Micro Electro Mechanical Systems Paper 1

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A paper presentation on

Micro electromechanicalsystems

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Micro electromechanicalsystems

MEMS is the integration of mechanical

elements, sensors, actuators, and

electronics onto a common silicon basethrough the use of micro fabrication

technology.

This technology has expanded from theconventional two-dimensional design of

chips to three-dimensional structures.

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Components of MEMS

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Components of MEMS

Micro electronics: It receives data, processes it, and makes

decisions.

The data received comes from the microsensors in the MEMS

Micro sensors:

These constantly gather data from thesurrounding environment and pass this

information on to the microelectronics forprocessing.

These sensors can monitor mechanical,thermal, biological, chemical, optical and

magnetic readings from the surroundingenvironment.

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Micro actuators: A micro actuator acts as a switch or a trigger

to activate an external device.

The actuators respond according to thedecision taken by micro electronics.

Micro structures:

Due to the increase in technology for micromachining, extremely small structures can bebuilt onto the surface of a chip. These tinystructures are called micro structures and areactually built right into the silicon of theMEMS .

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Major steps involved in IC fabrication:

Preparation of silicon substrate. Deposition of silicon dioxide layer.

Photolithographic process.

Fabrication of thin film components. Packaging.

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Fabrication of MEMS

The major methods are:

Surface micro machining

LIGA

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Surface micro machining

It is based on deposition and etching ofdifferent structural layers.

A substrate is chosen and layers are grown onthe top of the substrate.

Sacrificial layers are selectively etched byphotolithography involving wet etching or dryetching processes.

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LIGA

LIGA is an acronym for the German words

lithography, electroforming and molding

electroforming is the process of creating 3-

dimensional metal parts by using a carefully

controlled long duration electroplating process

Can withstand high temperatures and pressures

Ad

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Advantages

Miniaturization

Portability

High accuracy, precision and reliability systems integration on a single chip.

Reduced manufacturing cost and time

Improved performance and fast response time

Low power consumption

Easily maintained and replaced

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Applications

Communications

Bio technology

Consumer market

Industrial Market

Military

Inertial sensors

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Challenges

Experts and professionals are few in

number.

High initial investment Packaging becomes difficult as some

devices have to be in contact with their

environment.

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Conclusion

MEMS is an emerging technology which

will rapidly revolutionize all the fields in

the near future.

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Thank you

S. Santhosh Kumar

&

V. Sandhya

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