MM-MD

Logistics Master Data DesignManufacturingSAP Best PracticesBaseline V1.603

Product HierarchyLogistics00001Top Level00001B0001Products A(Manufact./Trade)00001B0002Products B(Services)00001B000100000001Products A.01 (MTO)00001B000100000002Products A.02 (MTS)00001B000100000003Parts A.0300001B000200000001Products B.0100001B000200000002Products B.02Level 1Level 2Level 3Product Hierarchy Level 3 Product Group Level 2CO-PA

SOP InterfaceAll material master records assigned to product hierarchy level 3This data is created in BB 104

Product GroupManufacturing / Trading00001B001Products APlant100000001B000100000001Products A.01 (MTO)00001B000100000002Products A.02 (MTS)00001B000100000003Parts A.03 Material*:F226F100-M1F1000-P1Material*:F126F29Material*:H11S23S25* Not all materials used are assigned to sample product groups

Plant1000Level 1Level 2Product Hierarchy Level 3 Product Group Level 2CO-PA

SOP InterfaceThis data is created in BB 143

Classification Class & Characteristics for BatchesClass - 023 YB_EXP_DATE_001 Batch Products with Expiration DateChar. LOBM_VFDAT Expiration date, shelf life Char. YB_SUPPLIER_BATCH_NUMBER Vendor Batch NumberClass - 023 YB_BATCH Batch FIFO 1Char. YB_BATCH_NUMBER Batch NumberChar. LOBM_VFDAT Expiration date, shelf lifeClass - 023 YB_EXP_DATE_002 Batch Search class with expiration dateChar. LOBM_LFDAT Batch Determin. Delivery DateChar. LOBM_RLZ Remaining Shelf Life for BatchUsed in all processes which are using batch materialsThis data is created in BB 117

Classification Class & Characteristics for PO ReleaseProcurement Processes using PO release strategyThis data is created in BB 104

Trading Goods Product StructureBatch ManagementBH11Trading Good, Reg.Trading (HAWA-PD)H12Trading Good, Reorder Point, Reg. Trading (HAWA-VB)H20Trading Good, Reorder Point, Batch-FIFO (HAWA-VB)H21Trading Good, Reorder Point, Batch Exp.Date (HAWA-VB)SNSerial NumbersH14Trading Good, Bought-In(HAWA-PD) Used in Sales Bought in ItemUsed in Third Party w. / w/o Shipping NotificationBThis master data is created in BB 152BH20Trading Good, Reorder Point, Serial No (HAWA-VB)SNUsed in all MM/SD Scenarios for Man (reused from Trade).*H11Trading Good, Third Party (HAWA-PD)H12Trading Good, Reorder Point, Third Party (HAWA-VB)* Except Sceanrios: Third Party Order Proc. and Sales Bought In item Used in all MM /SD Scenarios for Man. (reused from Trade) showing (Serial Nos)Used in all MM /SD Scenarios for Man. (reused from Trade) (Batch Man. Funct.)Master Data Enhancement in BB (126 Layer 2Master Data Enhancement in BB (117 Layer 2

Returnables Product StructureL001Empties (LEIH-ND)Returnables ProcessingThis master data is created in BB 152

MTO with Variant ConfigurationProduct StructureF100Finished Good MTO VC Configurable(KMAT-PD)K-Item Category Class-Component 1Class-Component 2S25Semifinished Good, Repetitive Manuf.(HALB-20-PD)R20Raw Material(ROH-PD)S21Semifinsihed Good, Repetitive Manuf.Initial (HALB-20 PD) (HALB-PD)R28Raw Material, Packaging Foil(ROH-PD)R27Raw Material, Packaging Box(ROH-PD)F1000-M1 Metal with Normal Shrink Wrap F1000-P1 Plastic with Normal Shrink WrapF1000-G1 Golden with Normal Shrink Wrap F1000-G2 Golden with Special PackagingCFClass: YB_CL_TYPE_COMP_1 (S2201, S2202, S2203) Class: YB_CL_TYPE_COMP_2 (S2301, S2302, S2303) VC Dependencies: YB_PACKAGING_1 = NORMAL

VC Dependencies: YB_PACKAGING_2 = SPECIAL

MTO with Variant Configur ationRepetitiveManufact uringThis data is created in BB 143 & 147S2201 Semifinihed Good Phantom Ass.,Plastic(HALB-50-PD)R1801RAW Mat., Plastic(ROH-PD)R1601RAW Mat., Plastic(ROH-PD)R1701RAW Mat., Plastic(ROH-PD)S2202 Semifinihed Good Phantom Ass.,Metal(HALB-50-PD)R1802RAW Mat., Metal(ROH-PD)R1602RAW Mat., Metal(ROH-PD)R1702RAW Mat., Metal(ROH-PD)S2203 Semifinihed Good Phantom Ass.,Goldenl(HALB-50-PD)R1803RAW Mat., Golden(ROH-PD)R1603RAW Mat., Golden(ROH-PD)R1703RAW Mat., Golden(ROH-PD)MM Sub-contractingMaster Data Enhancement in BB 149 Layer 2Master Data Enhancement in BB 138 Layer 2

MTO Production Variant ConfigurationBOM Allocation

This data is created in BB 147Variant Links to maximum material BOMF1000-G2Finished Good Material variant, Golden,Boxed (FERT-PD)Type of Material Metallic - Component 1Type of Material Metallic - Component 2Shrink-Wrap PackagingS25Semifinished Good, External Procurement(HALB-20-PD)R20Raw Material(ROH-PD)S21Semifinsihed Good, Repetitive Manuf.Initial (HALB-20 PD) (HALB-PD)K-Item Category Class-Component 1Class-Component 2S25Semifinished Good, External Procurement(HALB-20-PD)R20Raw Material(ROH-PD)S21Semifinsihed Good, Repetitive Manuf.Initial (HALB-20 PD) (HALB-PD)R28Raw Material, Packaging Foil(ROH-PD)R27Raw Material, Packaging Box(ROH-PD)Type of Material Plastic - Component 1Type of Material Plastic - Component 2Shrink-Wrap PackagingS25Semifinished Good, External Procurement(HALB-20-PD)R20Raw Material(ROH-PD)S21Semifinsihed Good, Repetitive Manuf.Initial (HALB-20 PD) (HALB-PD)Type of Material Golden - Component 1Type of Material Golden - Component 2Shrink-Wrap PackagingS25Semifinished Good, External Procurement(HALB-20-PD)R20Raw Material(ROH-PD)S21Semifinsihed Good, Repetitive Manuf.Initial (HALB-20 PD) (HALB-PD)Type of Material Golden - Component 1Type of Material Golden - Component 2Packaging BoxS25Semifinished Good, External Procurement(HALB-20-PD)R20Raw Material(ROH-PD)S21Semifinsihed Good, Repetitive Manuf.Initial (HALB-20 PD) (HALB-PD)F1000-M1Finished Good Material variant, Metal,Foiled (FERT-PD)F1000-P1Finished Good Material variant, Plastic,Foiled (FERT-PD)F1000-G1Finished Good Material variant, Golden,Foiled (FERT-PD)F1000Finished Good MTO VC Configurable(KMAT-PD)CFConfigurableCF

ClassificationClass & Characteristics for Variant ConfigurationClass -200 YB_CL_TYPE_COMP_1 Class . Component 1ValuesDescriptionPLASTICPlasticMETALMetallicGOLDENGoldenChar. YB_BASIC-MATERIAL_1Type of Material

ValuesDescriptionPLASTICPlasticMETALMetallicGOLDENGoldenChar. YB_BASIC-MATERIAL_1Type of MaterialClass -200 YB_CL_TYPE_COMP_2 Class . Component 1Char. YB_PACKAGING_1Type of Packaging

ValuesDescriptionsNORMALShrink-wrap PackagingSPECIALSpecial PackagingValuesDescriptionPLASTICPlastic PenMETALMetallic PenGOLDENGolden PenClass -200 YB_CL_TYPE_PROD_1Class . Finsished Good 1Char. YB_BASIC-MATERIAL_1Type of MaterialThis data is created in BB 147MTO Production with Variant Configuration

MTS Production - Process Industry Product StructureF29Finished Good MTS PI(FERT-PD)B10 - Final OperationMaster Recipe F29 10 - Operation 120 - Operation 2Batch ManagementBMaster Recipe S24 Bulk Material FIFOExp. dateLQLean QMMTS Production Process IndustryR15RAW Material (ROH - PD)R09RAW Material Batch FIFO(ROH - PD)R19RAW Material Batch FIFO, Lean QM(ROH - PD)LQR30RAW Material, Batch FIFO, Reorder Point (ROH - VB)This master data is created in BB 143All SD processesFor Manu-facturing** Except Sceanrios: Third Party Order Proc. Sales Bought In item, Returnables ProcessingAll other Raw Materials used in MM / Procurement ProcessesPI-Sheet not included in process

MTS Production - Discrete IndustryProduct StructureF126Finished Good, MTS-DI, Batch-FIFO, Serial No(FERT-PD)S22 Semifinihed Good Phantom Ass.(HALB-50-PD)S23Semifinished Good Subcontracting initial (HALB-20-PD) (HALB-30-PD)R122RAW Material Batch-FIFO, Import (ROH-PD)R128RAW Material Consignment(ROH - PD)R120RAW Material QualityManaged (ROH - PD)S21Semifinsihed Good, Repetitive Manuf.Initial (HALB-20 PD) (HALB-PD)S25Semifinsihed Good, Ext. Procurement(HALB-20-PD)S124Semifinsihed Good Subassembly(HALB - PD)R20RAW Material (ROH - PD)R27 RAW Material Packaging Box(ROH - PD)R18RAW Material(ROH-PD)CPQMBRouting FERT10 Assembly20 Final Acceptance30 Painting (Ext. Processsing)40 Packaging50 GR w. Serial No Ass.Batch ManagementCPBConsignment ProcessingSCSubcontractingEPExternal processingQMRWReworkQuality MgmtEPRWBSNFIFOFIFOFBFixed BinIMIMImportSNSerial NosMTS Production Discrete IndustryPP-Subcon. (External Processing)Rework ProcessesAll other Raw, SF- Goods used in MM / Procurement Processes* Except Sceanrios: Third Party Order Proc. and Sales Bought In item This master data is created in BB 143Procurement & Consumpt. of Consigned InventoryQuality Management for Procurement with vendor EvaluationMaster Data Enhancement in BB 127 Layer 2Master Data Enhancement in BB 139 Layer 2R14RAW Material(ROH-PD)MM Subcon-tractingSCMaster Data Enhancement in BB 138 Layer 2R124Raw Material, Consumption, FixedBin (ROH-VB)FBR16RAW Material(ROH-PD)R17RAW Material(ROH-PD)R13RAW Material(ROH-PD)All SD processesFor Man. **Rep. Manufactr.Revision LevelRLRL**Can be used but not particulary explained in processMaster Data Enhancement in BBs in Layer 2

Repetitive Manufacturing Product StructureRouting Rep. Manufacturing

10 Assembly Repetitive Repetitive Manu-facturingS21Semifinished Good, Repetitive Manuf.(HALB-PD)R12RAW Material, Rep. Manufacturing(ROH - PD)This master data is created in BB 143Master Data Enhancement in BB 149 Layer 2Raw Material used in MM / Procurement Processes for Man.

MTO Production without Variant Config.Product StructureF226Finished Good, MTS-DI, Batch-FIFO, Serial No(FERT-PD)S22 Semifinihed Good Phantom Ass.(HALB-50-PD)S23Semifinished Good Subcontracting initial (HALB-20-PD) (HALB-30-PD)R122RAW Material Batch-FIFO, Import (ROH-PD)R128RAW Material Consignment(ROH - PD)R120RAW Material QualityManaged (ROH - PD)S21Semifinsihed Good, Repetitive Manuf.Initial (HALB-20 PD) (HALB-PD)S25Semifinsihed Good, Ext. Procurement(HALB-20-PD)S224Semifinsihed Good Subassembly(HALB - PD)R20RAW Material (ROH - PD)R27 RAW Material Packaging Box(ROH - PD)R18RAW Material(ROH-PD)CPQMBRouting FERT10 Assembly20 Final Acceptance30 Painting (Ext. Processsing)40 Packaging50 GR w. Serial No Ass.Batch ManagementCPBConsignment ProcessingSCSubcontractingEPExternal processingQMRWReworkQuality MgmtEP*BSNFIFOFIFOFBFixed BinIMIMImportSNSerial NosMTO Production Discrete IndustryAll other Raw, SF- Goods used in MM / Procurement Processes for Man.* Except Sceanrios: Third Party Order Proc. and Sales Bought In item; Sell from Stock, Returnables ProcessingThis master data is created in BB 143Procurement & Consumpt. of Consigned InventoryQuality Management for Procurement with vendor EvaluationMaster Data Enhancement in BB 127 Layer 2Master Data Enhancement in BB 139 Layer 2R14RAW Material(ROH-PD)MM Subcon-tractingSCMaster Data Enhancement in BB 138 Layer 2R124Raw Material, Consumption, FixedBin (ROH-VB)FBR16RAW Material(ROH-PD)R17RAW Material(ROH-PD)R13RAW Material(ROH-PD)SD processesin Layer 1/2 **Rep. Manufactr.Revision LevelRLRL**Can be used but not particulary explained in processMaster Data Enhancement in BBs in Layer 2RW*

MTS Production Internal Product Dev. Product StructureF326Finished Good, PLM, Batch-FIFO, Serial No(FERT-PD)S22 Semifinihed Good Phantom Ass.(HALB-50-PD)S23Semifinished Good Subcontracting initial (HALB-20-PD) (HALB-30-PD)R122RAW Material Batch-FIFO, Import (ROH-PD)R128RAW Material Consignment(ROH - PD)R120RAW Material Quality Managed (ROH - PD)S21Semifinsihed Good, Repetitive Manuf.Initial (HALB-20 PD) (HALB-PD)S325ASemifinsihed Good, Ext. Procurement(HALB-20-PD)S124Semifinsihed Good Subassembly(HALB - PD)R20RAW Material (ROH - PD)R27 RAW Material Packaging Box(ROH - PD)R18RAW Material(ROH-PD)CPQMBRouting FERT10 Assembly20 Final Acceptance30 Painting (Ext. Processsing)40 Packaging50 GR w. Serial No Ass.Batch ManagementCPBConsignment ProcessingSCSubcontractingEPExternal processingQMRWReworkQuality MgmtEP*B*SN*FIFOFIFOFBFixed BinIMIMImportSNSerial NosPLM - Internal Product Dev.All other Raw, SF- Goods used in MM / Procurement ProcessesThis master data is created in BB 143Procurement & Consumpt. of Consigned InventoryQuality Management for Procurement with vendor EvaluationMaster Data Enhancement in BB 127 Layer 2Master Data Enhancement in BB 139 Layer 2R14RAW Material(ROH-PD)MM Subcon-tractingSCMaster Data Enhancement in BB 138 Layer 2R124Raw Material, Consumption, FixedBin (ROH-VB)FBR16RAW Material(ROH-PD)R17RAW Material(ROH-PD)R13RAW Material(ROH-PD)Rep. Manufactr.Revision LevelRLRL*Can be used but not particulary explained in processBOM, Routing creation in BB 210S325BSemifinsihed Good, Ext. Procurement(HALB-20-PD)Replacement in ECM subprocessRW*

SAP Best Practices Work center HierarchyMANU_SERVManufacturing Service - Top Level0001 (Cap 001)PLANT_MCPlant Maintenance0005Service 0003Service 10003Service 20003TOT_PLNTPlant - Top Level0001DISCR_MFDiscrete Manufacturing - Top Level 0001 (Cap 001/002)PACK01 Packing Line0001 (Cap 001)PACK02Hand Packing Work Center0001 (Cap: 002)ASSEMBLYCapacity Machine 0001 (Cap 001)TESTING Capacity Machine0001 (Cap 001)TECHNICCNC processing0001 (Cap 001)WORK Work Machine / Person0001 (Cap: 001/002)PVRSN_MFProcess / REM Manufacutring - Top Level 0001 (Cap 001/002)MIXINGMixing Liquid0008 (Cap 001/002)BottlingBottling Liquid0008 (Cap: 001/002)WindingWinding REM 0007 (Cap 001)PackingPacking Liquid0008 (Cap: 001/002)Not realized in BL V1.603 - Possible enhancement for Manufacturing related Service Management ScenariosThis master data is created in BB 143

Legend

External to SAPBusiness Activity / EventUnit ProcessProcess ReferenceSub-Process ReferenceProcess DecisionHardcopy / DocumentFinancial ActualsBudget PlanningManual ProcessExisting Version / DataSystem Pass/Fail Decision

Copyright 2009 SAP AGAll Rights ReservedNo part of this publication may be reproduced or transmitted in any form or for any purpose without the express permission of SAP AG. The information contained herein may be changed without prior notice.Some software products marketed by SAP AG and its distributors contain proprietary software components of other software vendors.Microsoft, Windows, Excel, Outlook, and PowerPoint are registered trademarks of Microsoft Corporation. IBM, DB2, DB2 Universal Database, System i, System i5, System p, System p5, System x, System z, System z10, System z9, z10, z9, iSeries, pSeries, xSeries, zSeries, eServer, z/VM, z/OS, i5/OS, S/390, OS/390, OS/400, AS/400, S/390 Parallel Enterprise Server, PowerVM, Power Architecture, POWER6+, POWER6, POWER5+, POWER5, POWER, OpenPower, PowerPC, BatchPipes, BladeCenter, System Storage, GPFS, HACMP, RETAIN, DB2 Connect, RACF, Redbooks, OS/2, Parallel Sysplex, MVS/ESA, AIX, Intelligent Miner, WebSphere, Netfinity, Tivoli and Informix are trademarks or registered trademarks of IBM Corporation.Linux is the registered trademark of Linus Torvalds in the U.S. and other countries.Adobe, the Adobe logo, Acrobat, PostScript, and Reader are either trademarks or registered trademarks of Adobe Systems Incorporated in the United States and/or other countries.Oracle is a registered trademark of Oracle Corporation. UNIX, X/Open, OSF/1, and Motif are registered trademarks of the Open Group.Citrix, ICA, Program Neighborhood, MetaFrame, WinFrame, VideoFrame, and MultiWin are trademarks or registered trademarks of Citrix Systems, Inc.HTML, XML, XHTML and W3C are trademarks or registered trademarks of W3C, World Wide Web Consortium, Massachusetts Institute of Technology.Java is a registered trademark of Sun Microsystems, Inc.JavaScript is a registered trademark of Sun Microsystems, Inc., used under license for technology invented and implemented by Netscape. SAP, R/3, SAP NetWeaver, Duet, PartnerEdge, ByDesign, SAP Business ByDesign, and other SAP products and services mentioned herein as well as their respective logos are trademarks or registered trademarks of SAP AG in Germany and other countries. Business Objects and the Business Objects logo, BusinessObjects, Crystal Reports, Crystal Decisions, Web Intelligence, Xcelsius, and other Business Objects products and services mentioned herein as well as their respective logos are trademarks or registered trademarks of Business Objects S.A. in the United States and in other countries. Business Objects is an SAP company.All other product and service names mentioned are the trademarks of their respective companies. Data contained in this document serves informational purposes only. National product specifications may vary.These materials are subject to change without notice. These materials are provided by SAP AG and its affiliated companies ("SAP Group") for informational purposes only, without representation or warranty of any kind, and SAP Group shall not be liable for errors or omissions with respect to the materials. The only warranties for SAP Group products and services are those that are set forth in the express warranty statements accompanying such products and services, if any. Nothing herein should be construed as constituting an additional warrant.