s silica thin films: k ~ 2 required for <0.10 m integra Yang, et al., Adv. Mat. 10, 1385 (1998) • Current dense fluorinated silica or polymer films are n • Porosity is required, with mechanical and thermal stab Transmission electron micrographs 1.5 2 2.5 3 3.5 4 Perpendicular Parallel x4 Arbitrary Intensity 95 Å (200) (300) X-ray diffraction
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Mesoporous silica thin films: k ~ 2 required for <0.10 m integrated circuits
P. Yang, et al., Adv. Mat. 10, 1385 (1998)
• Current dense fluorinated silica or polymer films are not suitable
• Porosity is required, with mechanical and thermal stability