MEMs Fabrication Alek Mintz 22 April 2015 Abstract Microelectromechanical Systems (MEMS) are devices that integrate mechanical systems with electronic circuits. Fabrication of MEMS involves the use of specialized micromachining technologies. Device packaging aims to protect from outside damage and varies drastically depending upon application. Different materials used, fabrication techniques, and packaging types will be examined. Key Words: Surface Micromachining, Bulk Micromachining, LIGA Lithography, Isotropic Etching, Anisotropic Etching, XeF2 Etching, MEMS Packaging
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MEMs Fabrication Alek Mintz 22 April 2015 Abstract Microelectromechanical Systems (MEMS) are devices that integrate mechanical systems with electronic.
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MEMs FabricationAlek Mintz
22 April 2015
AbstractMicroelectromechanical Systems (MEMS) are devices
that integrate mechanical systems with electronic circuits. Fabrication of MEMS involves the use of specialized micromachining technologies. Device packaging aims to protect from outside damage and varies drastically depending upon application. Different materials used, fabrication techniques, and packaging types will be examined.
• Devices are made using Bulk or Surface micromachining or a combination
• Isotropic and Anisotropic etching
• Popular etching and microstructure fabrication technologies
• Wafer Bonding
• Packaging types and considerations
References
• "Fabricating MEMS and Nanotechnology." MEMS and Nanotechnology Exchange. Web. 18 Apr. 2015. <https://www.mems-exchange.org/MEMS/fabrication.html>.
• Gerke, R. "MEMS Packaging." University of Pennsylvania. Web. 18 Apr. 2015. <http://www.seas.upenn.edu/~meam550/PackagingJPL.pdf>.
• "Introduction to Microelectromechanical Systems (MEMS)." Brigham Young University. Web. 18 Apr. 2015. <https://compliantmechanisms.byu.edu/content/introduction-microelectromechanical-systems-mems>.
Key Concepts
• Advantages and Disadvantages of Bulk and Surface Micromachining