Mar. 2007 KOLON Electronic Materials B.C. TDS (Technical Data Sheet) KP-2100.

Mar. 2007

KOLON Electronic Materials B.C.

TDS(Technical Data Sheet)

KP-2100

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KS-8700 Series

GENERAL FEATURES

Scum Free

Excellent Plating Chemical Tolerance Excellent Alkaline Etching Resistance

APPLICATION

Plating Process Selective Gold Plating Alkaline Etching

FILM SPECIFICATION

Thickness : 40, 50 m Color (Unexposed) : Green Color (Exposed) : Blue

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General Properties [Circuit Properties]

KP-2140 KP-2150Dry film Thickness (m) 38 48

Minimum Develop Time (sec.) 26 34

Step 21sst 41sst

ExposureProperty

Exposure Energy *1

(mJ/cm2)

6 16 17 19

7 19 24 27

8 22 34 40

9 25 52 60

Circuit *2

Properties

Resolution(m)

6 16 29 32

7 19 31 35

8 22 38 42

9 25 46 50

Adhesion(m)

6 16 43 57

7 19 35 48

8 22 27 40

9 25 25 31

L/S=1/1 Resolution(m)

6 16 37 53

7 19 33 44

8 22 39 40

9 25 48 50

*1: Exposure Energy ; Real Exposure energy (ORC UV meter), *2: Circuit properties : Perkin-Elmer 5Kw Collimated Exposure, KOLON TEST Artwork ( Glass Artwork)

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General Properties [Strip Properties]

KP-2140 KP-2150

Step 21sst 41sst

Strip

Properties

Stripping Time

(sec)

3.0 wt% NaOH

6 16 37 45

7 19 46 65

8 22 53 78

9 25 63 93

TentingStrength(kg)

Instron0.63 0.71

Elongation(mm) 2.7 2.6

Scum Scum Generator Scum free Scum free

Skin Size - S : Small, M : Medium, L : Large

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Sensitivity vs. Exposure Energy

Test condition •Stouffer 21 and 41 Step Tablet, Resist step• Exposure System : Perkin-Elmer 5kw Collimated Exposure

1724

34

52

19

27

40

60

0

10

20

30

40

50

60

70

80

90

100

15 16 17 18 19 20 21 22 23 24 25 26

Step Held (41 SST)

Stou

ffer 4

1 St

ep T

able

t

KP-2140

KP-2150

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Resolution

2931

38

46

3235

42

50

0

10

20

30

40

50

60

15 16 17 18 19 20 21 22 23 24 25 26Step Held (41 SST)

Res

olut

ion

(m

)KP-2140

KP-2150

Test Condition•Stouffer 21 and 41 Step Tablet, Resist step•Test Artwork : KOLON Test Artwork(Glass Artwork)•Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min•Develop. condition : 1.0wt% Na2CO3, Temp. 30 ,Break Point 50%, Spray pressure 1.5kg/cm℃ 2

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Adhesion (Minimum Survived Line Width)

43

35

2725

57

48

40

31

0

10

20

30

40

50

60

15 16 17 18 19 20 21 22 23 24 25 26Step Held (41 SST)

Adh

esio

n (

m)

KP-2140KP-2150

Test Condition•Stouffer 21 and 41 Step Tablet, Resist step•Test Artwork : KOLON Test Artwork(Glass Artwork)•Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min•Develop. condition : 1.0wt% Na2CO3, Temp. 30 ,Break Point 50%, Spray pressure 1.5kg/cm℃ 2

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1/1 Resolution

3733

39

4853

4440

50

0

10

20

30

40

50

60

15 16 17 18 19 20 21 22 23 24 25 26Step Held (41 SST)

1/1

Res

olut

ion

(m

)

KP-2140KP-2150

Test Condition•Stouffer 21 and 41 Step Tablet, Resist step•Test Artwork : KOLON Test Artwork(Glass Artwork)•Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min•Develop. condition : 1.0wt% Na2CO3, Temp. 30 ,Break Point 50%, Spray pressure 1.5kg/cm℃ 2

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Strip Properties

0

10

20

30

40

50

60

70

80

15 16 17 18 19 20 21 22 23 24 25 26Step Held (41 SST)

Stri

ppin

g Ti

me(

sec.

)KP-2140 3wt%KP-2150 3wt%

Test Condition• Pretreatment ->Lamination->Exposure->Develop->Etching -> Strip •Temperature : 50 C, Conc. : NaOH 3, 4 wt%•TEST Method : Dipping Method

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Tenting: INSTRON Method

KP-2140 KP-2150

Step Held

(21 SST and 41 SST)8/21 ; 22/41 8/21 ; 22/41

Strength(kg) 0.63 0.71

Elongation(mm) 2.7 2.6

INSTRON

X = 3ØY = 6Ø

Copper Board

Dry film Photoresist

Probe

x

y

Stress/StrainX = 3ØY = 6Ø

Stress : Load of Max load when the 6mm hole broken. Average of 8 times test.

Strain : Displacement during the hole broken at Max.load(mm) Average of 8 times test.

0.0

0.5

1.0

1.5

2.0

2.5

3.0

Strength(Kg) Elongation(mm)Tenting

KP-2140KP-2150

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SEM Images of KP-2140(X200, X350)

Line / Space = 50 / 50 m

200 Times

350 Times

19 / 41SST(7 / 21SST) 22 / 41SST(8 / 21SST) 25 / 41SST(9 / 21SST)

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SEM Images of KP-2150(X250, X400)

Line / Space = 50 / 50 m

250 Times

400 Times

19 / 41SST(7 / 21SST) 22 / 41SST(8 / 21SST) 25 / 41SST(9 / 21SST)

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Evaluation Parameters (Sensitivity)

Optical DuPont Stouffer Stouffer StoufferDensity 25 Step Tab. 21 Step Tab. 31 Step Tab. 41 Step Tab.0.00 10.05 1 10.10 2 20.15 30.20 2 3 40.25 50.30 4 60.35 3 70.40 5 80.45 90.50 1 4 6 100.55 2 110.60 3 7 120.65 4 5 130.70 5 8 140.75 6 150.80 7 6 9 160.85 8 170.90 9 10 180.95 10 7 191.00 11 11 201.05 12 211.10 13 8 12 221.15 14 231.20 15 13 241.25 16 9 251.30 17 14 261.35 18 271.40 19 10 15 28

Step Tablet Relationships

2345678

KolonStep(21)

91011121314

2345678

KolonStep(21)

91011121314

Exposure

Step Held

Development

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General Process Guideline

Process Recomendation Specification

Lamination

Roll Temp. (°C) 110 ± 10

Exit Temp.: 50 10 °CSpeed (m/min) 2.0 ± 1.0

Roll Pressure (Kgf/cm2) 3.5 ± 1.5

Holding Time Time (min) 15min – 8hrs Under Yellow Light

Exposure Exposure Energy (mJ/cm2)Step Held7~10/21ST

Without ArtworkResist Step

Holding Time Time (min) 15min – 8hrs Under Yellow Light

Development

Chemical 1.0 ± 0.2wt% Na2CO3 *Antifoam:

Non-silicon Type

(0.05 ~ 0.1 vol%)

Temp. (°C) 30 ± 2

Break Point 50~70%

Spray Pressure (Kgf/cm2) 2.0 ± 0.5

Stripping

Chemical 2 - 4wt% NaOH

Temp. (°C) 45-55

Break Point 40~60%

* Clean Room: 20~22 °C, 50 ± 10 % RH