MC2006 - Digchipdatasheet.digchip.com/274/274-00022-0-MC2006.pdf · Product Data Sheet_01 April 2002 Product Data Sheet MC2006 ... The MC2006 is available in die packaged form ...

Product Data Sheet_01 April 2002

Product Data Sheet

MC2006CMOS Pre-amplifier with AGC for Long-reach 155 Mbps Fiber-optics Based ReceiverData Sheet

FeaturesDescriptionApplications Pin DescriptionsMeasurement TablesFunctional Description

FeaturesDescriptionApplications Pin DescriptionsMeasurement TablesFunctional Description

Information provided in this Product Data Sheet is subject to change without notice. Mindspeed™ Technologies, Inc, Proprietary and Confidential

Product Data Sheet _01 Page 2 of 12

MC2006

CMOS Pre-amplifier with AGC for Long-reach 155 Mbps Fiber-optics Based Receiver

Product Data Sheet

Information provided in this Product Data Sheet is subject to change without notice. Mindspeed™ Technologies, Proprietary and Confidential

TABLE OF CONTENTS

Features ...........................................................................................................................................................3Applications ......................................................................................................................................................3Connections (diagram) .....................................................................................................................................3Description ........................................................................................................................................................3Table 1 Ordering Information ............................................................................................................................3Top Level Diagram ...........................................................................................................................................3Table 2 Pin Description ....................................................................................................................................4Table 3 Absolute Maximum Ratings .................................................................................................................4Table 4 DC Characteristics ...............................................................................................................................4Table 5 AC Characteristics ...............................................................................................................................5Typical Performance Curves ............................................................................................................................6Functional Block Diagram .................................................................................................................................7Functional Description ......................................................................................................................................7TZA ...................................................................................................................................................................7AGC ..................................................................................................................................................................7Output Stage .....................................................................................................................................................7Typical Applications Circuit ...............................................................................................................................8Applications Information ...................................................................................................................................8Typical TO-can Assembly .................................................................................................................................8Bare Die Information (diagram) .........................................................................................................................9Table 6 Pad Co-ordinates .................................................................................................................................9Package Information (diagram) .........................................................................................................................10Disclaimer .........................................................................................................................................................11World Wide Sales Offices..................................................................................................................................12


MC2006


Product Data Sheet


FEATURESLow-cost IC, fabricated in advanced sub-micron pure-CMOS processReceiver sensitivity typically -40 dBm at 155 Mbps, when integrated into a module with suitable photodiode and post-amplifier115 MHz bandwidth allows wide range of operation; suitable for e.g. 51 Mbps/DS-3, 100, 125 and 155 MbpsTypical differential gain of 200 kΩ at low signal levelsAGC gives continuous operation to >0 dBm65 mW power consumption at +5 V supply> 35 dB Power-supply noise rejectionAvailable as dieAlso available in SOIC8 package for evaluation purposes only

APPLICATIONSSDH/SONET/ATM

Fast Ethernet

CONNECTIONS

DESCRIPTIONThe MC2006 is a low-noise, transimpedance amplifierwith AGC, manufactured in an advanced, yet low-cost,sub-micron CMOS process. Its wide dynamic range,differential output and high PIN bias make it well suited fortelecommunications, especially OC-3/STM-1. However,the MC2006 is intended to meet the needs of bothTelecom and Datacom users.The MC2006 is available in die packaged form. Foroptimum system performance die should be mounted inclose proximity with the photodetector. The MC2006 isalso available in SOIC8 package in sample quantities toease customer evaluation.The MC2006 is designed to be used with the MicrocosmMC2045 postamplifier IC. When combined with aphotodiode, the chip set forms a high performance, lowcost 5 V receiver.

TABLE 1 ORDERING INFORMATION

TOP LEVEL DIAGRAM

1

2

3

4

8

7

6

5

MC2006Date Code

DOUTVCC

VCC

PIN K

PIN A

DOUT

Gnd

Gnd

SO8 Package

Sam

ples O

nly

Fig. 1

Part Pin-packageMC2006DIE Waffle packMC2006DIE Expanded whole wafer on a ringMC2006S8 SOIC8 (Evaluation samples only)

MC2045-P6-EVM Evaluation board with an MC2045-2Y and an MC2006S8

VCC DOUT GND

PINK

PINA

GNDVCC DOUT

Fig. 2


MC2006


Product Data Sheet


TABLE 2 PIN DESCRIPTION

TABLE 3 ABSOLUTE MAXIMUM RATINGS

These are the absolute maximum ratings at or beyond which the IC can be expected to fail or be damaged.Reliable operation at these extremes for any length of time is not implied.

TABLE 4 DC CHARACTERISTICS

Die Pad No Pin Number Name Function

1, 8 6, 7 GND Ground pin. Connect to the most negative supply, Both pins should be used

2 8 DOUTNon-inverted data output. Differential output with DOUT (goes high as light increases)

3, 6 1, 4 VCC Power pin. Connect to most positive supply. Either or both pins may be used

4 2 PINK PIN cathode connection. Connect between this pin and PINA. Connect a decoupling capacitor to ground

5 3 PINA PIN anode connection. Connect between this pin and PINK

7 5 DOUT Inverted data output. Differential output with DOUT

Symbol Parameter Rating Units

VCC Power supply (VCC-GND) 6 V

TA Operating ambient (SOIC8) -40 to +85 °C

TSTG Storage temperature -65 to +150 °C

Symbol Parameter Min. Typ. Max. Units

VB PIN bias voltage (PINK - PINA) 2 2.3 2.6 V

VCM Common mode output voltage - VCC/2 - V

ICC Supply current (no loads) - - 35 mA


MC2006


Product Data Sheet


TABLE 5 AC CHARACTERISTICS

NOTE: (1) Measured with input capacitance, CIN = 0.7 pF(2) Assuming photodiode response of 0.9 A/W, extinction ratio of 10 dB and BER of 10-10

(3) The 2006 is designed to drive a load >500 Ω. Measurements are taken into high Z.(4) Measured at 10 MHz.(5) Input level 2 µApp

Symbol Parameter Min. Typ. Max. Units

ROUT Output impedance (single ended) - 35 - Ω

INOISE Input noise current (1), (2) - 7.5 12 nArms

Pin(mean), Min. Optical sensitivity (1), (2) -37 - -40 dBm

IMAX Input overload current 2.2 4.5 - mApp

Pin(mean), Max. Optical saturation (2) - +3 - dBm

GSmall signal transimpedance (3), (4), (5)

Single ended :Differential :

--

110-

130260

kΩ

VD Differential output voltage (3) - - 800 mV

BW Bandwidth to -3 dB point (electrical) 100 - - MHz

TrTf Data out rise/fall times (20% - 80% points) - - 2 ns

TPWD Pulse width distortion (5) - - 1 %

OSPULSE Pulse overshoot (5) - - 3 %

TAGC AGC setting time - - 100 µs

OSAGC AGC overshoot - - 12 %

PSRR Power supply rejection ratio (<4 MHz) 40 - - dB


MC2006


Product Data Sheet


TYPICAL PERFORMANCE CURVES

0 .0

5 0 .0

1 0 0 .0

1 5 0 .0

2 0 0 .0

2 5 0 .0

-3 8 -3 6 -3 4 -3 2 -3 0 -2 8 -2 6 -2 4 -2 2 -2 0 -1 8 -1 6 -1 4 -1 2 -1 0 -8 -6 -4 -2 0Input (dB m)

Gai

n (k

)

1000

10000

100000

1000000

0.01 0.1 1 10 100 1000

Frequency (MHz)

Tran

sim

peda

nce

(ohm

s)

max average min

Fig. 3 Typical gain vs input level

Differential output vs input

Transimpedance vs frequency(With the use of an MC2006S8 anda photodiode with a sensitivity of0.8 A/W @ -40 dBm optical inputpower)(VCC = 5.0 V, +21 °C)

0

2 0 0

4 0 0

6 0 0

8 0 0

1 0 0 0

1 2 0 0

1 4 0 0

-4 0 -3 5 -3 0 -2 5 -2 0 -1 5 -1 0 -5 0

Inp ut (d B m )

Diff

Out

put (

mV


MC2006


Product Data Sheet


FUNCTIONAL BLOCK DIAGRAM

FUNCTIONAL DESCRIPTION

TZAThe transimpedance amplifier consists of a high gainsingle-ended CMOS amplifier (TZA), with a feedbackresistor. The feedback creates a virtual earth lowimpedance at the input and virtually all of the input currentpasses through the feedback resistor, defining thevoltage at the output. Advanced CMOS designtechniques are employed to maintain the stability of thisstage across all input conditions.Single-ended amplifiers have inherently poor powersupply noise rejection. For this reason, an on-chip lowdropout linear regulator has been incorporated into thedesign to give excellent noise rejection up to several MHz.Higher frequency power supply noise is removed byexternal decoupling.The circuit is designed for PIN photodiodes in the“grounded cathode” configuration, with the anodeconnected to the input of the TZA and the cathodeconnected to AC ground. Reverse DC bias is applied toreduce the photodiode capacitance.

AGCThe MC2006 has been designed to operate over the inputrange of +3 dBm to –39 dBm at long wavelengths. Thisrepresents a ratio of 1:12500, whereas the acceptabledynamic range of the output is only 1:250 which implies acompression of 50:1 in the transimpedance.The design uses a MOS transistor in the triode region asa “voltage controlled resistor” to achieve thetransimpedance variation.

Output StageThe signal from the TZA enters a phase splitter and a pairof voltage follower outputs. These are designed to drivea high impedance (>500 Ω) load. They are stable fordriving capacitive loads, such as interstage filters.

TZA+1

+1

R

Series PassRegulator

ReferenceGenerator

AGC Control

Bandgap1.234v

PIN K

PIN A+1

DOUT

DOUT

Fig. 4


MC2006


Product Data Sheet


TYPICAL APPLICATIONS CIRCUIT

APPLICATIONS INFORMATIONFilter DesignThe achievable sensitivity of the MC2006 is dependant onthe noise bandwidth of the amplifier, which varies withtemperature and process. The bandwidth should therefor be limited by an interstage filter. This will typicallyemploy a one pole filter, using a capacitor across theoutputs. For maximum sensitivity, a filter with steeperroll-off and better transient response can be implementedwith inductors and capacitors. If the module is intendedto be used at several rates, interstage filtering should notbe employed. A typical application circuit is shown inFig. 5.Alternative Input ArrangementAn alternative arrangement can be used to connect thephotodiode, with the photodiode cathode beingconnected directly to VCC see Fig. 6. This requires twodecoupling capacitors, one connecting VCC to ground andthe other from PIN K to ground. This arrangement givesslightly more reverse bias on the photodiode, but will haveworse low frequency noise performance.Layout ConsiderationsUse good high-frequency design and layout techniques,taking care to bypass VCC over the frequencies to severalhundred MHz. When using die, take care to minimisebond-wire length, especially for the PIN A and Gnd pads.A typical TO-can assembly is shown in Fig. 7.

Alternative Application Arrangement

Typical TO-can Assembly

MC2045Post Amplifier

DIN

Gnd

Gnd

+5 V10 nF

*470 pF

CFILT

* The 470pF capacitor should be mounted inside the TOcan/optical sub assembly with the photodiode

DINVCC

VCC

PINK

PINA

DOUT

DOUT

10 nF

10 nF

Fig. 5

+5 V10 nF

VCC

VCC

PINK

PINA

1 nF

470 pF

Fig. 6

Gnd VCC

DOUT DOUT

4 7 0 p F

Fig. 7


MC2006


Product Data Sheet


BARE DIE INFORMATION

TABLE 6 PAD CO-ORDINATES

Pad No Description X (µm) Y (µm)

1 GND -347 255

2 DOUT -347 109

3 VCC -347 -255

4 PINK -202.6 -348.45

5 PINA -35.45 -352.3

6 VCC 347 -255

7 DOUT 347 109

8 GND 347 255

GND

DOUT

VCC

PINAPINK

GND

DOUT

VCC

Fig. 8

Die size : 1.01 x 0.96 mmDie Thickness : 300 µm ±10%


MC2006


Product Data Sheet


PACKAGE INFORMATION

SECTION A-A

e

E1

E/2 2X

1 2

TOP VIEW

D2 A2

A

A1b

FRONT VIEW

c1

b1

c

E2

E1

SIDE VIEW

A

A

R1

R

L1

0103

t2

t1

02

GaugePlane

-H-

DETAIL A

DETAIL Ab

E3E4

SCALE 40:1

L

aaa bbb M A B C

-A-

-C-

ccc A B C

3 7

26

5

E

-B- 2

0.25 MM

A

D

4

3 4

S

0.10

0.525 B S C0.65 B SC0.250.08

12.0°

0.95 B SC0.5512.0°

3.0°0.150.180.30

± 3.0°

± 0.15± 3.0°

± 0.05± 0.05

+ 0.03

± 3.0°- 0.02

0.15

0.330.410.310.15

0.510.512.953.00

± 0.08± 0.08

- 0.08+ 0.07

- 0.08

- 0.08+ 0.15

± 0.13± 0.13± 0.10± 0.10

+ 0.15

0.10

4.902.953.000.86

(M ILL IM E TE R )1.10

± 0.05

± 0.15± 0.10± 0.10± 0.08

M A X

Se

cccbbb

O2

L

aaaL1

O3

O1c1

b1c

M INI SOIC 8 LD

SYMBOL

R

t1

bt2

R 1

E 3E 4

E 2E 1

A 1

D 2E

A 2D

A

P A C KA GE OU TLIN E± TO L

Fig. 9

MC2006



Product Data Sheet


DISCLAIMER

© 2001 Mindspeed Technologies™, as a wholly owned subsidiary and the Internet infrastructure business of Conexant Systems, All Rights are Reserved.Information in this document is provided in connection with Mindspeed Technologies. "Mindspeed" products. These materials are provided by Mindspeed as a service to its customers and may be used for informational purposes only. Mindspeed assumes no responsibility for errors or omissions in these materials. Mindspeed may make changes to specifications and product descriptions at any time, without notice. Mindspeed makes no commitment to update the information contained herein. Mindspeed shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Mindspeed Terms and Conditions of Sale for such products, Mindspeed assumes no liability whatsoever.THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF CONEXANT PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Mindspeed further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. Mindspeed shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials.Mindspeed products are not intended for use in medical, life saving or life sustaining applications. Mindspeed customers using or selling Mindspeed products for use in such applications do so at their own risk and agree to fully indemnify Mindspeed for any damages resulting from such improper use or sale.The following are trademarks of Mindspeed Technologies,. the symbol M1, Mindspeed™, and "Build It First™" Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners.Reader Response: Mindspeed Technologies, strives to produce quality documentation and welcomes your feedback. Please send comments and suggestions to mailto:[email protected]. For technical questions, or to talk to a field applications engineer contact your local Mindspeed™ sales office listed below. For literature send email request to [email protected].


Americas

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Eastern Phone: (613) 271-2358Fax: (613) 271-2359

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US Mid-Atlantic - PennsylvaniaPhone: (215) 244-6784Fax: (215) 244-9292

Asia

TaiwanPhone: (886-2) 8789-8366Fax: (886-2) 8789-8366

China - Hong KongPhone: 86-755-518-2495Fax: 86-755-518-3024

Hong KongPhone: 852-2-827-0181Fax: 852-2-827-6488

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KoreaPhone: 82-2-565-2880Fax: 82-2-528-4301

Japan Phone: (81-3) 5380 1730Fax: (81-3) 5371 1501

Europe

Europe Central Germany, Switzerland Eastern Europe and TurkeyPhone: (49) 89 829 1320Fax: (49) 89 834 2734

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UKFrance, Belgium and NetherlandsPhone: 44 (0) 1925-661968Fax: 44 (0) 1925-661800

Europe - Israel/GreecePhone: (972) 9961-5100Fax: (972) 9957 5166

Headquarters

Newport BeachMindspeed Technologies4000 MacArthur Boulevard, East TowerNewport Beach, CA 92660Phone: (949) 579-3000

www.mindspeed.com

World Wide Sales Offices


MC2006 - Digchipdatasheet.digchip.com/274/274-00022-0-MC2006.pdf · Product Data Sheet_01 April 2002 Product Data Sheet MC2006 ... The MC2006 is available in die packaged form ...

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