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s silica thin films: k ~ 2 required for <0.10 m integra Yang, et al., Adv. Mat. 10, 1385 (1998) • Current dense fluorinated silica or polymer films are n • Porosity is required, with mechanical and thermal stab Transmission electron micrographs 1.5 2 2.5 3 3.5 4 Perpendicular Parallel x4 Arbitrary Intensity 95 Å (200) (300) X-ray diffraction
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Page 1: Mesoporous silica thin films: k ~ 2 required for

Mesoporous silica thin films: k ~ 2 required for <0.10 m integrated circuits

P. Yang, et al., Adv. Mat. 10, 1385 (1998)

• Current dense fluorinated silica or polymer films are not suitable

• Porosity is required, with mechanical and thermal stability

Transmission electron micrographs

1.5 2 2.5 3 3.5 4

PerpendicularParallel x4

Arb

itrar

y In

tens

ity

95 Å

(200) (300)

X-ray diffraction

Page 2: Mesoporous silica thin films: k ~ 2 required for
Page 3: Mesoporous silica thin films: k ~ 2 required for

Bio-Optic Synthetic SystemsDr.Leonard Buckley, DARPA/DSO

Page 4: Mesoporous silica thin films: k ~ 2 required for
Page 5: Mesoporous silica thin films: k ~ 2 required for

N.A. Melosh et al., Adv. Mater., submitted.

a b c

Tetraphenylporphyrin/silica/EO106-PO70-EO106

Optical Limiting Materials for Vision/Pilot Protection

Improved damage resistance compared to polymer hosts

a b c

1 mm

0 wt% F127 35 wt% F127 55 wt% F127

Increased dye solubility compared to inorganic glass hosts

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0 100 200 300 400 500

0 wt%29 wt%35 wt%45 wt%55 wt%

Tra

nsm

itta

nce

Incident Intensity (mJ/cm2)

Reduced light transmission at higher laser intensities

with Dr. Thomas Cooper, Wright-Patterson AFB