Mirtec MV-3 Series Desktop AOI Systems · The contents and details of this catalogue can be changed without notice. MV-3 Specifications Type MV-3L MV-3U Machine Dimensions 975 (W)

Mirtec MV-3 Series Desktop AOI Systems

The MV-3 Series offers Advanced Five Mega Pixel Digital Color Camera Technology in a desktop AOI system. This advanced technology provides the ultimate in inspection performance and speed. The optional Side Viewer® camera system provides enhanced inspection capability through the addition

of four Five Mega Pixel Side View Digital Color Cameras. MIRTEC's MV-3 Series is the world's first generation of five camera Desktop AOI systems.

Improved Powerful Inspection Performance Lifted Lead Inspection Solution New Lifted Inspection Techniques with Colour (Global patent on process) • With White LED light/ colour inspection

techniques with component gradient • The Best Inspection Performance for

Chip/ IC lifted lead defects IC Package Lifted Lead Inspection Function (Intelli-3DBeam)-Optional • Laser height measurement techniques

for coplanarity of the Component • Inspect lifted lead defects, BGA, QFP

etc. – Also scattered Chip inspection like when the chip is under component

Precision Debugging Function (Intelli-SideViewer)-Optional • Easy to Debug and perfect re-inspection

by operator with 360° images from side on defect (Lifted Lead and J-Lead component)

• 4 high resolution side cameras

Chip Positioning, Solder Ball and Scratch Inspection • Inspect the component in the correct

position, and that its not moved due to vibration, impact or static electricity

• Inspection algorithm for scratches, solder balls and chip misplacement, defects based on frame

• Chip scatter inspection: inspect the chip with incorrect positioning due to vibration, impact or static electricity

• Solder ball inspection: Inspect solder ball defects on the board

• Scratch inspection: Inspect scratches on the pad without solder

Telecentric Lens Application • Non-distortion during image

magnification Display the object with the same angle and distance.

• No compensation required for the Image edge as with a general lens

• Advanced inspection performance when using top camera, as depth and height issues with general cameras are eliminated.

General Lens 13,4 µ Telecentric Lens 13,4 µ

Center

Background

General Lens Telecentric lens effect

High Inspection Speed 5M Super High Resolution Camera with 9.8μm Lens • Improved inspection speed with wider

FOV(Field of View) • Excellent inspection performance for

0402 Chip (01005 chip) with a resolution of 9.8μm/pixel

2M (29.1 x 21.8 mm ) 5M (44.7 x 37.4 mm)

FOV area comparison 2M/5M camera

Auto Clamp Option - Optional • Developed for large and thin boards, the

auto clamp option ensures quick and easy positioning of the board, assisting in a high inspection performance.

Simple and Fast Programming Tools Multi frame part programming function • Makes the part inspection window bigger

than FOV with • Digital zoom function • Registration as one Part • Simple Programming with drag and drop • Statistics processing as one part on

SPC ATT/ Library with Gerb Win • ATT(Auto Teaching Tool) with GerbWin • Programming offline with Gerber data

and pick and place data • Fast programming and debugging with

library registration function • Automatic interlock function with library

table and ATT

Height Options to Assist the Customers Clearance Requirements 25mm & 45mm light head option • Easily changeable, top clearance with

25mm & 45mm Process Management Function Remote Debugging Function • Debug the program without interrupting

production • Its possible to use 1 remote PC to

control multiple machines • Debug false alarms with previous defect

data Built-in SPC • Maximize productivity and quality • Statistical Process Control • Monitor all the defects from the

statistical data of the product

Built-in Repair System • Repair the board with the defect data list • Easiest visual display for the operator

The contents and detai ls of this catalogue can be changed without notice.

MV-3 Specifications Type MV-3L MV-3U

Machine Dimensions 975 (W) x 1200 (D)x 595 mm (H) 1185 (W) x 1455 (D) x 610 mm (H) Inspection Area 50 x 50 ~ 450 x 400 mm 50 x 50 ~ 660 x 510 mm

Weight 110 Kg 160 Kg Option 1 FOV: 29.1 x 21.8 mm, Resolution : 18.2 μm/pixel

Option 2 FOV: 21.5 x 16.1 mm, Resolution : 13.4 μm/pixel 2.0 Mega Pixel

Camera System Option 3 FOV: 15.7 x 11.8 mm, Resolution : 9.8 μm/pixel

Option 1 FOV: 44,7 x 37,4 mm, Resolution : 18.2 μm/pixel Option 2 FOV: 32,9 x 27,5 mm, Resolution : 13.4 μm/pixel

FOV / Resolution 5.0 Mega Pixel Camera System Option 3 FOV: 24,0 x 20,1 mm, Resolution : 9.8 μm/pixel

Option 1 29 cm² /sec. (0,22 sec/frame) Option 2 16 cm² / sec. (0,22 sec/frame)

2.0 Mega Pixel Camera System Option 3 8 cm² / sec. (0,22 sec/frame)

Option 1 60 cm² /sec. (0,28 sec./frame) Option 2 32 cm² /sec. (0,28 sec/frame)

Inspection Speed 5.0 Mega Pixel

Camera System Option 3 17 cm²/sec. (0,28 sec/frame)

Option 1 0,4 pitch IC, 0201 Chip Option 2 0,3 pitch IC, 01005 Chip Smallest Component Inspection Option 3 0,3 pitch IC, 01005 Chip

Inspection Item

Lifted Lead, Lifted Components, Bridge, Wrong Component, Excessvie Solder, Insufficient Solder, Open Solder, Missing Component, Misalignment, Skew Component, Polarity,

Tombstone, Flipped Components,Incorrect Component (OCR Recognition), Pad Scratch, Solder Balls, Lifted Components under QFP/BGA Package (laser Option)

Options Side Viewer®, NG Marker(Mechanic), Barcode, OLTT, INTELLISYS® (Remote SPC, Remote Repair, Remote Management), 1D or 2D Guntype Barcode Reader

2.0 Mega (1600 x 1200 Pixels) Top Down Camera 5.0 Mega (2456 x 2058 Pixels)

SideViewer® : 2.0 Mega (1600 x 1200 Pixels) / 4 set Side Viewer Camera

SideViewer® : 5.0 Mega (2,592 x 1,944 Pixels) / 4 set

Lighting System 3 Layer LED (Horizontal, Vertical, Coaxial), Quad Angle Lighting System, User defined settings

3D-Beam Laser Resolution/accuracy Z-Height Repeating Measurement Accuracy:±20 μm (Resolution: 15 μm/point)

PC IntelR CoreTM 2 Duo, 19" LCD Monitor, Windows XP Professional

Power Requirements Single Phase AC 85~264V, 50/60Hz

Environment Temperature: 10-40° C., Humidity: 30-80% RH

Remark 1) Clearance between PCB surface and Robot is 25mm in common (45mm is optional) 2) With 45mm Clearance option, SideViewer® option is not applicable. 3) Either 3D-Beam® Laser system or NG-marker is only applicable as an option.

pb tec GmbHGüterbahnhofstraße 3-763450 Hanau (Germany)Tel. +49 6181 36011 0Fax +49 6181 36011 20E-Mail [email protected] www.pbt.de

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