Mems and sensors packaging technology and trends presentation held by Amandine Pizzagalli on Semicon West 2016 by Yole Développement

MEMS & Sensors packaging: Wafer-Level-Packaging

Technology and market trends

Amandine Pizzagalli, Technology & Market Analyst – Equipment & Materials

Fields of expertise:Yole Développement’s 30 analysts operate in the following areas

MEMS &

Sensors

Displays

Compound

Semi – LED

& OLEDs

Imaging Photonics

MedTech

Manufacturing

Advanced Packaging

Batteries / Energy

Management

Power

Electronics

A group of companies

Market,

technology and

strategy

consulting

www.yole.fr

M&A operations

Due diligences

www.yolefinance.com

Innovation and business maker

www.bmorpho.com

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

IP analysis

Patent assessment

www.knowmade.fr

Outline of the presentation

• Market trends & MEMS sensors

• Focus on Packaging technologies for MEMS

devices

• Conclusion

The 5 senses and many more: MEMS, sensors

The 5 senses and many more: Mems, sensors & actuators

MEMS & sensors RoadmapFrom More than Moore towards Beyond Law

Overview of the MEMS sensors & actuators

ACTUATORSSENSORS

Pressure Sound

(microphone)

Environment Optical sensors

Dru

g d

elivery

Microfluidics

Ink j

et

head

s

Au

to-F

ocu

s

Mic

ro m

irro

rs

RFOptical MEMS Micro structures

Parti

cle

s

Hu

mid

ity

Movement

Gas

Magn

eto

mete

rs

IMUs (6 to 9 DOF)

Accele

rom

ete

rs

Gyro

sco

pes

Tem

pera

ture

Op

tical b

en

ch

es

Mic

ro t

ips

Pro

bes

Watc

hes

co

mp

on

en

ts

PIR

& t

herm

op

iles

Mic

ro b

olo

mete

rs

Sw

itch

Filte

r

Bosch BME680

FLIR Lepton One

Infineon

microphoneSTM pressure

sensor

Invensense

MPU9250

Debiotech micro

pump

Texas Instruments

DLP

Avago FBAR Filter

Spiromax Patek

Philippe

Audio

Pixels

MEMS

based

speaker

Reso

nato

r

Bio

ch

ips

poLight AF

SiTime oscillator

Am

bie

nt

ligh

t se

nso

r

Fin

gerp

rin

t

Vis

ion

Optical combos“open” package

environmental

combos

“closed” package

6 to 11 DOF

combos

Possible integration with

environment combos

Possible

integration with

opto combos

MEMS & sensors transitioning towards 3 main Hubs…

Closed Package Hub

Accelerometer

Gyroscope

Magnetometer

INERTIAL

DOF6

9IMU

ENVIRONMENTAL

Open Cavity Hub

Gas/Particle

Pressure

Temp/Humidity

Microphone

OPTICAL

Optical Hub

Visible

3D vision

Multi spectral

3D

Proximity/ambient

MEMS & sensors: The inertial hub

Closed Package Hub

Accelerometer

Gyroscope

Magnetometer

DOF6

9IMU

ENVIRONMENTAL

Open Cavity Hub

Gas / Particle

Pressure

Temp/Humidity

Microphone

OPTICAL

Optical Hub

Visible

3D vision

Multi spectral

3D

Proximity/ambient

Complete integration has been

achieved at sensor level

Strong miniaturization race

Still some developments on

power consumption, advanced

packaging

Major developments at Software

level to achieve sensor fusion

Accurate data acquisition

Precise tracking within the

environment

Inertial

Bill Of Materials

$1

MEMS & sensors: The optical hub

Closed Package Hub

Accelerometer

Gyroscope

Magnetometer

INERTIAL

DOF6

9IMU

ENVIRONMENTAL

Open Cavity Hub

Gas / Particle

Pressure

Temp/Humidity

Microphone

Optical Hub

Visible

3D vision

Multi spectral

3D

Proximity/ambient

An ever growing market

Imaging is highly valued

The imaging industry stopped

the low cost/high integration

model by increasing the pixel

size and thus the die size

Imaging

Bill Of Materials

$10

MEMS & sensors: The environmental hub

Closed Package Hub

Accelerometer

Gyroscope

Magnetometer

INERTIAL

DOF6

9IMU

Open Cavity Hub

Gas / Particle

Pressure

Temp/Humidity

Microphone

OPTICAL

Optical Hub

Visible

3D vision

Multi spectral

3D

Proximity/ambientInteresting way for the

MEMS industry to gain value:

More integration at

environmental level

Pressure + Microphone

Add Particles & Gas

detection (market pull)

Environmental

Bill Of Materials

$1.50

Environmental

Bill Of Materials

$0.70

MEMS market by application

• Consumer is still the main driver

$ 0,00

$2 000,00

$4 000,00

$6 000,00

$8 000,00

$10 000,00

$12 000,00

$14 000,00

$16 000,00

$18 000,00

$20 000,00

2015 2016 2017 2018 2019 2020 2021 CAGR 2016-21

$M

MEMS $M forecast per application

©2016 Yole Développement

Telecom

Medical

Industrial

Defense

Consumer

Automotive

Aeronautics

48%

5.7$B

56%

11.1$B

MEMS average selling priceIs the market able to absorb such a price decrease?

$0,0

$0,5

$1,0

$1,5

$2,0

$2,5

$3,0

$3,5

$4,0

2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020

2000 – 2020 MEMS ASP decreaseSource Yole Développement

Smartphone wave

CAGR

-6%

CAGR

-13%

New MEMS challenges

• Yesterday, the main MEMS challenges were size decrease, which in turn led to price decrease then volume growth.

• Today, trends are different. They are: importance of user case (start with the definition of an application), fusion different

sensors with software and power decrease (which paradoxically is linked to an chip size increase because of the ASIC)

Yesterday

ASP decreaseConsumer

volume

Size decrease

2016, a new virtuous cycle?

Power

consumption

decrease

Importance

for user case

Sensor fusion,

software & more

features

Mobiles have to survive for long

periods on battery power while

interacting with environment (voice

calls, Wi-Fi, Bluetooth, GPS, sensors

…).

Start with applications, and work

downwards to the chips needed to

support them.

Less silicon, more brain.

Start with more intelligence!

Smarter or smaller? Two different paths in integration

• While some companies focus on developing smaller & smaller packaged dies, others prefer to go into another direction integrating

more functions in the package.

• Winners are those that can merge both approaches: more functions in a reduced package!

SMALLER (one sensor in a reduced package)

SM

AR

TE

R (

more

fu

nct

ion

s in

a p

ack

age)

SWEET SPOT!

Examples of MEMS companies with a « sensors

integration » road (e.g., mCube with iGyro, Spectral

Engines with integrated spectrometer, Bosch with

environmental combo sensors, AMS with optical combos,

InvenSense with IMUs ….

MEMS Evolution

MEMS die

Ceramic package

Wire Bonding

MEMS accelerometer ceramic package

(Courtesy of MEMSIC)

ASIC

Cap

MEMS Sensor

MEMS accelerometer plastic package with Wafer-level

capping (Courtesy of BOSCH)

MEMS accelerometer in 3D WLCSP

package with TGV (Courtesy of VTI / Murata)

PAST

TODAY

• Wafer Level capping combined with

Vertical interconnection

• Wafer to wafer bonding

• WLCSP

MEMS die is put in a ceramic

or metal package

Wafer –Level Packaging

Reduced form factor

Cost reduction

Improved performance

WLP for microbolometers

L3com WLP

17.9 mm

34 mm

ULIS ceramic

packaging

(640x480)

20 mm

Before

Conventional microbolometers

• Ceramic or metal package

• The air is pumped out before the package is sealed with a

silicon or germanium window

• Slow

• Costly metal packaging

WLP microbolometers

• more chips can be packaged on the wafer cost reduced

• Vacuum sealing with a silicon widow in parallel at the wafer

level improve throughput and yield

• Sensor size reduced

• Cost reduced

• Vacuum or temperature resistance improved

WLP technologies

3-Axis Accelerometer Package size comparison – TSV

Inside!

Surface: SST= 4mm²

Package thickness:

TST= 1mm

Surface: SmCube= 4mm²

Package thickness:

TmCube= 0.9mm

Surface: SBosch= 1.8mm²

Package thickness:

TBosch= 0.8mm

2013 20142012 2015 2016 2017

Surface: SmCube= 4mm²

Package thickness:

TmCube= 0.9mm

Surface: SmCube= 2,56mm²

Package thickness:

TmCube= 0.94mm

Surface: SmCube= 1,21mm²

Package thickness:

TmCube= 0.74mm

LGA package LGA package LGA packageWLCSP WLCSPLGA package

o Driven by IoT WLP will be one of the next key trend for MEMS and Sensors devices!

Source: mCube

70% reduction in package size enabled by 3D TSV and WLP

Other MEMS & sensors using TSV & WLP !

ALS

(Ambiant Light Sensor)IMU

6-Axis Accelerometer

2015Oscillator

And much more

to come!

TSV etch with DRIE (Silex

Microsystems process)

Polysilicon substrate

o TSV diameter 6µm

o TSV Depth 100µm

LGA package type

TSV etch with DRIE

TSV filled with doped polysilicon

o TSV depth 150µm

o TSV diamter 6µm

TSV - VIA LAST

approach is being

used.

o TSV diameter

80µm

o TSV depth

200µm

o Tungsten lining is

deposited with

PVD.

TSV - VIA Middle approach is

being used.

o TSV diameter 10µm

o TSV depth 85µm

o Similare AR as Silicon

interposer (2,5D)

o Cu bottom-up filling is used like

in TSV memory manufacturing

2015 20152010Finger Print Sensor

Conclusions

Conclusions and future perspectives

• MEMS & sensors are facing a strong demand driven by the consumer and

cost pressure

• Wafer Level Packaging significantly reduces the sensor size and has an

impact on the cost and performance

• New MEMS architectures are more and more required to achieve higher

features and functionalities in smaller footprint

• Therefore, WLP and TSV are the key packaging technologies enabling to

achieve innovative functions, higher performances as well as cost effective

integration

Thank you for your attention!

Contact: [email protected]