Metallized Polypropylene Film EMI Suppression … › datasheets › KEM_F3120_R41-T_Y2...• Tape and reel in accordance with IEC 60286-2 • RoHS compliant and lead-free terminations
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• Approvals: ENEC, UL, cUL, CQC • Class Y2/X1 (IEC 60384-14) • THB Grade IIIB: 85°C, 85% RH, 1,000 hours at 300 V
URAC/1,500 V URDC acc. to IEC 60384-14• Rated voltage: 300 VAC 50/60 Hz• Capacitance range: 0.0022 – 1 µF • Lead spacing: 10 – 37.5 mm• Capacitance tolerance: ±20%, ±10%• Climatic category 40/110/56, IEC 60068-1• Tape and reel in accordance with IEC 60286-2• RoHS compliant and lead-free terminations• Operatingtemperaturerangeof−40°Cto+125°C• Self-healing properties• Automotive (AEC–Q200) grade
Overview
TheR41Tisconstructedofmetallizedpolypropylenefilmencapsulated with self-extinguishing resin, in a box of material meeting the requirements of UL 94 V–0.
Automotive Grade devices meet the demanding Automotive ElectronicsCouncil'sAEC–Q200qualificationrequirements.
Applications
For use in electromagnetic interference (EMI) suppression filterin"line-to-ground"and"across-the-line"applications,requiringY2/X1safetyclassification.Suitableforuseinsituations where failure of the capacitor could lead to dangerofelectricshock.Notforusein"serieswithmains"type applications.
Metallized Polypropylene Film EMI Suppression Capacitors
R41T, THB, Class Y2, 300 VAC, 125°C(Automotive Grade)
Metallized Polypropylene Film EMI Suppression CapacitorsR41T, THB, Class Y2, 300 VAC, 125°C (Automotive Grade)
Performance Characteristics cont.
0102030405060708090
100
−40 −20 0 20 40 60 80
Rela
tive
Hum
idity
(%)
Temperature (°C)
Maximum Humidity in Storage Condition
30 DaysAnnual Average
Max
imum
I rms
Temperature Th(°C)
Maximum Irms vs. Th
0%
20%
40%
60%
80%
100%
120%
25 35 45 55 65 75 85 95 105 115 125
Maximum Overtemperature ∆Tlim vs Th
Temperature Th(°C)
∆Tlim
(°C)
0 10 20 30 40 50 60 70 80 90 100
110
120
130
0
5
10
15
20
25
Th is the maximum ambient temperature surrounding the capacitor or hottest contact point (e.g. tracks), whichever is higher, in the worst operation conditions in °C.
Metallized Polypropylene Film EMI Suppression CapacitorsR41T, THB, Class Y2, 300 VAC, 125°C (Automotive Grade)
Qualification
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualificationforPassiveComponents. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
Metallized Polypropylene Film EMI Suppression CapacitorsR41T, THB, Class Y2, 300 VAC, 125°C (Automotive Grade)
Soldering Process
The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has increased the liquidus temperature from that of 183°C for SnPb eutectic alloy to 217 – 221°C for the new alloys. As a result, the heat stress to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is 160 – 170°C). Wave soldering can be destructive, especially for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm), andgreatcarehastobetakenduringsoldering.TherecommendedsolderprofilesfromKEMETshouldbeused.PleaseconsultKEMET with any questions. In general, the wave soldering curve from IEC Publication 61760-1 Edition 2 serves as a solid guideline for successful soldering. Please see Figure 1.
Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcessoftheabove the recommended limits may result to degradation or permanent damage to the capacitors.
Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through-holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofileintheoven,if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Please allow time for the capacitor surface temperature to return to a normal temperature before the second soldering cycle.
Manual Soldering Recommendations
The following is the recommendation for manual soldering with a soldering iron.
The soldering iron tip temperature should besetat350°C(+10°Cmaximum)withthesoldering duration not to exceed more than 3 seconds.
Metallized Polypropylene Film EMI Suppression CapacitorsR41T, THB, Class Y2, 300 VAC, 125°C (Automotive Grade)
Soldering Process cont.
Wave Soldering Recommendations cont.1. The table indicates the maximum set-up temperature of the soldering processFigure 1
Dielectric Film Material
Maximum Preheat
Temperature
Maximum Peak Soldering
Temperature
Capacitor Pitch
≤15mm
Capacitor Pitch
> 15 mm
Capacitor Pitch
≤15mm
Capacitor Pitch
> 15 mm
Polyester 130°C 130°C 270°C 270°C
Polypropylene 110°C 130°C 260°C 270°C
Paper 130°C 140°C 270°C 270°C
Polyphenylene Sulphide 150°C 160°C 270°C 270°C
2. The maximum temperature measured inside the capacitor: Set the temperature so that inside the element the maximum temperature is below the limit:
Dielectric Film Material Maximum temperature measured inside the element
Polyester 160°C
Polypropylene 110°C
Paper 160°C
Polyphenylene sulphide
160°C
Temperature monitored inside the capacitor.
Selective Soldering Recommendations
Selectivedipsolderingisavariationofreflowsoldering.Inthismethod,theprintedcircuitboardwiththrough-holecomponentstobesolderedispreheatedandtransportedoverthesolderbathasinnormalflowsolderingwithouttouchingthe solder. When the board is over the bath, it is stopped and pre-designed solder pots are lifted from the bath with molten solder only at the places of the selected components, and pressed against the lower surface of the board to solder the components.
Thetemperatureprofileforselectivesolderingissimilartothedoublewaveflowsolderingoutlinedinthisdocument,however, instead of two baths, there is only one bath with a time from 3 to 10 seconds. In selective soldering, the risk of overheatingisgreaterthanindoublewaveflowsoldering,andgreatcaremustbetakensothatthepartsarenotoverheated.
Metallized Polypropylene Film EMI Suppression CapacitorsR41T, THB, Class Y2, 300 VAC, 125°C (Automotive Grade)
Mounting
Resistance to Vibration and Mechanical Shock
AEC-Q200 Mechanical Stress Tests:
Mechanical Shock MIL-SDT-202 Method 213 Test condition C Peak value 100 g, duration 6 ms, half-sine-wave (see MIL-HDBK for details)
Vibration MIL-SDT-202 Method 204
5 g for 20 minutes, 12 cycles each of 3 orientationsUse8"X5"PCB,0.031"thick.7securepointsonone8"sideand2securepointsatcornersofoppositesides.Partsmountedwithin2"fromany
secure point. Test from 10 – 2,000 Hz.
The capacitors are designed for PCB mounting. The stand-off pipes must be in good contact with the printed circuit board.Thecapacitorswithpitch≤22.5mmcanbemechanicallyfixedbytheleads,forpitch>22.5mm,thecapacitorbodyhastobeproperlyfixed(e.g.clampedorglued).
Construction
Detailed Cross SectionSelf-Extinguishing
ResinMolded Plastic
CaseMolded Plastic
Case
Leads
Metal Contact Layer
Metal Contact Layer
Margin
Single-sided Metallized Polypropylene Film
(Second Layer)
Single-sided Metallized Polypropylene Film
(First Layer)
Margin
Margin
2 Sections
Single-sided Metallized
Polypropylene Film
FILM WINDING SCHEME OPTIONS
1 Section
Single-sided Metallized
Polypropylene Film
Single-sided Metallized
Polypropylene Film
Single-sided Metallized
Polypropylene Film
Single-sided Metallized Polypropylene Film
2 Sections
3 Sections 4 Sections
Single-sided Metallized
Polypropylene Film
Polypropylene Film Dielectric
1 Section
Double-sided Metallized Polyester Film
3 Sections
Double-sided Metallized Polyester
Carrier Film
Polypropylene Film Dielectric
Double-sided Metallized Polyester
Carrier Film
2 Sections
Polypropylene Film DielectricDouble-sided
Metallized Polyester Carrier
Film
Single-sided Metallized
Polypropylene Film
4 Sections
Polypropylene Film DielectricDouble-sided
Metallized Polyester Carrier
Film
Polypropylene Film Dielectric
1 Section
Polypropylene Film/Foil
2 Sections
Metal Foil Metal Foil
Single-sided Metallized
Polypropylene Film
Polypropylene Film Dielectric
Metallized Polyphenyl-ene Sulfide Film with Vacuum-Evaporated
Aluminum Electrodes
1 Section
Metallized Polyphenylene Sulfide Film (SMR)
Metallized Impregnated
Paper
1 Section
Metallized Impregnated Paper
Single-sided Metallized Polyester
Film
1 Section
Single-sided Metallized Polyester Film
Polypropylene Film Dielec-
tric
1 Section
AXIAL - Polypropylene Film/Foil
2 Sections
Metal Foil
Single-sided Metallized
Polypropylene Film
Polypropylene Film DielectricMetal Foil
Single-sided Metallized
Polypropylene Film
2 Sections
Polypropylene Film Dielectric
Double-sided Metallized
Polyester Carrier Film
Single-sided Metallized
Polypropylene Film
1 Section
AXIAL - Single-sided Metallized Polypropylene Film
NOTE: Hot imprinting with or withoutcolor or ink jet or laser marking
NOTE: Hot imprinting with or withoutcolor or ink jet or laser marking
Capacitance,Capacitance
Tolerance
Rated Voltage
T Series
* Differences caused by technology (clichee, laser or ink jet) and production line
Manufacturing Date Code (IEC 60062)Y = Year, Z = Month
Year Code Year Code Year Code Month Code Month Code2010 A 2017 J 2024 S January 1 July 72011 B 2018 K 2025 T February 2 August 82012 C 2019 L 2026 U March 3 September 92013 D 2020 M 2027 V April 4 October O2014 E 2021 N 2028 W May 5 November N2015 F 2022 P 2029 X June 6 December D2016 H 2023 R 2030 A
Metallized Polypropylene Film EMI Suppression CapacitorsR41T, THB, Class Y2, 300 VAC, 125°C (Automotive Grade)
Lead Taping & Packaging (IEC 60286–2)
Taping Specifi cation
Description Symbol
Dimensions (mm)Lead Space
Tol.10 15 22.5 27.5Fig. 1 Fig. 2 Fig. 3 Fig. 3
Lead wire diameter d 0.6 0.6–0.8 0.8 0.8 ±0.05
Taping lead space P 25.4 25.4 38.1 38.1 ±1
Feedholeleadspace* P0 12.7 12.7 12.7 12.7 ±0.2**
Centering of the lead wire P1 7.7 5.2 7.8 5.3 ±0.7
Centering of the body P2 12.7 12.7 19.05 19.05 ±1.3
Leadspacing(pitch)*** F 10 15 22.5 27.5 +0.6/−0.1
Component alignment Δh 0 0 0 0 ±2
Height of componentfrom tape center H0**** 18.5 18.5 18.5 18.5 ±0.5
Carrier tape width W 18 18 18 18 +1/−0.5
Hold down tape width W0 9 10 10 10 Minimum
Hole position W1 9 9 9 9 ±0.5
Hold down tape position W2 3 3 3 3 Maximum
Feed hole diameter D0 4 4 4 4 ±0.2
Total tape thickness t 0.7 0.7 0.7 0.7 ±0.2
* 15 mm also available ** Maximum of 1 mm on 20 lead spaces*** Pitches 15 mm and 10 mm taped to 7.5 mm (crimped leads) available upon request**** H0 = 16.5 mm is available upon request
DisclaimerAllproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsibleforchecking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuchapplications,butarenotintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumesno obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (suchasinstallationofprotectivecircuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryor property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.