General Information Congress Committee CALL FOR PAPERS th 12 International Congress Molded Interconnect Devices Nuremberg – Fuerth Germany th th 28 – 30 September 2016 organized by Research Association Molded Interconnect Devices 3-D MID e. V. in cooperation with University of Erlangen-Nuremberg Institute for Factory Automation and Production Systems – FAPS Contact Congress Location The congress will take place at the Congress Center (Stadthalle) in Fuerth in Northern Bavaria. Direct connections to Nuremberg Airport (distance 15 km) as well as to Fuerth and Nuremberg central station are available by subway. Conference Languages The conference languages are German and English. In the Industrial Track, a simultaneous translation in German and English will be provided. In the Scientific Track, the lectures will be held in English. Exhibition The event will be complemented by an accompanying industrial exhibition as well as a poster presentation. Guest Lectures Invited experts from industry and research complement the technical program with speeches about general developments in MID technology. MID Award 2016 Within the conference the Research Association 3-D MID e.V. awards the MID Award 2016 for an outstanding developement work in the field of MID technology. Best Paper Award The congress committee honors the best scientific congress contribution with the Best Paper Award. Technical Tours th On Friday September 30 , 2016 Technical Tours to leading companies in electronics production are offered. Further Information For further information visit our website www.3dmid.de or directly contact the 3-D MID e.V. office. International Program Committee ▪ Prof. Drummer D. – University Erlangen-Nuremberg, DE ▪ Dr. Dumitrescu R. – Fraunhofer Mechatronic Systems Design, DE ▪ Prof. Feldmann K. – Research Association 3-D MID e. V., DE ▪ Prof. Franke J. – University Erlangen-Nuremberg, DE ▪ Prof. Gausemeier J. – Heinz Nixdorf Institute, DE ▪ Dr. Goth C. – Conti Temic microelectronic GmbH, DE ▪ Häcker G. – Häcker Automation GmbH, DE ▪ Hellmich M. – MID Solutions GmbH, DE ▪ Dr. Heyer J. – hc-heyerconsulting, DE ▪ Prof. Hirsch S. – University Magdeburg, DE ▪ Hirvonen E. – Nordic 3D-MID Solutions AB, SE ▪ Dr. Krüger R. – LPKF Laser & Electronics AG, DE ▪ Dr. Kriebitzsch I. – BMW AG, DE ▪ Dr. Kuhmann K. – Evonik Industries AG, DE ▪ Dr. Moguedet M. – Centre Technique de la Plasturgie, FR ▪ Prof. Niino T. – University of Tokyo, JP ▪ Dr. Pojtinger A. – 2E mechatronic GmbH & Co. KG, DE ▪ Rohde H. – Robert Bosch GmbH, DE ▪ Prof. Schulze V. – Karlsruhe Institute of Technology, DE ▪ Prof. Tseng M. – Feng Chia University, TW ▪ Ueda K. – Panasonic AG, JP ▪ Volkov I. – Ostec Enterprise Ltd., RU ▪ Zadarej V. – Molex Inc., US ▪ Prof. Zhang Y. – Tongji University, CN ▪ Prof. Zimmermann A. – Hahn-Schickard, DE ▪ Zippmann V. – Buss-Werkstofftechnik GmbH & Co. KG, DE Organizing Committee ▪ Prof. Franke J. – University Erlangen-Nuremberg, DE ▪ Dr. Goth C. – Conti Temic microelectronic GmbH, DE ▪ Kuhn T. – Research Association 3-D MID e. V., DE ▪ Dr. Pojtinger A. – 2E mechatronic GmbH & Co. KG, DE Office 3-D MID e. V. Research Association 3-D MID e. V. Fuerther Str. 246b D-90429 Nuremberg Phone: +49 911 5302-9100 Fax: +49 911 5302-9102 E-Mail: [email protected]Internet Further information about the congress and instructions for the speakers are provided on: www.3dmid.de Bionic ANTs - Festo AG & Co. KG
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General Information Congress Committee CALL FOR PAPERS
th12 International Congress
MoldedInterconnectDevices
Nuremberg – Fuerth
Germanyth th28 – 30 September 2016
organized by
Research Association
Molded Interconnect Devices 3-D MID e. V.
in cooperation with
University of Erlangen-Nuremberg
Institute for Factory Automation
and Production Systems – FAPS
Contact
Congress Location
The congress will take place at the Congress Center (Stadthalle) in
Fuerth in Northern Bavaria. Direct connections to Nuremberg Airport
(distance 15 km) as well as to Fuerth and Nuremberg
central station are available by subway.
Conference Languages
The conference languages are German and English.
In the Industrial Track, a simultaneous translation in German and
English will be provided. In the Scientific Track, the lectures will be
held in English.
Exhibition
The event will be complemented by an accompanying industrial
exhibition as well as a poster presentation.
Guest Lectures
Invited experts from industry and research complement the technical
program with speeches about general developments in
MID technology.
MID Award 2016
Within the conference the Research Association 3-D MID e.V.
awards the MID Award 2016 for an outstanding developement
work in the field of MID technology.
Best Paper Award
The congress committee honors the best scientific congress
contribution with the Best Paper Award.
Technical ToursthOn Friday September 30 , 2016 Technical Tours to leading
companies in electronics production are offered.
Further Information
For further information visit our website www.3dmid.de or directly
contact the 3-D MID e.V. office.
International Program Committee▪ Prof. Drummer D. – University Erlangen-Nuremberg, DE
▪ Dr. Dumitrescu R. – Fraunhofer Mechatronic Systems Design, DE
▪ Prof. Feldmann K. – Research Association 3-D MID e. V., DE
▪ Prof. Franke J. – University Erlangen-Nuremberg, DE
▪ Prof. Gausemeier J. – Heinz Nixdorf Institute, DE
▪ Dr. Goth C. – Conti Temic microelectronic GmbH, DE
▪ Häcker G. – Häcker Automation GmbH, DE
▪ Hellmich M. – MID Solutions GmbH, DE
▪ Dr. Heyer J. – hc-heyerconsulting, DE
▪ Prof. Hirsch S. – University Magdeburg, DE
▪ Hirvonen E. – Nordic 3D-MID Solutions AB, SE
▪ Dr. Krüger R. – LPKF Laser & Electronics AG, DE
▪ Dr. Kriebitzsch I. – BMW AG, DE
▪ Dr. Kuhmann K. – Evonik Industries AG, DE
▪ Dr. Moguedet M. – Centre Technique de la Plasturgie, FR
▪ Prof. Niino T. – University of Tokyo, JP
▪ Dr. Pojtinger A. – 2E mechatronic GmbH & Co. KG, DE
▪ Rohde H. – Robert Bosch GmbH, DE
▪ Prof. Schulze V. – Karlsruhe Institute of Technology, DE
▪ Prof. Tseng M. – Feng Chia University, TW
▪ Ueda K. – Panasonic AG, JP
▪ Volkov I. – Ostec Enterprise Ltd., RU
▪ Zadarej V. – Molex Inc., US
▪ Prof. Zhang Y. – Tongji University, CN
▪ Prof. Zimmermann A. – Hahn-Schickard, DE
▪ Zippmann V. – Buss-Werkstofftechnik GmbH & Co. KG, DE
Organizing Committee▪ Prof. Franke J. – University Erlangen-Nuremberg, DE
▪ Dr. Goth C. – Conti Temic microelectronic GmbH, DE
▪ Kuhn T. – Research Association 3-D MID e. V., DE
▪ Dr. Pojtinger A. – 2E mechatronic GmbH & Co. KG, DE