MEMS II: March 5, 2012 - colorado.edu II: March 5, 2012 ... 8 – 30 GHz S 21 (dB) ... Active Alignment and Laser Welding Laser Welding Machine Active alignment Searching pattern Fiber

MEMS II: March 5, 2012

• Literature Review #6• Literature Review #5

Aptamers on a Microchip• MEMS Packaging

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REMOTE CONTROL OF A CYBORG MOTH USING CARBON NANOTUBE-ENHANCED FLEXIBLE NEUROPROSTHETIC PROBE

• W.M. Tsang1, A. Stone2, Z. Aldworth3, D. Otten1, A.I. Akinwande1, T. Daniel3, J.G.

• Hildebrand2, R.B. Levine2, J. Voldman1• 1Massachusetts Institute of Technology,

Cambridge, MA, USA• 2University of Arizona, Tucson, AZ, USA• 3University of Washington, Seattle, WA,

USA2Literature review #6

ISOLATION OF THERMALLY SENSITIVE APTAMERS ON A MICROCHIP

• J. P. Hilton1, Jinho Kim1, ThaiHuuNguyen1, Mihaela Barbu2,

• Renjun Pei2, Milan Stojanovic2, and QiaoLin1

• 1Department of Mechanical Engineering,• 2Department of Medicine, Columbia

University, New York, USA

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Packaging and Microelectromechanical Systems (MEMS)

Y. C. LeeDepartment of Mechanical Engineering

University of Colorado, Boulder, Colorado 80309-0427, USA

[email protected]

Packaging of MEMS• Wafer level packaging• Integration using flip-chip assembly Packaging for MEMS• Flexible circuits for MEMSMEMS for Packaging • Active alignment for optoelectronic packagingFuture• Integrated MEMS Device and Package• Integrated MEMS/NEMS

Contents

Microelectromechanical Systems (MEMS)

Solid modelingElectro-thermal-mechanical coupling

Thick layersMechanical properties

Sacrificial materials removed during release

Testing Dicing

Assembly, sealing, testing and reliability




Testing Dicing





Testing Dicing


?

BondingCap

State-of-the-Art Wafer-Level Capping

State-of-the-ArtIntel Microshell Package for RF MEMS

John Heck, et al., ASME InterPACK’07

MEMS Device/Package Fabricated on Wafer

Device + Package

MEMS + CMOS

Kurt Petersen, SiTime, Jan. 2007.Tom Kenny’s group, InterPACK’01- InterPACK’07

Wafer Level MEMS Packaging

Literature review assigned.

Polymer MEMS Package

Atomic Layer Deposition (ALD) for Hermetic Sealing of Wafer Level Polymer Package

0.0001

0.001

0.01

0.1

1

10

0 5 10 15 20 25 30Alumina ALD Thickness (nm)

Per

mea

tion

Rat

eW

VTR

(g/m

2/da

y) H

TO te

st Polymer Film

ALD-on-Polymer Film

Polymer

Solder Bumps

ALD-alumina

0.00001 possible

Thermal and Vibration Isolation

BioMEMS

Packaging of MEMS• Wafer level packaging• Integration using flip-chip assemblyPackaging for MEMS• Flexible circuits for MEMSMEMS for Packaging • Active alignment for optoelectronic packagingFuture• Integrated MEMS Device and Package• Integrated MEMS/NEMS

Contents

MEMS Integrated with Other Components

MEMS Variable Capacitors

Tethers and Posts for Flip-Chip Assembly

Gap?

MEMS Designed for Flip-Chip Assembly

Post-Enabled Gap Control

Tethers

Mechanical Stops

Locking Bumps

Tethers

Mechanical Stops

(a) Layout of a successful tether design.

(b) Cross-sectional view of the tether design in (a-a).

(c) SEM photograph of successful tethers.

a a

Flip-Chip Assembly

Flip-Chip Bonding:

• Flip-chip bond micromirror chip to substrate

• Etch sacrificial oxide to free the silicon chip

Ceramic Substrate Flip-Chip Bonding Results


Contents

On-chip Variable Capacitor Berkeley Group Raytheon Switch

On-Chip MUMPSVariable CapacitorColumbia Univ.

Area Tuned Variable Capacitors

Plate Motion

CU Variable Capacitor (thermal actuation)

CU Variable CapacitorElectrostatic (1-D)

Si- or GaAs-Based RF MEMS

Manufacturable Flexible Circuits-Based MEMS

Ten Switches Laminated on

a Duroid Substrate

S 21

(dB

)

Capacitive Switch: 8 – 30 GHz

S 21

(dB

)

CPW Design:

W=1.6 mm, and G=100 μm

Switch electrode Design:

l = 2.0 mm, and w = 1.0 mmDown Position: Isolation

l

w

W GG

Frequency (GHz)

MeasuredEM simulation

Measured

EM simulationFitted Model*

Up position: Insertion loss

Performance SummaryInsertion loss < 0.3-0.4 dB

Isolation > 15 dB @ 12 GHz, 36 dB @ 30 GHz


Contents

Active Alignment and Laser Welding

Laser Welding MachineActive alignment

FiberSearching pattern

Laser Beam

Newport Corporation, 2001. http://www.newport.com

Hammering

Paradigm Shift in Automation?

Large expensive machinesfor sub-um precision alignments? Hundreds of micro-machines

for sub-um precision alignments!

MEMS-Enabled Laser-to-Fiber Coupling

Tethered Bimorph for Active Alignment and Position Fixing

Tethers

Bimorph

Tip Deflection 6030150 45 µm

Mirror with Tethered Bimorph


Roll


Pitch

ExperimentReflected Beam Angles

-5.0

0.0

5.0

10.0

15.0

20.0

25.0

30.0

-5.0 0.0 5.0 10.0

Roll (deg)

Pit

ch (

deg) Device 1

Device 2Device 3

Target

Experiment

Experimental Results – Step 1Target

Reflected Beam Angles

-5.0

0.0

5.0

10.0

15.0

20.0

25.0

30.0

-5.0 0.0 5.0 10.0

Roll (deg)

Pit

ch (

deg) Device 1

Device 2Device 3



-5.0

0.0

5.0

10.0

15.0

20.0

25.0

30.0

-5.0 0.0 5.0 10.0

Roll (deg)

Pit

ch (

deg) Device 1

Device 2Device 3



-5.0

0.0

5.0

10.0

15.0

20.0

25.0

30.0

-5.0 0.0 5.0 10.0

Roll (deg)

Pit

ch (

deg) Device 1

Device 2Device 3

Movements with Large-Degree of Freedom

for Optimum Alignment

0

2

4

6

8

10

12

-5 -4 -3 -2 -1 0 1 2 3Ro l l ( d eg )

Pi

tc

h

(d

eg

)


Contents

Cooler Assembly

51

Stable Cryogenic Cooling Demonstrated

Compressor Overheat

Pressure ratio =16.7 : 0.87 (atm)

Pressure ratio slowly increased

Feasible but unstable operation with low pressure level changed20 min

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SummaryGreat Challenges/Opportunities

for Packaging Engineers

MEMS II: March 5, 2012 - colorado.edu II: March 5, 2012 ... 8 – 30 GHz S 21 (dB) ... Active Alignment and Laser Welding Laser Welding Machine Active alignment Searching pattern Fiber

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