INVENTEC, 26, avenue du Petit Parc - 94683 Vincennes Cedex - France Tél : +33 (0) 1 43 98 75 00 - Fax : +33 (0) 1 43 98 21 51 Microelectronics and Semiconductor packaging materials INVENTEC semiconductor packaging ma- terials include soldering and cleaning solutions to be used at processes such as die attach, flip chip, CSP and defluxing for the manufacturing of power semiconductors, BGAs, micromodules, System in Package and hybrid assemblies Die Attach Soldering materials ECOREL TM solder pastes • Halogen free below 100 ppm • ROL0 class according to J-STD-004 Flip Chip: BGA, COB, COF, CSP ECOFREC TM tacky fluxes • Halogen Free • ROL0 • Clear and colourless residues • Pass Bono corrosion test to meet chemical reliability of residues • Different viscosities, starting low viscosity at 5 Pa. Sec at 20°C AMTECH TM tacky fluxes • Water washable Ecorel TM Free 305-16 Ecorel TM Free 405Y Ecorel TM Free HT245-16 Ecorel TM Free 808.1 Ecorel TM HT 296S Alloy Sn96.5Ag3.0Cu0.5 SnAg4.15Cu0.5Ni + dopants SnSb8.5 Sn96.5Ag3.5 Pb92.5Sn5Ag2.5 Melting Point 217°C 217°C 241° to 248°C 221°C 287° to 296° C Main Features Very good wetting Low voiding High reliability for high operating temperatures Thermal cycling resistance Suitable for hybrid or stacking as- sembly For dispensing application High temperature die attach