Managing Lead and Lead-Free Transition Dr. Sudarshan Lal FCI USA, Inc. Etters, PA (USA) June 20, 2002
Dec 24, 2015
Managing Lead and Lead-Free Transition
Dr. Sudarshan LalFCI USA, Inc.
Etters, PA (USA)June 20, 2002
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Outline
> Introduction
> Lead-free test plans
> Lead-free implementation for:
i) Pressfit ii) Reflow iii) BGA Applications
> Test status
> Conclusions
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Commercial 2003
Industrial Not Clearly
Defined
Computer 2003
Telecom/Backpanel Not Clearly
Defined
Request for segment data made to fleck and bishop
Board and connector performance issues are the cause for a less defined need in the Telecom/Backpanel market
Market Segment Requirements
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Regions – Timing Requirements
Americas Not Clearly Defined
A/P * 2003 (Some Appliances in
Japan)
Europe 2006 (Servers & Auto. 2010)
* Although there is no legislation, pending
or otherwise, Japan is calling for the
reduction or elimination of lead in
Electronics. Several Japanese OEM’s have
taken it upon themselves to be as proactive
in this market as possible
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The use of lead in electronics assembly within the
European Union will be banned after January 2008 (and
possibly as soon as 2006). Servers and Automotive
exempted until 2010
Since A/P, specifically Japan, is the first regional area to
require lead-free products, FCI’s lead-free implementation
will be heavily influenced by the needs and requirements
of major Japanese OEM customers.
Source:Envirowise Website http://www.envirowise.gov.uk
Timing Requirements – Europe & A/P
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Provide leadership, coordination, and communication to FCI Worldwide to implement a lead-free offering of our products where
appropriate in a way that:
Identifies marketing and customer expectations
Establishes product conversion priority and timing
Provides leadership and communication
Coordinates activities with the other regions
Provides technology solutions for our products
Assures the generation and communication of technical support data, and
Generates an implementation plan that includes sales, marketing, engineering, manufacturing, and technology actions and timing
so that FCI can provide a lead-free product offering that meets the needs of our customers in a timely manner and meets our business objectives.
Lead-Free Global Team Charter
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Rather than focus on 40+ product lines, the lead-free
team will focus on the three main termination styles.
Each termination style will have a different technical
solution or a significantly different performance or
whisker issue that needs solving.
Lead-Free Team Methodology
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Implementation By Termination Style
BGA Termination Reflow
Th
ru-H
ole
SMT
Pre
ss-F
it
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Advantages of Sn-Cu v. Sn coating
> Aesthetically superior bright deposit with low carbon & stable alloy composition
> Sn-Cu is less prone to whiskering than pure tin . Alloying helps in whisker mitigation
> Low foam, stable solution without strong odors for Sn-Cu bath
> Plated Sn-Cu film resistant to discoloration in heat tests
> Solderability for Sn-Cu coating is equivalent or better than Sn-Pb and pure tin finishes. Tin coatings after steam aging exhibited poor solderability (longer wetting times, negative forces)
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Technical Solution
Press-Fit & Reflow
Sn-Cu Plating ( Bath Globally Available)
BGA
Sn-Cu-Ag Spheres (Spheres Globally Available)
Note: FCI Searching Lead-Free Epoxy to Withstand 260 C
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Connector Technical
Solution Sn-Cu Plating
Perform DOE And Test Plan
Utilizing Multiple Boards
Press-Fit Lead-Free Implementation Flow Chart
Confirm Technical Solution In Press-Fit
Applications
Test Boards
Immersion Ag
Immersion Sn
Bare Cu/OSP
Tin/Lead
Nickel Gold
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Utilizing a Metral EON press-fit pin
Testing conducted with: Tin-Lead, OSP, ImAg, ImSn, & Ni-Au Boards
Telecom UE Tests:
Vibration & Shock – 50 Contacts – Min. & Max. PTH Board
Thermal Shock/Humidity – 50 contacts – Min. & Max. PTH Board
Mixed Flow Gas – 25 Contacts – Max. PTH Board Only
Repair (Insertion/Retention, Heat Age, Hole Deformation) 150
Contacts – Min. & Max. PTH Board
Lead-Free Press-Fit Test Plan
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Press-Fit Test Results Status
> Vibration & Shock : No abnormalities found
> Thermal Shock/Humidity test: In Progress
> Mixed Flow Gas: Initial Preparation Completed. Going to MFG chamber
> Repair (Insertion/Retention, Heat Age, Hole-size): Passed within normal limits
> Compliant pin resistances were within specifications (less than 1 milliohm)
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Connector Technical Solution
SnCuAg BGA
Perform DOE And Test Plan
Utilizing Copper Board
BGA Implementation Flow Chart
Confirm Technical
Solution In BGA Applications
Test Boards
Bare Cu/OSP
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Test PCB Pad Plating: OSP (Cu with Coating)
1.) Thermal Shock Testing Per MEG-Array Product Spec GS-12-100
2.) Solder Joint Tensile Strength & 3-Point Bend Testing per MEG-
Array Product Specification GS-12-100 2a. Solder ball pull strength.
3.) Solder Wicking Evaluation
4.) Thermal Cycling per IPC-SM-785 (Telecom Central Office
Environment)
Lead-Free BGA Test Plan
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Lead-Free BGA Test Results
> Passed three-point bend test. No dye penetration observed. Micro-cracks were absent
> Lead-free solder tensile strength was greater than standard Tin-lead solder
> Solder joint reliability was equivalent to Tin-lead
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Connector Technical
Solution Sn-Cu Plating
Perform DOE And Test Plan
Utilizing Copper Board
Re-flow Termination Implementation Flow Chart
Confirm Technical Solution In Re-
flow Applications
Test Boards
Bare Cu/OSP
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Lead-free Re-flow Test Status
> Solderability was excellent exhibiting normal forces and percentage coverage comparable to Tin-lead
> Tensile Strength using Instron was similar to Tin-lead
> Whisker tendency not studied yet. Reflow should minimize whisker formation
> Need to develop plan for i) Bergstik-thruhole ii) Bergstak-SMT iii) Memory-SMT Products
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Resins & Molding For Lead-Free
Three resins failed to withstand the industry anticipated 260C peak re-flow temperature for lead free soldering. These resins are :
LCP A (280C) (“Baby H”Metral Headers)
PPS (Card Edge Press-Fit)
SPS (GBIC SMT)
Polyamide 46 & Polyphthalamide high temperature nylons passed at all re-flow temperatures in the dry state, but failed at all re-flow temperatures (even the current 223C) in the wet state via blistering. The failures were due to the hygroscopic property of the material and not the re-flow temperature.
In general, those materials with a melting point of 285C and lower exhibited visual and/or dimensional defects following exposure to 260C and higher re-flow temperatures. All resins with melting points greater than 285C successfully sustained the industry anticipated 260C peak re-flow profile without visual/dimensional damage.
Converged EON Metral Headers Use LCP E – Melt Temp = 335C
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Existing FCI Lead-Free Products
Group Product PlatingBoard-To-Board BergStik Simplex - 30u Au, 15u Au
Quickie Headers Simplex - 30u Au, 15u AuShunts Simplex - 30u Au, 15u AuDubox Simplex - 30u Au, 15u AuCard Connectors Simplex - 30u Au, 15u AuBergCon Headers Simplex - 30u Au, 15u AuQuickie IDC Simplex - 30u Au, 15u AuPV Simplex - 40u Au, 30u Au, 15u AuMinitek Simplex - 30u Au, 15uAuSocket - Screw Machine Simplex - 30u Au
Group Product PlatingI/O Products SATA Duplex - 50u Au (Mate) 30uSnCu (Tail)
Modjack Simplex - 30u Au, 30u GXT, 50u AuClincher Simplex - 30u Au
Group Product PlatingBackpanel HPC Simplex - 50u Au, 30u Au, 30u GXT
BergPin Simplex - 50u Au, 30u Au, 15u Au
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Conclusions
FCI maintains an open dialogue with suppliers, contract
manufacturers, OEM’s and consortia regarding lead-free technical
solutions. Presently customers are interested in plans , capabilities
and limited test samples
The global lead-free team is in the process of identifying & testing
lead-free solutions for BGA, press-fit & re-flow products
Implementation and smooth transition shall be case-by- case
based on credible scientific data of proven reliability, market
demand, regulatory compliance, supply assurance, quality and
competitive cost