Hosted by Karen Lightman, Managing Director MEMS Industry Group August 21, 2012 MEMS Industry Group Presents MEMS Packaging: Transforming the Challenges into Solutions Presented by: Chuck Richardson, Director of Roadmapping, iNEMI & Bill Bottoms, 3MTS and iNEMI/ITRS & Packaging TWG Chair
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Hosted by Karen Lightman, Managing Director MEMS Industry Group
August 21, 2012
MEMS Industry Group Presents
MEMS Packaging: Transforming the Challenges into Solutions
Presented by: Chuck Richardson, Director of Roadmapping, iNEMI & Bill Bottoms, 3MTS and iNEMI/ITRS & Packaging TWG Chair
At the formative Meeting “NSF 2000 Workshop on Manufacturing of MEMS” in November of 2000 the initial ideas were:
”MEMS will likely follow IC and discrete electronic packaging forms and types…. Semiconductor manufacturers will likely use existing packages and adapt MEMS manufacturing to these well-established commercial form factors “- -Giasolli presentation November 2000.
Differences between MEMS and IC packaging requirements were quickly recognized
At the NSF 2000 Workshop on Manufacturing of MEMS conclusions were: ” Though the electronics manufacturing industry has a robust and viable infrastructure, direct application of electronics packaging techniques to most MEMS parts is not feasible because of the complexities of their operational structure and domain. For example, packaging should allow some moving parts to interact with other components through optical, electrical, thermal, mechanical and chemical interfaces. As a result, many MEMS packaging problems are new to most of electronic packaging engineers.”
Differences between MEMS and IC packaging Requirements were quickly recognized
Examples cited at the meeting included:
• Vacuum packaging needed when viscous damping is important
• Die-attachment might affect the pressure measured through thermal stresses
• Thermal strains might affect the performance of piezoresistive or membrane devices.
• Moisture could cause stiction problems. • There are no effective thermal paths for thin micro-
mirrors for heat transfer. • There are no accelerated tests since most of failure
mechanisms for the moving parts are unknown.
The cost of MEMS dropped dramatically with volume and cost came down the
learning curve.
Packaging cost did not scale and today it is typically between 50 and 90% of MEMS
component cost. “Packaging also has been identified as one of the major technical barriers that might hamper the growth of MEMS. It strongly affects a MEMS device's performance and reliability through mechanical, thermal, electrical, or chemical interactions. The full range of MEMS reliability techniques also need to be developed…”
The Challenges identified at the Workshop in 2000 remain
A Typical MEMS package and its function from the November 2000 Workshop
The Challenges identified at the Workshop in 2000 remain
It is a multidisciplinary challenge
Goals and Objectives
A workshop aimed initially at identifying the difficult challenges for MEMS Packaging
is our initial goal.
A follow on activity to identify potential solutions is our objective.
What are the difficult challenges
Our initial focus will be on a limited number of devices that represent the technical requirements for MEMS and are produced in volume today.
The reduction in size increases density but results in significant challenges:
– Reduced isolation
– Reduced tolerance to electrostatic discharge
– Reliability
– Operation with voltage differences across the relay
– Stiction and thermal “welding”
– Cost (hermitic package required)
– Flexing in the substrate causing distortion
– EMI shielding
Difficult Challenges for MEMS relay Packaging
What other issues pose difficult challenges for MEMS relays?
Difficult Challenges for MEMS Pressure Sensor Packaging
The reduction in size increases density but often increases environmental sensitivity :
– Package induces stress with temperature variation
– High temperature operation (automotive)
– Reliability at high temperature and pressure
– Testing and calibration of the packaged device (particularly for harsh environments)
– Special needs for acoustic signaling (MEMS microphone)
– EMI shielding
– Bio compatibility
– Open to the environment
High volume Applications for MEMS Pressure Sensor Packaging
Difficult Challenges for MEMS pressure sensor Packaging
What other issues pose difficult challenges for MEMS pressure sensors?
Difficult Challenges for MEMS accelerometer Packaging
The reduction in size should result in a reduction in cost.
Difficult Challenges for MEMS accelerometer Packaging
The reduction in size increases density but results in significant challenges:
• Testing
• Cost
• Stress in the sensor
• Temperature sensitivity
• Size (consumer apps)
Cost is a major factor for automotive and consumer markets
Difficult Challenges for MEMS accelerometer Packaging
What other issues pose difficult challenges for MEMS accelerometers?
Difficult Challenges for MEMS Microfluidic Packaging
Microfluidics are complex
• Flow rate Sensor
• Fluid in/out
• Electrical interface
• Flow control valves
Difficult Challenges for MEMS Microfluidic Packaging
Microfluidics challenges are also complex • Compatibility with wide range of fluids • Particulate contamination in fluid • Testing • Open to the environment • Potentially wide range of temperature and pressure • By-pass for high flow rate applications • Reliability in use case • Operation in high vibration environments • Bio compatibility
Difficult Challenges for MEMS Microfluidic Packaging
What other issues pose difficult challenges for MEMS microfluidics?
Summary The modern smart phone can be considered to be a complex SiP. Today it contains all of the elements discussed with the one exception of microfluidics. The consumer and automotive markets dominate MEMS demand today. These markets share some challenges:
– High levels of vibration and shock – Low cost demands
Some challenges are unique: – Bio compatibility – Extremes of temperature
New materials, new architectures and new processes will be required to continue progress against these challenges as we integrate more MEMS components into SiP electronics.
Summary
Meeting these difficult challenges will result in accelerated growth of the MEMS
markets as new applications become technically and economically viable .
Your input on the difficult challenges will help focus the collective efforts of industry and