01_136614_Slugout_Monitoring • 201303 Metal Forming Application Note Progressive Die Slug Out Monitoring To avoid costly damage to the die, it is imperative that all slugs be verified as having been successfully ejected. Balluff offers a range of sensor solutions to ensure that slugs have correctly cleared the die and that scrap material has been deposited into the correct receptacle. Need: 1. Slug ejection verification 2. Effective scrap management 3. Final part configuration verification Balluff Slug Out Monitoring Solutions Balluff inductive proximity sensors, available in a wide variety of sizes and shapes from very small tubular (3mm) and up through larger “flatpacks”, can be integrated into the system for verifying slug-out. Here a tubular inductive sensor (1) senses full punch retraction, while a BGL self-contained thru-beam fork sensor (2) and an inductive flatpack sensor (3) verify slug ejection through plexiglass tubes. Balluff BWL self contained thru-beam sensors have built-in “fiber optic” technology combining an amplifier and a thru-beam red, infrared or laser emitter-receiver pair that can monitor “slug-out” applications if the mechanical layout of the die permits. BWL angle sensors shoot a beam from corner to corner. Angle sensors allow for greater placement flexibility where BGL fork sensors cannot be used. Here a BWL angle sensor verifies the final configuration of a part after slugs have been ejected. Please Order From: Clark & Osborne, LLP 317-255-5668 Phone 6617 Ferguson Avenue 317-253-4486 FAX Indianapolis, IN 46220 [email protected]
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01_136614_S
lugout_
Monitoring •
201303
Metal Forming Application Note
Progressive Die Slug Out MonitoringTo avoid costly damage to the die, it is imperative that all slugs be verifi ed
as having been successfully ejected. Balluff offers a range of sensor
solutions to ensure that slugs have correctly cleared the die and that scrap
material has been deposited into the correct receptacle.
Need:
1. Slug ejection verifi cation
2. Effective scrap management
3. Final part confi guration verifi cation
Balluff Slug Out Monitoring Solutions
Balluff inductive proximity sensors, available in a wide variety of
sizes and shapes from very small tubular (3mm) and up through larger
“fl atpacks”, can be integrated into the system for verifying slug-out. Here
a tubular inductive sensor (1) senses full punch retraction, while a BGL
self-contained thru-beam fork sensor (2) and an inductive fl atpack sensor
(3) verify slug ejection through plexiglass tubes.
Balluff BWL self contained thru-beam sensors have built-in “fi ber
optic” technology combining an amplifi er and a thru-beam red, infrared or
laser emitter-receiver pair that can monitor “slug-out” applications if the
mechanical layout of the die permits. BWL angle sensors shoot a beam
from corner to corner. Angle sensors allow for greater placement fl exibility
where BGL fork sensors cannot be used. Here a BWL angle sensor
verifi es the fi nal confi guration of a part after slugs have been ejected.
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
02_136615_B
end
_M
easure
ment
• 2
01303
Metal Forming Application Note
Bend Angle MeasurementAccurate measurement of component bend angles is critical, especially
in progressive stamping procedures. Each bend angle can affect the
accuracy and tolerances of the next metal forming step. Highly accurate,
durable, and repeatable sensors can monitor the quality of each process
step in the metal forming operations, verifying that certain profi les, angles,
or features have been properly made.
Need:
Verifi cation that angles on parts produced by the stamping die are within
specifi cation.
Balluff Bend Angle Solutions
Balluff BAW analog inductive proximity sensors are simple, yet
highly accurate analog inductive sensors. They are perfect low-cost
solutions for measuring bend angles, verifying formed features, or
checking for die or press parallelism. With voltage or current output
equating to the distance of a metal target to the sensing face, these
sensors are so accurate; they can even measure thermal growth. Over
13 models are available to meet most any metal forming measurement
requirement. Here a BAW has spotted an incorrectly formed angle on a
microchip bracket progressive die.
Balluff’s BOD 26K analog laser sensors are highly accurate, as
low as 20 micron resolution, Class II laser measurement devices. With
operating ranges between 45 and 85 mm, they are perfect for use
where high precision, tight tolerance and longer distance measurement
is required. Bend angles, weld seams, metal-formed feature detection
and validation, plus other quality inspection steps can be reliably
accomplished with the BOD 26K.
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
03_136616_S
trip
Feed
Monitoring •
201303
Metal Forming Application Note
Progressive Die Strip Feed MonitoringAll automated metal forming presses must have material entering the press
in a constant, specifi cally aligned manner to maximize active press time
and parts production. State of the art use of high performance sensors is
needed to monitor the strip in motion to reduce misfeeds and downtime,
extend die life, and prevent needless overworking of the press itself.
Need:
1. Sense metal stock presence and end of strip on roll/blank feed mechanism
for parts-out verifi cation. Unlike fi ber optic sensors that must be used with a
separate amplifi er, the emitter/receiver of the BGL device is contained in a solid, rigid
metal frame that never goes out of alignment. The “fork” design, which comes in 5
to 220 mm widths, straddles the area where fi nished parts are ejected and verifi ed.
BGL’s are available in infrared, visible red and laser light sources (down to .03mm
resolution).
Balluff’s low cost photoelectric family offers some of the most cost-effective,
versatile solutions for a host of metal forming parts-out operations. Available in
either metal or rugged plastic enclosures and straight or right angle confi gurations,
there is bound to be a model in the Balluff offering that meets your metal forming
needs. Diffuse-refl ective, retro refl ective, and thru-beam energized pairs in infrared,
visible red or laser emissions are available at very attractive prices.
Balluff’s BIL Sensor is a unique rectangular long-range inductive sensor (35mm
x 35mm x 100, 120, and 150 mm) that’s ideal for many metallic parts-out sensing
applications. Two models have adjustable sensing ranges from 5 to 45mm and
another model has a fi xed 50 mm range, making it ideal for both large and small
metal-formed components.
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
05_138736_W
eld
_S
eam
_1
• 2
01303
Metal Forming Application Note
Weld Seam Verifi cation with ColorWeld seams must be continuous and of suffi cient strength and quality to
meet the requirements of the application. Monitoring the presence and
attributes of weld seams should always be an integral part of the welding
process.
Need:
To monitor the presence and verify the quality of weld seams on
fi nished metal parts.
Balluff Weld Seam Sensing Solutions:
It is possible to verify weld seams on fi nished metal-formed parts through
several sensing technologies. For example, weld seams can be detected
with highly accurate, dependable, Balluff full color sensors.
Color sensors, keyed to the coloration of the metal where a weld has
taken place, can easily measure weld position and quality parameters. In
this example, a Balluff BFS 26K detects the weld seam on an indexed
exhaust pipe in preparation for a hole to be bored in a specifi c position
relative to the seam. Up to three colors (or shades of a color) can be
accurately programmed into this one unit. With three color channels,
pulse stretcher time delay, key lock and a synchronization input or
blanking feature that allows extensive application fl exibility. Using
two easy-to-use teach buttons on this compact sensor, welds can be
accurately and dependently recognized.
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
06_138737_W
irele
ssC
onnectivity •
201303
Metal Forming Application Note
Non-Contact Connectivity for Die StampingSensors monitoring a stamping application need to have power and
communication connectivity to the control platform. Cables from these
sensors are usually routed and concentrated at an electrical port junction
box, which in turn requires a mechanical connection to be made from
that connection point to a mating cable on the press. These cables are
often prone to failure during operation due to motion fatigue. Wires and
connectors are crushed, and/or damaged during storage, retrieval and
setup.
Need:
Mating cables and connectors can be stripped from the tool if not discon-
nected before unloading a die set from the press. To connect die-mounted
sensors to the overall control solution without unnecessary complexity and
premature failure of the connection solution.
Balluff Non-contact Coupler Systems: The Answer to Die Stamping Connectivity Problems
In this example, a Balluff Non-contact Coupler is providing connectivity to
sensors monitoring various aspects of a typical tool. Power and sensing
information is being passed through the air gap between the base and
remote head. The remote accepts up to eight inputs from any DC sensor
regardless of sensor brand. The inputs are routed to the press control,
industrial PC, or PLC.
Balluff non-contact couplers come in various shapes and sizes to match
the specifi c needs of the stamping application, and to provide maximum
placement fl exibility when the die is positioned for production. When the
stamping die is placed on the press, care must be taken to ensure proper
alignment. With this system installed, the base can be easily placed in
position relative to the remote when the die is slid into place on the press,
eliminating the risk of crushed wires and connectors. Many users install the base in a common area of the bolster. Using this
system all sensors on the die are automatically connected to the overall system without a hardwired connection that is prone
to damage.
With Parallel Wiring
▪ 8 inputs
▪ 24 VDC 0.5A power
▪ 12 conductor cable
With Industrial Network
▪ Up to 4 analog plus 8 inputs
▪ 16 inputs plus diagnostics
▪ 24 VDC 0.5A power
▪ EIP, DNT, PNT, PBS, CCL, ECT
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
07_138738_S
hutH
eig
htM
onitoring •
201303
Metal Forming Application Note
Stamping Press Shut Height MonitoringMany existing stamping presses do not have any form of shut height
measurement device to reference the ram position. Retrofi tting presses
with a shut height position feedback device provides a wealth of benefi ts –
including more precision-stamped pieces, longer die life, a more controlled
press operation, and shorter set up time.
Need:
To know exactly the amount of shut height needed with every set up so that
the die and press will be producing the highest quality parts with the least
amount of stress on the die and press.
Balluff Micropulse® Linear Position Transducers for Shut Height Measurement
This illustration shows a Balluff magnetostrictive transducer and digital
display installed on a press, measuring and reporting the exact position
of the ram. Magnetostrictive technology involves a magnet sliding along
a rigidly positioned vaveguide. This provides highly accurate positioning
information with resolution down to 5 micrometers. Available in a full
range of confi gurations, Balluff Micropulse® transducers are absolute
devices. If power is removed, they remember their position and no
rehoming is required.
If your press does not have this feature built into the basic machinery,
there is a risk of premature wear every time a new stamping job is set up.
Tape measures don’t cut it when hundreds of pounds of unnecessary
overpressure can be applied, even when a stroke is almost within its
optimum limits. To avoid the miscalculation that results in die deforming or press lock up, use a sensor to pinpoint your ram
position.
Linear Transducers - Provide Measurement Feedback and Electronic ReferenceThe body of a magnetostrictive transducer is mounted to the press frame. A mechanical arm that moves a magnet
(captive on a track or fl oating above the surface of a profi le-style transducer) along the distance of the transducer provides
continuous analog feedback (typically 0-10V or 4-20mA output) to provide precise distance feedback. The electronic
feedback is translated into inches or millimeters and a correct reference shut height dimension is displayed. Transducers are
manufactured in lengths to match all stamping stroke requirements, from a few inches to over 12 feet.
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
08_138739_W
eld
_S
eam
_2
• 2
01303
Metal Forming Application Note
Weld Seam Verifi cation with MeasurementWeld seams must be continuous and of suffi cient strength and quality to
meet the requirements of the application. Monitoring the presence and
attributes of weld seams should always be an integral part of the welding
process.
Need:
To monitor the presence and verify the quality of weld seams on fi nished
metal parts.
Balluff Weld Seam Sensing Solutions
It is possible to verify weld seams on fi nished metal-formed parts through
several sensing technologies. For example, even very fi ne weld seam
profi les can be accurately detected and measured using Balluff’s BOD
26K analog laser sensors.
Analog laser sensors can be used to monitor weld quality. In this
example, a Balluff BOD 26K analog laser photoelectric sensor discovers
a break in a weld seam. Often anomalies such as these exhibit minor
deviations only laser beam technology can detect. Balluff BOD 26K
analog laser sensors are perfect for identifying and measuring small
deviations because its small diameter and stable laser beam delivers tight
resolution (20 and 80 microns in two separate models). They can be placed strategically in the metal forming/automated
welding process to detect virtually any weld anomaly.
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
09_138740_P
ress P
ara
llelis
m •
201303
Metal Forming Application Note
Press ParallelismWhen a press is out of parallel, or if its dies are not parallel to each other,
uneven forces can cause bad parts to be produced, premature or even
catastrophic press damage, or premature die wear and/or irreparable
damage to the dies themselves. These are costly, time consuming,
preventable, and unnecessary conditions given today’s sensor technology.
Need:
To avoid damage by making sure that the die and the press are parallel at all
times
Balluff Sensor Solutions for Press and Die Parallelism
Several different sensor technologies can provide all the information needed to prevent damage to a stamping operation.
Low-cost solutions can help produce a higher quality part and are an easy to install preventative measure against costly press
or die damage – and the resulting down time. For example, by strategically placing a sensor on each of the four corners of
a die, it is possible to measure closure distance (the distance between the sensor and the die) and accurately determine if
the die or the press itself is out of the parallel. Sensors can also discover if a scrap of metal or slug is raising the feed stock,
which is also a dangerous condition.
In this example, four highly precise Balluff analog proximity sensors are mounted
on the four corners of a die, detecting a small fl ange which has been installed on
the corresponding corner of the upper part of the die. The sensors will only read
the distance at the last 10 mm of die travel, but those readings are suffi cient
to prevent any damage to the press or die. The information from the four
sensors goes directly to the press controller to be automatically compared with
each other. Any discrepancy will cause the controller to stop the press, thus
protecting the entire application.
In this example, four Balluff Micropulse® non-contact absolute position
feedback linear transducers are positioned at the corners of a die. They derive
their positioning information from the magnets affi xed to the upper part of the
die. These transducers are longer and therefore track the press on a longer
portion of its stroke. However, they are also highly accurate and act in the same
manner as the analog proximity sensors in the fi rst example. Information is sent
back to the press controller and automatically compared, providing press and
die protection from non-parallel set up.
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
10_138741_D
ie T
rackin
g •
201303
Metal Forming Application Note
Die TrackingRFID has become a critical component in the stamping process to help
prevent die crashes, which cause thousands of dollars in damage and lost
production time. In addition to identifying the correct die for the correct
operation, the technology is also used to track the item as it is moved from
place to place so it can be readily located. Specifi c data is stored directly on
the tag which is fi xed on the die and includes information such as identifying
information, shut height settings, usage history, maintenance history, etc.
An RFID solution offers the ultimate visibility into the stamping process.
Need:
1. Reliably track, measure, and characterize die use
2. Simplify the stamping process
3. Eliminate hazards and opportunities for failure
Balluff RFID Traceability Solutions for the Stamping Process
The Balluff RFID solution is providing a hardware system that fi ts into the current
operating environment. The widest array of connectivity options, read ranges as
close as 1 millimeter and as far away as 6 meters, and the technical know-how
to assist with the most unique applications.
For large footprint stamping applications the BIS U, UHF System, is capable of
reading tags over a distance of several meters. The tag is fi xed directly on the
die and is read initially to identify the correct die for the application. When correct
identifi cation is confi rmed the die is loaded into the press. From there, data such
as corresponding shut height settings can be read from the tag and confi rmed
before the process starts. Ultimately, the traceability process prevents costly
crashes resulting in thousands of dollars in damage and long down-times.
In a similar process, the BIS M high frequency system is utilized when the distance between the tag and the reader is relatively
close. Capable of reading tags out to 17 inches, the BIS M system is also capable of running off the same function block as
the sensors and other devices that may be required in the stamping process via IO-Link connection. This allows for expanded
network architecture, which limits the number of runs to the controls cabinet and makes managing the devices a smarter and
more effi cient process.
Balluff has solved some of the most complex problems in manufacturing by listening to customer feedback and responding
with innovative products specifi c to the application. 30 years of RFID product development and manufacturing has solidifi ed
Balluff’s role as leader in the global industrial RFID market.
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
11_138742_W
eld
Seam
Dete
ction •
201303
Metal Forming Application Note
Weld Seam Detection
Detecting weld seams for their elimination is as important as for their
quality. A seam entering a process when it’s not supposed to can create a
dangerous condition affecting the life of an application.
Need:
To monitor the presence and verify the quality of weld seams on
fi nished metal parts.
Balluff Weld Seam Sensing Solutions
It is possible to verify weld seams on fi nished metal-formed parts through
several sensing technologies. For example, the telltale mass of a weld seam
can be identifi ed, verifi ed, and measured with Balluff BAW inductive analog
sensing technologies.
Balluff BAW analog inductive feedback sensors can precisely sense the
differing mass of a weld seam. When placed over a target, the amount
of metal under the sensor’s active face triggers a voltage change, tied
to the amount of mass in the weld seam. A set of output parameters
for a customer’s particular material pattern can be programmed into the
manufacturing process. Any value too high or too low indicates a deviation
from specifi cation or a material anomaly.
In this example, a Balluff BAW sensor monitors sheet steel in a continuous process. Its three set point capability allows it to
monitor the sheet thickness even while the sheet is fl exing and also detect a tack weld joining two sheets. The difference
in top surface height triggers the system to shear the area where the tack weld exists to prevent the weld from entering the
manufacturing process.
Please Order From:Clark & Osborne, LLP 317-255-5668 Phone6617 Ferguson Avenue 317-253-4486 FAXIndianapolis, IN 46220 [email protected]
12_144161_P
art
s P
resence •
201303
Metal Forming Application Note
Parts Presence Verifi cation in Automatic and Semiautomatic Welding EnvironmentsEven skilled and experienced operators can sometimes overlook a missing
part. Using sensors to verify parts presence can add signifi cant productivity
and cost improvements in both automatic and semiautomatic operations.
This is a key function in error proofi ng.
Need:
Verify that parts are nested and clamped correctly in automatic and
semiautomatic welding operations.
Balluff Parts Presence Verifi cation Soultions
In both automatic and semiautomatic weld processes, Balluff