalent digital output, giving
information toan external controller about the speed and phase of
themotor. The FG pin is an open drain output, connectingto a
logical voltage level through an external pull-upresistor. When a
lock or an out-of-sync situation isdetected by the driver, this
output is set to high-impedance until the motor is restarted. Leave
the pinopen when it is not used.
4.4 Lockup Protection and Automatic Restart
If the motor is blocked and cannot rotate freely, a lock-up
protection circuit detects it and disables the driver bysetting its
outputs to high-impedance to prevent themotor coil from burnout.
After a waiting time (TWAIT),the lock-up protection is released and
normal operationresumes for a given time (TRUN). If the motor is
stillblocked, a new period of waiting time is started. TWAITand
TRUN timings are fixed internally, so that noexternal capacitor is
required.
4.5 Overcurrent ProtectionThe motor peak current is limited by
the driver to750 mA (standard value), thus limiting the
maximumpower dissipation in the coils.
4.6 Thermal ShutdownThe MTD6505 device has a thermal protection
functionwhich detects when the die temperature exceedsTJ = +170C.
When this temperature is reached, thecircuit enters the Thermal
Shutdown mode, and theoutputs OUT1, OUT2 and OUT3 are disabled
(high-impedance), avoiding the IC destruction and allowingthe
circuit to cool down. When the junction temperature(TJ) drops below
+145C, normal operation resumes.
The thermal detection circuit has +25C hysteresis.
FIGURE 4-1: Thermal Protection Hysteresis.
Note 1: The PWM frequency has no direct effecton the motor speed
and is asynchronouswith the activation of the
outputtransistors.
Note 2: The standard output frequency is 30 kHz.A 20 kHz output
frequency option isavailable upon request.
TABLE 4-1: MOTOR ROTATION DIRECTION OPTIONS (DIR PIN)
DIR Pin State RotationDirectionOutputs Activation
Sequence
Connected to GND or Floating
Forward OUT1 OUT2 OUT3
Connected to VBIAS
Reverse OUT3 OUT2 OUT1
TJ+145
Thermal shutdown
+170
Normal operation 2011-2013 Microchip Technology Inc.
DS20002281B-page 11
-
MTD6505
4.7 Internal Voltage RegulatorVBIAS voltage is generated
internally and is used tosupply internal logical blocks. The VBIAS
pin is used toconnect an external decoupling capacitor (1 F
orhigher). Notice that this pin is for IC internal use, and isnot
designed to supply DC current to external blocks.
4.8 Back Electromotive Force (BEMF) Coefficient Setting
KM is the electro-mechanical coupling coefficient of themotor
(also referred to as motor constant or BEMFconstant). Depending on
the conventions in use, theexact definition of KM and its
measurement criteria canvary among motor manufacturers. To
accommodatevarious motor applications, the MTD6505 providesoptions
to facilitate diverse BEMF coefficients.
The MTD6505 defines BEMF coefficient (KM) as thepeak value of
the phase-to-phase BEMF voltage,normalized to the electrical speed
of the motor. Thefollowing table offers methods to set the KM value
forthe MTD6505 device.
The RPROG sensing is actually a sequence that iscontrolled by
the firmware. For any given RPROG, theinternal control block will
output the corresponding KMrange.
4.9 Defining the Correct RPROG Value
This section explains how to define the correct KMvalue for a
specific fan. The KM is linked to the RPROG(see Table 4-2). An
incorrect KM selection can createissues, or reduce the
efficiency.
4.9.1 OPERATION
Follow the next steps to define the right RPROG value:
1. Apply a constant stream of air to a fan that is
notconnected.
2. Using an oscilloscope, measure the waveformbetween two
phases, when the fan is rotating.
3. Measure the generated peak-to-peak voltage(Vp-p) value and
the frequency (f).
4. Compute KM based on the measured Vp-p andf (in mV/Hz):
EQUATION 4-1: KM COMPUTE
KM should be constant for all fan rotation speeds; but,for the
KM measurement, the fan rotation speed (due tothe air stream)
should be close to the nominal.
TABLE 4-2: Km SETTINGS
KM Option
KM (mV/Hz) RangePhase-to-Phase RPROG
Min Max
KM0 3.25 6.5 GNDKM1 6.5 13 24 kKM2 13 26 3.9 kKM3 26 52
VBIAS
Note: This is a theoretical procedure that doesnot take care of
the harmonics generatedby the BEMF. This information has to betaken
for indication only.
KMVp p2f-------------=DS20002281B-page 12 2011-2013 Microchip
Technology Inc.
-
MTD65055.0 PACKAGING INFORMATION
5.1 Package Marking Information
Device Code
MTD6505T-E/NA AAAD
10-Lead UDFN (3x3x0.5 mm) Example
AAAD1315256
Legend: XX...X Customer-specific informationY Year code (last
digit of calendar year)YY Year code (last 2 digits of calendar
year)WW Week code (week of January 1 is week 01)NNN Alphanumeric
traceability code Pb-free JEDEC designator for Matte Tin (Sn)* This
package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be
marked on one line, it will be carried overto the next line, thus
limiting the number of available characters for
customer-specificinformation.
3e
3e 2011-2013 Microchip Technology Inc. DS20002281B-page 13
-
MTD6505DS20002281B-page 14 2011-2013 Microchip Technology
Inc.
-
MTD6505 2011-2013 Microchip Technology Inc. DS20002281B-page
15
-
MTD6505DS20002281B-page 16 2011-2013 Microchip Technology
Inc.
-
MTD6505APPENDIX A: REVISION HISTORY
Revision B (October 2013)The following is the list of
modifications:
1. Updated the Absolute Maximum Ratingssection with the correct
VBIAS parameter.
2. Updated the Thermal Resistance values in theTemperature
Specifications table.
3. Added Figure 2-11 and Figure 2-12.4. Added Section 4.9
Defining the Correct
RPROG Value.5. Minor grammatical and editorial corrections.
Revision A (November 2011)This is the original release of this
document. 2011-2013 Microchip Technology Inc. DS20002281B-page
17
-
MTD6505
NOTES:DS20002281B-page 18 2011-2013 Microchip Technology
Inc.
-
MTD6505PRODUCT IDENTIFICATION SYSTEMTo order or obtain
information, e.g., on pricing or delivery, refer to the factory or
the listed sales office.
Device: MTD6505T: 3-Phase Brushless DC, Sinusoidal
Sensorless
Fan Motor Driver (Tape and Reel)
Temperature Range: E = Extended -40C to +125C
Package: NA = Plastic Dual Flat, thermally-enhanced, 3x3x0.5 mm
Body (UDFN)
Examples:a) MTD6505T-E/NA Tape and Reel,
Extended Temperature10LD UDFN Package
PART NO. T -X /XX
PackageTemperatureTape & ReelDevice 2011-2013 Microchip
Technology Inc. DS20002281B-page 19
-
MTD6505
NOTES:DS20002281B-page 20 2011-2013 Microchip Technology
Inc.
-
Note the following details of the code protection feature on
Microchip devices: Microchip products meet the specification
contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the
most secure families of its kind on the market today, when used in
the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to
breachknowledge, require using the Microchip products in a manner
ouSheets. Most likely, the person doing so is engaged in theft of
in
Microchip is willing to work with the customer who is
concerned
er canle.
mitteay b
workInformation contained in this publication regarding
deviceapplications and the like is provided only for your
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Neither Microchip nor any other semiconductor manufacturmean
that we are guaranteeing the product as unbreakab
Code protection is constantly evolving. We at Microchip are
comproducts. Attempts to break Microchips code protection feature
mallow unauthorized access to your software or other copyrighted
2011-2013 Microchip Technology Inc.
QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV
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guarantee the security of their code. Code protection does
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d to continuously improving the code protection features of oure
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Act.DS20002281B-page 21
SQTP is a service mark of Microchip Technology Incorporated in
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U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-533-2
Microchip received ISO/TS-16949:2009 certification for its
worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona; Gresham, Oregon and design centers in
California and India. The Companys quality system processes and
procedures are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchips quality system for the
design and manufacture of development systems is ISO 9001:2000
certified.
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DS20002281B-page 22 2011-2013 Microchip Technology Inc.
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Worldwide Sales and Service
08/20/13
Sinusoidal Sensorless 3-Phase Brushless DC (BLDC) Fan Motor
Driver1.0 Electrical Characteristics2.0 Typical Performance
Curves3.0 Pin Descriptions4.0 Functional Description4.1 Speed
Control4.2 Motor Rotation Direction4.3 Frequency Generator
Function4.4 Lockup Protection and Automatic Restart4.5 Overcurrent
Protection4.6 Thermal Shutdown4.7 Internal Voltage Regulator4.8
Back Electromotive Force (BEMF) Coefficient Setting4.9 Defining the
Correct RPROG Value
5.0 Packaging Information5.1 Package Marking Information
Appendix A: Revision HistoryWorldwide Sales and Service