Motion SPM ™ Introduction

www.fairchildsemi.com

Motion SPM™ Introduction

22st, Oct., 2007

Motion Control System TeamHV Functional Power Group

Advanced Information

2

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Motion SPM Portfolio

SPIM(CI)

SPM2

SPM3

SPM4

SPM5

6-IGBT/FRD for inverter + Gate Driver with Protection(SC, UV) + Thermistor + 3-phase Rectifier

6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Thermistor + TSD function (from V4)

6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Built-in Bootstrap diode & TSD function (from V4)

6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Thermistor

6-MOSFET for inverter + Gate driver with Protection( UV) + OT,OC, FO function + Bootstrap diode (from V2)

Basic Structure< 10kW

( 600V 75A 1200V 50A )

< 5kW(600V 75A)

< 2.2kW(600V 30A)

< 1kW(600V 15A)

< 0.1kW(500V 3A)-MOSFET

SPIM (Inv)

< 10kW( 600V 100A1200V 75A )

6-IGBT/FRD for inverter + Gate Driver with Protection(SC,UV) + Thermistor

SPM6 2-MOSFET for inverter + Gate driver with Protection( OC, OT, UV) + Bootstrap diode

< 0.5kW(500V 9A, 75V 75A)

- MOSFET

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SPM5 Series

External View

SPM3 Series

44x26.8

29x1254x29.545x28

60x31

SPIM Series SPM2 Series

SPM4 SIP2 SeriesSPM4 SIP1 Series SPM6 Series

26x10.5

95x55

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60x31 60x31 44x26.8 44x26.8 44x26.8

PKG SPM2 PKG with Ceramic substrate

SPM2 PKG with DBC

substrate

SPM3 PKG with Ceramic

substrate

SPM3 Full-pack PKG

SPM3 PKGWith DBC substrate

Developed SPM2 V1600V-10/15/20/30AFSAM10SH(M)60AFSAM15SH(M)60AFSAM20SH(M)60AFSAM30SH(M)60A

SPM2 V1600V-50A/75AFSAM50SM60AFSAM75SM60A

SPM3 V2600V-3/5/10/15AFSBS3/5/10/15CH60SPM3 MOSFET500V-5/6AFCBS0550FCBS0650

SPM3 V4(P6, ’07 code S)600V-3/5/10/15AFSBF3CH60BFSBF5CH60B(T)FSBF10CH60B(T)FSBF15CH60BT

SPM3 V2600V-15/20/30AFSBB15/20/30CH60SRM 1phase-SPM3 : 600V-50AFCAS50SN60PSCM-SPM3 : 600V-20AFSAB20PH60PFCM-SPM3 : 600V-20/30/50AFPDB20PH60,FPD(A)B30/50PH60SPM3 V4 (P7,’07 code S)600V-15/20/30AFSBB15CH60B(T)FSBB20CH60B(T)FSBB30CH60BBoost PFCM-SPM3 (P6,’07 code S) : 600V-30A FPAB30BH60

Developing SPM2 V4

(P10,’08 code S)

600V-15/20/30/5075A

FSAM15CH60C

FSAM20CH60C

FSAM30CH60C

FSAM50CH60C

FSAM75CH60C

SPM3 V5(P10, ’08 code S)600V-3/5/10/15AFSBF3CH60CFSBF5CH60CFSBF10CH60CFSBF15CH60C

SPM3 V5(P10, ’08 code S)600V-15/20/30AFSBB15CH60CFSBB20CH60CFSBB30CH60C

Line-up of SPM2 and SPM3

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Line-up :

- 600V/10A, 15A, 20A, 30A – with Ceramic Substrate,

(Inner Bonding)

- 600V/50A, 75A – with DBC Substrate

(Out Bonding) Major Applications :

- Consumer appliance inverters

(Air conditioner, Treadmill)

- Low power industrial inverters Feature :

- Built-in thermistor (NTC)

- Active Low

- Inner bonding/Out bonding

- Short-circuit protection with soft shut- down

control using sense-IGBTs

- Good thermal resistance and isolation capacity

with ceramic/DBC substrate

- 3 N-terminals for low-cost current sensing

SPM2 V1

COM(L)

VCC

IN(UL)

IN(VL)

IN(WL)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(WL)

NU (26)

NV (27)

NW (28)

U (29)

V (30)

W (31)

P (32)

(23) VS(W)

(22) VB(W)

(19) VS(V)

(18) VB(V)

(9) CSC

(8) CFOD

(7) VFO

(5) IN(WL)

(4) IN(VL)

(3) IN(UL)

(2) COM(L)

(1) VCC(L)

(10) RSC

RTH (25)

VTH (24)

(6) COM(L)

VCC

VB

OUTCOM

VSIN

VB

VS

OUT

IN

COM

VCC

VCC

VB

OUTCOM

VSIN

(21) VCC(WH)

(20) IN(WH)

(17) VCC(VH)

(15) IN(VH)

(16) COM(H)

(14) VS(U)

(13) VB(U)

(12) VCC(UH)

(11) IN(UH)

THERMISTOR

< Out Bonding >

COM(L)

VCC

IN(UL)

IN(VL)

IN(WL)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(WL)

NU (26)

NV (27)

NW (28)

U (29)

V (30)

W (31)

P (32)

(23) VS(W)

(22) VB(W)

(19) VS(V)

(18) VB(V)

(9) CSC

(8) CFOD

(7) VFO

(5) IN(WL)

(4) IN(VL)

(3) IN(UL)

(2) COM(L)

(1) VCC(L)

(10) RSC

RTH (25)

VTH (24)

(6) COM(L)

VCC

VB

OUTCOM

VSIN

VB

VS

OUT

IN

COM

VCC

VCC

VB

OUTCOM

VSIN

(21) VCC(WH)

(20) IN(WH)

(17) VCC(VH)

(15) IN(VH)

(16) COM(H)

(14) VS(U)

(13) VB(U)

(12) VCC(UH)

(11) IN(UH)

THERMISTOR

< Inner Bonding >

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Line-up :

- 600V/15A, 20A, 30A, 50A, 75A with DBC Substrate Major Applications :


(Air conditioner, Treadmill)

- Low power industrial inverters Feature :


- Active Low

- Inner bonding

- Built-in TSD(Thermal Shut Down) function

- Short-circuit protection with soft shut- down control

- High efficiency & robust NPT IGBT adopted

- Good thermal resistance and isolation capacity with

ceramic/DBC substrate


SPM2 V4 (under development)

< Inner Bonding >

COM(L)

VCC

IN(UL)

IN(VL)

IN(WL)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(WL)

NU (26)

NV (27)

NW (28)

U (29)

V (30)

W (31)

P (32)

(23) VS(W)

(22) VB(W)

(19) VS(V)

(18) VB(V)

(9) CSC

(8) CFOD

(7) VFO

(5) IN(WL)

(4) IN(VL)

(3) IN(UL)

(2) COM(L)

(1) VCC(L)

(10) NC

RTH (25)

VTH (24)

(6) COM(L)

VCC

VB

OUTCOM

VSIN

VB

VS

OUT

IN

COM

VCC

VCC

VB

OUTCOM

VSIN

(21) VCC(WH)

(20) IN(WH)

(17) VCC(VH)

(15) IN(VH)

(16) COM(H)

(14) VS(U)

(13) VB(U)

(12) VCC(UH)

(11) IN(UH)

THERMISTOR

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Line-up :

- 600V/3A, 5A, 10A, 15A – with Ceramic Substrate

- 600V/15A, 20A, 30A – with DBC Substrate Major Applications :


(Air conditioner, Washing machine, Refrigerator, etc)

- Low power industrial inverters

(Industrial inverter, Water pump, Treadmill, Sewing machine

Door Controller, etc) Feature :

- Good thermal resistance

- Active High

- Out bonding

- Small size & Large pin-to-pin spacing

with zigzag package structure


COM

VCC

IN(UL)

IN(VL)

IN(WL)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(WL)

NU (21)

NV (22)

NW (23)

U (24)

V (25)

W (26)

P (27)

(20) VS(W)

(19) VB(W)

(16) VS(V)

(15) VB(V)

(8) CSC

(7) CFOD

(6) VFO

(5) IN(WL)

(4) IN(VL)

(3) IN(UL)

(2) COM

(1) VCC(L)

VCCVB

OUTCOM

VSIN

VB

VS

OUT

INCOM

VCC

VCC

VB

OUTCOM

VSIN

(18) VCC(WH)

(17) IN(WH)

(14) VCC(VH)

(13) IN(VH)

(12) VS(U)

(11) VB(U)

(10) VCC(UH)

(9) IN(UH)

VSL

SPM3 V2

< Out Bonding >

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Line-up :

- 600V/3A, 5A, 10A, 15A – with Full-pack PKG

- 600V/15A, 20A, 30A – with DBC Substrate Major Applications :


(Air conditioner, Washing machine, Refrigerator, etc)


(Industrial inverter, Water pump, Treadmill, Sewing machine

Door Controller, etc) Feature :


- Active High

- Inner bonding



- Built-in Boot strap diodes

- Built-in TSD (Thermal Shut Down) function



SPM3 V4

COM

VCC

IN(UL)

IN(VL)

IN(WL)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(WL)

NU (21)

NV (22)

NW (23)

U (24)

V (25)

W (26)

P (27)

(20) VS(W)

(19) VB(W)

(16) VS(V)

(15) VB(V)

(8) CSC

(7) CFOD

(6) VFO

(5) IN(WL)

(4) IN(VL)

(3) IN(UL)

(2) COM

(1) VCC

VCC

VB

OUTCOM

VSIN

VB

VS

OUT

IN

COMVCC

VCC

VB

OUTCOM

VSIN

(18) VCC

(17) IN(WH)

(14) VCC

(13) IN(VH)

(12) VS(U)

(11) VB(U)

(10) VCC

(9) IN(UH)

VSL

< Inner Bonding >

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Line-up :

- 500V/ 5A (1.35(typ.)), 6A (1.15(typ)) Major Applications :

- Low power consumer appliance inverters

(Refrigerator, Fan) Feature :

- 3-phase MOSFET inverter with driver IC





SPM3 MOSFET

COM

VCC

IN(UL)

IN(VL)

IN(WL)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(WL)

NU (21)

NV (22)

NW (23)

U (24)

V (25)

W (26)

P (27)

(20) VS(W)

(19) VB(W)

(16) VS(V)

(15) VB(V)

(8) CSC

(7) CFOD

(6) VFO

(5) IN(WL)

(4) IN(VL)

(3) IN(UL)

(2) COM

(1) VCC(L)

VCC

VB

OUTCOM

VSIN

VB

VS

OUT

INCOM

VCC

VCC

VB

OUTCOM

VSIN

(18) VCC(WH)

(17) IN(WH)

(14) VCC(VH)

(13) IN(VH)

(12) VS(U)

(11) VB(U)

(10) VCC(UH)

(9) IN(UH)

VSL

Chap. 2

SPM Introduction

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PSC-SPM (Partial switching PFC) Line-up :

- 600V/20A - SPM3 package with DBC


(under development) Major Applications :

- Low/Medium power consumer

appliances such as Room air conditioner Feature :


- Same package as SPM3

- Built-in thermistor for temperature sensing

- LVIC with UVP, OCP

PSCM - SPM3 Package

CSC

CFOD

VFO

IN(S)

IN(R)

COM

VCC

OUT(S)

OUT(R)

NTCThermistor

Q1 Q2

D1

D3

D2

D4

VTH

RTH

CSC

CFOD

VFO

IN(S)

IN(R)

COM

VCC

PR

S

R

ND

NR

NS

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PFCM - SPM3 Package

PFC-SPM (Full switching PFC) Line-up :

- 600V/20A, 30A, 50A - SPM3 package with DBC Major Applications :

- Medium/high power consumer appliance

such as Package/System air conditioner Feature :


- Built-in shunt resistor (Optional)

- Same package as SPM3



- Tj = -20 ~ 150deg

CSC

CFOD

VFO

IN(S)

IN(R)

COM

VCC

OUT(S)

OUT(R)

VTH

RTH

CSC

CFOD

VFO

IN(S)

IN(R)

COM

VCC

PR

S

R

N

NSENSE

VAC-

ShuntResistor

NTCThermistor

Q1 Q2

D1

D3

D2

D4

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Boost PFCM - SPM3 Package

Line-up :

- 600V/30A – SPM3 package with DBC Major Applications :

- AC 85V ~ 264V single-phase front-end rectifier

- Mid-power application especially for an air conditioners Feature :

- Low thermal resistance due to Al2O3-DBC substrate

- Active High

- Single-phase rectifier diode

- single-phase IGBT PWM semi-converter including a drive IC

for gate driving and protection

- Typical switching frequency of 20kHz



- Tj = -20 ~ 150deg

CSC

CFOD

VFO

IN(S)

COM

VCC

OUT

VTH

RTH

CSC

CFOD

VFO

IN

COM

VCC

P

S

R

NR

NTCThermistor

PR

L

N

VG

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Line-up :


Major Applications :

- Single-phase SRM drives

(Vacuum cleaner)

Feature :





- Divided N-terminals for low-cost current sensing

SRM 1Phase - SPM3 Package

COM(L)

VCC

IN(UL)

IN(VL)

IN(WL)

VFO

C(FOD)

C(SC)

OUT(WL)

OUT(VL)

OUT(UL)

NB1 (23)

NA (24)

B (25)

A (26)

P (27)

(16) VS

(15) VB

(8) CSC

(7) CFOD

(6) VFO

(5) IN(L)

(4) NC

(3) NC

(2) COM

(1) VCC(L)

VCC

VB

OUTCOM

VSIN

(14) VCC(H)

(13) IN(H)

(11) NC

(9) G(L)

(10) E(L)

(17) G(H)

(18) E(H)

(12) NC

NB2 (21)

NC (22)

R(TH) (19)

V(TH) (20)

Chap. 2

SPM Introduction

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Line-up of SPM4, SPM5 and SPIM

54x29.5 45x28 29x12 95x55

PKG SPM4-SIP1 PKG SPM4-SIP2 PKG SPM5 PKG SPIM PKG

Developed SPM5 V1 DIP/SMD

500V - 2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3(typ))

FSB50250(T/S),

FSB50450(T/S), FSB50550(T/S)

250V - 3A(1.4(typ))

FSB50325(T/S)

Developing SPM4-SIP1

(P11, ’07 code S)

600V-10/16A

FDAU1060A

FDAU1660A

(Q2, ’08 code S)

600V-20/30A

FDAU2060A

FDAU3060A

SPM4-SIP2

(P6, ’08 code S)

600V-10/15A

FSAU10/15CH60

SRM 2phase-SIP2

(P10, ’07 code S)

600V- 10/20/30A

FCAS20/30DN60B

SPM5 V2 DIP/SMD

(P5, ’08 code S)

500V- 2/4/5A, 250V - 3A

FSB50250A(T/S), FSB50450A(T/S), FSB50550A(T/S), FSB50325A(T/S)

MV SPM5 DIP/SMD

(P10, ’07 code S)

60V- 20A( 48m (typ))

FSB52006(S)

SPIM 1200V

1200V- 30/45A(CI) (P9,’08 code S)

FSSR30/45CH120

1200V- 45A (Inv.) (P6,’08 code S)

FSSN45CH120

1200V- 30/60A (Inv.) (P9,’08 code S)

FSSN30CH120

FSSN60CH120

SPIM 600V

600V- 50/75A (CI) (Q2,’08 code S )

FSSR75CH60

600V- 50/75/100A (Inv.) (P10,’07 code S )

FSSN50CH60

* Gray color: Not fixed development plan

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Line-up :

- 600V/10A, 16A, 20A, 30A Major Applications :


(Air conditioner, Washing machine,

Refrigerator, Water pump, etc)


(Fan Motor, Industrial Inverter, etc) Feature :

- Large pin spacing and signal/power pins separation

- Single-In-Line package

- Active High


- Built-in thermistor


SPM4 - SIP1 Package(under development)

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Line-up :

- 600V/ 10A, 15A Major Applications :


(Air conditioner, Washing machine, Refrigerator, Water pump, etc)


(Fan Motor, Industrial Inverter, etc) Feature :

- Cross-Conduction Prevention Logic


- Active High


- Built-in thermistor


SPM4 - SIP2 Package(under development)

(1) W,VS(W)

FO

VCC

LIN

HIN

VB

HO

VS

LO

CSC

COM

FO

VCC

LIN

HIN

VB

HO

VS

LO

CSCCOM

(2) VB(W)

(3) IN(WH)

(4) IN(WL)

(5) V,VS(V)(6) VB(V)

(7) IN(VH)

(8) IN(VL)

(9) U,VS(U)

(10) VB(U)

(11) IN(UH)

(12) IN(UL)

(13) VCC

(16) COM

(17) NV

(15) NU

(19) NW(20) P

FO

VCC

LIN

HIN

VB

HO

VS

LO

CSC

COM

VSS

VSS

VSS(18) VFO

(14) CSC

Thermistor

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ConfidentialSRM 2phase - SIP2 Package(under development)

Line-up :

- 600V/ 10A, 20A, 30A Major Applications :

- 2-phase SRM drives

(Vacuum cleaner) Feature :

- 2-phase asymmetric bridge converter

- Active High


- Built-in bootstrap diode


- Low saturation voltage

- Large pin spacing and signal/power pins separation


COM(L)

VCC

IN(VL)

IN(UL)

Vfo

Cfod

Csc

OUT(VL)

OUT(UL)

(20) P

(12) CSC

(13) CFOD

(14) VFO

(16) IN(UL)

(18) COM

(17) VCC

VS

(7) V(TH)

OUT

COM

IN(UH)

VS

VBVCC

OUT

COM

IN(VH)

VS

VBVCC

(9) VS(U) / U+

(3) U-

(5) VS(V) / V+

(2) V-

(19) N

(10) VB(U)

(6) VB(V)

(11) IN(UH)

(8) IN(VH)

(15) IN(VL)

(4) U-

(1) V-

Gray color : Not fixed development plan

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Line-up :

- V1 SPM5 DIP:

500V/2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ))

& 250V/3A(1.4 (typ))

- V1 SPM5 SMD: 500V/2A, 4A, 5A & 250V/3A

- MV SPM5 DIP and SMD : 60V/20A( 48m(typ) )

(Under development)

- Transfer-molded full-pack package Major Applications :

- Fan motor, water pump, etc.

- Small motor applications up to 150W Feature :

- High power density compared to small package

- Ruggedness (Switching and short-circuit)

- Low conducted and radiated EMI

(Slow dV/dt & dI/dt)

- HVIC with UVP

COM

VCC

LIN

HIN

VB

HO

VS

LO

COM

VCC

LIN

HIN

VB

HO

VS

LO

COM

VCC

LIN

HIN

VB

HO

VS

LO

(1) COM

(2) VB(U)

(3) VCC(U)

(4) IN(UH)

(5) IN(UL)

(6) VS(U)

(7) VB(V)

(8) VCC(V)

(9) IN(VH)

(10) IN(VL)

(11) VS(V)

(12) VB(W)

(13) VCC(W)

(14) IN(WH)

(15) IN(WL)

(16) VS(W)

(17) P

(18) U

(19) NU

(20) NV

(21) V

(22) NW

(23) W

SPM5 V1

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Line-up :

- V2 SPM5 DIP:

500V/ 2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ))

& 250V/ 3A(1.4 (typ))

- V2 SPM5 SMD: 500V/ 2A, 4A, 5A & 250V - 3A

- Transfer-molded full-pack package Major Applications :

- Fan motor, water pump, etc.

- Small motor applications up to 150W Feature :

- High power density compared to small package

- Ruggedness (Switching and short-circuit)

- Low conducted and radiated EMI

(Slow dV/dt & dI/dt)

- HVIC with UVP

- Built-in bootstrap diode

- No external REH connection

- Multi-function I/O, FO

SPM5 V2(under development)

(1) COM

(2) VB(U)

(3) VCC(U)

(4) IN(UH)

(5) IN(UL)

(6) FO(U)

(7) VB(V)

(8) VCC(V)

(9) IN(VH)

(10) IN(VL)

(11) FO(V)

(12) VB(W)

(13) VCC(W)

(14) IN(WH)

(15) IN(WL)

(16) FO(W)

(17) P

(18) U

(19) NU

(20) NV

(21) V

(22) NW

(23) W

FO

COM

VCC

LIN

HIN

VB

HO

VS

LO

COM

VCC

LIN

HIN

VB

HO

VS

LOFO

COM

VCC

LIN

HIN

VB

HO

VS

LOFO

DIP SMD Double DIP

20

ConfidentialSPIM-CI (under development)

Line-up :

- 1200V/ 30A, 45A

- 600V/ 50A, 75A

- Transfer-molded DBC package Major Applications :

- Industrial Inverter, System A/C Feature :

- High power density in a small package

- 3-phase Rectifier and IGBT inverter

- Built-in Thermistor for temperature sensing



< 1200V >

< 600V >

Q1 Q3

Q6

Q5

Q2

P

NWNVCOM

D1 D3

D6

D5

D2

COM

LINU LOU

FO

IN(UH)

Q4

NU

D4

FO

VB(U)

IN(VL)

VB(V)IN(VH) IN(WH) VB(W)VCC

COM

LOV

LOW

VCC

LINV

LINW

IN(WL)IN(UL)

VS(U)

VCC

HIN

VB

HO

VS

VCC

HIN

VB

HO

VSCOM

VS(V)

VCC

HIN

VB

HO

VSCOM

VS(W)

CSC

CSCNR

R

S

T

VTH

RTH

D11 D13

D14 D16

PR

U V W

Q1 Q3

Q6

Q5

Q2

P

NWNV

D1 D3

D6

D5

D2

COM

VCC

LIN

HIN

VB

HO

VS

LO

FO

IN(UL)

IN(UH)

Q4

NU

D4

FO

VB(U)

IN(VL)

VB(V)IN(VH)

IN(WL)

IN(WH) VB(W)VS(U) VS(V) VS(W)

COM

VCC

CSC

CSC

COM

VCC

LIN

HIN

VB

HO

VS

LO

FO

CSC

COM

VCC

LIN

HIN

LO

FO

CSC

VB

HO

VS

NR

R

S

T

VTH

RTH

D11 D13 D15

D14 D16 D12

PR

VU W


21

ConfidentialSPIM-INV(under development)

Line-up :

- 1200V/ 30A, 45A, 60A

- 600V/ 50A, 75A, 100A

- Transfer-molded DBC package Major Applications :

- Industrial Inverter, System A/C Feature :

- High power density in a small package

- 3-phase IGBT inverter

- Built-in Thermistor for temperature sensing



< 600V >

< 1200V >

Q1 Q3

Q6

Q5

Q2

P

NWNVCOM

D1 D3

D6

D5

D2

COM

LINU LOU

FO

IN(UH)

Q4

NU

D4

FO

VB(U)

IN(VL)

VB(V)IN(VH) IN(WH) VB(W)VCC

COM

LOV

LOW

VCC

LINV

LINW

IN(WL)IN(UL)

VS(U)

VCC

HIN

VB

HO

VS

VCC

HIN

VB

HO

VSCOM

VS(V)

VCC

HIN

VB

HO

VSCOM

VS(W)

CSC

CSC

VTH

RTHU V W

Q1 Q3

Q6

Q5

Q2

P

NWNV

D1 D3

D6

D5

D2

COM

VCC

LIN

HIN

VB

HO

VS

LO

FO

IN(UL)

IN(UH)

Q4

NU

D4

FO

VB(U)

IN(VL)

VB(V)IN(VH)

IN(WL)

IN(WH) VB(W)VS(U) VS(V) VS(W)

COM

VCC

CSC

CSC

COM

VCC

LIN

HIN

VB

HO

VS

LO

FO

CSC

COM

VCC

LIN

HIN

LO

FO

CSC

VB

HO

VSVTH

RTH

VU W


22

Confidential

Line-up : (Q2, ’08 code S)

- 500V/ 9A, 13A MOSFET (UNIFET)

- 600V/ 3A, 5A, 8A IGBT (NPT IGBT)

- 75V/ 75A MOSFET (ULTRAFET, PT3 MOSFET) Major Applications :


(Washing machine, Refrigerator, etc)

- E-Bike, Power Tools (B&D) Feature :

- Single-In-Line 9-SIP compact package

- Built-in fault-out and external shut-down functions

- Built-in Bootstrap diode

- OC, OT, UV protection Function

- FO function(not fixed)

- Thermal Shut-down(not fixed)

- Two kinds of Form Package(9-SIP-Y or 9-SIP-L)

SPM6(under development)

Not fixed

COM

VCC

LIN

HIN

VB

HO

LO

(2) VCC

(3) HIN

(4) LIN

(1) P

(9) U

(7) N(6) COM

(8) VB

VS

FO(5) FO

10.5x26

23

Confidential

Thank You.

Motion SPM ™ Introduction

Documents